CN1408895A - ITO sputtering target - Google Patents
ITO sputtering target Download PDFInfo
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- CN1408895A CN1408895A CN02142798A CN02142798A CN1408895A CN 1408895 A CN1408895 A CN 1408895A CN 02142798 A CN02142798 A CN 02142798A CN 02142798 A CN02142798 A CN 02142798A CN 1408895 A CN1408895 A CN 1408895A
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- target
- ito
- film
- sputtering target
- sputter
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- 238000005477 sputtering target Methods 0.000 title claims abstract description 28
- 238000000227 grinding Methods 0.000 claims abstract description 31
- 238000004544 sputter deposition Methods 0.000 claims abstract description 14
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims description 38
- 230000003746 surface roughness Effects 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 67
- 230000015572 biosynthetic process Effects 0.000 abstract description 7
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 229910003437 indium oxide Inorganic materials 0.000 abstract 1
- 239000010409 thin film Substances 0.000 abstract 1
- 229910001887 tin oxide Inorganic materials 0.000 abstract 1
- 238000000034 method Methods 0.000 description 39
- 238000010891 electric arc Methods 0.000 description 20
- 238000009825 accumulation Methods 0.000 description 9
- 239000000843 powder Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 230000010354 integration Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 6
- 238000005245 sintering Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000000428 dust Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000001914 filtration Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- VIKNJXKGJWUCNN-XGXHKTLJSA-N norethisterone Chemical compound O=C1CC[C@@H]2[C@H]3CC[C@](C)([C@](CC4)(O)C#C)[C@@H]4[C@@H]3CCC2=C1 VIKNJXKGJWUCNN-XGXHKTLJSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000001755 magnetron sputter deposition Methods 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000006187 pill Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000005342 ion exchange Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N iron(II,III) oxide Inorganic materials O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000803 paradoxical effect Effects 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 239000002195 soluble material Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
- C04B35/457—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates based on tin oxides or stannates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/086—Oxides of zinc, germanium, cadmium, indium, tin, thallium or bismuth
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
The present invention provides an ITO sputtering target comprising a target produced through a machine grinding step and made of an oxide (ITO) containing at least one of indium oxide and tin oxide and an ITO film having a film thickness of more than 1 mum that is formed on a sputter surface of the target. According to the present invention, a sputtering target capable of effectively reducing occurrence of initial arc and having high initial stability can be obtained. By conducting sputtering using this sputtering target, formation of thin films having high performance can be effectively carried out with enhanced productivity. Further, since finish grinding is omissible, the grinding step can be simplified and the cost can be decreased.
Description
Technical field
The present invention relates to the ITO sputtering target.
Background technology
So far, known sputtering method is one of film forming method.So-called sputtering method, normally under reduced pressure rare gas element with the plasmoid impact target, make the molecule that flies out from target and atomic deposition on substrate by this energy, thereby on substrate, form film, therefore this method can be used for industrial owing to can big area use and obtain easily high performance membrane.
In recent years, as the sputter mode, known have: thus the reactive sputtering method of carrying out sputter in reactant gas is provided with magnetite so that the magnetron sputtering system that film forms at a high speed in the target the inside.
In the film that forms by these sputtering methods, particularly contain Indium sesquioxide (In
2O
3) and stannic oxide (SnO
2) at least a oxide compound (hereinafter referred to as ITO (indium tin oxide)) film because the visible light transmission height, electroconductibility is also high, therefore is widely used as the nesa coating of liquid crystal indicator and prevents heating film and the infrared reflection film that the glass dewfall is used.
But, when forming this high performance film, have following problem by sputtering method.
That is to say, during sputter, when particularly beginning the initial stage of sputter, can produce the paradoxical discharge that is called electric arc (arcing), this not only damages into membrane stability, and sputtering target (being designated hereinafter simply as target) goes up deposit and gather particle, and generation is called the black deposit of agglomerate (nodule), this causes producing electric arc, and has produced new particle by electric arc.In addition,, can make the film performance variation, cause film defects if this particle is deposited on the film.
Particularly from be provided with new sputtering target just begun then to be splashed to do not produce electric arc (hereinafter referred to as initial arc) thus the time that can make goods must dally, this has influenced the raising of productivity.
