CN1373510A - Cooling device for cooling heat-generating element and electronic apparatus comprising same - Google Patents
Cooling device for cooling heat-generating element and electronic apparatus comprising same Download PDFInfo
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- CN1373510A CN1373510A CN02106449A CN02106449A CN1373510A CN 1373510 A CN1373510 A CN 1373510A CN 02106449 A CN02106449 A CN 02106449A CN 02106449 A CN02106449 A CN 02106449A CN 1373510 A CN1373510 A CN 1373510A
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- diffusing member
- heat diffusing
- fin
- heater element
- heat
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
- G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
- G06F1/166—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories related to integrated arrangements for adjusting the position of the main body with respect to the supporting surface, e.g. legs for adjusting the tilt angle
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Abstract
A cooling unit comprises a heat sink (24) arranged adjacent to a heat generating component (17), the heat sink (24) having area dimensions greater than the heat generating component (17). A heat diffusing member (45) is arranged between the heat generating component (17) and the heat sink (24). A first heat conducting member (56) is interposed between the heat generating component (17) and the heat diffusing member (45), and a second heat conducting member (57) is interposed between the heat diffusing member (45) and the heat sink (24). The heat diffusing member (45) has a thermal conductivity higher than the second heat conducting member (57) and area dimensions greater than the heat generating component (17).
Description
To quoting of related application
The Japanese patent application No.2001-055207 that the application filed an application based on February 28 calendar year 2001, and require the priority of this application.
Technical field
The present invention relates to cooling device, be used to improve the radiation efficiency of heater element, described heater element for example is semiconductor subassembly and electric equipment, as has the portable computer of this cooling device.
Background technology
The notebook type portable computer, PDA (personal digital assistants: personal digital assistant) and other portable electric appts generally comprise a semiconductor subassembly, be used to handle the multimedia messages of literal, sound and image format.Recently, along with the increase of the information processing rate of semiconductor subassembly and multifunction more, the energy that they consumed is more and more.Thereby they than whenever produced more heat in the past with being directly proportional.
In this case, must improve the radiation efficiency of semiconductor subassembly in order to ensure the operational stability of electronic equipment.In other words, must make semiconductor subassembly that certain radiation/cooling device, for example fin are housed.
Traditional fin has a hot joining receiving portions, the IC chip hot link of it and semiconductor subassembly.If IC chip and hot joining receiving portions are separated from each other by a gap, then this gap then plays a part a thermal insulation layer.Thereby, cut off by this gap from the heat conduction of IC chip thermotropism receiving unit.Therefore, if between IC chip and hot joining receiving portions, any gap is being arranged traditionally, then a conducting strip is filled or is provided with in this gap in this gap with thermally conductive grease.Utilize this structure, can be reliably from the IC chip with heat transferred hot joining receiving portions, so that improve the radiation efficiency of IC chip.
(ball grid arrag: ball grid array) assembly has become the main flow of the semiconductor subassembly of electronic equipment to BGA in recent years.A BGA assembly is set on the surface mounted device (SMD, surface mount device) that is positioned at IC chip offside, and it has a series of soldered balls of arranging with grid.When the BGA assembly was installed on each circuit substrate, the deviation of their height can be in the scope of ± 0.25mm.
On the other hand, a fin is installed on circuit substrate, so that cover the BGA assembly.Fin forms with the mode of the aluminium alloy of injection moulding high-termal conductivity usually.But each parts comprise the hot joining receiving portions that utilizes the fin that injection moulding makes, owing to solidify and shrink, change in size can occur inevitably.Therefore, when being installed to radiator on the circuit substrate, the distance from the hot joining receiving portions to circuit substrate can take place significantly to change.
Thereby, can be because the inexactness of the size of the deviation of BGA component height and fin, and make the hot joining receiving portions of fin and the gap between the IC chip become very big, when the gap between IC chip and the fin becomes big, must correspondingly increase between the thickness of grease between them or conducting strip.So, the region list of hot link IC chip and hot joining receiving portions reveals big thermal resistance.
In addition, the flat surface area with the IC chip is big equally basically for the contact area in the zone of hot link IC chip and hot joining receiving portions.In other words, it is much smaller than the surface area of hot joining receiving portions.Thereby the heat conduction path that connects IC chip and hot joining receiving portions has a little cross section, and therefore the heat of the unit are by the hot link zone must move with very high speed.Thereby a very big temperature difference can appear in IC chip and hot joining receiving portions, and heat can not be delivered on the fin from the IC chip effectively.
Summary of the invention
Therefore, the purpose of this invention is to provide a kind of cooling device, it can absorb the change in size in the zone of heater element that hot link generally is the IC chip and fin effectively, simultaneously effectively with heat from heater element to the fin transmission, to improve the radiation efficiency of heater element.
Another object of the present invention provides an electronic equipment that includes this cooling device.
In order to achieve the above object, the cooling device according to the first string of the present invention comprises: a fin that is provided with near heater element; Be arranged on the heat diffusing member between heater element and the fin; First heat conduction component between heater element and heat diffusing member is used for hot link heater element and heat diffusing member; Second heat conduction component between heat diffusing member and fin is used for hot link heat diffusing member and fin.
In order to achieve the above object, the cooling device according to second scheme of the present invention comprises: the semiconductor subassembly with IC chip of heating; A fin that is provided with near this semiconductor subassembly, this fin has one greater than the IC area of chip; A heat diffusing member that is arranged between semiconductor subassembly and the fin; First heat conduction component between the IC of semiconductor subassembly chip and heat diffusing member is used for IC chip and heat diffusing member are carried out hot link; Second heat conduction component between heat diffusing member and fin is used for heat diffusing member and fin are carried out hot link; And the gap between IC chip and heat diffusing member, this gap is less than the gap between heat diffusing member and the fin, and this heat diffusing member has the pyroconductivity that is higher than second heat conduction component, and its area is greater than the IC area of chip.
In order to achieve the above object, the cooling device according to the 3rd scheme of the present invention comprises: a fin that is provided with near heater element; A heat diffusing member that is arranged between heater element and the fin; First heat conduction component between heater element and thermal diffusion component is used for heater element and heat diffusing member are carried out hot link; Second heat conduction component between heat diffusing member and fin is used for heat diffusing member and fin are carried out hot link.The area of fin is greater than the area of heat diffusing member, and the area of heat diffusing member is greater than the area of heater element.
