CN1424699A - Non-contact cards producing method and non-contact cards thereby - Google Patents
Non-contact cards producing method and non-contact cards thereby Download PDFInfo
- Publication number
- CN1424699A CN1424699A CN 02157667 CN02157667A CN1424699A CN 1424699 A CN1424699 A CN 1424699A CN 02157667 CN02157667 CN 02157667 CN 02157667 A CN02157667 A CN 02157667A CN 1424699 A CN1424699 A CN 1424699A
- Authority
- CN
- China
- Prior art keywords
- coil
- module
- corrosion
- making
- mylar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Credit Cards Or The Like (AREA)
Abstract
This invention discloses a method for manufacturing untouching card used in smart card field and the untouching card manufactured by the method. The manufacturing method includes following steps: A. packing the module; B. making corrosion coil; C. processing the corrosion coil and the module in combination; D. laminating to make card. The untouching card manufactured by this method includes radio-frequency module, module soldering disk, polyester film, PVC card base, as well as coil and film capacitor made by corrosion, coil and film capacitor being electrically connected with the radio-frequency module on the polyester film. The advantageous effect of the invention is that the manufacturing process is simpler, the properties of the products are more stable and reliable and the consistance of the products is higher than prior art because the method of corrosion is used.
Description
Technical field
The invention belongs to field of intelligent cards, relate in particular to the method for making of non-contact card.
Background technology
Now, non-contact card, become indispensable consumption instrument in people's life as transportation card, consumption recreation card etc. with its simple and practical advantage that is difficult to substitute, yet we also know, the conventional method taked when making antenna of the non-contact card of Chu Xianing is the enameled wire coiling in the market, and this mode of production is because of being subjected to the apparatus factor restriction greatly, the production capacity of equipment is very low, production can't realize producing in enormous quantities, if drop into large number quipments, can increase cost again.Moreover influence because of being subjected to human factor with the coil that winding mode is made, coil has modification slightly, will influence the frequency of operation deviation of card, thereby causes the card job insecurity.
Summary of the invention
One of technical issues that need to address of the present invention provide a kind of method of making non-contact card, to overcome low and the defective that manufacturing cost is high of prior art production efficiency.
Another technical matters that the present invention need solve provides the non-contact card that the following method of a kind of usefulness is made.
For solving above-mentioned first technical matters, technical scheme of the present invention may further comprise the steps: one, four fabrication laminations are processed in the combination of module package two, corrosion coil making three, corrosion coil and module
The non-contact card that another technical matters that the present invention will solve promptly utilizes said method to make, it comprises radio-frequency module, the module pad, mylar, PVC card base, also comprise coil and the thin film capacitor made by caustic solution, coil and thin film capacitor and radio-frequency module are electrically connected on the mylar.
Process of the present invention compared with prior art has following beneficial effect, owing to adopted the method for making of corrosion coil, make it simpler and more direct than prior art on manufacturing process, properties of product are more reliable and more stable than prior art, consistance is higher, manufacturing cost obviously reduces, and is more suitable for big production and processing.
Description of drawings
Fig. 1 is the structural representation of non-contact card of the present invention
Embodiment
Below in conjunction with specific embodiment the present invention is elaborated.
As Fig. 1, non-contact card involved in the present invention comprises radio-frequency module 1, module pad 4, mylar 5, PVC card base 6, also comprises coil 3 and the thin film capacitor of being made by caustic solution 2 that coil and thin film capacitor and radio-frequency module are electrically connected on the mylar.
Method involved in the present invention is made non-contact card,
First step operation is a module package.
At first, cut again disk chip thinning to 0.15～0.18mm; Chip after will cutting with machine combines with band with the silver slurry, reaches tangential thrust standard＞500g/mm
2For after semi-manufacture after finishing carry out gold ball bonding, with spun gold the solder joint of chip and band are coupled together, go into a path, and test reaches following standard: vertical direction is broken spun gold, and pulling force need reach standard＞4g; With the black moulding compound chip and spun gold are partly sealed fully, promptly module package must guarantee that the spun gold lead-in wire is intact again.The smooth nothing of module external form cavity, and package area 5.0*4.8MM; Package thickness 0.4MM.Last coding carries out 100% test to the electrical property of module, rejects failed module, utilizes die cutting device die-cut down qualified module.