Up to now, make it smoothly to reduce the generation of this electric arc and agglomerate by grinding target surface, therefore the surface becomes present main flow through the surfacing target of smoothing processing.For example, speciallyying permit No. 2750486 communique and No. 3152108 communique of special permission etc. has put down in writing by the target surfaceness is prevented from produce the ITO sputtering target of electric arc and agglomerate in specialized range.But this method is the surfaceness that reaches regulation, must be after making target roughly grinds to cut by mechanical grinding and adjusts its thickness, progressively carries out fine ginding (grinding) then and makes the target surface smoothing, the problem that this exists manufacturing time and cost to increase.In addition, even in the ITO target of making thus, can not prevent initial arc, after being set, new sputtering target must carry out the idle running of long period with regulation surfaceness.
In addition, specially permit in No. 3040432 communique, put down in writing by in containing the atmosphere of reactant gases, the target that partly is made of metallic compound part and metal being carried out the sputtering target that metal that pre-sputter obtains is formed with metal compound film on partly.Divide combination by described target and metal part, not only reduced the cost of target itself, also reduced the gas of emitting, thereby improved film performance, complicated problems but the production process of existence formation target becomes.
In the Te Kaiping 11-92923 communique, put down in writing by the plating thing that generates when film suppresses sputter is set on the target surface and peeled off, thereby prevented dust, and improved the sputtering target of film article productive rate.But, suppress the purpose that the surperficial plating thing that generates of target is peeled off in order to reach, just can not suppress initial arc.
The present inventor furthers investigate these situations, found that it is that to form the particulate position from sur-face peeling be the major cause that causes electric arc and agglomerate for the initial stage particle that is present in the target surface that caused by grinding process etc. and the thermal shocking during because of sputter, by forming ITO film with specific thickness with other approach plating on the sputter face of ITO target, can prevent the generation of initial arc, finish the present invention thus.
Summary of the invention
The purpose of this invention is to provide the ITO sputtering target that can prevent that initial arc generation, primary stability height, productivity from significantly improving.
The feature of ITO sputtering target involved in the present invention is, through mechanical grinding by the sputter face that contains the target that oxide compound at least a in Indium sesquioxide and the stannic oxide (ITO) forms on plating thickness above 1 micron, be preferably more than 1.5 microns, the ITO film more than 2 microns more preferably.
In addition, the surface roughness Ra of ITO sputtering target involved in the present invention is more than 1 micron, also can be more than 1.5 microns, can also be more than 2 microns.In this specification sheets, surface roughness Ra is meant the arithmetic average roughness of the roughness curve of measuring according to JIS B0601 (1994).
Among the present invention, the film that the ITO film that plating forms at least one sputter face of ITO target is preferably formed by the sputtering method plating.
Thus, among the present invention, formation has the ITO film of specific thickness on the sputter face of ITO target, thereby has effectively prevented to produce electric arc from the sputter initial stage.
Description of drawings
Fig. 1 is the thickness of the ITO film that plating forms on the sputter face of target and the graph of a relation of initial arc characteristic.
Specifying of invention
Below, the present invention is specifically described.
Usually, the ITO target is to be made by following sintering process: material powder is mixed with the proportioning of regulation, again with so far known various dry process or damp process shaping, roasting (sintering), mechanical grinding then.
Dry process for example has CP (colding pressing) method and HP (hot pressing) method and HIP (high temperature insostatic pressing (HIP) power) method. The CP method is the material powder through mixing to be packed into make formed body in the shaping dies, roasting under air atmosphere or oxygen atmosphere (sintering). The HP method is in the shaping dies with the electric furnace inside of packing into through the material powder that mixes, adds to depress in heating to form simultaneously and sintering. The HIP method is that the material powder that will mix or preform are enclosed the sack such as rubber or at high temperature also formed in the metal forming etc. of nappe, inserts in the container after degassed again, passes into the inert atmosphere medium and carries out the isotropism pressurization and add simultaneously thermal bake-out.
Damp process for example has the filtering type method of forming of putting down in writing in the Unexamined Patent 11-286002 communique. This filtering type forming process is used the filtering type shaping dies that can obtain by decompression draining from the ceramic raw material slurries non-water soluble material formation of formed body, in this filtering type shaping dies, inject the slurries that formed by the material powder, ion exchange water and the organic additive that mix, with the slurries draining of reducing pressure, make formed body, with this formed body drying defatted, then roasting (sintering).
