CN1431692A - Chip component feeder - Google Patents
Chip component feeder Download PDFInfo
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- CN1431692A CN1431692A CN 02152276 CN02152276A CN1431692A CN 1431692 A CN1431692 A CN 1431692A CN 02152276 CN02152276 CN 02152276 CN 02152276 A CN02152276 A CN 02152276A CN 1431692 A CN1431692 A CN 1431692A
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- chip
- chip component
- sheet material
- protuberance
- component feeder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
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- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a chip component feeder in which chip components pasted on a chip supporting sheet can be taken out at a high rate in a short time. A feeding head 12 is disposed under a chip supporting sheet 4 mounting chip components 4 pasted onto the upper surface thereof. A carrying means 8 moves the chip supporting sheet 4 and the feeding head 12 relatively along the lower surface of the sheet 4. A mound 13 protruding along the feeding direction of the chip components 2 is projected from the upper surface of the feeding head 12. A width in the vicinity of the top of the mound 13 is made narrower than the width of the chip component 2. When the chip supporting sheet 4 and the feeding head 12 move relatively, the chip supporting sheet 4 is pushed up locally and deformed and thereby the chip supporting sheet 4 is stripped partially from the chip component 2 at a part deviated from the mound 13.
Description
Technical field
The present invention relates to a kind of chip component feeder that attaching is carried chip component, supplied with on open the chip support sheet material of establishing below taking out with anchor clamps.
Background technology
As above-mentioned chip component feeder, for example can see Japanese patent laid-open 11-274181 communique for details.This chip component feeder carries out following action.That is, at first, form the below that irregular paper groove is positioned at the chip component that should take out above making.Under this state, by chip being supported the sheet material vacuum suction on the paper groove, make chip support that sheet material is out of shape under the concavo-convex state above the paper groove, support sheet material to peel off chip locally from chip component.Secondly, make very useful pin protrusion above the paper groove, on one side chip component is peeled off come-up, the taking-up by the vacuum suction type on one side keeps with anchor clamps.
Also have a kind of Japan Patent spy to open the chip component feeder that the 2000-12570 communique is disclosed.This chip component feeder carries out following action.That is, at first, make to attach to be supported in chip and to support the position of the chip component above the sheet material to be in the below of taking out with anchor clamps, under this state, by the pushing pin from the sheet material below with chip component top 1 time and support sheet material to peel off chip from the chip component locality.Secondly, carry out the pushing pin is gone up the action on top again.Like this, support sheet material to peel off fully from chip component basically chip, and carry out element taking-up action by taking out with anchor clamps.
Above-mentioned traditional chip component feeder all is after the position that makes chip component is in extracting position, carry out chip and support peeling off action and peeling off action basically completely of sheet material locality, take out action by taking out with anchor clamps, the stroke that element takes out is many, and the processing time is long.
Again, in the former traditional die component supplying apparatus, the reduction ability that chip supports sheet material to attach power is determined that by the area above the paper groove after lift-off processing, remaining attaching power changes according to the size of chip component.Therefore, for corresponding to the size of chip component to guarantee taking out action, for example must change the pushing pin on push the speed of work etc., set the specification when moving respectively with the big or small corresponding taking-up of chip component.
In the latter's traditional die component supplying apparatus,, therefore consumed the time that the jacking row is peeled off on the pin and supplied with the required time owing to after chip component is delivered to take-off location, pick up via the operation in 2 stages again.
The present invention in view of the above problems, its main purpose be to provide a kind of can take out at short notice to attach carry the chip component feeder of supporting the chip component on the sheet material at chip.Another object of the present invention is to provide a kind of no matter chip component to have muchly all can take out the chip component feeder of action with same specification reliably.
Content of the present invention
For achieving the above object, the present invention has adopted following structure.
Promptly, the chip component feeder of the present invention's the 1st technical scheme is a kind ofly to support that chip component is carried in attaching above the sheet material opening the chip establish, to taking out the structure of supplying with the below of anchor clamps, it is characterized in that, the supply head is equipped with below described chip support sheet material,, be provided with the carrying device that this supply head is relatively moved simultaneously below described chip support sheet material, on described supply head, be formed with protuberance, described protuberance makes chip component along swelling towards supplying with a direction of sending, near the top of described protuberance, form the width of the width of described protuberance less than chip component, support sheet material and described supply head to relatively move by make described chip by described carrying device, by described protuberance described chip is supported to push up on the sheet material locality and be out of shape, support the sheet material locality to peel off described chip from chip component at the position that breaks away from from described protuberance.
