CN1322106A - Solidified glue silk-screen printing screen frame for circuit board and its processing method - Google Patents
Solidified glue silk-screen printing screen frame for circuit board and its processing methodInfo
- Publication number
- CN1322106A CN1322106A CN 00114251 CN00114251A CN1322106A CN 1322106 A CN1322106 A CN 1322106A CN 00114251 CN00114251 CN 00114251 CN 00114251 A CN00114251 A CN 00114251A CN 1322106 A CN1322106 A CN 1322106A
- Authority
- CN
- China
- Prior art keywords
- metallic plate
- circuit board
- silk
- screen frame
- screen printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- Printing Plates And Materials Therefor (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
The present invention discloses a screen frame for solidification glue screen printing circuit board, including metal plate, the proper position of back surface of said metal plate is equipped with several projections, and the centre of the projection is equipped with a through-hole communicated with front surface and back surface of the metal plate. Said invention also discloses the method for processing said screen frame, including the following steps: using a metal plate with proper thickness and size; applying anticorrosive protection layer on the printing glued position and making electrocorrion on the back surface of the metal plate to form anti-welling vacancy and projection; and processing through-hole on the centre of projection. Said invention screen frame can be used in mounting process of hybrid packaged circuit board, and can be used for implementing glued one-time screen printing on the surface of projection.
Description
The present invention relates to a kind ofly in the packaging technology of circuit board component, be used for coating curing glue on substrate so that the silk-screen printing screen frame of permanent circuit element and processing method thereof.
In the packaging technology of circuit board, the method that element is installed on the substrate has plug-in mounting usually and mounts.Plug-in mounting is behind the suitable eyelet of processing on the substrate, and the metal electrode of element is passed eyelet, will wear the suitable angle of metal electrode bending to the back side again.Mount normally after processing many eyelets according to the distribution of element on the thick corrosion resistant plate of about 0.2mm and form silk-screen printing screen frame, again silk-screen printing screen frame and circuit substrate are fitted, end on silk-screen printing screen frame top adds an amount of glue then, glue is scraped to the other end and along the surface of silk-screen printing screen frame with suitable pressure with the silk-screen scraper again and spread out, glue sees through the disposable position that is imprinted on all need mount components on the substrate of eyelet, heat with proper temperature after element being attached to the appropriate location that is printed on glue, glue curing is fixed on element on the substrate again.With silk-screen printing screen frame and the silk-screen scraper is disposable that glue is imprinted on the circuit substrate, the face that requires to be printed is necessary for highly smooth plane to prior art in attachment process.
Along with the development of technology, the application that loads in mixture circuit board is more and more, and the positive and negative of a common circuit substrate is all wanted installation elements, and have for mounting part, what have is pick-and-place components.After a face was loaded onto some pick-and-place components, its electrode was worn to another face, and the planarization of another face is damaged.Make and to carry out glue silk-screen printing screen with the mode of routine at another face.The solution of prior art has two kinds: a kind of is to adopt artificial some glue, and this mode greatly reduces production efficiency, does not satisfy requirement of mass production, and production cost is greatly risen; Another kind is the appropriate location of adopting point gum machine glue drop by drop to be put circuit substrate, though this mode is more manually put the efficient of glue and is increased, to compare with silk-screen glue, efficient still is much lower, and point gum machine costs an arm and a leg, and cost of investment greatly increases.
One of purpose of the present invention provides a kind of solidified glue silk-screen printing screen frame for circuit board, be used in the mounting process that loads in mixture circuit board, the face that ridge such as element electrode is arranged is implemented the disposable silk-screen of glue, enhance productivity greatly, reduce cost of investment and production cost.
Two of purpose of the present invention provides a kind of processing method of solidified glue silk-screen printing screen frame for circuit board, utilize the silk-screen printing screen frame of this method processing to be used in the mounting process that loads in mixture circuit board, the face that ridge such as element electrode is arranged is implemented the disposable silk-screen of glue.
One of purpose of the present invention is achieved by the following technical solution: a kind of solidified glue silk-screen printing screen frame for circuit board, comprise metallic plate, it is characterized in that, suitable position is provided with some boss at the back side of described metallic plate, is provided with the perforation that is communicated with the described metallic plate front and the back side at the middle part of described boss.
