CN1331378C - 用于电子电路、电连接元件和接触弹簧的壳体以及电磁屏蔽的方法 - Google Patents

用于电子电路、电连接元件和接触弹簧的壳体以及电磁屏蔽的方法 Download PDF

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Publication number
CN1331378C
CN1331378C CNB028166566A CN02816656A CN1331378C CN 1331378 C CN1331378 C CN 1331378C CN B028166566 A CNB028166566 A CN B028166566A CN 02816656 A CN02816656 A CN 02816656A CN 1331378 C CN1331378 C CN 1331378C
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CN
China
Prior art keywords
protrusion
contact
backplane
main part
main
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB028166566A
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English (en)
Chinese (zh)
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CN1547876A (zh
Inventor
B·洛赫曼
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Bertil Lohman Design AB
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Bertil Lohman Design AB
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Application filed by Bertil Lohman Design AB filed Critical Bertil Lohman Design AB
Publication of CN1547876A publication Critical patent/CN1547876A/zh
Application granted granted Critical
Publication of CN1331378C publication Critical patent/CN1331378C/zh
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    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185Mounting of expansion boards
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/184Mounting of motherboards
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/18Packaging or power distribution
    • G06F1/183Internal mounting support structures, e.g. for supporting printed circuit boards
    • G06F1/185Mounting of expansion boards
    • G06F1/186Securing of expansion boards in correspondence to slots provided at the computer enclosure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007Casings
    • H05K9/0015Gaskets or seals
    • H05K9/0016Gaskets or seals having a spring contact

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
CNB028166566A 2001-06-27 2002-06-27 用于电子电路、电连接元件和接触弹簧的壳体以及电磁屏蔽的方法 Expired - Fee Related CN1331378C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0102322A SE523388C2 (sv) 2001-06-27 2001-06-27 Hölje för elektroniska anordningar med en öppning för instickskort samt kontaktelement för elektrisk förbindning mellan en panel för instickskort och ett apparathölje
SE01023225 2001-06-27

Publications (2)

Publication Number Publication Date
CN1547876A CN1547876A (zh) 2004-11-17
CN1331378C true CN1331378C (zh) 2007-08-08

Family

ID=20284671

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028166566A Expired - Fee Related CN1331378C (zh) 2001-06-27 2002-06-27 用于电子电路、电连接元件和接触弹簧的壳体以及电磁屏蔽的方法

Country Status (9)