The second step operation is that corrosion coil is made.
At first carry out the design of corrosion coil, promptly require to calculate antenna equivalent electric sensibility reciprocal according to the module series capacitance, computing formula is L=1/4 Л
2f
2C, f are the modular design optimum resonant frequency; C is a module equivalent series resonant capacitance amount; Parameters such as the size design wire circle of inductance value on request, and the sectional area of definite coil again, live width, line-spacing, thickness.Reserve module in the relevant position by the dress hole, so that the two-layer PVC in the outside can strong bonded in the follow-up lamination.Electric capacity can be according to capacitor design value in the chip generally about tens PF, and the Card Reader of actual card distance adjusts, to reach best Card Reader distance.If optimum resonant frequency is 15-19MHz, the about 3000-5000mm of the sectional area of coil
2The number of turns: 3-6 circle; Live width 1-2mm; Line-spacing 0.2-0.8mm; Begin the manufacturing of corrosion coil then, choose the mylar of thickness from 0.02 to 0.1mm, the conductive coil of the silver-colored material of corrosion on mylar then also can corrode the conductive coil of copper or aluminium material, and the corrosion thickness of conductive coil requires 0.02-0.05mm.Shaping under the 140-150 celsius temperature afterwards.The gross thickness of mylar coil like this, promptly the mylar layer thickness is 0.05 to 0.15mm after adding the corrosion thickness of conductive coil.Next be to make resonance coupling thin-film capacitor, the conducting surface of in parallel one suitable big small size at radio-frequency module electrode two ends, the material of conducting surface is consistent with the material of corrosion coil, overlap to form equivalent capacity at the mylar pros and cons, the size of electric capacity is directly proportional with overlapping area, is inversely proportional to the distance of faying surface.Amount of capacity requires design according to actual chips, to reach best matching effect.
Three-procedure is the combination processing of corrosion coil and module
Printing conductive bonding agent on mylar corrosion coil pad at first, the die-cut module pressing that gets off is being scribbled the mylar of electrically conducting adhesive, be on the film antenna base material, partly (black sealing is after chip is finished the spun gold welding the black sealing of module again, be encapsulated in a kind of protection plastic packaging material of chip outside) embed. the mylar tapping, module weld zone and coil pad join; Through 200-260 degree centigrade of wave-soldering welding module and coil hot setting are coupled together effectively.The product of finishing so can be used as intelligent label, corrodes powerful bonded adhesives as single face, can directly be attached on the article, as intelligent label.
The 4th step operation is the fabrication lamination.
The sandwich layer of above-mentioned the 3rd product finished of step as non-contact card, according to the thickness calibration of card, choose suitable PVC and can be attached to the sandwich layer both sides to PVC in the above by the demand printed text, with laminating machine three sample thing hot pressings are got up, the gross thickness of blocking behind the lamination requires 0.76-0.84mm., the temperature of laminating machine can be set in 130 ℃-140 ℃, and pressure can be set in 8-10Mpa, and pressing is later on again through the die-cut non-contact card that just can become standard.
Claims (8)
1. the method for making of a non-contact card is characterized in that may further comprise the steps:
Module package;
Corrosion coil is made;
The combination processing of corrosion coil and module;
The fabrication lamination;
2. method for making as claimed in claim 1 is characterized in that: corrosion coil is made and is comprised following two steps:
Require to calculate antenna equivalent electric sensibility reciprocal according to the module series capacitance, parameters such as the size design wire circle of inductance value on request, and the sectional area of definite coil again, live width, line-spacing, thickness; Reserve module in the relevant position by the dress hole;
Choose mylar, corrode conductive coil in the above, and shaping at high temperature.
In parallel one conducting surface consistent with the material of corrosion coil is to overlap to form equivalent capacity at the mylar pros and cons at radio-frequency module electrode two ends.
3. method for making as claimed in claim 2 is characterized in that: the corrosion thickness of described conductive coil is 0.02-0.05mm.
4. method for making as claimed in claim 2 is characterized in that: mylar thickness is 0.02-0.1mm.
5. method for making as claimed in claim 2 is characterized in that: corrosion coil is silver, copper or aluminium.