Adopt this structure, support sheet material on the direction parallel, to relatively move by making chip with the sheet face with the supply head, chip component on the sheet material rises to high position gradually from the low position of protuberance of supplying with head, at this moment, the sheet material part of directly not bearing the protuberance both sides of top distortion is peeled off from chip component gradually.
The chip component feeder of the present invention's the 2nd technical scheme is in the 1st technical scheme, and protuberance sets that width diminishes along with the increasing of described protuberance protuberance for.
Adopt this structure, at the initial stage of rising to protuberance, because of the protuberance width big, so peel off end at chip component from the sheet material of chip component, along with protuberance increase and width diminishes, Width central side at chip component is constantly peeled off, and sheet material is not peeled off reluctantly and smoothly from the end of chip component.
The chip component feeder of the present invention's the 3rd technical scheme is in the 1st or 2 technical schemes, forms the element seating surface of fixed to some extent certain area at the top of described protuberance.
Adopt this structure, only formed a state that is held in sheet material that attaches though arrive the chip component at protuberance top at the element seating surface, but because no matter element has much, the specification of this element seating surface also is certain, therefore, the attaching intensity of the chip component on the protuberance top is that the element peeling force is certain.Like this, as long as the size of element seating surface is set in the required minimal area of holding core piece element, just can under the situation of not using isolation auxiliary body (going up pushing tow pad etc.), support sheet material to take out from chip chip component.
The chip component feeder of the present invention's the 4th technical scheme is in the 1st to 3 each technical scheme, be equipped with will be positioned at the chip component at described protuberance top from the below pushing pin on top upwards.
Adopt this structure, the chip component that arrives the protuberance top passes through to sell forcibly upwards top by pushing, and complete basically and chip supports sheet material to peel off, and is taken out with anchor clamps by taking-up.
The chip component feeder of the present invention's the 5th technical scheme is in the 1st technical scheme, and the described head of supplying with supports the revolving roll that contacts below of sheet material to constitute by outer peripheral face and chip, simultaneously the outer peripheral face of described protuberance at this revolving roll is convexly equipped with circlewise.
Adopt this structure, when chip supports that sheet material relatively moves with the supply head, can prevent that the sheet material that causes because of friction from pulling distortion etc.Again because chip component supports sheet material to remain on the arc surface of supplying with head by chip, therefore, be that the occasion of tabular surface is compared and can be reduced the area that chip component contacts with chip support sheet material with supplying with head.Like this, can reduce chip component required power when chip supports sheet material to peel off.Thus, can realize simplification, to such an extent as to do not need mechanism itself with chip component used mechanism when chip supports sheet material to peel off.
The chip component feeder of the present invention's the 6th technical scheme is in the 1st to 4 each technical scheme, is provided with to make the described drive unit that head back and forth moves up and down of supplying with on direction vertical below described chip is supported sheet material.
Adopt this structure, during the supply head is relatively moved, can support that sheet material separate with supplying with head (protuberance) and chip by drive unit.Like this, can support the time decreased of sheet material butt to Min. with chip with supplying with head (protuberance).Thus, when chip supports that sheet material relatively moves with the supply head, can prevent that the sheet material that causes because of friction from pulling distortion etc.
The chip component feeder of the present invention's the 7th technical scheme is in the 1st to 6 each technical scheme, is equipped with the attraction hole of sheet material absorption usefulness in the both sides of described protuberance.
Adopt this structure, support that by the chip that forcibly attracts to be positioned at from the position that protuberance breaks away from sheet material is out of shape, can guarantee to peel off from chip component.
From above-mentioned explanation, as can be seen, adopt the present invention can obtain following effect.
Adopt technical scheme 1 of the present invention, because chip supports sheet material and supply head to relatively move, chip has been supported sheet material to peel off from the chip component part during the start that chip component is risen to protuberance in advance, therefore, the chip component that is in extracting position has formed the state of easily peeling off.Like this, need not wait to be ready to use in to alleviate the stroke peeled off and just can carry out picking action with anchor clamps, can shorten the chip component take-off time, correspondingly can shorten the required time of operation by taking out.And, compare with conventional case and can reduce chip component chip is supported the attaching power of sheet material can make the responsiveness high speed that picks up thus.