Country Link
US (1) US7158388B2 (https=)
EP (1) EP1407645B1 (https=)
JP (1) JP4126013B2 (https=)
KR (1) KR20040038920A (https=)
CN (1) CN1331378C (https=)
AT (1) ATE487360T1 (https=)
DE (1) DE60238197D1 (https=)
SE (1) SE523388C2 (https=)
WO (1) WO2003003802A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005251309A (ja) * 2004-03-04 2005-09-15 Hitachi Ltd ディスクアレイ装置
JP4672599B2 (ja) * 2006-05-26 2011-04-20 富士通テレコムネットワークス株式会社 プラグインユニット板の表示構造
SE534234C2 (sv) * 2009-10-23 2011-06-07 Clamco Invest Ab Hölje för elektronisk utrustning
SE0950788A1 (sv) * 2009-10-23 2010-10-05 Clamco Invest Ab Hölje för elektronisk utrustning, innefattande kontakteringsanordning
US8270929B1 (en) * 2011-09-09 2012-09-18 Contech RF Devices, LLC RF shielding for mobile devices
CN105027020B (zh) * 2013-02-28 2019-10-18 甲骨文国际公司 架装式现场可更换单元的带外管理
CN104122961A (zh) * 2013-04-25 2014-10-29 鸿富锦精密工业(深圳)有限公司 机柜式服务器及虚拟服务器机箱
GB2515113B (en) 2013-06-14 2015-12-30 Eschmann Holdings Ltd Surgical table and method of operating the same
CN104238656A (zh) * 2013-06-24 2014-12-24 鸿富锦精密工业(深圳)有限公司 扩充卡固定装置
GB2516051B (en) 2013-07-09 2016-06-08 Eschmann Holdings Ltd Surgical tables
GB2534738B (en) 2013-07-12 2017-01-11 Eschmann Holdings Ltd Tabletop sections for surgical tables
CN105241293B (zh) * 2015-10-30 2017-05-31 成都标建铝业有限公司 一种增强散热效果的散热器型材
CN106647444B (zh) * 2016-10-31 2023-08-01 国网山东省电力公司莱芜供电公司 采用负反馈的电源调节装置及其调节方法
CN109358715B (zh) * 2018-10-26 2021-10-01 英业达科技有限公司 计算机机壳
BE1026757B1 (de) * 2018-11-07 2020-06-08 Phoenix Contact Gmbh & Co Baugruppe eines Elektronikgeräts mit einem Gerätegehäuse und einer Elektronikbaugruppe
CN112462862B (zh) * 2019-09-06 2023-04-07 英业达科技有限公司 用于扩充卡槽口的电磁遮蔽结构及其扩充卡挡板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993020676A1 (en) * 1992-03-27 1993-10-14 Italtel Società Italiana Telecomunicazioni S.P.A. Electromagnetic shielding device
US5952608A (en) * 1997-08-11 1999-09-14 Kim; Sun-Ki Finger strip for shielding electromagnetic wave and front panel assembly mounting the same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3907412A1 (de) * 1989-03-08 1990-09-13 Ant Nachrichtentech Gehaeusesystem zur aufnahme von elektrischen einschueben
JP3011379B2 (ja) * 1991-07-17 2000-02-21 北川工業株式会社 電磁波シールド用ガスケット
US5957465A (en) * 1997-06-17 1999-09-28 Sun Microsystems, Inc. Modular EMC PCI card gasket
US5929376A (en) 1997-06-20 1999-07-27 Tektronix, Inc. Electromagnetic interference shield and method of manufacturing
US6201711B1 (en) * 1999-05-18 2001-03-13 Hewlett-Packard Company Computer system housing for attenuating electromagnetic inferference (EMI)
US6332618B1 (en) * 1999-09-20 2001-12-25 Telefonaktiebolaget Lm Ericsson (Publ) Double sided gasket
US6403879B1 (en) * 2000-06-21 2002-06-11 Hewlett-Packard Company Electronic chassis having an EMI gasket and integral ventilation holes
WO2002037920A1 (en) * 2000-11-03 2002-05-10 Instrument Specialities Company, Inc. Modular shielding of openings with passing cables
US6618271B1 (en) * 2002-04-01 2003-09-09 Gateway, Inc. EMI shield

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1993020676A1 (en) * 1992-03-27 1993-10-14 Italtel Società Italiana Telecomunicazioni S.P.A. Electromagnetic shielding device
US5952608A (en) * 1997-08-11 1999-09-14 Kim; Sun-Ki Finger strip for shielding electromagnetic wave and front panel assembly mounting the same

Also Published As

Publication number Publication date
SE0102322D0 (sv) 2001-06-27
SE523388C2 (sv) 2004-04-13
EP1407645A1 (en) 2004-04-14
US7158388B2 (en) 2007-01-02
US20040196627A1 (en) 2004-10-07
JP2004531095A (ja) 2004-10-07
ATE487360T1 (de) 2010-11-15
JP4126013B2 (ja) 2008-07-30
WO2003003802A1 (en) 2003-01-09
CN1547876A (zh) 2004-11-17
KR20040038920A (ko) 2004-05-08
DE60238197D1 (de) 2010-12-16
SE0102322L (sv) 2002-12-28
EP1407645B1 (en) 2010-11-03

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20070808

Termination date: 20140627

EXPY Termination of patent right or utility model