CN1335643A - 带有空气轴承的线性引导体 - Google Patents

带有空气轴承的线性引导体 Download PDF

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CN1335643A
CN1335643A CN01112442A CN01112442A CN1335643A CN 1335643 A CN1335643 A CN 1335643A CN 01112442 A CN01112442 A CN 01112442A CN 01112442 A CN01112442 A CN 01112442A CN 1335643 A CN1335643 A CN 1335643A
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厄斯·普罗布斯特
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Abstract

一种线性导向件,该线性导向件包括支承件和滑架,它在支承件上滑动。滑架带有两个在支承件的空气轴承上滑动的中空柱体以及设置在上述中空柱体之间的主体。支承件和滑架的两个中空柱体分开一定的间隙,可将压缩空气提供给所述间隙。将一由U形定子和电枢构成的线性电机预先设置为用于滑架的驱动装置。在操作过程中,电枢上会有热量散发,这就会对滑架进行加热。为了使间隙的厚度在预定界限内变化,将支承件和/或滑架的温度会对间隙的厚度产生影响的那些部件加热至预定的温度。

Description

带有空气轴承的线性引导件
本发明涉及权利要求1的导言中所述类型的带有空气轴承的线性引导件。
为了将半导体芯片组装起来，使用了周知为“模接合器”(DieBonder)的自动组装机，它用于安装多个均匀的由晶片构成的芯片，这些芯片在载体上彼此相邻，一个接一个地位于例如为金属引导框的基片上。芯片载体位于其上的晶片台与芯片抓持器的取放运动相配合提供下一个芯片，并且，基片同样地进行移动，以便在第二部位处提供一新的基片位置。为了拾取然后放下芯片，可按周知的方式使芯片抓持器上升和下降。
对这种模接合器特别是对其移动部分的轴承结构有很大的需求。为了对安装好的芯片作进一步的处理，必须按一定的位置精度将这些芯片放置到基片上，这就需要芯片抓持器能相应精确地到达第二部位并且以精确地接近拾取芯片的第一部位为先决条件。另一方面，需要有高的速度和短的循环时间，这就会相应地导致出现在移动部分上的高加速度和惯性力。
到目前为止，已经用部分地包含有摇杆导向件的多种杠杆装置来使芯片抓持器有交替的运动。由于在杠杆导向件上出现有显著的力，故这种类型的导向件就精确的运动序列是有缺陷的并且必须加以适当的维护。就另一种周知的装置而言，芯片抓持器位于前后移动的杠杆的端部上也即对应于杠杆的摆动偏移，芯片抓持器作弧形运动，这种运动必须总是停止于限定位置，从而，存在有很大的振荡可能性。这种靠杠杆操纵的装置的缺点在于，该装置仅能在固定的预定路行中将芯片从部位A传送到部位B。
还周知有驱动装置，利用这种装置，通过带齿的传动带驱动芯片抓持器。其缺点是将芯片放置到基片上的大的不精确度。
从日本专利申请书JP01194847号中周知有空气轴承，一冷冻器用于冷却该空气轴承。这种冷却系统具有多种缺陷，因为，该系统使得所述空气轴承变得沉重和复杂。
本发明的目的是研制一种用于模接合器的取放系统(Pick andPlace system)的驱动器，利用这种驱动器可使得半导体芯片的传送在任何距离上都有高的布局精度。
依照本发明可用一种线性导向件来达到上述目的，所述线性导向件具有权利要求1的特征并适用于模接合器的取放系统。
以下根据附图详细地说明本发明的实施例。
图1示出了带有支承件和滑架的线性导向件以及用于所述滑架的驱动装置；
图2、3示出了上述支承件和滑架的剖面图；以及
图4示出了模接合器的取放系统。
图1示出了线性导向件的透视图，该线性导向件包括支承件2和滑架3，它在支承件2上滑动。支承件2是一柱形杆。滑架3带有两个在支承件2的空气轴承上滑动的中空柱体4和5以及设置在上述中空柱体之间的主体6。支承件2和滑架3的两个中空柱体4和5分开一定的间隙7，可将压缩空气提供给所述间隙。通过设置在两个中空柱体4和5的内壁上的喷嘴来提供压缩空气。滑架3的空气轴承能使滑架3沿支承件2作无磨损的运动。两个中空的柱体4和5最好由一个单体部件构成，从而，主体6能大体上设置在该部件的中部。
将一由U形定子8和电枢9构成的线性电机预先设置为用于滑架3的驱动装置。在这一透视图中，电枢9是不可见的，从而用虚线来表示。就与所述驱动装置有关的其它细节而言，请参照欧洲专利申请书第98810988.0，本文显式地引用了该专利申请书。电枢9刚性地连接于滑架3的主体6。电枢因其重量而将扭矩施加给滑架3。为了吸收上述扭矩，预先设置一导轨10，安装在滑架3的主体6上的转轮11在所述导轨上转动。为了确保转轮11永久地接触于导轨10，最好预先设置一第二靠弹簧安装的转轮(未示出)，它可在导轨10的后部上转动。另外，可预先设置一加载了真空的空气轴承，因为，代替转轮11或两个转轮，存在有与主体6相连的部分，它具有相对导轨10的加载了真空的滑动表面，可向该表面提供空气。
所述线性导向件和线性电机可例如用作模接合器的取放系统。在操作过程中，流过电枢9的电流会产生热量，这种热量还可对滑架3进行加热，因此，滑架3和支承件2的长度上的相应变化会导致间隙7的厚度的变化。在极端的情况下，这一点会导放气隙变得越来越小从而滑架3因负载而接触到支承件2或者气隙变得越来越大，从而使得诸如空气轴承的刚度或承载力之类的特性变差。为了消除间隙7的厚度有超过预定程度的变化，依照本发明，建议保持线性导向件的温度在预定温度下或在预定温度范围内会对间隙7的厚度产生影响的那些部分的温度。为了做到这一点，预先设置有加热件。最好对温度进行控制。对应于极端情况下电枢9所提供的热量来确定对温度进行控制的值，因此，滑架3在任何情况下都不会接触到支承件2，并且，空气轴承的刚度会保持在预定的限定值内。以下详细地说明实例。
实例1
将电加热件设置在支承件2内。对应于支承件2以及中空柱体4和5所用的材料的热膨胀系数来选定它们的尺寸，因此，在将支承件2的温度控制于60℃的值时，间隙7的厚度例如总计为8μm。在支承件2上设置一温度传感器，以便对温度进行测定。
实例2
滑架3的两个中空的柱体4和5带有电加热件12，以便将它们的温度保持在预定的容许范围内。最好将温度控制在预定的值。为此，将温度传感器设置在中空的柱体4和5中。对应于支承件2以及中空柱体4和5所用的材料的热膨胀系数来选定它们的尺寸，因此，在将支承件2的温度控制于60℃的值时，间隙7的厚度例如总计为8μm。
实例3
也可以将以上两个实例结合起来，也就是说，使用支承件2内的加热件以及中空柱体4和5中的加热件。此外，可以将支承件2控制在与两个中空柱体4和5的温度有所不同的温度。
实例4
本发明应解决的一个重要的附属任务包括限制操作中从电枢9供给空气轴承的散发热量的影响或者将支承件2与中空柱体4或5之间的间隙7的厚度保持于预定的界限内。为了使得对支承件2或中空柱体4和5进行控制的温度尽可能的低，主体6和/或中空柱体4和5可具有冷却片，以便将尽可能大的大部散发热量释放给环境。
图2示出了线性导向件1的剖面图，其中支承件2具有矩形截面。用U形滑架部件14来代替根据图1所述的实施例的中空柱体4、5。安装在支承件2中的加热件12还是可见的。图3示出了线性导向件1，其中滑架3完全包围了支承件2。
如图4所示，本发明的线性导向件1(图1)特别适用于模接合器15的取放系统。在这种情况下，滑件3携带着带有芯片抓持器的接合头16，所述抓持器用于拾取、传送并放置半导体芯片17。支承件2最好形成为框架18的一部分，所述框架可沿垂直方向(箭头所示)上升和下降，从而，在将定子18固定到模接合器15的平台上时，可额外通过微型操纵器使框架18沿与支承件2的纵向方向相垂直的水平方向移动一般高达约250μm。

Claims (7)

1、一种线性导向件(1)，该线性导向件带有支承件(2)和滑架(3)，它在支承件(2)上滑动，滑架(3)和支承件(2)分开一定的间隙(7)，可将压缩空气提供给所述间隙，所述线性导向件的特征在于，预先设置有至少一个加热件(12)，以便将支承件(2)和/或滑架(3)的温度会对间隙(7)的厚度产生影响的那些部件(4，5；14)的温度保持在预定的容许范围内。
2、如权利要求1的线性导向件(1)，其特征在于，所述至少一个加热件(12)设置在支承件(2)上。
3、如权利要求1的线性导向件(1)，其特征在于，所述至少一个加热件(12)设置在滑架(3)上。
4、如权利要求1的线性导向件(1)，其特征在于，所述至少一个加热件(12)设置在支承件(2)上，并且，至少另一个加热件(12)设置在滑架(3)上。
5、如权利要求1至4中任一个的线性导向件(1)，其特征在于，将支承件(2)的温度控制于预定的值，并且/或者，将滑架(3)的温度会对间隙(7)的厚度产生影响的那些部件(4，5；14)的温度控制于预定的值。
6、如权利要求1至5中的一个的线性导向件(1)，其特征在于，将包括定子(8)和可向其提供电流的电枢(9)的线性电机预先设置为用于滑架(3)的驱动装置，并且，电枢(9)刚性地连接于滑架(3)。
7、一种带有取放系统的模接合器(15)，它包括如权利要求6的线性导向件(1)。
CNB011124423A 2000-04-04 2001-04-04 带有空气轴承的线性引导件 Expired - Fee Related CN1249797C (zh)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100364041C (zh) * 2003-07-05 2008-01-23 莱卡显微系统半导体股份有限公司 晶圆检测用的装置
CN101937839B (zh) * 2005-03-10 2012-06-06 三星电子株式会社 用于制造平板显示器的装置

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CN101937839B (zh) * 2005-03-10 2012-06-06 三星电子株式会社 用于制造平板显示器的装置

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CN1249797C (zh) 2006-04-05
SG100644A1 (en) 2003-12-26
KR20010095007A (ko) 2001-11-03
US20010025411A1 (en) 2001-10-04
KR100778949B1 (ko) 2007-11-22
TW511218B (en) 2002-11-21
US6571461B2 (en) 2003-06-03
DE10115301A1 (de) 2001-11-08

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