Adopt technical scheme 2 of the present invention, along with the rising of chip component to protuberance, chip supports that sheet material can slowly not carry out from the end of chip component limpingly from peeling off of chip component, support sheet material and the relative moving speed of supplying with head even accelerate chip, also can successfully carry out sheet material and peel off action.
Adopt technical scheme 3 of the present invention, no matter element has much, the chip component of extracting position only is to attach with certain attaching power to keep in the element seating surface of the certain area that is arranged at the protuberance top, therefore, no longer need specially to change the specification of taking out with the taking-up function of the action of anchor clamps and last pushing tow pad etc. for the size that meets chip component, the required times such as gear-change operation when changing the chip component of supplying be can shorten, change taking-up anchor clamps and the required cost of last pushing tow pad specification also can be reduced simultaneously effectively.
Adopt technical scheme 4 of the present invention, reduced the attaching power of chip component, and make progress the top and form the state of peeling off fully basically, therefore, can carry out the taking-up of using anchor clamps 7 by taking out reliably, error-free by pushing to sell owing to rising to protuberance.
Adopt technical scheme 5 of the present invention, because supplying with head is made of revolving roll, therefore, support sheet material and supply with head can pull distortion etc. by the sheet material that the revolution of supplying with head is avoided causing because of friction when relatively moving at chip, the malfunction of chip component can not take place in the action that protuberance rises at chip component, can with the state that takes out with the correct contraposition of anchor clamps under supply with.Owing to support sheet material to make chip component, therefore can in the process of the upper end of protuberance, chip limit end and sheet material peeled off along arc surface by chip again.
Adopt technical scheme 6 of the present invention, the sheet material that can avoid causing because of friction when chip supports that sheet material relatively moves with the supply head pulls distortion etc., the changing of the relative positions can not take place at chip component in the action that protuberance rises, can with the state that takes out with the correct contraposition of anchor clamps under supply with.
Adopt technical scheme 7 of the present invention, can support sheet material to peel off chip reliably in the position beyond protuberance, even chip is supported also can peel off action reliably when the attaching power of sheet material is big from chip component.
The simple declaration of accompanying drawing
Fig. 1 is the vertical section front view of expression chip component feeder the 1st example of the present invention.
Fig. 2 is the vertical section front view of wanting portion to amplify of expression chip component feeder the 1st example of the present invention.
Fig. 3 is the vertical section end view of wanting portion to amplify of expression chip component feeder the 1st example of the present invention.
Fig. 4 (a) and (b) are respectively the stereogram that a top is supplied with in expression.
Fig. 5 is for supplying with the vertical view of head.
Fig. 6 is the stereogram of a supply variation of expression the 1st example.
Fig. 7 is a supply vertical view of variation.
Fig. 8 is the vertical section front view of expression chip component feeder the 2nd example of the present invention.
Fig. 9 is the vertical section front view of expression chip component feeder the 3rd example of the present invention.
Figure 10 is the end view of a supply partial cut of expression chip component feeder the 3rd example of the present invention.
Figure 11 is the end view of the partial cut of a supply variation of expression chip component feeder the 3rd example of the present invention.
Figure 12 is the a-a line cutaway view among Figure 11.
Figure 13 is the vertical section front view of expression chip component feeder the 4th example of the present invention.
Embodiment
Example of the present invention is described with reference to the accompanying drawings.
Fig. 1 represents the front view of chip component feeder the 1st example of the present invention.In chip component feeder 1, chip component 2 attach and be supported in open the chip of being located at support 3 support sheet material 4 above.Support 3 by the right left horizontal conveyance of carrying device 8 from figure, and is moved into the below of the taking-up of the vacuum suction type that is held in element transfer 6 with anchor clamps 7 under the state that remains in support retaining ring 5.At this, described chip support sheet material 4 utilize with above it as the attaching sheet material of adhesive surface, by this adhesive surface attach open be located at support 3 below.Again, chip supports sheet material 4 that a plurality of chip component 2 permutations ground is attached lift-launch on adhesive surface.Thus, chip component 2 supports sheet material 4 to be moved into the below of taking-up with anchor clamps 7 by chip.For example can use along XY worktable device of in-plane conveyance support retaining ring 5 etc. as carrying device 8 again.
