CN1355075A

CN1355075A - Technology for making welding balls used for packing material

Info

Publication number: CN1355075A
Application number: CN 00133617
Authority: CN
Inventors: 张道光
Original assignee: Individual
Current assignee: Individual
Priority date: 2000-11-27
Filing date: 2000-11-27
Publication date: 2002-06-26
Anticipated expiration: 2020-11-27
Also published as: CN1127386C

Abstract

A technology for preapring welding balls used for package incldues such steps as drawing metallic wire for reduced smaller diameter, cutting by needed shaping size, cleaning surface for removing residual dregs, dead-weight dropping step for shaping balls, cleaning surface, and screening. Its advantages include high roundness, precise size, low cost and high rate of finished products (more than 95%).

Description

The technology for making welding balls of used for packing material

The present invention relates to the technology for making welding balls of BGA (Ball Grid Array spherical grid array component), CSP products such as (CommunicationScanner Processor communication scanner processors) encapsulation usefulness.

The packaged type of fabrication schedule behind the present semiconductor, gradually adopt advanced method for packing such as BGA, CSP, be that leg is replaced with soldered ball as shown in Figure 1, make its directly solid welding upper plate, with reduction overall package volume, therefore the precision of its upper plate solid welding is influenced by the soldered ball quality just, so the soldered ball quality also is the key factor of influence encapsulation quality.

The known package technology for making welding balls, its be by metal wire rod through reel off raw silk from cocoons and cut processing after make one little section thin footpath heart line, made the soldered ball body of demand again through one soldered ball moulding fabrication schedule, yet the fabrication schedule ability of this soldered ball moulding is very big to the influence of quality yield, encapsulate with technology for making welding balls with commonly used, it is being the thin wire that reels off raw silk from cocoons to be blown through a kind of tunnel airstream shaped device through passing through on the round mould on soldered ball moulding fabrication schedule, to make the ball-type body of demand, but the soldered ball that this tunnel airstream moulding fabrication schedule mode is molded, after blowing out moulding, can form wire drawing phenomenon or unedged situation generation according to the air motion direction, not only the precision influence to the solid welding of subsequent implementation upper plate is very big, also cause whole yields to reduce relative also having improved on manufacturing cost.Therefore the requirement that how to improve yields is to become to be the major subjects of this kind industry on enhancing competitiveness.

Main purpose of the present invention, be for a kind of technology for making welding balls of making the good and rate of good quality rate of out of roundness is provided, and then reach the saving manufacturing cost, and subsequent applications implements to have the high effect of upper plate solid welding precision, and have on the yields up to the ability more than 95%, can significantly improve its competitiveness on industry, to meet the value of this industry.

The object of the present invention is achieved like this: a kind of technology for making welding balls of used for packing material, it is characterized in that: this method is the processing of earlier a metal wire rod being reeled off raw silk from cocoons, then make thin footpath heart line and cut operation, to cut into the transversal material of required compact dimensions, again the transversal material is removed the cleaning treatment of surface attachment detritus or dust, after cleaning treatment, carry out a kind of soldered ball forming processes with material material dead weight falling bodies, to make the soldered ball body of required size, soldered ball surface with moulding gives cleaning treatment again, after cleaning treatment, implement Screening Treatment and work for inspection, make satisfactory encapsulation soldered ball.

Metal wire rod is the wire rod of tin, gold, copper or tin, gold, copper alloy portioning; It is to decide its size range between φ 1000 μ m～0.01 μ m according to required size of solder ball that the thin footpath heart line of making pulls out size; The heating-up temperature of soldered ball forming processes is the metal wire rod fusing point that is provided is provided and decides, and its heating-up temperature is between 20 ℃～2000 ℃.

The soldered ball forming processes is to utilize itself deadweight falling bodies to be passed a plurality of round holes screen cloth to screen layer by layer with cutting transversal material after the cleaning, and this transversal material is at first to be heated into molten condition in handling, and the while is when screen cloth is handled and add the processing of high-purity glycerine lubrication and the soldered ball body of the required size of moulding.

This shows, the invention provides a kind of at made soldered balls of encapsulating material such as tin, gold, copper or its alloying metals, and can reach the technology for making welding balls that out of roundness is good and yields is high, this method can significantly improve the fabrication schedule ability, save manufacturing cost, and have the characteristic of more accurate upper plate solid welding precision in the subsequent applications enforcement, and whole yields can reach more than 95%, the volume production demand that meets the rate of good quality rate also can significantly improve its competitiveness on industry.