In order to reach the another one purpose, comprise according to the electronic equipment of the 4th scheme of the present invention: the shell that heater element is housed; A fin that holds in the enclosure, this fin is arranged near the heater element, and the area of this fin is greater than the area of heater element; A heat diffusing member that is arranged between heater element and the fin; First heat conduction component between heater element and heat diffusing member is so that carry out hot link with heater element and heat diffusing member; And, second heat conduction component between heat conduction component and fin, be used for heat diffusing member and fin are carried out hot link, the pyroconductivity of heat diffusing member is greater than the pyroconductivity of second heat conduction component, and its area is greater than the area of heater element.
Other purpose of the present invention and advantage will be illustrated in the following description, and partly become clearer from these are described, and perhaps become clearer by implementing the present invention.Can realize and reach objects and advantages of the present invention by method of describing in detail below and combination thereof.
Description of drawings
Be attached in the explanation and constitute the accompanying drawing of the part of explanation, be used to illustrate embodiments of the invention and top given in a word bright and following given detailed description to embodiment together, be used for illustrating principle of the present invention.
Fig. 1 is the exploded pictorial perspective view of first embodiment of the present invention, the position relation of a portable computer of expression and its cooling device;
Fig. 2 is the constructed profile of a portable computer, is used to represent the position relation of the cooling device of a portable computer and embodiment;
Fig. 3 is the constructed profile of a portable computer, the position relation of the cooling device of expression semiconductor subassembly and embodiment;
Fig. 4 is the constructed profile of a portable computer, represents a shell and the interior cooling device of shell that is contained in embodiment;
Fig. 5 is the perspective illustration of the cooling device of an embodiment;
Fig. 6 is the perspective illustration of an embodiment, represents the position relation of a semiconductor subassembly and its heat diffusing member;
Fig. 7 is the perspective illustration of the heat diffusing member of an embodiment;
Fig. 8 is the constructed profile of embodiment, the position relation of expression BGA N-type semiconductor N assembly, a heat diffusing member and its fin;
Fig. 9 is the constructed profile of embodiment, and expression is thermally connected to BGA N-type semiconductor N assembly on the fin by heat diffusing member;
Figure 10 is the constructed profile along the F10-F10 line intercepting of Fig. 9;
Figure 11 A is the constructed profile along the F11A-F11A line intercepting of Fig. 9;
Figure 11 B is the constructed profile along the F11B-F11B line intercepting of Fig. 9;
Figure 12 is the decomposition diagram of the part of a portable computer, the diapire of the shell of expression embodiment, a lid, a heat exchange sheet and a fin;
Figure 13 is the perspective view of the part of portable computer, represents the lid on the diapire of a shell that is installed to embodiment;
Figure 14 A is the constructed profile of second embodiment of the present invention, and expression is thermally connected to a BGA N-type semiconductor N assembly on the fin by a heat diffusing member;
Figure 14 B is the constructed profile of the amplification of the part that is surrounded with circle X among Figure 14 A;
Figure 15 is the constructed profile of the 3rd embodiment of the present invention, and expression is thermally connected to a BGA N-type semiconductor N assembly on the fin by a heat diffusing member;
Figure 16 is the perspective illustration of the heat diffusing member of the 3rd embodiment;
Figure 17 is the schematic sectional view of the 4th embodiment of the present invention, and expression is thermally connected to BGA N-type semiconductor N assembly on the fin by a heat diffusing member; And
Figure 18 is the constructed profile of the 5th embodiment of the present invention, and expression is thermally connected to BGA N-type semiconductor N assembly on the fin by heat diffusing member.
Embodiment
Present invention is described referring now to Fig. 1 to 13, and these figure represent to be used for first embodiment of the present invention on the portable computer.
Fig. 1 and Fig. 2 represent the portable computer as an electronic equipment, and a cooling device 2 that is suitable for cooling off portable computer 1.
Shown in Fig. 2 and 3, accommodate a circuit substrate 13 in the shell 5.Circuit substrate 13 has an installation surface 13a, and it is in the face of the diapire 5a of shell 5.A BGA N-type semiconductor N assembly is installed on the surperficial 13a, as an electronic unit.Semiconductor subassembly 15 includes a microprocessor as the core of portable computer 1.
Shown in Fig. 6 and 8, semiconductor subassembly 15 comprises a substrate 16 and an IC chip 17, and it is a heater element.Substrate 16 has a rectangular profile, in its periphery four angles is arranged.The about 30mm of length on substrate 16 each limit.IC chip 17 comprises the multimedia messages of literal, sound and image with very high velocity process, therefore, produces heat with very high speed in its operating process, thereby, in order to operate reliably, need cool off.
On the another one surface of substrate 16, many soldered balls 20 are arranged as grid.Soldered ball 20 is incorporated on the installation surface 13a of circuit substrate 13.Thereby semiconductor subassembly 15 is installed on the circuit substrate 13 in Ic chip 17 ventricumbent modes.
Shown in Fig. 2 to 4, shell 5 also comprises a cooling unit 23 that is used to cool off semiconductor subassembly 15.This cooling unit 23 comprises a fin 24 and an electric fan device 25.
Shown in Figure 4 and 5, the hot joining receiving portions 26 of fin 24 has four 28a to 28d of base plate supports portion.The 28a to 28d of base plate supports portion is outstanding from four angle circuit substrates 13 of hot joining receiving portions 26 respectively.Circuit substrate 13 is rigidly fixed in the free end of the 28a to 28d of base plate supports portion by each screw 29.Circuit substrate 13 is provided with the ground plate (not shown), and they are separately positioned on the position of contact substrate support section 28a to 28d.Thereby, fin 24 by base plate supports part 28a to 28d be positioned at the ground plate that circuit substrate 13 contacts their each position and be grounded.
Among four base plate supports part 28a to 28d, be arranged on a pair of support section 28a on the diagonal Z of hot joining receiving portions 26,28c places a pair of from the outstanding protuberance 30a of the diapire 5a of shell 5, on the 30b respectively.Each that rigidly fixes in two screws 29 of circuit substrate 13 is passed the 28a of base plate supports portion respectively, and 28c enters protuberance 30a, among the 30c.Thereby the hot joining receiving portions 26 of fin 24 directly is rigidly fixed on the diapire 5a of shell 5 at two positions of diagonal Z.