Be provided with below the element extracting position in support 3 mobile routes and supply with 12.Supply with 12 upright being located on the stand 11.Shown in Fig. 4 (a), supply with 12 and constitute the height that contacts below of supporting sheet material 4 above it with chip, on supply with 12, be formed with protuberance 13 simultaneously.Protuberance 13 is along swelling to supplying with 12 direction of sending chip component 2.Specifically, protuberance 13 forms crowned along the moving direction of support 3.
The shape of protuberance 13 is chevrons of the slow inclination of swelling gradually towards a center of supplying with 12.Again, the width of protuberance 13 is set for littler than the width of chip component 2 near the protuberance top.And the top of protuberance 13 is formed with supports 1 chip component element seating surface 2 sizes, horizontal flat 13a.In addition, in Fig. 4 (a), the shape of protuberance 13 is conveyance direction (moving direction of the support 3) shapes of linearity protuberance roughly along chip component 2, but shown in Fig. 4 (b), also can be along the shape of the circular-arc protuberance of chip component 2 conveyance directions.
Again, supply with 12 inside and constitute hollow form, be connected with not shown negative pressure devices such as suction pump by connecting nozzle 14 simultaneously.And dispersion is formed with a plurality of suctions hole 15 in the zone except protuberance 13 supplying with above 12.
And, have the pushing pin 17 that withdraws from from the opening 16 that is formed at described element seating surface 13a in the inside of supplying with 12.This pushing pin 17 is arranged on the movable frame 19.In addition, guide rail 18 is fixed on the stand 11, can guide movable frame 19 up or down.This movable frame 19 is provided with cam follower 22, by by the actuator 20 revolution driving cams 21 driving cam driven members 22 of the motor etc. of band decelerator jack-up upwards.Constituting the pushing pin 17 that is arranged on the movable frame 19 thus back and forth moves up and down with certain stroke.
The 1st example of chip component feeder 1 of the present invention adopts above structure.Taking-up to this chip component feeder 1 describes with the action of the component feeding on the anchor clamps 7 below.
Be under the state of supplying with a position above 12 when not carrying the position maintain chip component 2, the support 3 that conveyance comes below being adjusted to sheet material with the height that contacts above the supply 12 after, move by carrying device 8 along continuous straight runs.
In addition, by carrying device 8 support 3 is moved after fixing here, certainly also can be after support 3 is fixing supply 12 is moved by carrying device 8 or with the equal device of carrying device 8 though constitute with supply 12.
Move by this, begun constantly to carry on protuberance 13 in order from the front, but near these protuberance 13 tops width setup going up must be littler than the width of chip component 2 by 2 groups of the chip components of permutation.Like this, the chip of deviating from from protuberance 13 supports sheet material partly to utilize the tension force of oneself and the sheet material suction-operated in suction hole 15 to peel off from chip component 2.Thus, under the state of the element seating surface 13a at chip component 2 arrival protuberance tops in front, as shown in Figure 3, chip component 2 only forms on element seating surface 13a and attaches and prop up the state that chip is supported sheet material that is held in, and attaches the whole occasion that attaches support of strength ratio and reduces significantly.
At this moment, push the action that pin 17 produces the top that makes progress, upwards also support sheet material 4 to peel off from chip fully in the top chip component 2 that attaching intensity reduces.Meanwhile, take out with anchor clamps 7 declines, chip component 2 absorption of upwards pushing up are kept, thus, the supply of 1 item finishes, on taking out, keep with anchor clamps 7 and the action by element transfer 6 of the chip component 2 of taking-up by the conveyance transfer arrive fixed into treatment sites.
Then, along with the spacing of support 3 moves repeatedly above-mentioned action, the chip component 2 that is carried by permutation begins constantly to supply with in order taking-up from its front.
