CN1364053A - Improved structure and method for packing image sensor - Google Patents
Improved structure and method for packing image sensor Download PDFInfo
- Publication number
- CN1364053A CN1364053A CN01100755A CN01100755A CN1364053A CN 1364053 A CN1364053 A CN 1364053A CN 01100755 A CN01100755 A CN 01100755A CN 01100755 A CN01100755 A CN 01100755A CN 1364053 A CN1364053 A CN 1364053A
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- CN
- China
- Prior art keywords
- circuit board
- sensing wafer
- image sensing
- flexible circuit
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention relates to encapsulation structure and encapsulation method of image detector. The structure is as follows: multi electric circuits are formed on an image-sensing wafer, and each electric circuit has a welding pad; there is a soft circuit board, its upper surface and lower surface; signal-input ends are formed on said lower surface with positions faced to each positions of welding pad to imaging-sensing wafer; each signal-input end is connected to a signal-output end electrically; a transparent layer covers on upper surface of said soft circuit board; there is input end of signal and output end of signal on the transparent layer, and the output ends of signal are connected to the printing circuit board. The structure and method made image detector produce easier so as to reduce cost greatly.
Description
The present invention relates to a kind of packaging structure and method for packing thereof of image sensor, refer in particular to a kind ofly, can simplify procedure for producing and reduce manufacturing cost to cover the packaging structure of the image sensor that crystalline form makes.
Press, general sensor is to be used for measuring signal, and this signal can be light signal or sound signal, and sensor of the present invention is to be used for receiving an image signal, and this image signal is converted to electric signal is passed on the printed circuit board (PCB).
See also the cutaway view of Fig. 1 for known image sensor, it includes:
One substrate 10 is arranged, and this substrate is a pottery magnetic material, and its periphery is provided with a signal input end 12 and a signal output end 14, and signal output end 14 is in order to be electrically connected on the printed circuit board (PCB) 16.
One spacer 18 is to be arranged on the substrate 10, makes substrate 10 be formed with an accommodation chamber 20;
One image sensing wafer 22 is to be arranged on the substrate 10, and be positioned at the accommodation chamber 20 that substrate 10 and spacer 18 form, on the weld pad 26 that is electrically connected on image sensing wafer 22 by plural wires 24 and the signal input end 12 of substrate 10, substrate 10 is electrically connected with image sensing wafer 22 formation.
One transparent glass 28 is fixed in product on device 18, make image sensing wafer 22 be seen through transparent glass 28 and receive image signal, and it is fast to the signal input end 12 of substrate 10 that image signal is converted to the electric signal biography, signal input end 12 by substrate 10 is passed to signal output end 14 with electric signal, is passed on the printed circuit board (PCB) 16 by signal output end 14.
The packaging structure of above-mentioned image sensor, the more and processing procedure that produce of its element relatively be a complexity, moreover, substrate 10 is made with pottery magnetic material material, the costliness that its price is suitable, and when making since the ceramics material cutting be difficult for, therefore necessary single manufacturing, relatively its manufacturing cost is quite high.
Main purpose of the present invention is to provide a kind of improvement encapsulating structure of image sensor, directly be packaged in image sensing wafer on the flexible circuit board to cover crystal type, and do not need with the transmission medium of substrate as signal, have the effect that reduces packing component, packaging cost is reduced.
Another object of the present invention is to provide a kind of improvement method for packing of image sensor, have the simplification procedure for producing, it is made now on the facility.
The object of the present invention is achieved like this: a kind of improvement packaging structure of image sensor, it is in order to be electrically connected on the printed circuit board (PCB), it is characterized in that: include an image sensing wafer, be formed with a plurality of electronic circuits on it, each electronic circuit all is provided with a weld pad; One flexible circuit board, it is provided with a upper surface and a lower surface, this lower surface is formed with a signal input end with respect to each bond pad locations of this image sensing wafer, in order to be electrically connected on the corresponding weld pad of this image sensor, reach this each signal input and be electrically connected on a signal output end, in order to be electrically connected on this printed circuit board (PCB); And a photic zone, it is covered in the upper surface of this flexible circuit board, and the number of which is provided with input and signal output end, and this news output is in order to be electrically connected this printed circuit board (PCB).
Described photic zone is a transparent glass.
Described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.
Each bond pad locations of described image sensing wafer is formed with metallic contact, in order to be electrically connected with the signal input end of this flexible circuit board.
Be formed with adhesive layer between described image sensing wafer and this photic zone, and seal this flexible circuit board and be electrically connected the place with image sensing wafer.
A kind of improvement method for packing of image sensor, the step of its feature is:
(1) provides an image sensing wafer, have a plurality of electronic circuits on it, on this each electronic circuit, have a weld pad;
(2) provide a flexible circuit board, machine is formed with signal input end corresponding to each bond pad locations of this image sensing wafer on it, and the signal input end of this flexible circuit board is electrically connected on the weld pad of this image sensing wafer;
(3) provide a photic zone to be covered on this image sensing wafer, make this image sensing wafer receive image signal via photic zone.
