CN1336963A - Solderable aluminium - Google Patents
Solderable aluminium Download PDFInfo
- Publication number
- CN1336963A CN1336963A CN98811721A CN98811721A CN1336963A CN 1336963 A CN1336963 A CN 1336963A CN 98811721 A CN98811721 A CN 98811721A CN 98811721 A CN98811721 A CN 98811721A CN 1336963 A CN1336963 A CN 1336963A
- Authority
- CN
- China
- Prior art keywords
- aluminium
- substrate
- tin
- alloy
- scolder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/04—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/003—Alloys based on aluminium containing at least 2.6% of one or more of the elements: tin, lead, antimony, bismuth, cadmium, and titanium
Abstract
The invention is directed to a solderable aluminium alloy having an aluminium alloy which is formable into substrate. The aluminium alloy has 0.05-4.5% by weight of tin added to the aluminium alloy to be formed into the substrate. The invention is also directed to a process for preparing a solderable aluminum substrate. The process includes preparing an aluminum slug with 0.05-4.5% of tin added to the aluminum slug; then rolling the aluminium slug to the desired thickness for the substrate; finally forming the rolled slug into the final shaped of the substrate.
Description
The present invention relates to use the method for scolder and the scolder molten bath solderable aluminium alloy and the alloying of standard.
General scolder molten bath is to be made of the liquid tin that contains to the lead that wherein adds certain percentage.Also have and manyly join other components in the scolder to improve or to improve the characteristic of scolder.Usually scolder is dissolved in the molten bath, and part is immersed the molten bath, uses solidified liquid solder cap piece subsequently.This solder composition is very good for the part time job of being made by copper and copper alloy such as bronze.But because form alumina layer at the outside surface of aluminium part, this scolder molten bath is not good to the aluminium part time job.Because formed hard aluminum oxide skin, the molten tin that contains a small amount of lead can not form good combination to the aluminium surface.
Other people have attempted seeking a kind of method of welding of aluminum.For the welding of aluminum part, attempted changing the general method of scolder component so that scolder and aluminium surface form good combination.U.S. patent No.5,147,471 disclose a kind of such scolder, and it can use on the oxide skin of metal that forms oxide layer and alloy thereof.Said composition contains tin and zinc, as the germanium of wetting agent, and preferred a spot of copper and antimony and silicon carbide coarse sand.When germanium infiltrates any oxide skin that oxide skin these coarse sand wearing and tearing of following time form in the metallic surface, so that good metal and melts combine to be provided.Germanium contains 10 weight % of scolder, so that sufficient humidification is provided, but can not cause the melt temperature of solder composition to be higher than 300 ℃.Scolder is applied on the part, makes coarse sand and scolder wear surface by at first wipe scolder in the metallic surface, heating surface begins fusing and germanium infiltration oxide skin until scolder simultaneously, then its any oxide skin that fluffs is brushed.
It will be favourable using aluminium in electrical connector, as the vestige or some other shackle, shell, ground plane or other any metals that are used on electrical contact, the circuit card are used.Because its electronics and mechanical property, copper or copper alloy are usually used in these application.Copper and copper alloy also is easy to weld or can be electroplated and forms the substrate that can weld.Aluminium has higher electroconductibility than copper, therefore uses good in some cases.Aluminium weight is also light, also is an advantage in some cases.Except electrical connector, the aluminium that has a kind of easy welding in other field also is favourable.
Required is a kind of aluminium, and it can use the scolder molten bath that is made of tin of standard directly to weld, and it easily is made into part.
But the present invention relates to have the welding aluminum alloy of the aluminium alloy that easily is processed into substrate.This aluminium alloy contains and joins the tin that this is processed into the 0.05-4.5 weight % in the aluminium alloy of substrate.
Can add other yuan and usually improve the wet characteristic of aluminum.
The invention still further relates to preparation and can weld the method for aluminium substrate.This method comprises that preparation contains the aluminium block that joins 0.05-4.5% tin in this aluminium block, and rolling then aluminium block is processed into the rolled metal piece the final shape of substrate at last to the required thickness of substrate.
The present invention relates to easily be processed into various difform aluminium alloys.Aluminium alloy is the surface tension characteristics of the part that is processed into raising of the aluminium alloy of wherein carrying tin secretly of standard and improves wet characteristic.
Usually tin and aluminium at room temperature do not dissolve each other.At room temperature only a spot of tin is dissolved in the aluminium.At high temperature, tin is dissolved in the aluminium fully.But when composition cools also can be solidified, tin will be separated from aluminium and form tin sweat(ing) or particle in aluminium.If material can enough cool off apace, then tin seldom will be separated from aluminium.This technology is specially adapted to the quick cooling of material surface and keeps more being dissolved in tin in the aluminium of material surface.Think that the tin that is dissolved in the aluminium is many more, the solder composition of surface and standard and the wettability in molten bath are strong more.Even allow aluminium slowly to cool off,, the tin of minute quantity give aluminium in the aluminium with better weldability thereby also will remaining in.But this aluminium quantity not sufficient is thought the weldability that substrate provides.
General, by the tin formation aluminium alloy and the casting aluminium ingot of dissolving appropriate amount in molten aluminum.Aluminium ingot is rolled and is processed into part or the required thickness of equipment that subsequently aluminium is processed into then.
When ingot rolling being processed into required thickness, tin sweat(ing) or particle will come out along rolling substrate surface.In addition, in rolling technology, many these metallic beads will break, and tin will distribute or spread upon the surface of rolling substrate.Al oxide layer is also with partial crushing in rolling technology, thereby forms the combination of metal to metal between tin of smearing and aluminium.Because tin can be moistening by scolder, the tin sweat(ing) of smearing will provide wettable big surface in rolling substrate.
To use the manufacturing technology of standard that required substrate is processed in rolling substrate then.Required substrate can be to be used for the electrical contact of electrical connector or shell.Substrate also can be other any substrates that can be processed into by aluminium.
When forming required substrate, it will have the surface property identical with rolling substrate, and promptly it has along its surperficial tin sweat(ing), and some pearl is broken and along the surface arrangement of required substrate at least.When the welding substrate, the tin that is distributed in substrate surface will provide wettable surface to substrate for solder attach.
The tin sweat(ing) that forms along material surface will be partly or major part be embedded among the material itself.Only the metallic bead of small portion will be exposed to the surface of material.When rolling this material, only the part metallic bead that is exposed to material surface will be distributed in the surface of rolling substrate.Usually, most of tin sweat(ing) is with residual embedding substrate itself.
When required substrate is processed in rolling substrate, the surface of required substrate will not only have and be distributed in its surperficial tin, the metallic bead that also will have a large amount of embedding base materials and expose along base part.
When welding required substrate, the scolder of heat will move on substrate surface, and will form mechanical and electronic the combination with the tin that is distributed on the substrate surface.Because tin is to the strong interaction of tin metal, the combination between scolder and tin is strong.In addition, scolder will form strong machinery and electronics combination with the tin sweat(ing) that still is embedded in the material itself to small part.So because metallic bead is embedded in the combination of the machinery between substrate and scolder in the substrate is extremely strong, therefore be safely secured in the substrate.
In addition, because will there be strong electronics combination in the metal to metal combination between tin sweat(ing) and aluminium.Because tin sweat(ing) forms in the inside of aluminium in process for cooling, will there be aluminum oxide coating layer on the aluminium surface of inside, cave.Process for cooling prevention oxygen enters into and will form the inside in the cave of tin sweat(ing).Therefore, the interaction of electrons between tin sweat(ing) and cave will be strong metal to metal combination.In welding procedure, tin sweat(ing) will melt and mix with the fused scolder is possible.In case solder cools, the material in the cave will solidify again, perhaps become the primary tin sweat(ing) or with scolder blended tin sweat(ing).Because the cave will cover with fusion welding continuously, oxygen will continue to discharge from the cave, thereby stop aluminum oxide to form in the cave.Therefore, though tin sweat(ing) fusing and with the fusion welding diffusion, will form good metal to the metal electron combination.
Being suitable for aluminium alloy used in this invention is series alloy.But all these alloys have suitable forming characteristic, can be processed into part or other parts of electronic connector.Particularly, the alloy of 1000,3000 and 5000 series alloys will be suitable for using in the present invention.All these alloys have and are processed into the required necessity of part and make characteristic.Particularly, alloy 3003,3004,5080,5082 and 5784 is the plasticity that the invention provides.But useful alloy is not limited to this five kinds of compositions.Aluminium alloy is that prior art is known, will not be further described here.
The aluminium alloy of listing in the above will have a spot of tin that joins in this alloy.Percentage range is 0.05-4.5%.Particularly, the alloy of listing in the above can each contain 0.5,1.0, and 2.0 or 2.5%, be added in the composition.But the invention is not restricted to these specific per-cent.
In addition, other materials also can join in the alloy to optimize performance.As, can add material to improve the manufacturing characteristic of alloy.In addition, can add some material to improve the solvability of tin in aluminium alloy or the surperficial wettability of raising alloy.The element that adds a spot of silver and other similar characteristics can help to improve the wettability of alloy.
To from foregoing description, understand solderable aluminium alloy of the present invention and be processed into technology and many bonus thereof that can weld aluminium substrate.Being apparent that can be in form, carry out various changes on structure and the arrangements of components and do not break away from the spirit or scope of the present invention or sacrifice all material advantages.
