CN1398698A - Clean-free liquid flux - Google Patents
Clean-free liquid flux Download PDFInfo
- Publication number
- CN1398698A CN1398698A CN 01128513 CN01128513A CN1398698A CN 1398698 A CN1398698 A CN 1398698A CN 01128513 CN01128513 CN 01128513 CN 01128513 A CN01128513 A CN 01128513A CN 1398698 A CN1398698 A CN 1398698A
- Authority
- CN
- China
- Prior art keywords
- free liquid
- clean
- acid
- synthetic resin
- derivative
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000004907 flux Effects 0.000 title claims abstract description 15
- 239000007788 liquid Substances 0.000 title claims abstract description 15
- 239000000057 synthetic resin Substances 0.000 claims abstract description 11
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 11
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims abstract description 6
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 9
- 239000004094 surface-active agent Substances 0.000 claims description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 6
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 150000001408 amides Chemical class 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 241001272567 Hominoidea Species 0.000 claims description 2
- -1 carboxylic acid amine Chemical class 0.000 claims description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 claims description 2
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 5
- 239000007787 solid Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000005476 soldering Methods 0.000 abstract description 2
- 150000001990 dicarboxylic acid derivatives Chemical class 0.000 abstract 1
- 239000002736 nonionic surfactant Substances 0.000 abstract 1
- 239000000843 powder Substances 0.000 description 11
- 238000003466 welding Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000007524 organic acids Chemical class 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 125000005600 alkyl phosphonate group Chemical group 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012459 cleaning agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000000640 hydroxylating effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Abstract
A cleaning-free liquid flux is used for soldering in electronic industry. It is prepared with fatty monocarboxylic acid derivative, fatty dicarboxylic acid derivative, non-ionic surfactant, synthetic resin and organic solvent by the routine technological process. It has good solderability, low solid content, little ion pollution, no corrosion, high surface insulating resistance and relatively high cleanness, and may be used in the available technological equipment.
Description
Technical field:
The present invention relates to a kind of clean-free liquid flux of electron and electrician industry PCB welding usefulness.
Background technology:
At present, advancing by leaps and bounds of electron and electrician industry, also have higher requirement with material for the solder that matches with it, simultaneously, the importance of health is also more and more paid attention to by people, advocated and taked a series of measure by developed country, be used to improve the earth environment that the mankind depend on for existence, Environmental Protection Administration of the United Nations has also proposed the requirement of the material of the harmful atmospheric environment of time limit change.And the electron and electrician industry is because very high to the reliability requirement of portioned product; existing scaling powder is owing to the reason of aspect of performance; after welding, must clean the performance that could guarantee product to weldment; and the cleaning agent major part of using now all is fluorine-containing; the hydrocarbon compound of chlorine substituent; this type of material has serious destruction to atmospheric ozone layer; belong to necessary time limit that Environmental Protection Administration of the United Nations proposes and forbid the scope of producing and using; simultaneously this type of material has very big toxic action equally to operative employee healthy; at above factor; the electron and electrician industry presses for to be improved existing processes; to reach the purpose of protection human body and atmospheric environment; wherein an important measures is exactly to adopt the scaling powder of exempting from cleaning-type; the domestic research institute that no-clean scaling powder is also arranged; but foaming is good inadequately during the welding of ubiquity no-clean scaling powder; be used for spraying apparatus, postwelding is full inadequately more, and surface insulation resistance is not really high.Once announced on Chinese patent that notification number was that 1131076 " no-clean scaling powder " is by deionized water, contain 5 C following organic dibasic acid or hydroxylating organic acid, the multicomponent organic acid that contains 3 to 7 C, water-soluble polymer, the alkylphosphonate or the surfactant F501 that contain 3 to 8 C are the liquid soldering flux that raw material is mixed and made into by a certain percentage.
The Chinese patent notification number is 1209374 " low solid-material content cleaning-free scaling powder ", mainly by adipic acid, succinic acid, surfactant, benzotriazole, single-stearic acid glyceride, ethylene glycol monobutyl ether, ethyl acetate, ethanol and isopropyl alcohol are raw material, be prepared from general conventional production process, the activator of these no-clean scaling powders is the organic acid of ionic, and the surface insulation resistance after the welding is not high enough.
Summary of the invention:
The object of the present invention is to provide a kind of solderability good, solid content is low, and ionic pollution degree is little, does not have corrosion, the surface insulation resistance height, and what have higher cleanliness factor exempts from the cleaning liquid solder flux.
