CN1371792A - Metal mould for moulding and making method thereof - Google Patents
Metal mould for moulding and making method thereof Download PDFInfo
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- CN1371792A CN1371792A CN 02103487 CN02103487A CN1371792A CN 1371792 A CN1371792 A CN 1371792A CN 02103487 CN02103487 CN 02103487 CN 02103487 A CN02103487 A CN 02103487A CN 1371792 A CN1371792 A CN 1371792A
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- formation
- film
- master mold
- nitride
- metal mould
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Abstract
To provide a mold for molding an optical recording medium; especially, to provide a durable mold. A multilayered film 17, wherein nitride films 18 and nitrogen-containing carbon films 19 are alternately laminated, is provided to the attaching surface 1a of a stamper constituting the cavity 3 of a movable mold 1 or a fixed mold 2.
Description
Technical field
The present invention relates to forming metal mould, particularly make the forming metal mould of CD (Compact Disk), DVD (Digital Video Disk), optomagnetic disk etc., a kind of long-life forming metal mould and manufacture method thereof are provided.
Prior art
As the manufacturing installation of disc-shaped recording mediums such as CD, DVD, existing method is that plastic cement is inserted in the cavity of the metal pattern of supporting master mold, by press molding, simultaneously the surface configuration of master mold is copied on the formed products.Fig. 4 is an example of this metal mould for formation.
Fig. 4 is the cutaway view of the structure of metal pattern critical piece in the existing form metal casting machine of expression.In this figure, the 1st, movable side metal pattern, the 2nd, fixation side metal pattern, the 3rd, the cavity that forms by the composition surface of above-mentioned two metal patterns 1,2.Above-mentioned movable side metal pattern 1 with above-mentioned cavity 3 facing surfaces (master mold basal plane) 1a on, the master mold 4 that forms pre-group (pregroup) He Qiankeng relief patterns such as (prepit) on single face is installed.Above-mentioned master mold 4 is positioned on the master mold basal plane 1a of above-mentioned movable side metal pattern 1, and its inner rim portion and outer edge are fixed on the movable side metal pattern 1 by master mold securing member 5a, 5b.In addition, in Fig. 4, the 6th, the melt substance that comes out from the emission forming machine (not shown) is imported the plastic cement supply port of cavity 3, the 7th, the casting nozzle parts, the 8th, control enters the casting nozzle of the melt substances stream in the above-mentioned cavity 3.
Above-mentioned movable side metal pattern 1 and fixation side metal pattern 2 are made of a steel by the plastic cement forming metal mould.In order to improve its hardness and wearability, at least the cavity surface 2a to the master mold basal plane 1a of above-mentioned movable side metal pattern 1 and said fixing side metal pattern 2 quench, tempering, perhaps plate hard material.And above-mentioned master mold basal plane 1a and cavity surface 2a are finish-machined to mirror status, to improve by the dimensional accuracy of the goods of injection molding.
The reason that movable side metal pattern will carry out this grinding is, owing to master mold 4 will stretch under the effect of heat, so can slide on the surface of movable side metal pattern 1.For example, the temperature that makes melt plastic cement is 360 ℃, and the surface temperature of movable side metal pattern 1 is 100 ℃, and plastic cement pressure is 400kg/cm
2, then the surface temperature of master mold 4 is 360 ℃, back temperature is 100 ℃, and is pushed by above-mentioned pressure.Like this, master mold 4 will move along the surface of movable side metal pattern 1 under the effect of heat and pressure.Therefore, if use above-mentioned metal pattern to form repeatedly, master mold 4 is under the effect of friction, and each injection molding all can sustain damage, and produces be full of cracks, will stay the vestige of be full of cracks on the surface of formed products.
On the other hand, above-mentioned master mold 4 is made by nickel, and the surface that engages with the master mold basal plane 1a of above-mentioned movable side metal pattern 1 is finish-machined to minute surface.
During injection molding, between the master mold basal plane 1a and master mold 4 of above-mentioned movable side metal pattern 1, be easy to enter among the figure gas that contains in the fusion polymer substance that the quilt of expression do not penetrate or fine solid impurity.As everyone knows, during the polymer substance injection molding, the fusion polymer substance of HTHP is launched in the above-mentioned cavity 3, and after penetrating end of a period, solidify the preceding stage fully to the polymer substance that is launched in the above-mentioned cavity 3, uniformity and replicability in order to improve polymer substance are subjected to high pressure in the cavity 3.
But; for existing metal pattern; because the hardness of the master mold basal plane 1a of above-mentioned movable side metal pattern 1 is not very high; between the back side of the master mold basal plane 1a of movable side metal pattern 1 and master mold 4; if enter above-mentioned gas or solid impurity, then under the effect of the grinding of the effect of air pressure and solid impurity, the back side of master mold 4 not only; and the master mold basal plane 1a of above-mentioned movable side metal pattern 1 also can peel off the part, promptly generates so-called rough surface.This rough surface phenomenon worsens dimensional accuracy of products.