To shown in Figure 5, the heat exchange section 27 of fin 24 and hot joining receiving portions 26 are in aggregates and be thermally connected on the latter as Fig. 3.Heat exchange section 27 is between the left side wall 5d and semiconductor subassembly 15 of the shell 5 when shell 5 front sides are observed.Heat exchange section 27 has one from the upwardly extending supporting walls 31 of its periphery.A metal top plate 32 is rigidly fixed to the upper end of supporting walls 31.Thereby top board 32 and heat exchange section 27 and supporting walls 31 combine, and form a path of cool air 33.Path of cool air 33 is communicated with a cooling air outlet 34 in its downstream, and this outlet 34 is opened on the left side wall 5d of shell 5.
As Fig. 2 and shown in Figure 4, fan assembly 25 is located at tight the place ahead of fin 24.Fan 25 comprises a fan drum 36 and a receded disk impeller 37.
Fan drum 36 has one first air entry, 38, the second air entries 39 and an exhaust outlet 40, and simultaneously, it is as a whole with 24 one-tenth of fin.First air entry 38 is in the face of first group of air intake 41 on a series of diapire 5a that are opened on shell 5.Second air entry 39 is in the face of being opened on a series of second group of air intake 42 on the palm saddle 6.Exhaust outlet 40 opens wide to fin 24, and its part is in the face of the upstream extremity of path of cool air 33 simultaneously.
When impeller 37 was driven rotation by flat motor 43, air was inhaled into by the inside of first and second air entries 38,39 from fan drum 36.Air is discharged from as cooling air from the periphery of impeller 37 then.Then, cooling air is sent to the zone of path of cool air 33 and encirclement semiconductor subassembly 15 by exhaust outlet 40.
Shown in Fig. 8 to 11, the IC chip 17 of semiconductor subassembly 15 is thermally connected on the hot joining receiving portions 26 of fin 24 by heat diffusing member 45.Heat diffusing member 45 has a thermal diffusion plate 46 and pair of side plates 47.Diffuser plate 46 and side plate 47 are made by metal material usually, for example the aluminium alloy of high thermal conductivity or copper alloy.They also conduct electricity.
The size of diffuser plate 46 is measure-alike with the substrate 16 of semiconductor subassembly 15 basically, about thick 2mm.Diffuser plate 46 has one first thermal interface 48a and second a thermal interface 48b who is positioned at the first thermal interface 48a opposite.The first thermal interface 48a is towards semiconductor subassembly 15.The area of the first contact-making surface 48a is much larger than the surface thermal radiation 19 of IC chip 17.The second thermal interface 48b is towards the hot joining receiving portions 26 of fin 24.The area of second thermo-contact surface 48b is much larger than the area of the surface thermal radiation 19 of IC chip 17.First and second thermo- contacts surface 48a, 48b is made very flat-satin.
Diffuser plate 46 is provided with a pair of groove 49a, 49b.Groove 49a, 49b thermotropism receiving unit 26 opens wide, and extends along the corresponding two edges relatively of second thermo-contact surface 48b respectively.
Shown in Fig. 7 and 8, side plate 47 is kept by diffuser plate 46 and with respect to the first and second thermal interface 48a, 48b vertically upwards erects.To upper process, its protrusion amount is greater than the protrusion amount of IC chip 17 with respect to substrate 16 from first thermo-contact surface 48a for side plate 47.Thereby, the ledge of side plate 47 mutually in the face of and first thermo-contact surface 48a is clipped in the middle of them.
Each side plate 47 is provided with the tongue piece 53 of a pair of inside vertical curve at its vertical opposite end, and each tongue piece 53 is collaborative mutually with the respective end of side plate 47, forms the mate 54 of a vertical curve.Mate 54 is arranged on four corners of first thermo-contact surface 48a, and corresponding to four turnings 18 of the substrate 16 of semiconductor subassembly 15.The turning 18 of substrate 16 respectively with 54 engagements of corresponding mate to determine the relative position relation between semiconductor subassembly 15 and the heat diffusing member 45.
Each support section 52 of side plate 47 has a pair of by being tilted to down the spring portion 55 that bending side plate 47 forms, and makes that they can be along the short transverse strain of diffuser plate 46.The end of spring portion 55 extends downwardly into below the 48b of second thermo-contact surface, contacts with the hot joining receiving portions 26 of fin 25.
Utilize said structure, heat diffusing member 45 is continued upwards to promote by spring portion 55 between hot joining receiving portions and semiconductor subassembly 15.Thereby first thermo-contact surface 48a of diffuser plate 46 is upwards pushed to the surface thermal radiation 19 of IC chip 17.
In addition, spring portion 55 remains between heat diffusing member 45 and the hot joining receiving portions 26 with compressed state, so that heat diffusing member 45 and fin 24 are electrically connected.Thereby heat diffusing member 45 is connected on the ground plate of circuit substrate 13 by fin 24.
Shown in Figs. 9 to 11, heat diffusing member 45 is maintained on the position of a deflection semiconductor subassembly 15 between thermo-contact part 26 and the semiconductor subassembly 15.Thereby, between the surface thermal radiation 19 of surperficial 48a of first thermo-contact of heat diffusing member 45 and IC chip, produce a S1 at interval, simultaneously formation another gap S2 between surperficial 48b of second thermo-contact of heat diffusing member 45 and hot joining receiving portions 26.Gap S1 is narrower than S2.
Gap S1 is maintained at one and approaches 0 infinitesimal numerical value, so that expeditiously heat is delivered on the heat diffusing member 45 from IC chip 17.Usually the first soft heat conduction component of being made by grease 56 is arranged in the S1 of gap.First heat conduction component 56 closely contacts with the surface thermal radiation 19 of IC chip 17 and first thermo-contact surface 48a of heat diffusing member 45, so that hot link chip 17 and heat diffusing member 45.
Gap S2 is maintained at such numerical value, makes it be enough to absorb the dimensional discrepancy of fin 24 and semiconductor subassembly 15 with respect to the design height of circuit substrate 13 and the difference of actual height.Common second a soft heat conduction component 57 by the grease manufacturing is arranged in the S2 of gap.Second heat conduction component 57 closely contacts with second thermo-contact surface 48a and the hot joining receiving portions of heat diffusing member 45, so that with heat diffusing member 45 and fin 24 hot links.Therefore, the thickness of first heat conduction component 56 is less than the thickness of second heat conduction component 57.