6. method for making as claimed in claim 2 is characterized in that: the shaping temperature is 140-150 ℃.
7. non-contact card, comprise radio-frequency module 1, module pad 4, mylar 5, PVC card base 6, it is characterized in that: also comprise coil 3 and the thin film capacitor 2 made by caustic solution, coil and thin film capacitor and radio-frequency module are electrically connected on the mylar.
8. non-contact card as claimed in claim 8 is characterized in that: the material of coil 3 is silver, aluminium or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02157667 CN1195283C (en) | 2002-12-20 | 2002-12-20 | Non-contact cards producing method and non-contact cards thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02157667 CN1195283C (en) | 2002-12-20 | 2002-12-20 | Non-contact cards producing method and non-contact cards thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1424699A true CN1424699A (en) | 2003-06-18 |
| CN1195283C CN1195283C (en) | 2005-03-30 |
Family
ID=4752965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02157667 Expired - Fee Related CN1195283C (en) | 2002-12-20 | 2002-12-20 | Non-contact cards producing method and non-contact cards thereby |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1195283C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322467C (en) * | 2003-12-30 | 2007-06-20 | 上海东方磁卡工程有限公司 | Manufacturing method of non contact type intelligent low frequency card |
| CN102047500A (en) * | 2008-05-28 | 2011-05-04 | 株式会社村田制作所 | Wireless ic device and component for a wireless ic device |
| CN106503784A (en) * | 2016-10-10 | 2017-03-15 | 杭州潮盛科技有限公司 | RFID label tag and its manufacture craft |
-
2002
- 2002-12-20 CN CN 02157667 patent/CN1195283C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1322467C (en) * | 2003-12-30 | 2007-06-20 | 上海东方磁卡工程有限公司 | Manufacturing method of non contact type intelligent low frequency card |
| CN102047500A (en) * | 2008-05-28 | 2011-05-04 | 株式会社村田制作所 | Wireless ic device and component for a wireless ic device |
| CN106503784A (en) * | 2016-10-10 | 2017-03-15 | 杭州潮盛科技有限公司 | RFID label tag and its manufacture craft |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1195283C (en) | 2005-03-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5598032A (en) | Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module | |
| US20190205722A1 (en) | Implantable electronic tag for tire and assembly process | |
| US7069652B2 (en) | Method for producing laminated smart cards | |
| JP2007150868A (en) | Electronic equipment and method of manufacturing the same | |
| CN2891100Y (en) | Reverse encapsulated electronic tag | |
| CN110472721B (en) | Embedded RFID label | |
| CN102708399A (en) | Soldering and packaging method for biface smart cards | |
| CN1918583B (en) | Electronic device | |
| EP1942446A1 (en) | Connecting part for mounting IC chip, antenna circuit, IC inlet, IC tag and method of adjusting capacitance | |
| WO1999041699A1 (en) | Ic card and its frame | |
| CN1195283C (en) | Non-contact cards producing method and non-contact cards thereby | |
| KR100661479B1 (en) | The manufacturing method of non-contacting rf card and rf cards thereby | |
| CN103679258B (en) | A kind of RF base card of embedded laminates wire type thin film capacitor | |
| CN213518314U (en) | Etching antenna double-interface smart card | |
| CN206774530U (en) | Lead frame for biradical island encapsulated circuit | |
| CN111564272B (en) | Composite fuse resistor and preparation method thereof | |
| CN1203447C (en) | Manufacturing method of non-contact intelligent label, counter | |
| CN207993846U (en) | A kind of encapsulating structure of stent-type electronic tag | |
| CN102376012B (en) | A kind of double-interface smart card | |
| CN109754054A (en) | A kind of high temperature resistant anti-metal electronic tag and packaging technology | |
| JPH061096A (en) | Card-like substrate and manufacture thereof | |
| CN111105001B (en) | Non-contact module packaging intelligent card and preparation method thereof | |
| CN115271018A (en) | Efficient production process of environment-friendly glue-dripping intelligent card | |
| CN220627072U (en) | Metal-resistant electronic tag capable of being implanted into cable | |
| CN207993596U (en) | Plastic packaging patch hot pressing sensitive resistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050330 Termination date: 20141220 |
|
| EXPY | Termination of patent right or utility model |