When using aforesaid solidified glue silk-screen printing screen frame for circuit board of the present invention, the back side that will have boss is suitably involutory with a face of the circuit substrate that needs silk-screen glue, make the perforation at boss place just in time aim at need silk-screen glue place, and the ridges such as various electrodes of circuit substrate on this face empty place between each boss just in time, end on silk-screen printing screen frame top adds an amount of glue then, glue is scraped to the other end and along the surface of silk-screen printing screen frame with suitable pressure with the silk-screen scraper and spread out, glue sees through that perforation is disposable to be imprinted on that all need the position of mount components on the substrate.Silk-screen printing screen frame of the present invention utilizes the boss of tape punching to avoid the ridge on the circuit substrate dexterously, the perforation of seal glue can be fitted tightly with the position of need seal glue on the circuit substrate, efficiently solve at circuit board and load in mixture in the technology, the difficult problem of disposable silk-screen glue, production efficiency is greatly improved, and production cost greatly reduces.
The processing method of solidified glue silk-screen printing screen frame for circuit board of the present invention comprises the steps:
A. get the metallic plate of a suitable thickness and size;
B. the element according to the circuit board that will mount distributes, and determines printing glued position at the back side of described metallic plate, and these printing glued positions are coated the anti-corrosion protection layer;
C. the back side to described metallic plate imposes the galvano-cautery reasonable time, and the position of being corroded is removed suitable thickness formation and keeps away protruding room; And the position of posting protective layer is not corroded, and forms boss;
D. in perforation that the front and the back side of described metallic plate are communicated with of the middle part of described boss processing.
Because the thickness of silk-screen printing screen frame generally has only a few tenths of a mm, need the boss quantity of formation quite a lot of usually, adopt general processing method to be difficult to realize.The present invention adopts the galvano-cautery method to form at the rack back side and keeps away protruding room and boss, and is simple, makes in loading in mixture the mounting process of circuit board, and the disposable silk-screen of the face that ridge such as element electrode is arranged being implemented glue becomes possibility.
Below in conjunction with drawings and Examples the present invention is described in further detail.
Fig. 1 is the schematic cross-section of an exemplary embodiments of solidified glue silk-screen printing screen frame for circuit board of the present invention;
Fig. 2 is for adopting the schematic diagram of solidified glue silk-screen printing screen frame for circuit board of the present invention to circuit board seal cementing;
Fig. 3 a-3d is the processing method process schematic diagram of solidified glue silk-screen printing screen frame for circuit board of the present invention.
Solidified glue silk-screen printing screen frame for circuit board embodiment of the present invention as shown in Figure 1 comprises metallic plate 1, is provided with some boss 2 at the back side of metallic plate 1 suitable position, is provided with the perforation 3 that is communicated with metallic plate 1 front and the back side at the middle part of boss 2.Glue is carried at the position that perforation 3 needing on circuit substrate to be used for, and forms between each boss 2 and keeps away protruding room, is used for ridges such as receiving element electrode.In the present embodiment, the top of perforation 3 is the funnel-shaped structure 4 that opening upwards enlarges, and this structure helps reducing hole wall to the resistance that glue flows into, and guarantees that glue is pressed into preposition.Metallic plate 1 is a corrosion resistant plate in the present embodiment.
Fig. 2 is for adopting the schematic diagram of solidified glue silk-screen printing screen frame for circuit board of the present invention to circuit board seal cementing.6 expressions keep away protruding room among the figure; 7 indication circuit substrates; 8 expression inserting electronic components; The electrode ridge to the circuit substrate another side is worn in 9 expressions; 10 expression glue; 11 expression silk-screen scrapers; G represents the silk-screen printing screen frame total height; H represents silk-screen printing screen frame web plate thickness.In the present embodiment, G is 1.5mm, and H is 0.2mm, and when reality enforcement was of the present invention, G and H can have a lot of selections according to the characteristics of circuit board size and electronic component.
Fig. 3 a-3d is the process schematic diagram of an exemplary embodiments of processing method of solidified glue silk-screen printing screen frame for circuit board of the present invention.
The processing method of plate solidified glue silk-screen printing screen frame comprises the steps: in a circuit according to the invention
A. get the metallic plate 5 of a suitable thickness and size, referring to Fig. 3 a;
B. the element according to the circuit board that will mount distributes, and determines printing glued position at the back side of described metallic plate, and these printing glued positions are sticked the anti-corrosion protection layer;
C. the back side to described metallic plate imposes the galvano-cautery reasonable time, and the position of being corroded is removed suitable thickness formation and keeps away protruding room 6; And the position of posting protective layer is not corroded, and forms boss 2, referring to Fig. 3 b;
D. in perforation 3 that the front and the back side of described metallic plate 5 are communicated with of the middle part of described boss 2 processing, referring to Fig. 3 c-3d.
