CN1329659C - Valveless micro-pump and packaging method thereof - Google Patents
Valveless micro-pump and packaging method thereof Download PDFInfo
- Publication number
- CN1329659C CN1329659C CNB2004100436996A CN200410043699A CN1329659C CN 1329659 C CN1329659 C CN 1329659C CN B2004100436996 A CNB2004100436996 A CN B2004100436996A CN 200410043699 A CN200410043699 A CN 200410043699A CN 1329659 C CN1329659 C CN 1329659C
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- pump
- piezoelectric constant
- micro
- ring
- metal ring
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Abstract
The present invention provides a micro-pump without valves and a packaging method thereof. Firstly, the pump body of the micro-pump is manufactured, an annular sealing elastic cushion, on which a piezoelectric ceramic buzzing sheet is concentrically placed, is concentrically placed in the cavity of the pump body, the PZT face of the piezoelectric ceramic buzzing sheet faces outside the cavity, a metal ring is concentrically placed on the piezoelectric ceramic buzzing sheet, and the components are tightly pressed by a clamp from top to bottom; afterwards, the components from the metal ring to the pump body are glued and solidified by encapsulating resin glue. The micro-pump without valves of the present invention has the advantages of good sealing performance, stable operation, high reliability, convenient batch production, etc. The product of the present invention can be widely applied to the propulsion control of micro-planes and micro-spacecrafts, and the fields of micro-chemical analysis, biotical medicine, etc.
Description
(1) technical field
What the present invention relates to is a kind of valve free pump.The present invention also relates to a kind of packaging method of valve free pump.
(2) background technique
The research work of valve free pump aspect starts from the initial stage nineties, and 1992, the people such as Richter of Germany proposed to adopt the imagination of valveless first in the Micropump design; 1993, people such as the E.Stemmed of Sweden successfully adopted diffusing opening/nozzle arrangements to make Micropump; 1994, they made first silica-based valve free pump according to the working principle of valveless, adopted the corrosion of anisotropic etch method to form pyramid shape diffusing opening/nozzle arrangements on (100) silicon chip; Then, people such as T.Geriach has made littler valve free pump (7 * 7 * 1mm
3); Nineteen ninety-five and 1996, people such as E.Stemmed proposed the equivalent circuit of the lumped parameter of valve free pump again, begin the structural design of valve free pump is optimized, propose simultaneously on silicon chip, to obtain this microstructure by isotropic wet chemical etching technique and anisotropic dry etching technology, and, the performance characteristic of valve free pump is greatly improved by two self-contained pumps being parallel to on the chip piece and make their anti-phase work; People such as M.Heshchel adopted CVD (chemical vapor deposition), RIE (reactive ion etching), laser to help corrosion technology to make little diffusing opening of pure three-dimensional in 1997; The people such as A.Ullman of Israel in 1998 carry out series parallel connection to the valve free pump unit by employing and make up flow and the pump pressure that improves valve free pump on same chip; The people such as A.Olsson of Sweden in 1998 adopt the thermoplastic replica technique to make valve free pump.But present valveless pump structure also exists and seals difficulty, poor reliability, making difficulty, can not realize deficiencies such as production in enormous quantities.
(3) summary of the invention
The purpose of this invention is to provide a kind of good seal performance, working stability, reliability height, be convenient to produce in batches valve free pump.The present invention also aims to provide a kind of packaging method of valve free pump.
The object of the present invention is achieved like this: it comprises the pump housing and piezoelectric constant buzz sheet, an annular concentric sealing cushion is arranged between the pump housing and piezoelectric constant buzz sheet, a metal ring is set on the piezoelectric constant buzz sheet with one heart, sealing adhering resin glue is arranged outside ring packing cushion, piezoelectric constant buzz sheet and metal ring.
The bright valve free pump of we is to adopt such method encapsulation: at first make the Micropump pump housing, place a ring packing cushion with one heart at the cavity place of the pump housing, on the ring packing cushion, put the piezoelectric constant buzz sheet with one heart well, the PZT of piezoelectric constant buzz sheet faces outside the cavity, on the piezoelectric constant buzz sheet, place a metal ring with one heart, use anchor clamps that each component from top to down is compressed, then, with sealing resin glue metal ring each component to the pump housing are gluedd joint, solidify.
During valve free pump work, the piezoelectric constant buzz sheet is under action of electric signals, produce contraction (electric actuation effect) radially, because the ring packing cushion is that elasticity is connected with the piezoelectric constant buzz sheet, when so the piezoelectric constant buzz sheet produces radially contraction, can not be subjected to solid rigidity restriction, move freely, and still can keep its original sealing.Therefore the present invention has good seal performance, working stability, reliability height, is convenient to advantage such as batch process.The long post-installation review of valve free pump process that we adopt the method to make, none leakage.Product of the present invention can be widely used in can be used for the propelling control of miniplane, minitype spacecraft motor, and fields such as little chemical analysis, biological medicine.