Be described in detail as follows with regard to specific embodiments of the invention below in conjunction with accompanying drawing.

Description of drawings:

Fig. 1 is the enforcement illustration that the known package mode is used soldered ball;

Fig. 2 is the manufacture method flow chart of invention.

See also shown in Figure 2, main manufacture methods of the present invention is handled 1 for earlier a metal wire rod reeling off raw silk from cocoons, and then make thin footpath heart line and cut operation 2, to cut into the transversal material of required compact dimensions, again the transversal material is removed the cleaning treatment 3 of surface attachment detritus or dust, after cleaning treatment 3, carry out soldered ball forming processes 4 to make the soldered ball body of required size, soldered ball surface with moulding gives cleaning treatment 5 again, implement Screening Treatment 6 and check 7 in cleaning treatment 5 backs, to make satisfactory encapsulation soldered ball 8.

Above-mentioned reeling off raw silk from cocoons handles 1, be that the metal wire rod pull is made thin footpath heart line, this metal wire rod can be the wire rod of tin, gold, copper or tin, gold, copper alloy portioning, it being pulled out comply with required size of solder ball and fixed thin footpath heart linear dimension, is between φ 1000 μ m～0.01 μ m with the thin directly heart line of present fabrication schedule ability institute's pull range of needs.

Above-mentioned soldered ball forming processes 4, be to cut transversal material after the cleaning to send in a towering setting and the inner vacuum plant that is provided with a plurality of stacked in multi-layers circles hole screen cloth, this transversal material at first is heated into molten condition in vacuum plant, simultaneously when melt process and add the lubricated of high-purity glycerine, utilize itself deadweight falling bodies to be passed that a plurality of round holes screen cloth screens layer by layer and the soldered ball body that molds required size, and this heating-up temperature parameter is the metal wire rod fusing point that is provided is provided and decides, and its heating-up temperature is between 20 ℃～2000 ℃.

Finish after the soldered ball forming processes 4, must carry out cleaning treatment 5 to product, implement Screening Treatment 6 in cleaning treatment 5 backs, to distinguish out the non-defective unit that closes in standard, at last non-defective unit is tested 7, this check includes out of roundness, size and the weldering property reliability that detects soldered ball, to guarantee certain quality, after by check 7, be to make satisfactory encapsulation soldered ball 8.

Learn by above-mentioned, the made encapsulation of this kind manufacture method soldered ball manufactured goods, owing to be the method that adopts material material dead weight falling bodies when the soldered ball forming processes, and in making, processing adds the lubricated of high-purity glycerine (glycerine), the soldered ball body of the preferable out of roundness of energy moulding when making it pass through to screen layer by layer, avoid wire drawing phenomenon or unedged situation, compare mutually with technology for making welding balls with encapsulation commonly used, can significantly improve the fabrication schedule ability, save manufacturing cost, and subsequent applications implements to have the characteristic of accurate upper plate solid welding precision, and whole yields can reach more than 95%, the volume production demand that can meet the rate of good quality rate also can significantly improve its competitiveness on industry.

Claims

1, a kind of technology for making welding balls of used for packing material, it is characterized in that: this method is the processing of earlier a metal wire rod being reeled off raw silk from cocoons, then make thin footpath heart line and cut operation, to cut into the transversal material of required compact dimensions, again the transversal material is removed the cleaning treatment of surface attachment detritus or dust, after cleaning treatment, carry out a kind of soldered ball forming processes with material material dead weight falling bodies, to make the soldered ball body of required size, soldered ball surface with moulding gives cleaning treatment again, after cleaning treatment, implement Screening Treatment and work for inspection, make satisfactory encapsulation soldered ball.

2, the technology for making welding balls of used for packing material as claimed in claim 1 is characterized in that: metal wire rod is the wire rod of tin, gold, copper or tin, gold, copper alloy portioning; It is to decide its size range between φ 1000 μ m～0.01 μ m according to required size of solder ball that the thin footpath heart line of making pulls out size; The heating-up temperature of soldered ball forming processes is the metal wire rod fusing point that is provided is provided and decides, and its heating-up temperature is between 20 ℃～2000 ℃.

3, the technology for making welding balls of used for packing material as claimed in claim 1, it is characterized in that: the soldered ball forming processes is to utilize itself deadweight falling bodies to be passed a plurality of round holes screen cloth to screen layer by layer with cutting transversal material after the cleaning, and this transversal material is at first to be heated into molten condition in handling, and the while is when screen cloth is handled and add the processing of high-purity glycerine lubrication and the soldered ball body of the required size of moulding.