The present invention is made up of following material by weight percentage:
Aliphat monocarboxylic acid derivative 0.1-4%
Aliphatic dicarboxylic acid and derivative 0.1-4% thereof
Nonionic surface active agent 0.01-2%
Synthetic resin 0.1-5%
Organic solvent 85-98%
Concrete preparation method is:
1, the raw material acid amides of synthetic resin, additive, rosin etc. are put into jacket reactor, the synthetic resin that obtains modification is as polyamide, modified rosin resin etc.
2, at first organic solvent is added reactor by weight percentage, add surfactant, aliphat monocarboxylic acid derivative, aliphatic dicarboxylic acid and derivative thereof, the modified synthetic resin of nonionic more by weight percentage respectively.
3, stirred 90-120 minute in reactor, discharging detects then, makes finished product.
The present invention becomes modified synthetic resin with resin, the increased activity of resin like this, foaminess is strengthened, and can about 245 ℃, can partly decompose, residual reduction after the welding, visual residual few, the activating agent of former traditional product mostly is adipic acid, organic amine halogen acid salt of ionic etc., these materials are in the activity that truly has in when welding, but postwelding corrosivity is also strong, and residue is very big to the infringement of PCB, when welding, the activator of modification can guarantee to have activity, the residual of postwelding has any injury to PCB hardly, really reached noresidue, the purpose of exempting to clean.
No-clean scaling powder Performance Detection table of the present invention
| Test item | Normal data | Testing result | |
| Outward appearance | Clear | Clear | |
| Solids content (%) | ????≤10 | ????2.0 | |
| The rate of spread (%) | ????≥80 | ????83 | |
| The bronze mirror corrosion | Nothing penetrates | Nothing penetrates | |
| Content of halogen (%) | Do not have | Do not detect | |
| Ionic pollution degree (μ gNaCl/cm 2) | ????＜3.0 | ????1.8 | |
| Insulation resistance (Ω) | Before the weldering | ????＞1.0×10 11 | ????1.6×10 12 |
| Postwelding | ????＞1.0×10 11 | ????1.8×10 12 | |
The performance table of comparisons of no-clean scaling powder of the present invention and like product
| Test item | Detect data | Contrasting data * |
| Outward appearance | Clear | Clear |
| Solids content (%) | ????2.0 | ????2.2 |
| The rate of spread (%) | ????83 | ????82.5 |
| The bronze mirror corrosion | Nothing penetrates | Penetrate |
| Content of halogen (%) | Do not detect | Do not detect |
| Ionic pollution degree (μ gNaCl/cm 2) | ????1.8 | ????1.9 |
| Postwelding insulation resistance (Ω) | ????1.8×10 12 | ????3.9×10 11 |
| Flash-point (T.o.c) (℃) | ????15 | ????15 |
*Reference product is the import no-clean scaling powder.
By the table of comparisons as seen, the every compared with similar products index of the present invention is better than like product especially more illustrates modified resins, activator aspect corrosion experiment excellent effect.
Embodiment:
Below in conjunction with specific embodiment no-clean scaling powder of the present invention is described
Embodiment 1: the aliphat monocarboxylic acid derivative of clean-free liquid flux of the present invention is selected carboxylate, amine, the acid amides of C12-C18 for use.
Embodiment 2: the aliphatic dicarboxylic acid of clean-free liquid flux of the present invention and derivative thereof are selected the carboxylic acid of C4-C10 or ester, amine, acid amides for use.
Embodiment 3: the organic solvent of clean-free liquid flux of the present invention is selected methyl alcohol, ethanol or isopropyl alcohol or its several mixtures for use.
Embodiment 4: the nonionic surface active agent that clean-free liquid flux of the present invention is selected for use can be chosen one or the combination of the two wantonly from APES, AEO.
Embodiment 5: the synthetic resin that clean-free liquid flux of the present invention is selected for use is softening point 80-130 ℃ modified synthetic resin.
Claims (4)
1, a kind of electron and electrician already welds the clean-free liquid flux of usefulness, it is characterized in that by weight composed as follows:
Aliphat monocarboxylic acid derivative 0.1-4%
Aliphatic dicarboxylic acid and derivative 0.1-4% thereof
Nonionic surface active agent 0.01-2%
Synthetic resin 0.1-5%
Organic solvent 85-98%
2, according to the described clean-free liquid flux of claim 1, it is characterized in that: aliphat monocarboxylic acid derivative is carboxylic acid amine, acid amides, the fat of C12-C18; Aliphatic dicarboxylic acid and derivative thereof are the carboxylic acid of C4-C10 and fat, amine, acid amides; Organic solvent is ethanol, isopropyl alcohol, methyl alcohol or its two kinds of three kinds of mixtures.