Ring packing cushion among the present invention is the critical component in this packaging method, and it not only plays the effect of sealing Micropump cavity, and can give full play to the maximum output of piezoelectric constant buzz sheet electric actuation effect.
(4) description of drawings
Fig. 1 is the structural representation of product of the present invention;
Fig. 2 is an annular seal cushion schematic representation;
Fig. 3 is a rectangular ring sealing cushion schematic representation.
(5) embodiment
For example the present invention is done description in more detail below in conjunction with accompanying drawing:
In conjunction with Fig. 1, the composition of valve free pump comprises the pump housing 3, has inlet opening 1 and delivery outlet 2 on the pump housing.It also comprises piezoelectric constant buzz sheet 5.An annular concentric sealing cushion 4 is arranged between the pump housing and piezoelectric constant buzz sheet, and simultaneously in conjunction with Fig. 2,3, the shape of the shape of ring packing cushion and the cavity of pump, piezoelectric constant buzz sheet is complementary, and can be ring, rectangular ring etc.A metal ring 6 is set on the piezoelectric constant buzz sheet with one heart, sealing adhering resin glue 7 is arranged outside ring packing cushion, piezoelectric constant buzz sheet and metal ring.
Product of the present invention is that the employing MEMS technology that adopts such method to encapsulate is made valve free pump, at first to make the Micropump pump housing, place a ring packing cushion with one heart at the cavity place of the pump housing, on this pad, put piezoelectric constant buzz sheet (PZT faces outside the cavity) with one heart well, place a metal ring on the piezoelectric constant buzz sheet with one heart, use special fixture that above-mentioned component from top to down is compressed, then, with sealing resin glue metal ring each component to the pump housing are gluedd joint, solidify.
Claims (4)
1, a kind of valve free pump, it comprises the pump housing and piezoelectric constant buzz sheet, it is characterized in that: an annular concentric sealing cushion is arranged between the pump housing and piezoelectric constant buzz sheet, a metal ring is set on the piezoelectric constant buzz sheet with one heart, sealing adhering resin glue is arranged outside ring packing cushion, piezoelectric constant buzz sheet and metal ring.
2, valve free pump according to claim 1 is characterized in that: described ring packing cushion is a ring.
3, valve free pump according to claim 1 is characterized in that: described ring packing cushion is a rectangular ring.
4, a kind of packaging method of valve free pump, it is characterized in that: at first make the Micropump pump housing, place a ring packing cushion with one heart at the cavity place of the pump housing, on the ring packing cushion, put the piezoelectric constant buzz sheet with one heart well, the PZT of piezoelectric constant buzz sheet faces outside the cavity, places a metal ring on the piezoelectric constant buzz sheet with one heart, uses anchor clamps that each component from top to down is compressed, then, with sealing resin glue metal ring each component to the pump housing are gluedd joint, solidify.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100436996A CN1329659C (en) | 2004-07-12 | 2004-07-12 | Valveless micro-pump and packaging method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100436996A CN1329659C (en) | 2004-07-12 | 2004-07-12 | Valveless micro-pump and packaging method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1594883A CN1594883A (en) | 2005-03-16 |
| CN1329659C true CN1329659C (en) | 2007-08-01 |
Family
ID=34665397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100436996A Expired - Fee Related CN1329659C (en) | 2004-07-12 | 2004-07-12 | Valveless micro-pump and packaging method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1329659C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070085449A1 (en) | 2005-10-13 | 2007-04-19 | Nanyang Technological University | Electro-active valveless pump |
| CN102562540A (en) * | 2011-12-27 | 2012-07-11 | 太原理工大学 | Diaphragm compressed valve-less micropump |
| CN110206993B (en) * | 2019-05-28 | 2021-01-05 | 哈尔滨工业大学 | Bearing active micro-redundancy lubricating mechanism based on valveless piezoelectric micropump |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5466932A (en) * | 1993-09-22 | 1995-11-14 | Westinghouse Electric Corp. | Micro-miniature piezoelectric diaphragm pump for the low pressure pumping of gases |
| US6227809B1 (en) * | 1995-03-09 | 2001-05-08 | University Of Washington | Method for making micropumps |
| CN1442612A (en) * | 2003-04-11 | 2003-09-17 | 华中科技大学 | Valve less thin film driving micro pump |
| US20030185692A1 (en) * | 2002-03-27 | 2003-10-02 | Institute Of High Performance Computing | Valveless micropump |
-
2004
- 2004-07-12 CN CNB2004100436996A patent/CN1329659C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5466932A (en) * | 1993-09-22 | 1995-11-14 | Westinghouse Electric Corp. | Micro-miniature piezoelectric diaphragm pump for the low pressure pumping of gases |
| US6227809B1 (en) * | 1995-03-09 | 2001-05-08 | University Of Washington | Method for making micropumps |
| US20030185692A1 (en) * | 2002-03-27 | 2003-10-02 | Institute Of High Performance Computing | Valveless micropump |
| CN1442612A (en) * | 2003-04-11 | 2003-09-17 | 华中科技大学 | Valve less thin film driving micro pump |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1594883A (en) | 2005-03-16 |
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