CN1332910C - Method for preparing high heatconducting aluminium nitride ceramic base sheets through powder metallurgical technique - Google Patents
Method for preparing high heatconducting aluminium nitride ceramic base sheets through powder metallurgical technique Download PDFInfo
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- CN1332910C CN1332910C CNB2005100730503A CN200510073050A CN1332910C CN 1332910 C CN1332910 C CN 1332910C CN B2005100730503 A CNB2005100730503 A CN B2005100730503A CN 200510073050 A CN200510073050 A CN 200510073050A CN 1332910 C CN1332910 C CN 1332910C
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Abstract
Description
Sequence number | 1 | 2 | 3 | ||
The embodiment of the invention | Material composition (wt%) | AlN+3%Y 2O 3 | AlN+1.5%Y 2O 3+2.5% Dy 2O 3 | AlN+2.0%Y 2O 3+1.5% CaO+1.0%CaF 2+0.5% SrO | |
Powder mean particle sizes | 0.5μm | 3μm | 6μm | ||
The binding agent kind | The gasoline solution of 4.5wt% sodium butadiene rubber | The spirituous solution of 3.5wt% ethyl cellulose | The spirituous solution of 7.5wt% polyvinyl alcohol | ||
The binding agent add-on | 450ml/kg | 520ml/kg | 550ml/kg | ||
Join powder | Wet-mixed | 10 hours | 7 hours | 13 hours | |
Add the glue granulation | Mix the glue time | 1.0 hour | 0.5 hour | 1.5 hour | |
Bake out temperature | 75℃ | 50℃ | 60℃ | ||
Drying time | 40min | 30min | 15min | ||
Cold isostatic compaction | Moulding process | 215MPa*10min | 200MPa*15min | 180MPa*30min | |
Sintering | Binder removal technology | 10 -1* was 770 ℃ in Pa*3 hour | 10 -2* was 680 ℃ in Pa*2 hour | 10 -3* was 550 ℃ in Pa*4 hour | |
Soaking time | 2 hours | 1.5 hour | 1 hour | ||
Heat-up time | 5 hours | 7 hours | 9 hours | ||
Sintering process | 2000 ℃ of * 3 hours | 1850 ℃ of * 6 hours | 2150 ℃ of * 1.5 hours | ||
The sintering briquette size | Φ41*80mm | 52*52*65mm | 152*27*20mm | ||
Sizes of substrate | Φ40*1.5mm | 50.8*50.8*1.0mm | 150*25*1.5mm |
Sequence number | Sintering briquette density | Thermal conductivity | |
The embodiment of the invention | 1 | 3.39g/cm 3 | 220W/m·K |
2 | 3.36g/cm 3 | 198W/m·K | |
3 | 3.38g/cm 3 | 210W/m·K | |
Comparative Examples CN1087010C | 4 | 3.35g/cm 3 | 165W/m·K |
5 | 3.33g/cm 3 | 190W/m·K | |
6 | 3.34g/cm 3 | 110W/m·K | |
Comparative Examples CN1557776A | 7 | - | 138W/m·K |
Claims (3)
Priority Applications (1)
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CNB2005100730503A CN1332910C (en) | 2005-05-31 | 2005-05-31 | Method for preparing high heatconducting aluminium nitride ceramic base sheets through powder metallurgical technique |
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CNB2005100730503A CN1332910C (en) | 2005-05-31 | 2005-05-31 | Method for preparing high heatconducting aluminium nitride ceramic base sheets through powder metallurgical technique |
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CN1686944A CN1686944A (en) | 2005-10-26 |
CN1332910C true CN1332910C (en) | 2007-08-22 |
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CNB2005100730503A Expired - Fee Related CN1332910C (en) | 2005-05-31 | 2005-05-31 | Method for preparing high heatconducting aluminium nitride ceramic base sheets through powder metallurgical technique |