Master mold 4 is at the optical recording media that duplicates thousands of pieces, lose the normal replication of relief pattern after, the master mold that will more be renewed in turn, its wearability is just enough in this scope.Yet movable side metal pattern 1, fixation side metal pattern 2 are composite devices that each master mold of being replaced in turn all uses, and the cost height, and therefore semipermanent wearability is preferably arranged.The problem that invention will solve
Therefore,, provide high-precision master mold for when prolonging the service life of metal pattern, on the master mold basal plane of above-mentioned metal pattern, form higher than the material hardness that constitutes this master mold basal plane, and the wearability hard layer that constitutes of excellent material more.For example, have the metal pattern (spy opens clear 62-267937 communique) that forms TiN etc. and overcome the above problems,, but can't obtain sufficient abrasion resistance and low frictional properties though this technology can overcome the above problems to a certain extent.
As the technology that obtains wearability and low frictional properties; proposition is on the master mold basal plane of metal pattern; cover the metal mould for formation (spy opens flat 1-234214 communique) of diamond-like carbon element film, but have and metal pattern with the adaptation instability between the steel and the problem of durability aspect.
The present invention proposes in view of above problem.For the service life that prolongs metal pattern, high-precision master mold is provided, the invention provides a kind of metal mould for formation, it is characterized in that, on the master mold part that provides support on surface, be provided with that nitride film and nitrogenous carbon film replace lamination and the multilayer film that forms to the cavity that constitutes movable side metal pattern and fixation side metal pattern.
Summary of the invention
The present invention program 1 is a kind of metal mould for formation, it is characterized in that, on the master mold basal plane 1a on the surface of the cavity 3 that constitutes movable side metal pattern 1 and fixation side metal pattern 2, is provided with the alternately multilayer film 17 that forms of lamination of nitride film 18 and nitrogenous carbon film 19.
The present invention program 2 is a kind of metal mould for formation, it is characterized in that, in the metal mould for formation of scheme 1 record, the composition of nitride film 18 is titanium nitride (TiN), silicon nitride (Si
3N
4), aluminium nitride (AlN), tantalum nitride (TaN), zirconium nitride (ZrN) or TiAlN.
The present invention program 3 is a kind of metal mould for formation, it is characterized in that, in the metal mould for formation of scheme 1 record, nitride film 18 is 2nm to 20nm with the lamination cycle 20 of nitrogenous carbon film 19.
The present invention program 4 is a kind of manufacture method of metal mould for formation; it is characterized in that; nitride film 18 that on the master mold basal plane 1a on the surface of the cavity 3 of the metal mould for formation of formation scheme 1 record, is provided with and nitrogenous carbon film 19; be by rotation time on the substrate carrier 11 that metal mould for formation is placed in vacuum film formation chamber 10; according to the reactive sputtering method, on above-mentioned master mold basal plane 1a deposition and form.
Description of drawings
Fig. 1 is the key diagram of an embodiment of the film formation device of expression multilayer film, and this film formation device is used to form the multilayer film that is provided with on the master mold basal plane of the movable side metal pattern that constitutes metal mould for formation involved in the present invention.
Fig. 2 is the side view of the configuration example of expression multilayer film.
Fig. 3 is other a side view of the configuration example of expression multilayer film.
Fig. 4 is the cutaway view of existing metal mould for formation.
Fig. 5 represents by metal mould for formation by the key diagram of the comparison of the master mold of the present invention of injection molding and conventional example.
The specific embodiment
Below, based on accompanying drawing a preferred embodiment of the present invention is illustrated.Because the following stated embodiment is a preferred object lesson of the present invention, so carried out all preferred qualifications technically.But as long as be not particularly limited record of the present invention in the following description, scope then of the present invention is not limited to the qualification of these embodiments.
Fig. 1 is expression is used to form the film formation device of the multilayer film that is provided with on the master mold basal plane of the movable side metal pattern that constitutes the related metal mould for formation of present embodiment a key diagram.Fig. 2 is the side view of the configuration example of expression multilayer film.Fig. 3 is other a side view of the configuration example of the same multilayer film of expression.
Fig. 1 is explanation is used to form the film formation device of the multilayer film that is provided with on the master mold basal plane of movable side metal pattern figure.Among Fig. 1, the 10th, vacuum film formation chamber, the 12nd, the substrate that assembles on the surface of the discoid substrate holder 11 in being configured in vacuum film formation chamber 10.In addition, 11a is the axle of aforesaid substrate support 11, this 11a by means of among the figure not device shown can rotate freely.