Adopt the 1st example to have following advantage.That is, make chip support sheet material 4 with supply with 12 relatively move and make chip component 2 rise to the action of protuberance 13 during, can partly chip be supported sheet material 4 to peel off from chip component 2.Can make the chip component 2 that is in extracting position form the state of peeling off easily like this.Thus, need not wait to be ready to use in to alleviate the picking action that the stroke of peeling off can carry out being used by taking-up anchor clamps 7, can shorten the take-off time of chip component 2, can correspondingly shorten the required time on the operation.And, can support to carry out under the situation of attaching power of 4 pairs of chip components 2 of sheet material the picking action of chip component 2 fully reducing chip, also can make picking action speed realize high speed.
In addition, as mentioned above, also the shape of protuberance 13 can be formed circular-arc along the conveyance direction shown in Fig. 4 (b).Under this occasion, has following advantage.That is, chip component 2 is supported the shape that sheet material 4 forms along arc surface through chip, in the process that is sent to protuberance 13 upper ends, the chip limit end that is on the conveyance direction is peeled off with chip support sheet material 4.
As mentioned above, inhale hole 15 and support sheet material 4 and chip component 2 to support sheet material 4 to peel off chip by attracting chip again.Thus,, supplying with above 12 but inhale hole 15 as Fig. 4, decentralized configuration shown in Figure 5 for chip component 2 that can corresponding all size, certain also can be shown in the dotted line among Fig. 4, Fig. 5 along protuberance 13 centralized configuration near protuberance 13.
Fig. 6 and Fig. 7 represent to supply with the variation of the protuberance 13 on 12.In this occasion, the shape of protuberance 13 is that the beginning side width that rises is big, and forms and swell highly more, and width is more little.Like this, can not carry out chip from the end of chip component 2 limpingly and support peeling off smoothly of sheet material 4.
Fig. 8 represents the side view of the 2nd example of chip component feeder 1 of the present invention.In this example, omitted above the supply 12 in above-mentioned the 1st example by top stripping off device on pushing pin 17 elements that constitute.In order to omit top stripping off device on the element, can take following method.That is, strengthen the element hold facility or the corresponding attaching power that reduces chip support sheet material 4 of taking out, can omit top stripping off device on the element with anchor clamps 7.
In addition, also can omit top stripping off device on the element by the size of taking following method to be located at the element seating surface 13a at protuberance top.That is, the size of element seating surface 13a is set at the size that can bring into play the required minimal attaching power of holding core piece element 2, also can omits top stripping off device on the element.
Fig. 9 and Figure 10 represent the front view and the end view of the 3rd example of chip component feeder 1 of the present invention.In this example, supply with 12 and constituted, be formed with the protuberance 13 of ring-type at the outer peripheral face of this revolving roll 32 by can swim the revolving roll 32 that commentaries on classics supports freely around fulcrum 31.Again, this revolving roll 32 also constitutes hollow form, and the air vent hole 34 that is formed at bearing pedestal 33 and fulcrum 31 inside is connected with not shown vacuum plant, is formed with suction hole 15 with internal communication at the outer circumferential surface section branch of deviating from from the protuberance 13 of revolving roll 32 simultaneously.
Adopt this structure, support 3 is along with the left among Fig. 7 moves horizontally, and begins to carry in order on protuberance 13 from the front of chip component 2.At this moment, protuberance 13 is owing to have the pushing effect under the state that is inclined to circular-arc chevron protuberance with respect to chip support sheet material 4, therefore identical with precedent, chip component 2 supports sheet material 4 to peel off on one side from chip on one side protuberance 13 is risen partly, peels off the fastest top at sheet material and accepts to take out taking-up action with anchor clamps 7.In this occasion, support sheet material 4 to hold chip at the position of deviating from from the protuberance 13 of revolving roll 32 by inhaling hole 15.Like this, along with chip is supported moving horizontally of sheet material 4, revolving roll 32 turns round towards the counter clockwise direction among Fig. 9.Thus, chip support sheet material 4 not with revolving roll 32 relative frictions, can not take place to support the towing of sheet material 4 to be out of shape because of friction causes chip.
In addition, the 3rd example also is to carry out structure that support 3 move by carrying device 8 with supplying with 12 after fixing, but also can use carrying device 8 certainly or with the equal device of carrying device 8 supply 12 is moved after support 3 is fixing.