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Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101985396B (en) * | 2010-11-03 | 2013-03-20 | 刘述江 | Method for preparing aluminum nitride ceramic substrate by clinker slicing |
CN102581271A (en) * | 2012-03-30 | 2012-07-18 | 吉林大学 | Powder metallurgy material mixing method |
CN103121848B (en) * | 2013-02-25 | 2015-08-19 | 潮州三环(集团)股份有限公司 | A kind of aluminum nitride ceramic substrate sintering process |
CN103539457A (en) * | 2013-09-29 | 2014-01-29 | 合肥工业大学 | Preparation method of AlN ceramic base plate for microelectronic packaging |
CN106830945A (en) * | 2016-11-30 | 2017-06-13 | 莱鼎电子材料科技有限公司 | It is a kind of to add the method that composite sintering agent prepares high heat conduction aluminium nitride ceramic substrate |
CN108147821B (en) * | 2017-12-21 | 2021-04-27 | 北京华进创威电子有限公司 | Preparation method of high-purity porous aluminum nitride crystal material source |
CN109400175B (en) * | 2018-11-15 | 2020-07-31 | 中国科学院上海硅酸盐研究所 | Preparation method of high-thermal-conductivity silicon nitride ceramic substrate material |
CN109809833B (en) * | 2019-04-01 | 2021-09-28 | 河北工业大学 | Composite phase-change material and preparation method thereof |
CN110628223A (en) * | 2019-11-01 | 2019-12-31 | 银川艾森达新材料发展有限公司 | Heat-conducting filler |
CN115261747B (en) * | 2021-04-29 | 2023-08-22 | 苏州铜宝锐新材料有限公司 | Powder metallurgy composite functional material, manufacturing method and application thereof |
US20230069395A1 (en) * | 2021-08-30 | 2023-03-02 | Applied Materials, Inc. | Stress treatments for cover wafers |
Citations (3)
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JPS58162675A (en) * | 1982-03-23 | 1983-09-27 | Ricoh Co Ltd | Ink medium |
CN1130607A (en) * | 1995-11-17 | 1996-09-11 | 清华大学 | Method for manufacturing high-heat conductivity aluminium nitride ceramics |
JP2004192872A (en) * | 2002-12-09 | 2004-07-08 | Toshiba Ceramics Co Ltd | Aluminum nitride heater |
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2005
- 2005-05-31 CN CNB2005100730503A patent/CN1332910C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58162675A (en) * | 1982-03-23 | 1983-09-27 | Ricoh Co Ltd | Ink medium |
CN1130607A (en) * | 1995-11-17 | 1996-09-11 | 清华大学 | Method for manufacturing high-heat conductivity aluminium nitride ceramics |
JP2004192872A (en) * | 2002-12-09 | 2004-07-08 | Toshiba Ceramics Co Ltd | Aluminum nitride heater |
Non-Patent Citations (6)
Title |
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AIN基材材料研究进展 孟献丰等,材料导报,第17卷第3期 2003 * |
AIN基材材料研究进展 孟献丰等,材料导报,第17卷第3期 2003;AIN基材材料研究进展 孟献丰等,陶瓷研究与职业教育,第1卷第1期 2003;氮化铝陶瓷研究与发展 秦明礼等,稀有金属材料与工程,第31卷第1期 2002;高热导率氮化铝陶瓷的制备和研究 李振荣,山东建材,第2期 1994;两面顶技术低温超高压烧结AL-N陶瓷的研究 李丹等,材料与表面处理,第8期 2004 * |
AIN基材材料研究进展 孟献丰等,陶瓷研究与职业教育,第1卷第1期 2003 * |
两面顶技术低温超高压烧结AL-N陶瓷的研究 李丹等,材料与表面处理,第8期 2004 * |
氮化铝陶瓷研究与发展 秦明礼等,稀有金属材料与工程,第31卷第1期 2002 * |
高热导率氮化铝陶瓷的制备和研究 李振荣,山东建材,第2期 1994 * |
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