Usually, like this with raw material after mould internal shaping and roasting (sintering), also will this sintered body be shaped through mechanical grinding be processed as given size, then is adhered to backing plate backing plate) on make target.
Wherein, mechanical grinding should adopt methods such as plane grinding, rotary grinding or sandblast where necessary usually, after the aforesaid grinding of processing that is used to be shaped, the surface roughly ground cut to adjust its thickness, the particle that progressively reduces grinding stone then carries out fine ginding (hereinafter referred to as grinding) so that the surface is more level and smooth, perhaps carries out grinding (following and fine ginding be collectively referred to as grinding) as the projection material with sandblast with granulated glass sphere, the pill of aluminium and zirconium pearl etc.
Feature of the present invention be on through the sputter face of the ITO target of such mechanical grinding operation plating the ITO film of specific thickness, by thus on the sputter face of target plating form the ITO film, the position that burr that is produced by grinding and powder and the thermal shocking during because of sputter are peeled off easily is with ITO plating and bonding, can obtain good target surface, the initial arc when therefore having reduced sputter effectively.
The method of plating formation ITO film preferably for example has sputtering method, vapour deposition method, ion plating, coating method and spray method like this.Wherein, from easy adjustment thickness and consideration economically, sputtering method is more preferred.
Among the present invention, the composition of the ITO film that plating forms on the sputter face of the target preferably ratio of components with the ITO that forms target is identical, but only otherwise contain element beyond the target component, also not necessarily will have the same composition ratio.
In addition, among the present invention,, measure in order to following method in this specification sheets though the methods such as cross section microscopic examination of the available scanning electronic microscope of thickness (SEM) of the ITO film that plating forms on the sputter face of target are measured.That is, on glass substrate, form the ITO film in advance, measure thickness, calculate rate of film build (nm/sec) by this thickness and the required sputtering time of film forming then, determine thickness by sputtering time by the difference of height of glass substrate and ITO film with sputter.Specifically, this method is as substrate with glass substrate (corning society makes #7059), after forming the ITO film by sputter, measure difference of height between the position that glass substrate and glass substrate be provided with the ITO film with Dektak II A (manufacturing of Sloan Technology society), measure the thickness of ITO film.Can obtain rate of film build from the thickness and the required sputtering time of film forming of the ITO film of trying to achieve thus.
Among the present invention, the thickness of the ITO film that plating forms on the target surface preferably surpasses 1 micron, more preferably more than 1.5 microns, is preferably 2 microns especially.
If the thickness of ITO film surpasses 1 micron, the accumulation electric arc number of times during sputter obviously reduces, and the initial arc characteristic is good.The thickness of ITO film is more than above-mentioned scope, usually below 5 microns.
Among the present invention, the available following mode of the evaluation of the initial arc characteristic of target: use arc detector (MAMGenesis) (manufacturing of Landmard Technology society) as measuring apparatus, when using the target that forms the ITO film by other approach plating on its sputter face to carry out sputter, by with respect to the electric quantity integration value on the input target unit surface in the unit time (integration import the electric weight watt hr/centimetre
2) accumulation electric arc number of times estimate.We can say that not only the accumulation electric arc number of times with respect to integration input electric weight is few, and the initial arc characteristic is good.In addition, because the electric arc number of times is few, so the life-span of target is also long, therefore long-term film forming good stability.
According to the present invention, form ITO film by plating on sputter face with specific thickness, can effectively reduce initial arc, even the essential target that makes the surface also can obtain effectively to carry out sputter before not necessarily will carrying out for level and smooth grinding (fine ginding) as the minute surface.That is to say, the surfaceness of sputtering target of the present invention (arithmetic average roughness) is though Ra depends on the condition of surface of target behind the mechanical grinding, but can be than preferably 0.5 micron bigger in the past, specifically, surface roughness Ra can be more than 1 micron, also can be more than 1.5 microns, also can be more than 2 microns.On the other hand, the Ra that also there is no need target is below 0.5 micron the time, and the present invention also can be suitable for.
Therefore, can omit grinding process, form the ITO film by plating on the sputter face of target and can effectively obtain sputtering target in suitable occasion of the present invention.
In addition, can after plating on the ITO target behind the mechanical grinding forms the ITO film, it be adhered on the backing plate, make final sputtering target with common method, but preferably be adhered on the backing plate with the ITO target of common method after with mechanical grinding, plating forms the ITO film then.As the latter, can prevent to adhere on the sputter face after plating forms the ITO film impurity such as dust.