Described flexible circuit board is electrically connected on this image sensing wafer, and fixes with sticker.
Described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.
Each bond pad locations of described image sensing wafer is formed with metallic contact, and in order to be electrically connected with the signal input end of this flexible circuit board.
Described photic zone is a transparent glass.
Because adopt such scheme: it is more convenient to make in the manufacturing, can significantly reduce production costs.
The present invention must be able to more deep understanding by following graphic and detailed description:
Fig. 1 is the cutaway view that known image is surveyed the packaging structure of device.
Fig. 2 surveys the analysing and observe of improvement packaging structure of device for image of the present invention.
Fig. 3 surveys the exploded view of the improvement packaging structure of device for image of the present invention.
Fig. 4 surveys the enforcement figure of the improvement packaging structure of device for invention image picture.
See also the cutaway view of Fig. 2 for the improvement packaging structure of image sensor of the present invention, it includes:
One image sensing wafer 30 which is provided with a upper surface 32 and a lower surface 34, and upper surface 32 is formed with many electronic circuits (figure does not show), and each electronic circuit all is provided with a weld pad 36, is formed with metallic contact 38 (Gold Bump) on each weld pad 36.
One flexible circuit board 40, it is provided with a upper surface 42 and a lower surface 44, lower surface 44 is formed with a signal input end 46 with respect to each weld pad 36 position of image sensing wafer 30, in order to the metallic contact 38 on the weld pad 36 that is electrically connected on image sensing wafer 30, each signal input end 46 is electrically connected on a signal output end 48 that is formed at the lower surface 44 of flexible circuit board 40; Flexible circuit board 40 central parts have one and are little hollow slots 50 than image sensing wafer 30, signal input end 46 then is positioned at hollow slots 50 peripheries, make that image sensing wafer 30 is able to be exposed by hollow slots 50 when the metallic contact 38 of image sensing wafer 30 is electrically connected on the signal input end 46 of flexible circuit board 40.
One photic zone 52 is transparent glass, and it is adhered to the upper surface 42 of flexible circuit board 40, the hollow slots 50 of flexible circuit board 40 is covered, and image sensing wafer 30 is seen through photic zone 52 and receives image signals, and image signal is converted to electric signal.
Please cooperate and consult Fig. 3, the present invention is when encapsulation, at first image sensing wafer 30 is connected to flexible circuit board 40 to cover the crystal type electricity, the metallic contact 38 on it is electrically connected mutually with the signal input end 46 of flexible circuit board 40, and can it be adhesively fixed viscose glue.Then photic zone 52 is adhered on the flexible circuit board 40 with viscose glue 54; be filled in image sensing wafer 30 and photic zone 52 peripheries with an encapsulated layer 56 again; and flexible circuit board 40 and image sensing wafer 30 are sealed up, be electrically connected the place with protection flexible circuit board 40 with image sensing wafer 30.So image sensing wafer 30 must see through photic zone 52 and receive image signal, and image signal is converted to the signal input end end 46 that electric signal is passed to flexible circuit board 40, is passed to signal output end 48 by signal input end 46 again.
See also Fig. 4, the image sensor of finishing is placed in the printed circuit board (PCB) 58 formed breach 60, the signal output end 48 of flexible circuit board 40 then is electrically connected on the printed circuit board (PCB) 58, make that seeing through photic zone 52 with image sensing wafer 30 receives image signal, and after image signal is converted to electric signal, electric signal is passed to the signal input end 36 of flexible circuit board 40, is passed on the printed circuit board (PCB) 58 by flexible circuit board 40 signal output ends 48 again.
Borrow tectonic association as above, the improvement packaging structure and the method for packing thereof of the brilliant device of image sensing of the present invention, it has following advantage:
1. with the signal transmission medium of flexible circuit board 40, can save the member of known substrate 10, can reduce production costs as image sensing wafer 30.
2. owing to save the member of known substrate 10, therefore, the encapsulation volume of image sensor reached gently, approach, short and small demand.
3. because flexible circuit board 40 can be convenient to cut, therefore, a plurality of image sensor can be encapsulated simultaneously, be cut into single packaging body again, therefore, its a large amount of manufacturing costs are lower.
The specific embodiment that in the detailed description of preferred embodiment, is proposed, in order to be easy to illustrate technology contents of the present invention, be not that invention narrow sense is limited to embodiment, all situations according to spirit of the present invention and following claim, the many variations of doing implements all to belong to scope of the present invention.