3, according to claim 1 or 2 described clean-free liquid fluxes, it is characterized in that: nonionic surface active agent can be selected APES, AEO or its mixture for use.
4, according to claim 1 or 2 or 3 described clean-free liquid fluxes, it is characterized in that: synthetic resin is softening point 80-130 ℃ modified synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01128513 CN1218811C (en) | 2001-07-25 | 2001-07-25 | Clean-free liquid flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01128513 CN1218811C (en) | 2001-07-25 | 2001-07-25 | Clean-free liquid flux |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1398698A true CN1398698A (en) | 2003-02-26 |
| CN1218811C CN1218811C (en) | 2005-09-14 |
Family
ID=4668362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01128513 Expired - Fee Related CN1218811C (en) | 2001-07-25 | 2001-07-25 | Clean-free liquid flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1218811C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
| CN1308114C (en) * | 2004-10-12 | 2007-04-04 | 哈尔滨商业大学 | Use of 1-methyl-4-isopropyl-bicyclic [2,2,2] octene-2,3-dicarboxylic acid |
| US8853417B2 (en) | 2009-12-03 | 2014-10-07 | Hunan Astar Biotechnology Ltd. | Non-halogen activating agent used as flux |
| CN106216883A (en) * | 2016-07-19 | 2016-12-14 | 徐州工程学院 | A kind of for Cu Mg Sn Fe composite nano materials laser scaling powder and preparation method thereof |
| CN107175432A (en) * | 2017-06-05 | 2017-09-19 | 苏州龙腾万里化工科技有限公司 | A kind of lead-free solder Special wear-resistant no-clean scaling powder |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103737200A (en) * | 2013-08-27 | 2014-04-23 | 工业和信息化部电子第五研究所华东分所 | Water-based environment-friendly scaling powder |
-
2001
- 2001-07-25 CN CN 01128513 patent/CN1218811C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1307024C (en) * | 2004-05-09 | 2007-03-28 | 邓和升 | High adhesion leadless soldering tin grease |
| CN1308114C (en) * | 2004-10-12 | 2007-04-04 | 哈尔滨商业大学 | Use of 1-methyl-4-isopropyl-bicyclic [2,2,2] octene-2,3-dicarboxylic acid |
| US8853417B2 (en) | 2009-12-03 | 2014-10-07 | Hunan Astar Biotechnology Ltd. | Non-halogen activating agent used as flux |
| CN106216883A (en) * | 2016-07-19 | 2016-12-14 | 徐州工程学院 | A kind of for Cu Mg Sn Fe composite nano materials laser scaling powder and preparation method thereof |
| CN106216883B (en) * | 2016-07-19 | 2018-02-13 | 徐州工程学院 | One kind is used for Cu Mg Sn Fe composite nano materials laser scaling powders and preparation method thereof |
| CN107175432A (en) * | 2017-06-05 | 2017-09-19 | 苏州龙腾万里化工科技有限公司 | A kind of lead-free solder Special wear-resistant no-clean scaling powder |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1218811C (en) | 2005-09-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHENZHOU JINJIAN SOLDER LTD. Free format text: FORMER OWNER: DENG HESHENG Effective date: 20060210 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20060210 Address after: 423000 science and Technology Industrial Zone, Chenzhou Development Zone, Hunan Patentee after: Chenzhou Gold Arrow Solder Co., Ltd. Address before: 423000 Hunan city of Chenzhou Province Economic and Technological Development Zone Wan Hua Lu Chenzhou Jinjian solder Co Ltd Patentee before: Deng Hesheng |
|
| DD01 | Delivery of document by public notice |
Addressee: Chenzhou Gold Arrow Solder Co., Ltd. Document name: Notification to Pay the Fees |
|
| DD01 | Delivery of document by public notice |
Addressee: Chenzhou Gold Arrow Solder Co., Ltd. Document name: Notification of Termination of Patent Right |
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| DD01 | Delivery of document by public notice | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050914 Termination date: 20160725 |
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| CF01 | Termination of patent right due to non-payment of annual fee |