By the present invention, can obtain effectively to reduce the high sputtering target of primary stability that initial arc produces, carry out sputter by using this sputtering target, can form high performance film effectively with high productivity.In addition, owing to can save the fine ginding operation, thus can also simplify grinding process, and reduce cost.
Embodiment
Followingly be described more specifically the present invention, but the invention is not restricted to these embodiment with reference to embodiment.
Embodiment 1
With In
2O
3Powder and SnO
2Powder is with In
2O
3: SnO
2The ratio of=90: 10 quality % mixes, and makes the ITO sintered compact with common method, as target.This target is cut into the size of 4 inches of φ, cuts the surface (sputter face) that is used for sputter and be used for this two sides, adherent surface (adhesive face) with the plane grinding mill then, it is adjusted into 6 microns thickness, then with diamond abrasive tool grinding sputter face.
Anode side at sputter equipment is provided with this target, at cathode side another ITO target is set, and carries out sputter under following condition, and to form thickness be the ITO film of 135000 dusts (1.35 microns) to plating on the sputter face of the target of anode side.
Sputtering condition and the sputter mode of this moment are: DC magnetron sputtering machine, process gas: Ar, pressure process: 3 milli torrs, oxygen partial pressure: 0.02 milli torr, input electric power: 3 watts/centimetre
2
Measure the surfaceness that ITO film plating forms the sputter face of front and back target according to JIS B 0601, it the results are shown in table 1.Surfaceness is measured as the surfaceness meter with SE1700 (little Ban Yanjiusuoshe make), at the contact pilotage radius: 2 microns, transfer rate: 0.5 mm/second, point cut-off (cut-off): 0.8 millimeter of λ c, evaluation length: measure under 4 millimeters the condition.
Embodiment 2
The thickness of the ITO film that plating forms on the sputter face that makes target is that (2.7 microns, all the other are according to making target with embodiment 1 identical method for 27000 dusts.With measuring the surfaceness that ITO film plating forms front and back with embodiment 1 identical method.It the results are shown in table 1.
Embodiment 3
Except sputter face and this two sides of adhesive face of cutting target with plane grinding dish corase grind, it is adjusted into after 6 mm thick, carrying out sandblasting with the pill of aluminium replaces with diamond abrasive tool grinding sputter face, and the thickness that makes the ITO film that plating forms on the sputter face of target be 27000 dusts (2.7 microns) in addition, all the other are by making target with embodiment 1 identical method.With measuring the surfaceness that ITO film plating forms front and back with embodiment 1 identical method.It the results are shown in table 1.
Comparative example 1
The thickness of the ITO film that plating forms on the sputter face that makes target is 1350 dusts (0.135 micron), and all the other are by making target with embodiment 1 identical method.With measuring the surfaceness that ITO film plating forms front and back with embodiment 1 identical method.It the results are shown in table 1.
Comparative example 2
The thickness of the ITO film that plating forms on the sputter face that makes target is 9450 dusts (0.945 micron), and all the other are by making target with embodiment 1 identical method.With measuring the surfaceness that ITO film plating forms front and back with embodiment 1 identical method.It the results are shown in table 1.
Experimental example
The target that uses embodiment 1-3 and comparative example 1,2 to make, the following sputtering condition of sputter mode: DC magnetron sputtering machine, process gas are that Ar, pressure process are that 3 milli torrs, oxygen partial pressure are that 0.02 milli torr, input electric power are 3 watts/centimetre
2, be carried out to film test, the initial arc characteristic when estimating sputter.
By with respect to integration input electric weight (watt/centimetre
2) accumulation electric arc number of times estimate the initial arc characteristic.We can say that not only the accumulation electric arc number of times with respect to integration input electric weight is few, and the initial arc characteristic is good.
Specifically, with arc detector (MAM Genesis) (manufacturing of Landmark Technology society) as the electric arc counter, with following detection mode as measuring condition: energy, electric arc measuring voltage are that 100 volts, big-middle energy limit are burnt, the minimum times of hard arc of 50 millis: 100 microseconds, the integration input electric weight of measuring up to sputter is 3 watts/centimetre
2The time accumulation electric arc number of times.It the results are shown in table 1.