Among the processing method embodiment of the present invention, the top of perforation 3 is the funnel-shaped structure 4 that opening upwards enlarges, and metallic plate 5 is a corrosion resistant plate, and used anti-corrosion protection layer is the sensitization anticorrisive agent, galvano-cautery is carried out at the back side of metallic plate 5 adopted the ferric trichloride corrosive liquid.
The processing sequence of perforation 3 two sections can adopt following scheme: shown in Fig. 3 c, the position corresponding to boss 2 processes funnel-shaped opening 4 on the top of the metallic plate after galvano-cautery 5 earlier; Shown in Fig. 3 d, the bottom of funnel-shaped opening 4 is punched with laser processing mode or machining mode for another example, promptly form a complete perforation 3.
Claims (10)
1, a kind of solidified glue silk-screen printing screen frame for circuit board, comprise metallic plate (1), it is characterized in that, be provided with some boss (2), be provided with the perforation (3) that is communicated with described metallic plate (1) front and the back side at the middle part of described boss (2) at the back side suitable position of described metallic plate (1).
2, silk-screen printing screen frame according to claim 1 is characterized in that, the top of described perforation (3) is the funnel-shaped structure (4) that opening upwards enlarges.
3, silk-screen printing screen frame according to claim 1 is characterized in that, described metallic plate (1) is a corrosion resistant plate.
4, a kind of processing method of solidified glue silk-screen printing screen frame for circuit board is characterized in that, comprises the steps:
A. get the metallic plate (5) of a suitable thickness and size;
B. the element according to the circuit board that will mount distributes, and determines printing glued position at the back side of described metallic plate, and these printing glued positions are coated the anti-corrosion protection layer;
C. the back side to described metallic plate imposes the galvano-cautery reasonable time, and the position of being corroded is removed suitable thickness formation and keeps away protruding room (6); And the position of posting protective layer is not corroded, and forms boss (2);
D. in perforation (3) that the front and the back side of described metallic plate (5) are communicated with of the middle part of described boss (2) processing.
5, processing method according to claim 4 is characterized in that, the top of described perforation (3) is the funnel-shaped structure (4) that opening upwards enlarges.
6, processing method according to claim 4 is characterized in that, described metallic plate (5) is a corrosion resistant plate.
7, processing method according to claim 4 is characterized in that, described anti-corrosion protection layer is the sensitization anticorrisive agent.
8, processing method according to claim 6 is characterized in that, adopts the ferric trichloride corrosive liquid that electrolytic corrosion is carried out at the back side of described metallic plate (5).
9, according to claim 4 or 5 described processing methods, it is characterized in that, adopt laser processing to process described perforation (3).
10, according to claim 4 or 5 described processing methods, it is characterized in that, adopt machining process to process described perforation (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00114251 CN1124780C (en) | 2000-05-01 | 2000-05-01 | Solidified glue silk-screen printing screen frame for circuit board and its processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 00114251 CN1124780C (en) | 2000-05-01 | 2000-05-01 | Solidified glue silk-screen printing screen frame for circuit board and its processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1322106A true CN1322106A (en) | 2001-11-14 |
| CN1124780C CN1124780C (en) | 2003-10-15 |
Family
ID=4583957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 00114251 Expired - Fee Related CN1124780C (en) | 2000-05-01 | 2000-05-01 | Solidified glue silk-screen printing screen frame for circuit board and its processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1124780C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102769060A (en) * | 2012-07-31 | 2012-11-07 | 常州天合光能有限公司 | Novel solar battery interconnection structure and manufacturing method thereof |
| CN105491815A (en) * | 2016-01-20 | 2016-04-13 | 长沙格力暖通制冷设备有限公司 | Reflow soldering template, template component, tin paste printing device and reflow soldering method |
| CN115503268A (en) * | 2022-09-05 | 2022-12-23 | 重庆三大伟业制药有限公司 | Method for manufacturing container box for blood circulation |
-
2000
- 2000-05-01 CN CN 00114251 patent/CN1124780C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102769060A (en) * | 2012-07-31 | 2012-11-07 | 常州天合光能有限公司 | Novel solar battery interconnection structure and manufacturing method thereof |
| CN102769060B (en) * | 2012-07-31 | 2015-10-28 | 常州天合光能有限公司 | A kind of novel solar cell interconnect architecture and manufacture method thereof |
| CN105491815A (en) * | 2016-01-20 | 2016-04-13 | 长沙格力暖通制冷设备有限公司 | Reflow soldering template, template component, tin paste printing device and reflow soldering method |
| CN115503268A (en) * | 2022-09-05 | 2022-12-23 | 重庆三大伟业制药有限公司 | Method for manufacturing container box for blood circulation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1124780C (en) | 2003-10-15 |
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