CN1414394A

CN1414394A - Probe cladding device of probe measuring and testing card

Info

Publication number: CN1414394A
Application number: CN 01136794
Authority: CN
Inventors: 陈文祺
Original assignee: Individual
Current assignee: Individual
Priority date: 2001-10-25
Filing date: 2001-10-25
Publication date: 2003-04-30
Anticipated expiration: 2021-10-25
Also published as: CN1241023C

Abstract

A probe cladding device is used for the probe test card which is installed on the chip test desk to be used to test the chip. The multiple electrodes are made on a circuit board to form the probe test card. The said multiple electrodes are connected to hair thin probes. The one end of the probes is connected to the electrodes, and the other ends of the probes are floating ends. The floating end can detect the contact on the chip. An insulation layer and a metal cladding layer cover the exterior of the probe. The invented technique of the metal clad cladding layer provides good effect of electromagnetic shielding, making the electromagnetic interference among probes decrease effectively. Thus, probes can work normally giving the qualified test.

Description

The cladding device of probe of probe testing device

Technical field

The present invention is meant a kind of being installed on the chip testing board especially relevant for a kind of cladding device of probe of probe testing device, is used for the probe testing device of chip testing, and it can provide good ELECTROMAGNETIC OBSCURANT effect, and is preferable for covering of electromagnetic interference (EMI).

Background technology

Common chip is when test, be through special design with chip testing board (IC tester), load onto a probe testing device (probe card) in its detection head, and the structure of this probe testing device as shown in Figure 1, be a plurality of electrode 20a that on a circuit board 10a, are provided with circular arrangement, these electrodes 20a then is connected with thin probe 30a as hair respectively, make that the other end of these probes 30a is unsettled, can be used for detecting the contact (pad) of chip on the wafer, so that directly to the chip input signal or detect and read output valve, by the control of electron microscope and robotic arm, make that all chips on same wafer can be tested seriatim again.

As shown in Figure 2, above-mentioned common probe 30a makes with conductor, and respectively be coated with the insulation course 31a that one deck is made with plastic material in this probe 30a outside, but when reality is used, because probe 30a adopts closely and is provided with at interval, (electro magnetic interference EMI) produces so have electromagnetic interference (EMI) between probe 30a and the probe 30a, make that probe 30a can't normal operation, make the chip testing qualification rate significantly reduce.

Therefore as from the foregoing, the probe of above-mentioned common probe testing device on reality is used, obviously has inconvenience and awaits improving with shortcoming.

Summary of the invention

Fundamental purpose of the present invention; be to provide a kind of cladding device of probe of probe testing device; it is probe outer setting one metal carbonyl coat at probe testing device; this metal carbonyl coat can provide good ELECTROMAGNETIC OBSCURANT effect; preferable for covering of electromagnetic interference (EMI), can reach the preferable protection effect of covering, make that electromagnetic interference (EMI) effectively reduces between probe and the probe; but the probe normal operation makes the chip testing qualification rate significantly improve.

In order to achieve the above object, the invention provides a kind of cladding device of probe of probe testing device, it is to be provided with a plurality of electrodes to be connected with probe respectively on a circuit board, and the other end of these probes is unsettled, can be used for detecting the contact of chip on the wafer, these probe outsides respectively are coated with an insulation course and a metal carbonyl coat is formed, and this insulation course is coated on the probe outside, and this metal carbonyl coat is coated on the insulation course outside.

Description of drawings

Fig. 1 is the stereographic map of common probe testing device;

Fig. 2 is the cut-open view of the probe of common probe testing device;

Fig. 3 is the stereographic map of probe testing device of the present invention;

Fig. 4 is the cut-open view of the probe of probe testing device of the present invention.

10a: circuit board

20a: electrode

30a: probe

31a: insulation course

10: circuit board

20: electrode

30: probe

31: insulation course

32: metal carbonyl coat

Embodiment

See also Fig. 3 and Fig. 4, the invention provides a kind of cladding device of probe of probe testing device, this probe testing device can be installed on the detection head of chip testing board (IC tester), test for use in chip, and the structure of this probe testing device is to be provided with a plurality of electrodes 20 on a circuit board 10, the arrangement of these electrodes 20 does not limit, can do different variations according to need, these electrodes 20 then are connected with thin probe 30 as hair respectively, these probes 30 are connected to electrode 20 with welding manner, and the other end of these probes 30 is unsettled, can be used for detecting the contact of chip on the wafer.

Probe of the present invention 30 is made with conductors such as tungsten filaments, its outside respectively is coated with an insulation course 31 and a metal carbonyl coat 32, this insulation course 31 is made with plastic material, this insulation course 31 is coated on probe 30 outsides, 32 of this metal carbonyl coats are made with metal material, this metal carbonyl coat 32 is coated on insulation course 31 outsides, and promptly insulation course 31 and metal carbonyl coat 32 are coated on probe 30 outsides simultaneously; By above-mentioned composition to form the cladding device of probe of probe testing device of the present invention.

This insulation course 31 and metal carbonyl coat 32 are coated on probe 30 outsides, but probe 30 2 ends need suitable insulation course 31 and the metal carbonyl coat 32 of stretching out, make these probe 30 1 ends be connected to electrode 20 with welding manner, and these probe 30 other ends, can be used for detecting the contact of chip on the wafer, so that,, make that all chips on same wafer can be tested seriatim again by the control of electron microscope and robotic arm directly to the chip input signal or detect and read output valve.

The present invention mainly is probe outer setting one metal carbonyl coat 32 at probe testing device; this metal carbonyl coat 32 can provide good ELECTROMAGNETIC OBSCURANT effect; preferable for covering of electromagnetic interference (EMI); can reach the preferable protection effect of covering; so electromagnetic interference (EMI) is effectively reduced between probe 30 and the probe 30; but make and probe 30 normal operations make the chip testing qualification rate significantly improve.

In sum, the present invention can make the probe of probe testing device that good ELECTROMAGNETIC OBSCURANT effect is provided, and makes the chip testing qualification rate significantly improve.

Claims

1, a kind of cladding device of probe of probe testing device, it is characterized in that, on a circuit board, be provided with a plurality of electrodes and be connected with probe respectively, and the other end of these probes is unsettled, can be used for detecting the contact of chip on the wafer, these probes respectively are coated with an insulation course and a metal carbonyl coat, and this insulation course is coated on the probe outside, and this metal carbonyl coat is coated on the insulation course outside.

2, the cladding device of probe of probe testing device as claimed in claim 1 is characterized in that, the insulation course of these probes is to make with plastic material.