The pyroconductivity of heat diffusing member 45 (W/ (mK)) is greater than the pyroconductivity of first and second heat conduction components 56,57.In other words, the heat-conductive characteristic of heat diffusing member 45 to the first and second heat conduction components 56,57 is good.Thereby, be transmitted to heat on the diffuser plate 46 of heat diffusing member 45 from IC chip 17 by first heat conduction component 56 along first and second thermo-contacts surface 48a, the 48b disperse makes heat be transferred to second heat conduction component 57 from a zone greater than the surface thermal radiation 19 of IC chip 17.
Shown in Fig. 2 and 3, the hot joining receiving portions 26 of fin 24 has a heat emission surface 60.Heat emission surface 60 is away from semiconductor subassembly 15 and towards the diapire 5a of shell 5.Heat emission surface 60 has a plane domain, and it covers greater than semiconductor subassembly 15 and by the heat exchange sheet 61 of a softness.
Shown in Figure 12 and 13, the diapire 5a of shell 5 is provided with an opening 62, and this opening 62 is towards the heat emission surface 60 of fin 24.The size of opening 62 is greater than heat emission surface 60.Opening 62 tegmentums 63 cover.Lid 63 is supported by diapire 5a removably by screw 64.
As illustrated in fig. 1 and 2, the cooling device 2 that is used to cool off portable computer 1 has an apparatus main body 70.Apparatus main body 70 has a flat appearance profile that is similar to chest, and its size is latter half of corresponding to shell 5.The upper surface of apparatus main body 70 plays a part receiving surface 71, is used to hold the latter half of of shell 5.Receiving surface 71 is provided with a series of locking jaw 73.When shell 5 was placed on the receiving surface 71, locking jaw 73 was caught the diapire 5a of shell 5 releasedly.Shell 5 promptly is locked on the receiving surface 71.
Apparatus main body 70 comprises an auxiliary heat dissipation sheet 75.Auxiliary heat dissipation sheet 75 is usually by making such as the metal material of this high-termal conductivity of aluminium alloy.Fin 75 has a series of hot joinings that project upwards from its top surface and receives projection 76.Hot joining is received projection 76 and is had the appearance profile that is similar to prism, cover in each through hole 65 of 63 thereby can be inserted into respectively, is arranged in a checkerboard type arrangement.Hot joining is received projection 76 and is exposed on the receiving surface 71 of apparatus main body 70.Each hot joining is received projection 76 and is had a smooth contact surface 76a on its top.The contact surface 76a of hot joining receipts projection 76 is concordant mutually.
Thereby, when the shell 5 of portable computer 1 is placed on the receiving surface 71, hot joining receive projection 76 lay respectively at cover 63 corresponding through hole 65 under, the contact surface 76a that makes hot joining receive projection 76 faces conducting strip 61.
Auxiliary heat dissipation sheet 75 is supported on the apparatus main body 70, its supporting way is, it can be projected into vertical moving between concordant with the receiving surface 71 basically second place of contact surface 76a that primary importance and hot joining above the receiving surface 71 receive projection 76 at the contact-making surface 76a that hot joining is received projection 76.Auxiliary heat dissipation sheet 75 can vertically move or on the contrary to the second place from primary importance by an operating mechanism 78.
Describe now portable computer 1 is connected to step on the cooling device 2.
At first, shell 5 is placed on the receiving surface 71 of apparatus main body 70 and and be securely held on the receiving surface 71 by locking jaw 73.Under this condition, operating mechanism is operated, so that upwards shift auxiliary heat dissipation sheet 75 onto primary importance from the second place.The result is, the contact surface 76a that hot joining is received projection 76 is by covering each through hole 65 of 63 and be embedded into the inside of shell 5 and being pressed on the heat exchange sheet 61.
Thereby heat exchange sheet 61 is sandwiched in the heat emission surface 60 and the hot joining of fin 24 and receives between the contact surface 76a of projection 76, makes fin 24 be thermally connected to auxiliary heat dissipation sheet 75 by heat exchange sheet 61.
At this moment, the hot joining receiving portions 26 with heat emission surface 60 stands the power by 76 effects of hot joining receipts projection, and this power attempts it upwards to be pushed away and its diapire 5a from shell 5 is removed.But, because hot joining receiving portions 26 is to be rigidly connected on the diapire 5a of shell 5 with screw 29 in two positions of diagonal Z, being securely fixed in this place, it can be revolted the effect of this power reliably and be held in place.Therefore, when shell 5 is contacted with cooling device 2, can prevent that hot joining receiving portions 26 from rocking and/or being lifted.
When portable computer 1 work, the IC chip 17 of semiconductor subassembly 15 produces and emitting heat quantity.The heat that IC chip 17 produces is passed to by first heat conduction component 56 on the diffuser plate 46 of heat diffusing member 45, is passed on the hot joining receiving portions 26 of fin 24 by second heat conduction component 57 then.Thereby the heat emission surface 60 of hot joining receiving portions 26 is transmitted the heat that comes from IC chip 17 and is heated to a very high temperature.Heat emission surface 60 is thermally connected on the auxiliary heat dissipation sheet 75 of cooling device 2 by heat exchange sheet 61.Thereby the heat that is delivered on the hot joining receiving portions 26 from IC chip 17 is directly transferred to auxiliary heat dissipation sheet 75.
Thereby, increase from the thermal capacity of IC chip 17 to the heat delivered path of auxiliary heat dissipation sheet 75 extensions by fin 24.So the radiation efficiency of the IC chip 17 of heating increases, so that keep the ambient temperature of semiconductor subassembly 15 rightly in operating process.
If portable computer 1 is also being operated, and the temperature of semiconductor subassembly 15 is elevated to predetermined level when above, and fan assembly 25 is started working.Cooling air promptly is directed in the path of cool air 33 of fin 24.
When the cooling air of fan assembly 25 flow through path of cool air 33 before it is forced to flow out by cooling air outlet 34 from shell 5, force the heat exchange section 27 of cold sink 24.Therefore, the heat that is passed to heat exchange section 27 from hot joining receiving portions 26 partly is discharged into outside the shell 5 heat discharge of accelerated semiconductor assembly 15 by flowing of cooling air.
Utilize said structure, heat diffusing member 45 is clipped between IC chip 17 and the hot joining receiving portions 26.First thermo-contact surface 48a of heat diffusing member 45 is pressed to the surface thermal radiation 19 of IC chip 17 by paired spring portion 55.Therefore, the gap S1 between first thermo-contact surface 48a and the surface thermal radiation 19 is retained as infinitely small, approaches 0.In other words, first heat conduction component 56 that is arranged in this gap is made extremely thin.Therefore, the thermal resistance in the zone of hot link first thermo-contact surface 48a and surface thermal radiation 19 becomes minimum, makes the heat by 17 generations of IC chip can be delivered to the diffuser plate 46 of heat diffusing member 45 effectively.
In addition, first and second thermo-contacts of diffuser plate 46 surface 48a, the area of 48b is much larger than the area of the surface thermal radiation 19 of IC chip 17, and the pyroconductivity of diffuser plate 46 is much larger than the pyroconductivity of first and second heat conduction components 56,57.Thereby the heat that is delivered to diffuser plate 46 from IC chip 17 is soon along first and second thermo- contacts surface 48a, and 48b permeates into each corner of diffuser plate 46.Consequently, heat is passed to hot joining receiving portions 26 by the extended area much larger than the surface thermal radiation 19 and second heat conduction component 57 from IC chip 17.
Thereby the size in the thermo-contact zone of heat diffusing member 45 and hot joining receiving portions 26 can satisfy required heat transfer speed satisfactorily.In other words, the rate of heat flow of unit are has minimized.Therefore, if the gap S2 between thermal diffusion plate 46 and the hot joining receiving portions 26 has a big thickness greater than the gap S1 and second heat conduction component 57, the thermal resistance in the thermo-contact zone of heat diffusing member 45 and hot joining receiving portions 26 can be remained on enough low level.Thereby the temperature difference between the temperature of second thermo-contact surface 48b and the temperature of hot joining receiving portions 26 has minimized.
As described above, by 24 the hot transmission path heat diffusing member 45 being set, can effectively heat be delivered to fin 24 from IC chip 17 from IC chip 17 to fin, improve the radiating efficiency of IC chip 17.
In addition, utilize structure described above, if since for example the dimensional discrepancy of fin 24 make between hot joining receiving portions 26 and the IC chip 17 apart from the off-design value, strain and distortion take place in second heat conduction component 57 that is contained in the softness in the S2 of gap, with the variation of absorption distance.
More particularly, when strain and distortion took place second heat conduction component 57, the diffuser plate 46 of heat diffusing member 45 obviously was maintained at the state that floats with respect to fin 24.This means that the hot joining receiving portions 26 of fin 24 needn't be set at quick condition from the beginning, thereby can from fin 24, eliminate moveable portion, thereby the structural design of simplification fin 24 makes fin 24 sizes little, in light weight simultaneously.
Simultaneously, because fin 24 can avoid using any movable part, its mechanical strength obtains to improve, and avoids making fin 24 to become loosening in the handling process of portable computer 1.
In addition, utilize structure recited above, the heat diffusing member 45 that is placed on the semiconductor subassembly 15 is electrically connected on the ground plane of circuit base plate 13 by fin 24.Therefore, semiconductor subassembly 15 can utilize heat diffusing member 45 by electromagnetic shielding.Thereby, can prevent that from the leakage of the electromagnetic noise of semiconductor subassembly 15 this is a kind of very favourable antinoise means.
Although among described in the above first embodiment, adopt grease as first heat conduction component 56, mean that never the present invention is confined to this.For example, available scolder replaces grease.Because the pyroconductivity of scolder is much larger than the pyroconductivity of grease, the thermal resistance in the zone of hot link IC chip 17 and diffuser plate 46 can further reduce.Thereby, can efficiently heat be delivered to diffuser plate 46 from IC chip 17.
Figure 14 A and 14B schematically represent second embodiment of the present invention.
The difference of second embodiment and first embodiment only is the structure of the side plate 47 of heat diffusing member 45.In addition, identical with second embodiment.
Each side plate 47 of the heat diffusing member 45 of present embodiment has an extension 81, and it extends upward from the top edge of each tongue piece 53, and each extension 81 is provided with an engaging piece 82 that forms by the upper end of the extension 81 that bends inwards simultaneously.Each engaging piece 82 removably hangs on corresponding other surperficial 16b at 18 places, turning of substrate 16 of semiconductor subassembly 15.Thereby heat diffusing member 45 remains on the semiconductor subassembly 15 in four corners corresponding to each mate 54 of semiconductor subassembly 15.
Utilize the said structure of present embodiment, heat diffusing member 45 can keep hanging on the semiconductor subassembly 15 that is installed on the circuit substrate 13.Therefore, when the position that heat diffusing member 45 placed between semiconductor subassembly 15 and the fin 24, can prevent that it from coming off or displacement.Thereby, can easy manipulation heat diffusing member 45, improve the efficient of assembly portable formula computer 1 and cooling device 2 and hot link semiconductor subassembly 15 and fin 24.
Figure 15 and 16 schematically represents the 3rd embodiment of the present invention.
The 3rd unique first embodiment part that is different from of embodiment is, further improves the effect of shielding semiconductor assembly by utilizing heat diffusing member 45.In addition identical with first embodiment.
As shown in figure 15, a series of ground plates 91 are set on the installation surface 13a of circuit substrate 13.Ground plate 91 is arranged to surround the element installing zone of semiconductor subassembly 15.Ground plate 91 is electrically connected to the ground plane (not shown) of the inside of circuit substrate 13.
Each side plate 47 of heat diffusing member 45 has all-in-one-piece connector portions 92 with it, and the latter extends upward from the top edge of each tongue piece 53.Connector portions 92 is arranged to surround semiconductor subassembly 15 and is welded to respectively on the corresponding ground plate 91 of circuit substrate 13.Thereby heat diffusing member 45 is directly connected on the ground plane of circuit substrate 13.
Utilize the structure of above-mentioned the 3rd embodiment, heat diffusing member 45 is collaborative with circuit substrate 13, is sandwiched in semiconductor subassembly 15 in the middle of their and is electrically connected on the ground plane of circuit substrate 13.Thereby heat diffusing member 45 is as a shield that is suitable for surrounding the nearly source conductor of semiconductor subassembly 15 thereby can be used as the leakage of an electromagnetic noise that prevents to be produced by semiconductor subassembly 15.Thereby, in a very wide scope from the low frequency range to the high frequency region, can improve shield effectiveness to semiconductor subassembly 15.