13a, 13b are 2 kinds of negative electrode targets that are configured in the above-mentioned vacuum film formation chamber 10 that stands facing each other with aforesaid substrate 12, and 14a, 14b are respectively the power supplys that negative electrode target 13a, 13b use.In addition, the 15th, the high-vacuum exhaust system that constitutes by turbomolecular pump and drum pump, be connected with above-mentioned vacuum film formation chamber 10.By this high-vacuum exhaust system, vacuum film formation chamber 10 is pumped into 10
-6High vacuum about Torr.16a, 16b are connected with above-mentioned vacuum film formation chamber 10, control the mass flow controller of the flow of argon gas, nitrogen respectively.
Secondly, utilize the film formation device of Fig. 1, the film build method that forms multilayer film is elaborated.At first, by the high-vacuum exhaust system 15 that constitutes by above-mentioned turbomolecular pump and drum pump, will be pumped into 10 in the above-mentioned vacuum film formation chamber 10
-6High vacuum state about Torr then by the built-in heater (not shown) of substrate holder 11, is heated to substrate 12 temperature of regulation.
As mentioned above, be to get rid of impure gas with the purpose of being pumped into high vacuum state in the vacuum film formation chamber 10 by improving its vacuum, improve quality of forming film.
Secondly, by mass flow controller 16a, import the argon gas (sputter gas) of certain flow.Then,, import the nitrogen as reacting gas of certain flow, make the speed rotation of substrate holder 11 with regulation by mass flow controller 16b.
On the other hand, by above-mentioned power supply 14a, 14b, make above-mentioned spraying plating gas produce the plasma excitation, from each negative electrode target 13a of titanium (Ti) and graphite, the particle that 13b splashes, lamination in the cycle lamination become titanium nitride (TiN) film and nitrogenous carbon (CN) film, thereby form multilayer film.
The side view of the configuration example of Fig. 2 multilayer film that to be expression form by above-mentioned film build method, Fig. 3 are other the side views of representing the configuration example of same multilayer film.Among two figure, the 17th, multilayer film, the 18th, nitride film, the 19th, nitrogenous carbon film, the 20th, lamination cycle.And this lamination cycle 20 is comparatively suitable in the scope of 2nm to 20nm.Because during less than 2nm, productivity ratio is low, and the hardness on the surface that obtains does not reach by the desired hardness of the associativity of interlayer; During greater than 20nm, with above-mentioned same, productivity ratio, hardness etc. does not reach desired value.
As mentioned above; by constituting the lamination cycle 20 by having the 1st and the 2nd layer 18,19 that mutual difference forms; by these lamination order a plurality of cycles of sequential laminating on substrate 12; form the multilayer film shown in Figure 2 17 that traverses master mold basal plane 1a fully; thus, can make full use of each character of lamination unit.
And for multilayer film 17, because its top layer is nitrogenous carbon film, the low frictional properties that is easy to get is so be desirable multilayer film.
The multilayer film that is formed by reactive metallikon of present embodiment is fit to freely regulate the thickness of each layer.Yet vapour deposition method in addition, for example the multilayer film of formation such as cathode arc method, vacuum evaporation, ion plating, plasma enhanced chemical vapor deposition method also has good performance, needn't be only limited to present embodiment.
In addition, the multilayer film of formation, no matter the interface of interlayer is on the plane or on the on-plane surface, can both reach this described effect is described.And during deposition, even mix at each layer, the rough interface degree becomes big occasion, also can obtain identical therewith effect.＜the 1 embodiment 〉
Below referring to figs. 1 through Fig. 4, present embodiment is illustrated.Part same as the prior art is represented with same numeral, omits its explanation.At first, by the above-mentioned high-vacuum exhaust system 15 that constitutes by turbomolecular pump and drum pump, will be pumped into 10 in the vacuum film formation chamber 10
-6High vacuum state about Torr.
Secondly; the movable side metal pattern 1 that the surface is finish-machined to minute surface is configured to the assigned position of the vacuum film formation chamber 10 of Fig. 1; with the master mold basal plane 1a of the cavity side of Fig. 4 as substrate 12; when adjusting influx, as the argon gas (Ar) of spraying plating gas with as the nitrogen (N of reacting gas by mass flow controller
2) import constantly in the above-mentioned vacuum film formation chamber 10 shown in Figure 1, being evacuated to 10 in the vacuum film formation chamber 10
-3About high vacuum state.
Secondly, the temperature that makes substrate 12 is 200 ℃, and the spraying plating electrical power of titanium (Ti) negative electrode target is 1500W, and the spraying plating electrical power of graphite is 700W, with the lamination cycle be the film that 4nm forms thickness 2 μ m.
The for example CD that the metal pattern that obtains is assembled in Fig. 4 forms with on the emission forming machine.For relatively, by having the metal pattern of method plating TiN now, carry out injection molding too, obtain result as shown in Figure 5.