Figure 11 and Figure 12 represent the variation of the supply 12 in the chip component feeder 1 of above-mentioned the 3rd example.The supply of this variation 12 is a kind of structures of cutting apart revolving roll 32a, 32b to cut apart about closely-spaced being combined with.Again, the protuberance 13 of ring-type is also cut apart to be formed at and is respectively cut apart revolving roll 32a, 32b matching part.And, cut apart two and can be equipped with the movable frame 35 that engages guiding with roller lug boss 32c in the gap that forms between revolving roll 32a, 32b with moving up and down, on this movable frame 35, dispose pushing pin 17 simultaneously.And as mentioned above, the chip component 2 that will be arrived supply 12 top of revolution roll shape by pushing pin 17 upwards pushes up, and supports sheet material 4 to peel off and be supplied to chip and takes out with anchor clamps 7.
Figure 13 represents the front view of the 4th example of chip component feeder 1 of the present invention.This example is an all enforceable variation in arbitrary structure of above-mentioned the 1st～the 3rd example.Thus, as the one example, be that example illustrates the 4th example with the structure of the 1st example.The structure that had illustrated in the 1st example is marked with same title and symbol thereof, omits explanation it.
In the 4th example, it is characterized in that being provided with making and supply with 12 drive unit that move 40.Drive unit 40 is by supply 12 mechanism that support the sheet material 4 edges direction vertical with its sheet face direction to move repeatedly with respect to chip are constituted.In addition, drive unit 40 both can only drive supplies with 12, also can be made by each stand 11 certainly and supply with 12 and move.
Drive unit 40 carries out following action.By being supported the conveyance action of sheet material 4 by the chip of carrying device 8, near (supply with 12 directly over) time, drive unit 40 is implemented following action under chip is supported chip component 2 on the sheet material 4 to come to take out with anchor clamps 7.That is, drive unit 40 makes supply 12 court approach chip and supports the direction of sheet material 4 to move, support sheet material 4 upwards to push away chip.Thus, form chip component 2 by conveyance action and can support the state that sheet material 4 is peeled off with chip by the support 3 of carrying device 8.
On the other hand, near (supply with 12 directly over) time, drive unit 40 is implemented following action under chip component 2 no shows are taken out with anchor clamps 7.That is, drive unit 40 makes to be supplied with 12 and supports the direction of sheet material 4 to move towards being away from chip, makes to supply with 12 and separate with chip support sheet material 4.Thus, in conveyance action, forms by the support 3 of carrying device 8 chip component 2 with the state of chip support sheet material 4 butts.
Adopt structure as above, in the 4th example, chip support to become during sheet material 4 and the revolving roll 32 relative break-ins required minimal during, the towing that the chip support sheet material 4 that causes because of friction can not take place basically is out of shape.
In addition, the present invention also can following form be implemented.
(1) above-mentioned example is to make to open to be provided with the structure that chip supports that the support 3 of sheet material 4 moves horizontally, but also can be formed in a support 3 that is provided with chip support sheet material 4 is fixed on institute's allocation, and make supply with 12 support along chip sheet material 4 below move horizontally in, make take out with anchor clamps 7 move to supply 12 directly over take out action.Like this, because of omitting the mobile space of support 3, so can make equipment miniaturization.
(2) form of taking out with anchor clamps 7 is not limited to the vacuum suction type, so long as with the size of chip component 2 and shape is corresponding all can utilize.For example, also can utilize fixture to carry out the mechanical type clamping and take out the form of moving by driven for opening and closing.
(3), also attaching can be remained in chip and support the semiconductor wafer cut-out processing back of sheet material 4 as chip component as attaching the chip component 2 of lift-launch on chip support sheet material 4 except that the form that attaches by single-piece work.
Claims (10)
1. chip component feeder is a kind of structure that attaching is carried chip component, supplied with below taking out with anchor clamps on open the chip support sheet material of establishing, it is characterized in that,
The supply head is equipped with below described chip support sheet material,, simultaneously,
Be provided with and make described chip support sheet material and described supply head along supporting the carrying device that the direction of sheet material lower plane row relatively moves with described chip,
On described supply head, be formed with protuberance, described protuberance makes chip component along swelling towards supplying with a direction of sending, near the top of described protuberance, form the width of the width of described protuberance less than chip component, support sheet material and described supply head to relatively move by make described chip by described carrying device, by described protuberance described chip is supported to push up on the sheet material locality and be out of shape, support sheet material locality and chip component to peel off described chip at the position that breaks away from from described protuberance.