In addition, because the blank area 92 of heat diffusing member 45 is soldered on the circuit substrate 13, so heat diffusing member 45 is remained on the circuit substrate 13 by rigidity.Thereby, when semiconductor subassembly 15 and fin 24 mutual hot links together the time, can prevent that heat diffusing member 45 from coming off or displacement, improve the operating efficiency of assembly portable formula computer 1.
Figure 17 schematically represents the 4th embodiment.
In the 4th embodiment, on the hot joining receiving portions 26 of fin 24, be integrally formed into a series of protuberances 101.Protuberance 101 upwards protrudes to the corresponding ground plate 91 of circuit substrate 13 respectively.The top surface 101a of each protuberance 101 is in the face of a corresponding ground plate 91.The blank area 92 of heat diffusing member 45 is separately positioned between the top surface 101a and ground plate 91 of protuberance 101.
Utilize the structure of the 4th embodiment described above, heat diffusing member 45 is collaborative with circuit substrate 13, semiconductor subassembly 15 is sandwiched between them, and the same with the situation of the 3rd embodiment, is electrically connected to the ground plate of circuit substrate 13.Thereby, heat diffusing member 45 can be more reliably as a near-end conductor that is suitable for around semiconductor subassembly 15, thereby can be as the shield that prevents the electromagnetic noise leakage that semiconductor subassembly 15 produces.
In addition, heat diffusing member 45 remains on the circuit substrate 13 by connector portions 92 rigidity.Therefore, when the mutual hot link of semiconductor subassembly 15 and fin 24, can prevent that heat diffusing member 45 from coming off or be offset, and improves the packaging efficiency of portable computer 1.
Figure 18 schematically represents the 5th embodiment of the present invention.
In the 5th embodiment, utilize filler 110 to fill gap between the substrate 16 of first thermo-contact surface 48a of heat diffusing members 46 and semiconductor subassembly 15.Filler 110 can be a kind of thermoplastic resin material with adhesion properties, for example paraffin class material usually.Filler 110 is bonding and be firmly held in together with heat diffusing member 45 and semiconductor subassembly 15, makes their surround the IC chip 17 of heating.
Utilize the structure of the 5th embodiment described above, owing to by filler 101 heat diffusing member 45 is securely fixed on the semiconductor subassembly 45, so, can stably keep the position relation between semiconductor subassembly 15 and the heat diffusing member 45.Therefore,, prevented coming off and displacement of heat diffusing member 45, improved the operating efficiency of assembly portable formula computer 1 when semiconductor subassembly 15 and fin 24 are thermally connected to a time-out mutually.
Claims (34)
1. the cooling device of a cooling heating element is characterized in that comprising:
A near fin (24) that is arranged on the described heater element (17);
A heat diffusing member (45) that is arranged between described heater element (17) and the described fin (24);
First heat conduction component (56) between described heater element (17) and described heat diffusing member (45) is used for described heater element of hot link (17) and described heat diffusing member (45); And
Second heat conduction component (57) between described heat diffusing member (45) and described fin (24) is used for described heat diffusing member of hot link (45) and described fin (24).
2. cooling device as claimed in claim 1 is characterized in that, the area of described fin (24) is greater than the area of described heater element (17).
3. cooling device as claimed in claim 1 is characterized in that, described heat diffusing member (45) has the pyroconductivity greater than described second heat conduction component (57), and has the area greater than described heater element (17).
4. cooling device as claimed in claim 1 further comprises a spring member (55), is used for pushing described heat diffusing member (45) to described heater element (17).
5. cooling device as claimed in claim 1 is characterized in that,
Described first heat conduction component (56) is thinner than described second heat conduction component (57), and described second heat conduction component (57) is along the thickness direction displacement.
6. cooling device as claimed in claim 1 is characterized in that,
Described heater element (17) has a heat radiation surface (19), described heat diffusing member (45) has first thermal interface (48a) and second thermal interface (48b) towards described fin (24) towards described heat radiation surface (19) simultaneously, (48a, 48b) each all has an area greater than described heat radiation surface (19) to described first and second thermal interfaces.
7. cooling device as claimed in claim 6 is characterized in that,
Described heat diffusing member (45) is pressed to described heater element (17) by spring (55).
8. cooling device as claimed in claim 1 is characterized in that,
Described heater element (17) has one group of turning (18) along a periphery, described heat diffusing member (45) has one group of engaging piece (54), be used for being meshed with each turning (18), position relation being meshing with each other by described turning (18) and described engaging piece (54) of described heater element (17) and described heat diffusing member (45) determined.
9. cooling device as claimed in claim 8 is characterized in that,
Described heat diffusing member (45) has one group of tongue piece (53), is used for being hooked in removably described heater element (17).
10. cooling device as claimed in claim 1 is characterized in that,
Described first heat conduction component (56) has the pyroconductivity that is higher than described second heat conduction component (57).
11. cooling device as claimed in claim 1 is characterized in that,
Described fin (24) has a hot joining receiving portions (26) that keeps in touch with described second heat conduction component (57), a heat exchange section (27) that is thermally connected to described hot joining receiving portions (26) and separates with described heater element (17).
12. cooling device as claimed in claim 11 further comprises a fan (25), it is fed to cooling air the described at least heat exchange section (27) of described fin (24).
13. a cooling device is characterized in that it comprises:
Semiconductor subassembly (15) with IC chip (17) of heating;
A fin (24) that is provided with near described semiconductor subassembly (15), described fin (24) has the area greater than described IC chip (17);
A heat diffusing member (45) that is arranged between described semiconductor subassembly (15) and the described fin (24);
One between the described IC chip (17) of described semiconductor subassembly (15) and first heat conduction component (56) between the described heat diffusing member (45), is used for described IC chip of hot link (17) and described heat diffusing member (45);
Second heat conduction component (57) between described heat diffusing member (45) and described fin (24) is used for described heat diffusing member of hot link (45) and described fin (24); And
Gap (S1) between described IC chip (17) and described heat diffusing member (45), it is narrower than the gap (S2) between described heat diffusing member (45) and the described fin (24), described heat diffusing member (45) has the pyroconductivity greater than described second heat conduction component (57), and has the area greater than described IC chip (17).
14. cooling device as claimed in claim 13 is characterized in that,
Described semiconductor subassembly (15) is installed on the circuit substrate (13), described heat diffusing member (45) and described fin (24) are made by conductive material respectively, and described heat diffusing member (45) is electrically connected to described circuit substrate (13) by described fin (24).
15. cooling device as claimed in claim 14 is characterized in that,
Described heat diffusing member (45) is pressed to IC chip (17) by the conductivity spring (55) between described heat diffusing member (45) and described fin (24), and described heat diffusing member (45) and described fin (24) are electrically connected mutually by described spring (55).
16. cooling device as claimed in claim 13 is characterized in that,
Described semiconductor subassembly (15) has the substrate (16) of the IC chip (17) that a carrying is mounted thereon, and described heat diffusing member (45) is rigidly fixed on the described substrate (16).
17. a cooling device is characterized in that it comprises:
Circuit substrate (13) with the installation surface (13a) on carrying one winding floor (91);
Electronic component (15) on described installation surface (13a) that is installed in described circuit substrate (13), described electronic component (15) has a heating part (17) that is arranged on a side relative with described installation surface (13a);
One is arranged near the described electronic component (15), has the fin (24) greater than the area of described heating part (17);
One is arranged between described electronic component (15) and the described fin (24) and has heat diffusing member (45) greater than the area of described heating part (17);
One between the described heating part (17) of described electronic component (15) and first heat conduction component (56) between the described heat diffusing member (45), is used for described heating part of hot link (17) and described heat diffusing member (45);
Second heat conduction component (57) between described heat diffusing member (45) and described fin (24) is used for described fin of hot link (24) and described heat diffusing member (45); And
Gap (S1) between described heating part (17) and described heat diffusing member (45), it is narrower than the gap (S2) between described heat diffusing member (45) and the described fin (24), described heat diffusing member (45) is made by electric conducting material, its pyroconductivity is greater than the pyroconductivity of described second heat conduction component (57), be provided with set of joints part (92) simultaneously, be used to be connected respectively to the corresponding ground plate (91) of described circuit substrate (13).
18. cooling device as claimed in claim 17 is characterized in that,
Described fin (24) has one group to the outstanding protuberance (101) of described circuit substrate (13), be rigidly fixed on the described circuit substrate (13) in the position that corresponds respectively to described ground plate (91), the described blank area (92) of described heat diffusing member (45) is clamped in respectively between the front surface (101a) of protuberance (101) of the ground plate (91) of described correspondence and described correspondence.
19. an electronic equipment is characterized in that it comprises:
A shell (5) that accommodates heater element (17);
A fin (24) that is installed in the described shell (5), described fin (24) is set near the described heater element (17), and the area of described fin (24) is greater than the area of described heater element (17);
A heat diffusing member (45) that is arranged between described heater element (17) and the described fin (24);
First heat conduction component (56) between described heater element (17) and described heat diffusing member (45) is used for described heater element of hot link (17) and described heat diffusing member (45); And
Second heat conduction component (57) between described heat diffusing member (45) and described fin (24), be used for described heat diffusing member of hot link (45) and described fin (24), described heat diffusing member (45) has greater than the pyroconductivity of described second heat conduction component (57) and has area greater than described heater element (17).
20. electronic equipment as claimed in claim 19 is characterized in that,
Narrower than the gap (S2) between described heat diffusing member (45) and the described fin (24) in the gap (S1) between described heater element (17) and the described heat diffusing member (45), described second heat conduction component (57) can be subjected to displacement according to the gap (S2) between described heat diffusing member (45) and the described fin (24).
21. electronic equipment as claimed in claim 19 further comprises a circuit substrate (13) that is contained in the described shell (5), this circuit substrate (13) carries described heater element (17).
22. electronic equipment as claimed in claim 21 is characterized in that,
Described heat diffusing member (45) and described fin (24) are made by electric conducting material respectively, and described heat diffusing member (45) is electrically connected to described circuit substrate (13) by described fin (24).
23. electronic equipment as claimed in claim 21 is characterized in that,
Described circuit substrate (13) has a winding floor (91), and described heat diffusing member (45) is provided with one group of blank area (92) that is connected to described ground plate (91) respectively.
24. a cooling device that is used for cooling heating element is characterized in that it comprises:
A fin (24) that is provided with near described heater element (17);
A heat diffusing member (45) that is arranged between described heater element (17) and the described fin (24);
First heat conduction component (56) between described heater element (17) and described heat diffusing member (45) is used for described heater element of hot link (17) and described heat diffusing member (45); And
Second heat conduction component (57) between described heat diffusing member (45) and described fin (24), be used for described heat diffusing member of hot link (45) and described fin (24), wherein, the area of described fin (24) is greater than the area of described heat diffusing member (45), simultaneously, the area of described heat diffusing member (45) is greater than the area of described heater element (17).
25. cooling device as claimed in claim 24 further comprises a spring member (55), is used for pushing described heat diffusing member (45) to described heater element (17).
26. a cooling device that is used for cooling heating element is characterized in that it comprises:
A fin (24) that is provided with near described heater element (17);
A substrate (16), described heater element (17) is fixed thereon, and described substrate (16) has four turnings (18);
A heat diffusing member (45) that is arranged between described heater element (17) and the described fin (24), described heat diffusing member (45) has four mates (54) corresponding to four turnings (18) of described substrate (16), allows described substrate (16) is installed on the described heat diffusing member (45);
First heat conduction component (56) between described heater element (17) and described heat diffusing member (45) is used for described heater element of hot link (17) and described heat diffusing member (45); And
Second heat conduction component (57) between described heat diffusing member (45) and described fin (24) is used for described heat diffusing member of hot link (45) and described fin (24).
27. cooling device as claimed in claim 26 further comprises a spring member (55), is used for pushing described heat diffusing member (45) to described heater element (17).
28. cooling device as claimed in claim 26 is characterized in that, described fin (24) has the area greater than described heat diffusing member (45), and described heat diffusing member (45) has the area greater than described heater element (17) simultaneously.
29. an assembling has the method for the semiconductor subassembly of heat diffusing member, it is characterized in that, it may further comprise the steps:
A substrate (16) is provided, fixes a heater element (17) thereon to form described semiconductor subassembly (15), described substrate (16) has four turnings (18);
A heat diffusing member (45) that is arranged between a described heater element (17) and the fin (24) is provided, the latter has corresponding in four engaging pieces (54) at four turnings (18) of described substrate (16), allows described substrate (16) to cooperate with described heat diffusing member (45);
One first heat conduction component (56) is placed between described heater element (17) and the described heat diffusing member (45), with described heater element of hot link (17) and described heat diffusing member (45);
Four engaging pieces (54) of described heat diffusing member (45) are assembled on four turnings (18) of described substrate (16); And
One second heat conduction component (57) is placed between described heat diffusing member (45) and the described fin (24), with described heat diffusing member of hot link (45) and described fin (24).