As finding out from Fig. 5, the metal mould for formation of present embodiment because nitride film and nitrogenous carbon film are replaced multilayer film that lamination forms as the master mold seating surface, has prolonged the life-span of metal pattern significantly.
And, in the present embodiment, as above-mentioned nitride film, though be that example describes with titanium nitride (TiN), for silicon nitride (Si
3N
4), aluminium nitride (AlN), tantalum nitride (TaN), zirconium nitride (ZrN) or TiAlN, also can obtain same effect.
For the related invention of scheme 1, owing to consisting of drawer at movable side metal pattern and fixation side gold On the master mold basal plane on the surface of the cavity of genus mould, be provided with nitride film and nitrogenous carbon film alternating layer The long-pending multilayer film that forms has been strengthened easy friction, master mold support surface easy to wear and corrosion-prone, Increased substantially its wearability, corrosion resistance and low frictional properties, thereby can carry significantly High by the service life of the master mold of supporting in the cavity surface of metal mould for formation.
For the related invention of scheme 2, because in the metal mould for formation of scheme 1 record, the nitrogenize constituent of the film is titanium nitride (TiN), silicon nitride (Si3N
4), aluminium nitride (AlN), Tantalum nitride (TaN), zirconium nitride (ZrN) or TiAlN have been strengthened easy friction, easy to wear And corrosion-prone master mold support surface, increased substantially its wearability, corrosion resistance and Low frictional properties, thereby can increase substantially by the cavity surface at metal mould for formation and support Service life of master mold.
For the related invention of scheme 3, because in the metal mould for formation of scheme 1 record, The lamination cycle of nitride film and nitrogenous carbon film is 2nm to 20nm, has strengthened easy friction, easily Wearing and tearing and corrosion-prone master mold support surface have increased substantially its wearability, corrosion resistance And low frictional properties, thereby can increase substantially the cavity surface that is formed with metal pattern and prop up The service life of the master mold of holding.
Scheme 4 related inventions are manufacture methods of metal mould for formation, because in formation side The nitride film that arranges on the master mold basal plane on the surface of the cavity of the metal mould for formation of case 1 record and Nitrogenous carbon film is by metal mould for formation is placed on the substrate carrier of vacuum film formation chamber In the time of rotation, according to reactive metallikon, form in above-mentioned master mold basal plane deposition, Thereby wearability, the corrosion resistance and low of resulting metal mould for formation have been increased substantially Frictional property.
Claims (4)
1. a metal mould for formation is characterized in that, on the master mold basal plane on the surface of the cavity that constitutes movable side metal pattern and fixation side metal pattern, is provided with nitride film and nitrogenous carbon film and replaces the multilayer film 17 that lamination forms.
2. metal mould for formation as claimed in claim 1 is characterized in that, the composition of nitride film is titanium nitride (TiN), silicon nitride (Si
3N
4), aluminium nitride (AlN), tantalum nitride (TaN), zirconium nitride (ZrN) or TiAlN.
3. metal mould for formation as claimed in claim 1 is characterized in that, the lamination cycle of nitride film and nitrogenous carbon film is 2nm to 20nm.
4. the manufacture method of a metal mould for formation; it is characterized in that; nitride film that on the master mold basal plane on the surface of the cavity that constitutes the described metal mould for formation of claim 1, is provided with and nitrogenous carbon film; be when rotating on the substrate carrier that metal mould for formation is placed in the vacuum film formation chamber; according to the reactive sputtering method, on above-mentioned master mold basal plane deposition and form.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP047999/2001 | 2001-02-23 | ||
| JP2001047999A JP3279312B1 (en) | 2001-02-23 | 2001-02-23 | Mold for molding and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1371792A true CN1371792A (en) | 2002-10-02 |
| CN1179833C CN1179833C (en) | 2004-12-15 |
Family
ID=18909334
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021034877A Expired - Fee Related CN1179833C (en) | 2001-02-23 | 2002-02-06 | Metal mould for moulding and making method thereof |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3279312B1 (en) |
| CN (1) | CN1179833C (en) |
| TW (1) | TW529991B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101647678B1 (en) * | 2013-11-22 | 2016-08-11 | 한국생산기술연구원 | Coating layer of hot and warm forging dies and method for surface treatment of hot and warm forging dies |
-
2001
- 2001-02-23 JP JP2001047999A patent/JP3279312B1/en not_active Expired - Fee Related
- 2001-12-03 TW TW90129863A patent/TW529991B/en not_active IP Right Cessation
-
2002
- 2002-02-06 CN CNB021034877A patent/CN1179833C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1179833C (en) | 2004-12-15 |
| TW529991B (en) | 2003-05-01 |
| JP2002248627A (en) | 2002-09-03 |
| JP3279312B1 (en) | 2002-04-30 |
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| SE01 | Entry into force of request for substantive examination | ||
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Granted publication date: 20041215 Termination date: 20100206 |