Claims (5)
1. solderable aluminium alloy comprises:
Can be configured as into the aluminium alloy of substrate;
Join the 0.05-4.5 weight % tin in this aluminium alloy that will be processed into substrate.
2. the weldable aluminium of claim 1, wherein aluminium alloy is taken from 1000,3000 and 5000 aluminum alloy series.
3. prepare the method for solderable aluminium substrate, comprising:
Preparation contains the aluminium block that joins 0.05-4.5% tin in this aluminium block;
Aluminium block is rolled down to the substrate desired thickness;
To be processed into the final shape of substrate through rolling aluminium block.
4. the method for claim 3 wherein joins the tin of 0.05-4.5% in the molten aluminum, and some is dissolved in the tin in the aluminium at least to keep to cool off aluminium then rapidly.
5. the method for claim 3, wherein aluminium block is processed by aluminium alloy, and this aluminium alloy takes from 1000,3000,5000 aluminum alloy series.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US6725197P | 1997-12-02 | 1997-12-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1336963A true CN1336963A (en) | 2002-02-20 |
Family
ID=22074756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN98811721A Pending CN1336963A (en) | 1997-12-02 | 1998-12-02 | Solderable aluminium |
Country Status (7)
Country | Link |
---|---|
US (1) | US6491772B1 (en) |
EP (1) | EP1036206A1 (en) |
JP (1) | JP2001525488A (en) |
KR (1) | KR20010052112A (en) |
CN (1) | CN1336963A (en) |
AU (1) | AU1618799A (en) |
WO (1) | WO1999028516A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107805744A (en) * | 2014-05-30 | 2018-03-16 | 东洋铝株式会社 | The manufacture method of aluminium foil, the electronic unit circuit board for having used it and aluminium foil |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US507822A (en) * | 1893-10-31 | Marguerite hortense lanqon | ||
US3827882A (en) * | 1968-03-15 | 1974-08-06 | Glacier Metal Co Ltd | High lead aluminium alloy |
JPS54110909A (en) * | 1978-02-21 | 1979-08-30 | Sumitomo Light Metal Ind | Aluminum alloy for use as sacrifice anode |
DE3000774C2 (en) * | 1980-01-10 | 1993-04-29 | Taiho Kogyo Co., Ltd., Toyota, Aichi | Tin-containing aluminum bearing alloy |
JPS59107056A (en) * | 1982-12-08 | 1984-06-21 | Natl Res Inst For Metals | Solderable aluminum alloy |
JPS6033896A (en) * | 1983-08-06 | 1985-02-21 | Taira Okamoto | Aluminum alloy |
GB2321869B (en) * | 1997-02-10 | 2001-05-30 | Furukawa Electric Co Ltd | Aluminum alloy brazing sheet |
-
1998
- 1998-12-02 JP JP2000523390A patent/JP2001525488A/en active Pending
- 1998-12-02 CN CN98811721A patent/CN1336963A/en active Pending
- 1998-12-02 WO PCT/US1998/025538 patent/WO1999028516A1/en not_active Application Discontinuation
- 1998-12-02 KR KR1020007005988A patent/KR20010052112A/en not_active Application Discontinuation
- 1998-12-02 AU AU16187/99A patent/AU1618799A/en not_active Abandoned
- 1998-12-02 EP EP98960634A patent/EP1036206A1/en not_active Withdrawn
- 1998-12-02 US US09/554,977 patent/US6491772B1/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107805744A (en) * | 2014-05-30 | 2018-03-16 | 东洋铝株式会社 | The manufacture method of aluminium foil, the electronic unit circuit board for having used it and aluminium foil |
TWI629365B (en) * | 2014-05-30 | 2018-07-11 | 日商東洋鋁股份有限公司 | Aluminum foil, electronic component wiring substrate using the same, and method for manufacturing aluminum foil |
CN107805744B (en) * | 2014-05-30 | 2019-10-11 | 东洋铝株式会社 | The manufacturing method of aluminium foil, the electronic component circuit board for having used it and aluminium foil |
US10706985B2 (en) | 2014-05-30 | 2020-07-07 | Toyo Aluminium Kabushiki Kaisha | Aluminum foil, electronic component wiring board manufactured using the same, and method of manufacturing aluminum foil |
Also Published As
Publication number | Publication date |
---|---|
KR20010052112A (en) | 2001-06-25 |
JP2001525488A (en) | 2001-12-11 |
EP1036206A1 (en) | 2000-09-20 |
WO1999028516A1 (en) | 1999-06-10 |
AU1618799A (en) | 1999-06-16 |
US6491772B1 (en) | 2002-12-10 |
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C06 | Publication | ||
C10 | Entry into substantive examination | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |