CN1319428C - Electronic circuit unit - Google Patents

Electronic circuit unit Download PDF

Info

Publication number
CN1319428C
CN1319428C CNB2004100980843A CN200410098084A CN1319428C CN 1319428 C CN1319428 C CN 1319428C CN B2004100980843 A CNB2004100980843 A CN B2004100980843A CN 200410098084 A CN200410098084 A CN 200410098084A CN 1319428 C CN1319428 C CN 1319428C
Authority
CN
China
Prior art keywords
mentioned
tongue piece
piece portion
electronic circuit
upper wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100980843A
Other languages
Chinese (zh)
Other versions
CN1627896A (en
Inventor
渡边英树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of CN1627896A publication Critical patent/CN1627896A/en
Application granted granted Critical
Publication of CN1319428C publication Critical patent/CN1319428C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15162—Top view

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Casings For Electric Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Provided is a small and inexpensive electronic circuit unit. The electronic circuit unit comprises a circuit board 1 where an electronic component 3 is mounted on a wiring pattern 2, and a box cover 4 made of a metal plate fixed to the circuit board 1 so as to cover the electronic component 3. The cover 4 has an upper wall 4a, a sidewall 4b bent from the side of the upper wall 4a to the circuit board 1 side, a housing section 4c surrounded by the upper wall 4a and the sidewall 4b, and a tongue part 4e formed to be located in the containing section 4c. Since the tongue part 4e is soldered to the land part 2a of the wiring pattern 2 at a position in the containing section 4c, the tongue part 4e for fixing the cover 4 will not project from the cover 4 to the outside. Consequently, a small and inexpensive circuit board 1 is obtained.

Description

Electronic circuit cell
Technical field
The present invention relates to a kind of electronic circuit cell that is fit to be used on the near radio equipment.
Background technology
Accompanying drawing to existing electronic circuit cell describes, and Fig. 9 is the oblique view of existing electronic circuit cell, and Figure 10 is the key diagram of the manufacture method of the existing electronic circuit cell of expression.
Below, according to Fig. 9 the formation of existing electronic circuit cell is described, wiring figure 52 is set on circuit substrate 51, simultaneously, electronic unit 53 (with reference to Figure 10) is installed on this wiring figure 52, form desired circuit.
The box-shaped lid 54 that is made of metallic plate has upper wall 54a, the sidewall 54b that bends from the limit of this upper wall 54a downwards, is surrounded the incorporating section 54c that forms and laterally bent rectangular tongue piece portion 54d from the end of sidewall 51b at opposed facing sidewall 54b in the face of the position by upper wall 54a and sidewall 54b.
And, this lid 54, under the state of overlay electronic parts 53, tongue piece portion 54d, and is installed on the circuit substrate 51 on the 52a of of the island of wiring figure 52 by soldering, forms existing electronic circuit cell.(for example, with reference to patent documentation 1)
But, in this existing electronic circuit cell, bend laterally and form owing to being arranged on the tongue piece portion 54d that covers on 54, therefore big in order to the circuit substrate 51 that this tongue piece portion 54d is installed, and be unsuitable for miniaturization, cost height.
In addition, has the manufacture method of the existing electronic circuit cell of this formation, as shown in figure 10, at first, the pairing electronic unit 53 in each unit is installed on the big plate substrate 55, then, under this state, a plurality of lids 54 are configured in respectively on each unit on the big plate substrate 55.
Next,, be transported to reflow ovens at this state, paste solder fusing, after on the 52a of island portion, the position of S2 along the line cuts off big plate substrate 55 to tongue piece portion 54d by soldering, and then the unit is separated respectively, thereby finishes the manufacturing of electronic circuit cell.(for example, with reference to patent documentation 1)
But, manufacture method according to this existing electronic circuit cell, be arranged on the tongue piece portion 54d of the bottom of covering 54 sidewall 54b, be bent into the right angle laterally in the position of facing, therefore the lid 54 tongue piece portion 54d each other with the adjacent states configuration becomes mutual aspectant state.
And if adjacent lid 54 interval each other is narrow and small, then aspectant tongue piece portion 54d is bonded with each other by solder, when consequently cutting off big plate substrate 55, takes place not only that solder is peeled off but also can be caused that to cut off operation poor by this solder.
In addition, it is good to cut off operation in order not take place solder to peel off, and strengthens the interval of 54 on adjacent lid, and then circuit substrate 51 increases, effective rate of utilization variation, the cost height of simultaneously big plate substrate 55.
Patent documentation 1: the spy opens 2002-57234
In existing electronic circuit cell, be arranged on the tongue piece portion 54d that covers on 54 and be bent to form laterally, therefore, exist 51 big in order to circuit substrate that this tongue piece portion 54d is installed, be unsuitable for miniaturization and the high problem of cost.
Summary of the invention
For this reason, the object of the invention is to provide a kind of small-sized and cheap electronic circuit cell.
In order to realizing the 1st solution of above-mentioned purpose, its formation is to possess the circuit substrate of electronic unit is being installed on the wiring figure and is being installed in the box-shaped lid that is made of metallic plate on the foregoing circuit substrate in order to cover above-mentioned electronic unit; Above-mentioned lid, the incorporating section that have upper wall, forms to the sidewall of above-mentioned circuit substrate lateral buckling, by above-mentioned upper wall and above-mentioned side walls enclose and be positioned at the tongue piece portion that this incorporating section forms from the limit of this upper wall; The position of above-mentioned tongue piece portion in above-mentioned incorporating section by soldering in the portion of the island of above-mentioned wiring figure, above-mentioned tongue piece portion, in opposed facing a pair of above-mentioned side wall side, the state configuration that staggers with the position.
In addition, as the 2nd solution, above-mentioned tongue piece portion is from forming to above-mentioned incorporating section lateral buckling with the contacted end of foregoing circuit substrate of above-mentioned sidewall.
In addition, as the 3rd solution, above-mentioned lid has the position that is positioned at than the more close central portion of above-mentioned sidewall, from the bent sheet of above-mentioned upper wall to above-mentioned circuit substrate lateral buckling, in the end of this bent sheet above-mentioned tongue piece portion is set.
Electronic circuit cell of the present invention possesses the box-shaped lid that is made of metallic plate that is installed at the circuit substrate that electronic unit is installed on the wiring figure with in order to the overlay electronic parts on the circuit substrate; Lid, the incorporating section that have upper wall, forms to the sidewall of circuit substrate lateral buckling, by upper wall and side walls enclose and be positioned at the tongue piece portion that this incorporating section forms from the limit of this upper wall; The position of tongue piece portion in above-mentioned incorporating section, therefore, in order to the tongue piece portion of mounting cover, can not given prominence to laterally from lid, thereby can reduce circuit substrate in the portion of the island of above-mentioned wiring figure by soldering, obtains small-sized and cheap goods.
In addition,, then during fabrication, the interval of adjacent lid tongue piece portion is each other strengthened, therefore can be reduced adjacent lid spacing as far as possible, thereby help effective utilization of big plate substrate, can obtain cheap goods if be set as this lid structure.
In addition, tongue piece portion forms to the incorporating section bending from an end of sidewall, and therefore, its formation is simple and the lid processability is good, can obtain the good goods of productivity.
In addition, lid has the position that is positioned at than the more close central portion of above-mentioned sidewall, from the bent sheet of above-mentioned upper wall to above-mentioned circuit substrate lateral buckling, be provided with above-mentioned tongue piece portion in the end of this bent sheet, therefore, be provided with the bent sheet of tongue piece portion, can select the place configuration that circuit board density is few in the incorporating section, can around wiring figure, have flexibility.
In addition, tongue piece portion is in the state configuration of opposed facing a pair of above-mentioned side wall side with mutual dislocation, therefore, during fabrication, thereby the interval of adjacent lid tongue piece portion each other can be strengthened as far as possible and reduce adjacent lid spacing as far as possible, helps effective utilization of big plate substrate, can obtain cheap goods.
Description of drawings
Fig. 1 is the vertical view of the 1st embodiment of expression electronic circuit cell of the present invention.
Fig. 2 is the major part cutaway view of the 1st embodiment of electronic circuit cell of the present invention.
Fig. 3 is the oblique view the 1st embodiment, see lid from the inboard of electronic circuit cell of the present invention.
Fig. 4 is the vertical view the 1st embodiment, that represent its manufacture method of electronic circuit cell of the present invention.
Fig. 5 is the major part cutaway view the 1st embodiment, that represent its manufacture method of electronic circuit cell of the present invention.
Fig. 6 is the vertical view of the 2nd embodiment of expression electronic circuit cell of the present invention.
Fig. 7 is the major part vertical view of the 2nd embodiment of expression electronic circuit cell of the present invention.
Fig. 8 is the oblique view the 2nd embodiment, see lid from the inboard of electronic circuit cell of the present invention.
Fig. 9 is the oblique view of existing electronic circuit cell.
Figure 10 is the key diagram of the manufacture method of the existing electronic circuit cell of expression.
Among the figure: the 1-circuit substrate; The 2-wiring; 2a-island portion (land portion); The 3-electronic unit; The 4-lid; The 4a-upper wall; The 4b-sidewall; The 4c-incorporating section; The 4d-bent sheet; The 4e-tongue piece portion; The big plate substrate of 5-; The S1-line.
Embodiment
Figure to electronic circuit cell of the present invention describes, Fig. 1 is the vertical view of the 1st embodiment of expression electronic circuit cell of the present invention, Fig. 2 is the major part cutaway view of the 1st embodiment of electronic circuit cell of the present invention, Fig. 3 is the 1st embodiment of electronic circuit cell of the present invention, see the oblique view of lid from the inboard, Fig. 4 is the vertical view of manufacture method of the 1st embodiment of expression electronic circuit cell of the present invention, and Fig. 5 is the major part cutaway view of manufacture method of the 1st embodiment of expression electronic circuit cell of the present invention.
In addition, Fig. 6 is the vertical view of the 2nd embodiment of expression electronic circuit cell of the present invention, Fig. 7 is the major part vertical view of the 2nd embodiment of expression electronic circuit cell of the present invention, and Fig. 8 is the oblique view the 2nd embodiment, see lid from the inboard of electronic circuit cell of the present invention.
Below, according to Fig. 1～Fig. 3 the 1st embodiment of electronic circuit cell of the present invention is described, and above the circuit substrate 1 that forms in stacked 1 or multi-disc, wiring figure 2 is set, simultaneously, various electronic units 3 are installed on this wiring figure 2, are formed desired circuit.
Cover 4 by the box-shaped that metallic plate forms, has flat upper wall 4a, the a plurality of sidewall 4b that bend downwards from 4 limits of this upper wall 4a, surround the incorporating section 4c that forms by upper wall 4a and sidewall 4b, a plurality of bent sheet 4d that bend downwards in a part of cutting upper wall 4a and sidewall 4b than the position of the more close central portion of sidewall 4b and from upper wall 4a and with the state that is positioned at incorporating section 4c, a plurality of tongue piece portion 4e that are arranged on bent sheet 4d end.
In addition, bent sheet 4d and tongue piece portion 4e, in the state configuration of opposed facing pair of sidewalls 4b side with mutual dislocation, under the state of lid 4 overlay electronic parts 3 with formation like this, tongue piece portion 4e by soldering on the 2a of island portion of the wiring figure 2 that is positioned at incorporating section 4c, lid 4 is installed on the circuit substrate 1, thereby forms electronic circuit cell of the present invention.
In addition, has the manufacture method of the electronic circuit cell of the present invention of formation like this, as Fig. 4, shown in Figure 5, at first, the pairing electronic unit 3 in each unit is installed on the big plate substrate 5, then, under this state, a plurality of lids 4 are configured in respectively on each unit of big plate substrate 5.
At this moment, as shown in Figure 4, the tongue piece portion 4e of the lid 4 that is arranged side by side, on 4 on adjacent lid, become be not in the face of but the state of the form that staggers mutually configuration, bigger state is separated in the space that becomes tongue piece portion 4e.
Next, be transported to reflow ovens with this state, after on the 2a of island portion, the position of S1 along the line cuts off big plate substrate 5 by soldering for fusing paste solder, tongue piece portion 4e, and then the unit is separated by each, thereby finishes the manufacturing of electronic circuit cell.
And, manufacture method according to such electronic circuit cell of the present invention, tongue piece portion 4e faces but the configuration of staggering mutually, simultaneously, the position of tongue piece portion 4e in the 4c of incorporating section by soldering on the 2a of island portion, therefore, its solder can sidewall 4b or tongue piece portion 4e attached to adjacent lid 4 on, thereby can reduce the interval of 4 on adjacent lid as far as possible.
In addition, the line S1 in the position that is positioned at 4 on adjacent lid cuts off big plate substrate 5, and can not be present in line S1 on attached to the solder on 2a of island portion and the tongue piece portion 4e this moment, and it is good therefore to cut off operation.
In addition, Fig. 6～Fig. 8 represents the 2nd embodiment of electronic circuit cell of the present invention, the 2nd embodiment, the bent sheet 4d that does not have above-mentioned the 1st embodiment, tongue piece portion 4e forms to incorporating section 4c lateral buckling from the end of sidewall 4b, simultaneously, tongue piece portion 4e is being positioned on the 2a of island portion of incorporating section 4c by soldering.
And, the tongue piece portion 4e of the 2nd embodiment also in opposed facing pair of sidewalls 4b side with the mutual alignment state configuration that staggers, other formations are identical with above-mentioned the 1st embodiment, therefore same parts used prosign, omit its explanation at this.