30. method as claimed in claim 29 further comprises a spring member (55) is provided, and is used for pushing described heat diffusing member (45) to described heater element (17).
31. a heat diffusing member is characterized in that it comprises:
A diffuser plate (16), it has one and is used for first thermal interface (48a) that combines with a heater element (17), and second thermal interface (48b) that is used for a fin (24) combination; And
Be positioned at the pair of side plates (47) of the opposite end of described diffuser plate (46), described side plate (47) from described diffuser plate (46) vertical extent in case with the engagement of the side of substrate (16), described heater element (17) is fixed on the described substrate (16).
32. heat diffusing member as claimed in claim 31 comprises that further a pair of end from each side plate (47) extends out, and forms the tongue piece (53) of engaging piece (54).
33. as heat diffusing member as described in the claim 31, further comprise a spring member (55), be used for pushing described heat diffusing member (45) to described heater element (17).
34. heat diffusing member as claimed in claim 31 is characterized in that, described fin (24) has the area greater than described heat diffusing member (45), and simultaneously, described heat diffusing member (45) has the area greater than described heater element (17).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP055207/2001 | 2001-02-28 | ||
| JP2001055207A JP3532871B2 (en) | 2001-02-28 | 2001-02-28 | Cooling device and electronic device having this cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1373510A true CN1373510A (en) | 2002-10-09 |
| CN1226784C CN1226784C (en) | 2005-11-09 |
Family
ID=18915422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021064490A Expired - Fee Related CN1226784C (en) | 2001-02-28 | 2002-02-28 | Cooling device for cooling heat-generating element and electronic apparatus comprising same |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6781832B2 (en) |
| JP (1) | JP3532871B2 (en) |
| CN (1) | CN1226784C (en) |
| TW (1) | TW592026B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104144589A (en) * | 2013-05-07 | 2014-11-12 | 华为终端有限公司 | Vehicle-mounted wireless internet device |
| CN108987359A (en) * | 2017-05-30 | 2018-12-11 | 发那科株式会社 | Radiator and heat sink assembly |
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| US20060196639A1 (en) * | 2005-03-04 | 2006-09-07 | Inventec Corporation | Heatsink assembly |
| TWM273940U (en) * | 2005-03-23 | 2005-08-21 | Inventec Corp | Main frame casing for electronic product |
| JP2006294782A (en) * | 2005-04-08 | 2006-10-26 | Hitachi Ltd | Semiconductor light source device |
| CN201115185Y (en) * | 2007-05-22 | 2008-09-10 | 富士康(昆山)电脑接插件有限公司 | Heat radiator module |
| JP2009043097A (en) | 2007-08-09 | 2009-02-26 | Fujitsu Ltd | Electronic equipment and heat radiation unit |
| CN201590031U (en) * | 2010-01-29 | 2010-09-22 | 鈤新科技股份有限公司 | Refrigeration type heat radiation frame structure |
| JP5441789B2 (en) * | 2010-03-30 | 2014-03-12 | キヤノン株式会社 | Electronics |
| US9357677B2 (en) * | 2012-09-26 | 2016-05-31 | Panasonic Intellectual Property Management Co., Ltd. | Electronic device with efficient heat radiation structure for electronic components |
| JP6281373B2 (en) * | 2014-03-28 | 2018-02-21 | 株式会社富士通ゼネラル | Electric motor |
| JP2016219599A (en) * | 2015-05-20 | 2016-12-22 | 株式会社リコー | Electronic equipment and heat spreader |
| KR102574453B1 (en) * | 2018-09-03 | 2023-09-04 | 삼성전자 주식회사 | semiconductor package having improved thermal emission and electromagnetic shielding characteristics |
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| US4639829A (en) * | 1984-06-29 | 1987-01-27 | International Business Machines Corporation | Thermal conduction disc-chip cooling enhancement means |
| JPS6115353A (en) | 1984-06-29 | 1986-01-23 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | Chip cooler |
| US5640302A (en) | 1992-06-29 | 1997-06-17 | Elonex Ip Holdings | Modular portable computer |
| JPH09213847A (en) | 1996-02-01 | 1997-08-15 | Hitachi Ltd | Semiconductor integrated circuit device, manufacture thereof, and electronic device equipped therewith |
| US5825625A (en) | 1996-05-20 | 1998-10-20 | Hewlett-Packard Company | Heat conductive substrate mounted in PC board for transferring heat from IC to heat sink |
| JPH11121662A (en) | 1997-10-09 | 1999-04-30 | Hitachi Ltd | Cooling structure for semiconductor device |
| JP2000269671A (en) * | 1999-03-19 | 2000-09-29 | Toshiba Corp | Electronic apparatus |
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2001
- 2001-02-28 JP JP2001055207A patent/JP3532871B2/en not_active Expired - Fee Related
-
2002
- 2002-02-05 TW TW091102017A patent/TW592026B/en not_active IP Right Cessation
- 2002-02-28 CN CNB021064490A patent/CN1226784C/en not_active Expired - Fee Related
- 2002-02-28 US US10/085,429 patent/US6781832B2/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104144589A (en) * | 2013-05-07 | 2014-11-12 | 华为终端有限公司 | Vehicle-mounted wireless internet device |
| CN104144589B (en) * | 2013-05-07 | 2017-11-17 | 华为终端有限公司 | A kind of onboard wireless equipment for surfing the net |
| CN108987359A (en) * | 2017-05-30 | 2018-12-11 | 发那科株式会社 | Radiator and heat sink assembly |
| CN108987359B (en) * | 2017-05-30 | 2020-07-17 | 发那科株式会社 | Heat sink and heat sink assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1226784C (en) | 2005-11-09 |
| JP3532871B2 (en) | 2004-05-31 |
| US6781832B2 (en) | 2004-08-24 |
| JP2002261207A (en) | 2002-09-13 |
| US20020149913A1 (en) | 2002-10-17 |
| TW592026B (en) | 2004-06-11 |
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