2. chip component feeder as claimed in claim 1 is characterized in that, described protuberance sets that width diminishes along with the increasing of described protuberance protuberance for.
3. chip component feeder as claimed in claim 1 or 2 is characterized in that, is formed with the element seating surface of predetermined certain area at the top of described protuberance.
4. chip component feeder as claimed in claim 1 is characterized in that, be equipped with will be positioned at the chip component at described protuberance top from the below pushing pin on top upwards.
5. chip component feeder as claimed in claim 2 is characterized in that, be equipped with will be positioned at the chip component at described protuberance top from the below pushing pin on top upwards.
6. chip component feeder as claimed in claim 1 is characterized in that, the described head of supplying with supports the revolving roll that contacts below of sheet material to constitute by outer peripheral face and chip, simultaneously the outer peripheral face of described protuberance at this revolving roll is convexly equipped with circlewise.
7. chip component feeder as claimed in claim 1 is characterized in that, also is provided with to make the described drive unit that head back and forth moves up and down along direction vertical below described chip is supported sheet material of supplying with.
8. chip component feeder as claimed in claim 2 is characterized in that, also is provided with to make the described drive unit that head back and forth moves up and down of supplying with on direction vertical below described chip is supported sheet material.
9. chip component feeder as claimed in claim 1 is characterized in that, is equipped with the attraction hole of sheet material absorption usefulness in the both sides of described protuberance.
10. chip component feeder as claimed in claim 2 is characterized in that, is equipped with the attraction hole of sheet material absorption usefulness in the both sides of described protuberance.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002002336 | 2002-01-09 | ||
| JP2002002336 | 2002-01-09 | ||
| JP2002058677 | 2002-03-05 | ||
| JP2002058677A JP3870803B2 (en) | 2002-01-09 | 2002-03-05 | Chip component supply device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1431692A true CN1431692A (en) | 2003-07-23 |
| CN1202564C CN1202564C (en) | 2005-05-18 |
Family
ID=26625462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02152276 Expired - Lifetime CN1202564C (en) | 2002-01-09 | 2002-11-19 | Chip Component feeder |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3870803B2 (en) |
| CN (1) | CN1202564C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100495650C (en) * | 2003-09-17 | 2009-06-03 | 株式会社瑞萨科技 | Method of manufacturing semiconductor device |
| CN1942091B (en) * | 2005-09-29 | 2010-12-22 | 株式会社半导体能源研究所 | Pickup device and pickup method |
| CN104043917A (en) * | 2013-03-11 | 2014-09-17 | 德克萨斯仪器股份有限公司 | Die eject assembly for die bonder |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050274457A1 (en) * | 2004-05-28 | 2005-12-15 | Asm Assembly Automation Ltd. | Peeling device for chip detachment |
| JP2015065367A (en) * | 2013-09-26 | 2015-04-09 | 株式会社テセック | Peeling device and pickup system |
| CN112017988B (en) * | 2019-05-31 | 2024-03-19 | 成都辰显光电有限公司 | Transfer apparatus |
| CN116508140A (en) | 2021-03-23 | 2023-07-28 | 株式会社新川 | Method for generating initial peeling of wafer and pick-up device of semiconductor bare chip |
-
2002
- 2002-03-05 JP JP2002058677A patent/JP3870803B2/en not_active Expired - Fee Related
- 2002-11-19 CN CN 02152276 patent/CN1202564C/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100495650C (en) * | 2003-09-17 | 2009-06-03 | 株式会社瑞萨科技 | Method of manufacturing semiconductor device |
| CN1942091B (en) * | 2005-09-29 | 2010-12-22 | 株式会社半导体能源研究所 | Pickup device and pickup method |
| US8137050B2 (en) | 2005-09-29 | 2012-03-20 | Semiconductor Energy Laboratory Co., Ltd. | Pickup device and pickup method |
| CN104043917A (en) * | 2013-03-11 | 2014-09-17 | 德克萨斯仪器股份有限公司 | Die eject assembly for die bonder |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3870803B2 (en) | 2007-01-24 |
| JP2003273195A (en) | 2003-09-26 |
| CN1202564C (en) | 2005-05-18 |
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