Table 1
| Sample | Thickness (dust) | Surfaceness (micron) before film forms | Surfaceness after film forms (micron) | Accumulation electric arc number of times (inferior) |
| Embodiment 1 | ??13500 | ????1.32 | ????1.53 | ????17 |
| Embodiment 2 | ??27000 | ????1.33 | ????1.45 | ????1 |
| Embodiment 3 | ??27000 | ????2.41 | ????2.43 | ????5 |
| Comparative example 1 | ??1350 | ????1.28 | ????1.27 | ????66 |
| Comparative example 2 | ??9450 | ????1.37 | ????1.37 | ????50 |
As known from Table 1, the surface roughness Ra on the target surface before and after the plating formation ITO film does not have much difference, and the Ra on the target surface behind the plating formation ITO film depends on that plating forms the condition of surface of the preceding target of ITO film.
Using the evaluation result of the initial arc characteristic of embodiment 1-3 and comparative example 1,2 to be shown in Fig. 1, is transverse axis with thickness (dust) wherein, is the longitudinal axis with accumulation electric arc number of times (inferior).
From table 1 and Fig. 1 as can be known, the thickness of the ITO film that forms with plating on the target surface is the boundary when being 10000 dusts, has effectively reduced accumulation electric arc number of times, and when the thickness of the ITO film that forms when plating on the target surface surpassed 1 micron, the initial arc characteristic was good.
Claims (7)
1.ITO sputtering target is characterized in that, it be through mechanical grinding by the ITO film of thickness that contained on the sputter face that oxide compound at least a in Indium sesquioxide and the stannic oxide is the target formed of ITO plating above 1 micron.
2. ITO sputtering target as claimed in claim 1 is characterized in that, the thickness of described ITO film is more than 1.5 microns.
3. ITO sputtering target as claimed in claim 1 is characterized in that, the thickness of described ITO film is more than 2 microns.
4. as any one described ITO sputtering target among the claim 1-3, it is characterized in that the surface roughness Ra of described sputter face is more than 1 micron.
5. as any one described ITO sputtering target among the claim 1-3, it is characterized in that the surface roughness Ra of described sputter face is more than 1.5 microns.
6. as any one described ITO sputtering target among the claim 1-3, it is characterized in that the surface roughness Ra of described sputter face is more than 2 microns.
7. as any one described ITO sputtering target among the claim 1-6, it is characterized in that the ITO film that plating forms at least one sputter face of described ITO sputtering target is the film that is formed by the sputtering method plating.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001283657 | 2001-09-18 | ||
| JP2001283657A JP2003089868A (en) | 2001-09-18 | 2001-09-18 | Ito sputtering target |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1408895A true CN1408895A (en) | 2003-04-09 |
| CN1207432C CN1207432C (en) | 2005-06-22 |
Family
ID=19107111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021427984A Expired - Fee Related CN1207432C (en) | 2001-09-18 | 2002-09-18 | ITO sputtering target |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP2003089868A (en) |
| KR (1) | KR100495886B1 (en) |
| CN (1) | CN1207432C (en) |
| SG (1) | SG108871A1 (en) |
| TW (1) | TWI242050B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4846872B2 (en) | 2009-03-03 | 2011-12-28 | Ｊｘ日鉱日石金属株式会社 | Sputtering target and manufacturing method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09324263A (en) * | 1996-06-06 | 1997-12-16 | Sumitomo Bakelite Co Ltd | Sputtering target |
| DE19855726A1 (en) * | 1998-12-03 | 2000-06-08 | Leybold Systems Gmbh | Sputtering cathode for coating substrates |
-
2001
- 2001-09-18 JP JP2001283657A patent/JP2003089868A/en active Pending
-
2002
- 2002-09-03 TW TW091120105A patent/TWI242050B/en not_active IP Right Cessation
- 2002-09-13 KR KR10-2002-0055703A patent/KR100495886B1/en not_active IP Right Cessation
- 2002-09-17 SG SG200205611A patent/SG108871A1/en unknown
- 2002-09-18 CN CNB021427984A patent/CN1207432C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TWI242050B (en) | 2005-10-21 |
| SG108871A1 (en) | 2005-02-28 |
| CN1207432C (en) | 2005-06-22 |
| KR20030024589A (en) | 2003-03-26 |
| KR100495886B1 (en) | 2005-06-16 |
| JP2003089868A (en) | 2003-03-28 |
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