Claims (10)
1, a kind of improvement packaging structure of image sensor, it is characterized in that in order to be electrically connected on the printed circuit board (PCB): include an image sensing wafer, be formed with a plurality of electronic circuits on it, each electronic circuit all is provided with a weld pad; One flexible circuit board, it is provided with a upper surface and a lower surface, this lower surface is formed with a signal input end with respect to each bond pad locations of this image sensing wafer, week is to be electrically connected on the corresponding weld pad of this image sensor, reach this each signal input and be electrically connected on a signal output end, in order to be electrically connected on this printed circuit board (PCB); And a photic zone, it is covered in the upper surface of this flexible circuit board, and the number of which is provided with input and signal output end, and this news output is in order to be electrically connected this printed circuit board (PCB).
2, the improvement packaging structure of image sensor as claimed in claim 1 is characterized in that: described photic zone is a transparent glass.
3, the improvement packaging structure of image sensor as claimed in claim 1, it is characterized in that: described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.
4, the improvement packaging structure of image sensor as claimed in claim 1; It is characterized in that: each bond pad locations of described image sensing wafer is formed with metallic contact, in order to be electrically connected with the signal input end of this flexible circuit board.
5, the improvement packaging structure of image sensor as claimed in claim 1 is characterized in that: be formed with adhesive layer between described image sensing wafer and this photic zone, and seal this flexible circuit board and be electrically connected the place with image sensing wafer.
6, a kind of improvement method for packing of image sensor, the step of its feature is:
(1) provides an image sensing wafer, have a plurality of electronic circuits on it, on this each electronic circuit, have a weld pad;
(2) provide a flexible circuit board, machine is formed with signal input end corresponding to each bond pad locations of this image sensing wafer on it, and the signal input end of this flexible circuit board is electrically connected on the weld pad of this image sensing wafer;
(3) provide a photic zone to be covered on this image sensing wafer, make this image sensing wafer receive image signal via photic zone.
7, the improvement method for packing of image sensor as claimed in claim 6, it is characterized in that: described flexible circuit board is electrically connected on this image sensing wafer, and fixes with sticker.
8, the improvement method for packing of image sensor as claimed in claim 6, it is characterized in that: described flexible circuit board has a hollow slots, and this signal input end is formed at this hollow slots periphery.
9, the improvement method for packing of image sensor as claimed in claim 6 is characterized in that: each bond pad locations of described image sensing wafer is formed with metallic contact, and in order to be electrically connected with the signal input end of this flexible circuit board.
10, the improvement method for packing of image sensor as claimed in claim 6; It is characterized in that: described photic zone is a transparent glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011007559A CN1201649C (en) | 2001-01-09 | 2001-01-09 | Improved structure and method for packing image sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011007559A CN1201649C (en) | 2001-01-09 | 2001-01-09 | Improved structure and method for packing image sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1364053A true CN1364053A (en) | 2002-08-14 |
| CN1201649C CN1201649C (en) | 2005-05-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011007559A Expired - Fee Related CN1201649C (en) | 2001-01-09 | 2001-01-09 | Improved structure and method for packing image sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1201649C (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1302541C (en) * | 2003-07-08 | 2007-02-28 | 敦南科技股份有限公司 | Chip packaging base plate having flexible circuit board and method for manufacturing the same |
| CN1306575C (en) * | 2003-01-17 | 2007-03-21 | 胜开科技股份有限公司 | Method for packaging image sensor by injection moulding |
| CN100362666C (en) * | 2004-03-24 | 2008-01-16 | 宏齐科技股份有限公司 | Packaging structure of optical sensing chip and producing method thereof |
| CN100383938C (en) * | 2003-06-09 | 2008-04-23 | 三洋电机株式会社 | Semiconductor device and manufacturing method thereof |
| CN101461701B (en) * | 2007-12-21 | 2010-11-03 | 华晶科技股份有限公司 | Minitype sensor and method for producing the same |
-
2001
- 2001-01-09 CN CNB011007559A patent/CN1201649C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1306575C (en) * | 2003-01-17 | 2007-03-21 | 胜开科技股份有限公司 | Method for packaging image sensor by injection moulding |
| CN100383938C (en) * | 2003-06-09 | 2008-04-23 | 三洋电机株式会社 | Semiconductor device and manufacturing method thereof |
| CN1302541C (en) * | 2003-07-08 | 2007-02-28 | 敦南科技股份有限公司 | Chip packaging base plate having flexible circuit board and method for manufacturing the same |
| CN100362666C (en) * | 2004-03-24 | 2008-01-16 | 宏齐科技股份有限公司 | Packaging structure of optical sensing chip and producing method thereof |
| CN101461701B (en) * | 2007-12-21 | 2010-11-03 | 华晶科技股份有限公司 | Minitype sensor and method for producing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1201649C (en) | 2005-05-11 |
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Granted publication date: 20050511 Termination date: 20190109 |
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| CF01 | Termination of patent right due to non-payment of annual fee |