Claims (3)

1. electronic circuit cell is characterized in that: possess and the circuit substrate of electronic unit is being installed on the wiring figure and is being installed in the box-shaped lid that is made of metallic plate on the foregoing circuit substrate in order to cover above-mentioned electronic unit; Above-mentioned lid, the incorporating section that have upper wall, forms to the sidewall of above-mentioned circuit substrate lateral buckling, by above-mentioned upper wall and above-mentioned side walls enclose and be positioned at the tongue piece portion that this incorporating section forms from the limit of this upper wall; The position of above-mentioned tongue piece portion in above-mentioned incorporating section by soldering in the portion of the island of above-mentioned wiring figure, above-mentioned tongue piece portion, in opposed facing a pair of above-mentioned side wall side, the state configuration that staggers with the position.
2. electronic circuit cell according to claim 1 is characterized in that: above-mentioned tongue piece portion, and from forming to above-mentioned incorporating section lateral buckling of above-mentioned sidewall with the contacted end of foregoing circuit substrate.
3. electronic circuit cell according to claim 1, it is characterized in that: above-mentioned lid, have be positioned at than the position of the more close central portion of above-mentioned sidewall, from the bent sheet of above-mentioned upper wall to above-mentioned circuit substrate lateral buckling, and above-mentioned tongue piece portion is set in the end of this bent sheet.
CNB2004100980843A 2003-12-12 2004-12-08 Electronic circuit unit Expired - Fee Related CN1319428C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003415499A JP2005175314A (en) 2003-12-12 2003-12-12 Electronic circuit unit
JP2003415499 2003-12-12

Publications (2)

Publication Number Publication Date
CN1627896A CN1627896A (en) 2005-06-15
CN1319428C true CN1319428C (en) 2007-05-30

Family

ID=34734978

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004100980843A Expired - Fee Related CN1319428C (en) 2003-12-12 2004-12-08 Electronic circuit unit

Country Status (2)

Country Link
JP (1) JP2005175314A (en)
CN (1) CN1319428C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007115977A (en) * 2005-10-21 2007-05-10 Mitsumi Electric Co Ltd Shield case fixing device
JP5107158B2 (en) * 2008-06-30 2012-12-26 シャープ株式会社 Electronic module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1204941A (en) * 1997-06-10 1999-01-13 阿尔卑斯电气株式会社 Connecting structure of frame and printed circuit board
JPH11307978A (en) * 1998-04-22 1999-11-05 Alps Electric Co Ltd Electronic apparatus
JP2002261486A (en) * 2001-03-01 2002-09-13 Alps Electric Co Ltd Electronic circuit unit
CN1461184A (en) * 2002-05-15 2003-12-10 阿尔卑斯电气株式会社 Electronic circuit unit

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1204941A (en) * 1997-06-10 1999-01-13 阿尔卑斯电气株式会社 Connecting structure of frame and printed circuit board
JPH11307978A (en) * 1998-04-22 1999-11-05 Alps Electric Co Ltd Electronic apparatus
JP2002261486A (en) * 2001-03-01 2002-09-13 Alps Electric Co Ltd Electronic circuit unit
CN1461184A (en) * 2002-05-15 2003-12-10 阿尔卑斯电气株式会社 Electronic circuit unit

Also Published As

Publication number Publication date
JP2005175314A (en) 2005-06-30
CN1627896A (en) 2005-06-15

Similar Documents

Publication Publication Date Title
US7232327B2 (en) Socket for attaching an electronic component
JP4500726B2 (en) Mounting structure for high frequency equipment
CN100524955C (en) Socket for digital camera module
EP1058307A1 (en) Electronic unit effectively utilizing circuit board surface
CN1319428C (en) Electronic circuit unit
JP4682646B2 (en) Implementation body
EP3302007B1 (en) Contact structure for electronic device
US20030169583A1 (en) Shielding structure suitable for use with transmitter-receivers
CN100379326C (en) Electronic circuit unit
US5097389A (en) Structure for fixing feedthrough capacitor in high-frequency device and manufacturing method of high-frequency device
JP2008112832A (en) High-frequency unit, and manufacturing method of high-frequency unit
US7214073B2 (en) Shielding structure
JPH02246199A (en) Shield structure of high-frequency module
EP1121006B1 (en) Transmitter-receiver unit that ensures mounting of a cover on a metallic frame
JP2001053460A (en) Transceiver unit
JP3190643B2 (en) High frequency unit and method of manufacturing the same
JP2012044017A (en) Electronic apparatus
JP2005064157A (en) Electronic circuit module
JP4355651B2 (en) Shield structure
JP2001136008A (en) Microwave waveguide device
JP3179922U (en) Shield cover
EP1399006A2 (en) A mounting structure of a wireless module
JPH0234463B2 (en)
JP2000278041A (en) Voltage controlled oscillator
JPH0217511Y2 (en)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee