CN1314509C - Pad spot welding method - Google Patents
Pad spot welding method Download PDFInfo
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- CN1314509C CN1314509C CNB200410052359XA CN200410052359A CN1314509C CN 1314509 C CN1314509 C CN 1314509C CN B200410052359X A CNB200410052359X A CN B200410052359XA CN 200410052359 A CN200410052359 A CN 200410052359A CN 1314509 C CN1314509 C CN 1314509C
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Abstract
The present invention discloses a spot welding method of welding pads. The method is used to carry out layout optimization of the welding pads arranged on a circuit board to adjust the area of the welding pads which need to be spot-welded so that the welding pads have the same size; more specifically, the welding pads can be adjusted in a leading-out mode and in a hollow mode. In this way, the area of all the welding pads is unified; in the process of welding, parameters, such as welding pressure, voltage output, pulse width, etc., do not need to be frequently adjusted; thus, the difficulty of processing steps is reduced, and welding efficiency and the stability of welding quality are favorably improved.
Description
Technical field
The present invention relates to a kind of welding method, relate in particular to a kind of pad spot welding method.
Background technology
The SW point electric welding of using at present mostly, SW takes from first letter of English " STRIPPING " (paint removal) and " WELDING " (welding), and meaning is that the SW electronic spot welder has and need not to remove in advance the function that insulated paint just can directly weld enamel-covered wire.Its basic functional principle is that an electric welding welding is with the metal works of powerful electric current short time by compacted overlap joint between two point electrodes (comprising parallel pole), forms the welding of solder joint under resistance heat and pressure.Its concrete operation method as shown in Figure 1, the SW electronic spot welder is according to the line footpath of enamel-covered wire 7 and the different requirements of weldment when welding on circuit board 6, welding pressure F, output pulse amplitude (voltage Voltage) and three groups of parameters of pulse width (Millisecond) are set, when the pressure that is applied to soldering tip reaches setting value, could trigger the microswitch turn-on current.Because the tip of parallel pole 8 is provided with the contact resistance of certain resistance, the energising rear electrode 8 most advanced and sophisticated electric sparks that produce, an insulated paint part that contacts with eletrode tip is by burn off, and remainder is shunk back to two ends, exposes metal wire.Because the continuation effect of welding pressure is ordered about a large amount of electric currents and changed exposed metal wire and pad metal substrate 9 over to, electric energy is converted into heat energy, is implemented in same pulse and finishes paint removal and welding.
Adopting the advantage of spot welding is to need not the paint removal operation, has simplified manufacturing procedure.But the setting of welding pressure, output pulse amplitude and width is relevant with the physical characteristic (as thermal diffusivity, conductor area, matrix hardness etc.) of the line of enamel-covered wire footpath and welded part, according to welding energy E=V
2T/R, pad is big on the circuit board, and the welded piece thermal diffusivity is good, heat-conducting area is big, and required welding energy is also big, so the setting of output pulse amplitude, width will be high, on the contrary then corresponding minimizing.As shown in Figure 2,1,2,3 pads that are respectively spot welding, when being soldered to enamel-covered wire on the pad in the practical operation, because the bonding pad area on the circuit board is not of uniform size, just cause parameters such as welding pressure, output voltage, pulse width to need constantly to carry out manual fine-tuning, to reach desirable welding effect according to different situations.Therefore, its shortcoming is in the product processing, and welding equipment is manual adjustments continually, has increased the manufacturing procedure difficulty, has prolonged the production cycle of product, and human factor has caused the unstability of product welding quality, increase bad quality hidden danger.
Summary of the invention
The object of the present invention is to provide a kind of process operation that is easy to, welding efficiency height, the pad spot welding method that welding quality is stable.
Purpose of the present invention is achieved by the following technical programs:
A kind of pad spot-welding technology method provided by the invention is carried out layout optimization to the pad on the circuit board exactly, and adjusting needs the bonding pad area of spot welding to make its size identical on the circuit board.So just, the area of having unified each pad need not frequently to adjust parameters such as welding pressure, output voltage, pulse width in welding process, has reduced the difficulty of manufacturing procedure, helps improving the stability of welding efficiency and welding quality.
And the bonding pad area of need spot welding on the adjustment circuit board can specifically adopt following two kinds of modes: one, adopt the form of drawing is adjusted needs spot welding on the circuit board bonding pad area, promptly cover from large tracts of land and draw pad the copper, make the area size of each pad identical.The bond pad locations of each pad was advisable with contiguous and proper alignment after this moment, pad was drawn, and pad layout is limited little like this, in the design allowed band, can be according to actual needs that the extraction location arrangement is more neat evenly, and reach the purpose of simplifying welding procedure.Two, adopt the hollow out form is adjusted needs spot welding on the circuit board bonding pad area, promptly cover from large tracts of land and dig out pad the copper, make the area size of each pad identical, its result of use is identical with the form of drawing.
The present invention has following beneficial effect: optimized welding sequence, simplified processing technology, reduced the difficulty of processing, shortened machining period, helped improving the stability of welding efficiency and welding quality.
Description of drawings
The present invention is described in further detail below in conjunction with embodiment and accompanying drawing:
Fig. 1 is a prior art SW point electric welding work principle schematic;
Fig. 2 is the welding schematic diagram of one of prior art spot welding pad;
Fig. 3 is the welding schematic diagram of one of embodiment of the invention;
Fig. 4 is two a welding schematic diagram of prior art spot welding pad;
Fig. 5 is two a welding schematic diagram of the embodiment of the invention.
The specific embodiment
Embodiment one
Figure 3 shows that one of embodiments of the invention, when circuit board carries out the component placement arrangement, need the large tracts of land pad as the spot welding element, then with the pad design of spot welding position for drawing shape, the pad that is about to the spot welding position is pressed the spot-welding technology standard, from large tracts of land cover draw the copper pad 1 ', make its area size identical with pad 2,3, do contiguous proper alignment simultaneously, with requirement that reaches component placement and the purpose of simplifying welding procedure, owing to break the whole up into parts, more help the layout of element on circuit board simultaneously.
Embodiment two:
Figure 5 shows that one of embodiments of the invention,, the pad 4 of spot welding position is designed to the hollow out form with spot welding circuit-board laying-out design before shown in Figure 4.As shown in Figure 5, promptly large tracts of land cover dig out on the copper pad 4 ', make its area size identical with pad 5.Its result of use is with to draw shape identical.
Claims (4)
1, a kind of pad spot welding method is characterized in that: by the pad that needs spot welding on the circuit board is adjusted, make on the circuit board area of each pad identical, implement spot welding on the identical pad of each area.
2, pad spot welding method according to claim 1 is characterized in that: employing is covered from large tracts of land and is drawn the bonding pad area that pad is adjusted the spot welding of circuit board need the copper, makes the area size of each pad identical.
3, pad spot welding method according to claim 2 is characterized in that: pad is drawn the bond pad locations marshalling that is evenly distributed of each pad of back.
4, pad spot welding method according to claim 1 is characterized in that: adopt from large tracts of land and cover the bonding pad area that the hollow out form of digging out pad the copper is adjusted the spot welding of circuit board need, make the area size of each pad identical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410052359XA CN1314509C (en) | 2004-11-24 | 2004-11-24 | Pad spot welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410052359XA CN1314509C (en) | 2004-11-24 | 2004-11-24 | Pad spot welding method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1608783A CN1608783A (en) | 2005-04-27 |
| CN1314509C true CN1314509C (en) | 2007-05-09 |
Family
ID=34764151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200410052359XA Active CN1314509C (en) | 2004-11-24 | 2004-11-24 | Pad spot welding method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1314509C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103934558A (en) * | 2013-01-17 | 2014-07-23 | 重庆亚宸汽车零部件有限公司 | Method for welding electronic devices of EPS (electric power steering) controller |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673681A (en) * | 1969-04-01 | 1972-07-04 | Inforex | Electrical circuit board wiring |
| JPH03149893A (en) * | 1989-11-06 | 1991-06-26 | Mitsubishi Electric Corp | Semiconductor device |
| US5950070A (en) * | 1997-05-15 | 1999-09-07 | Kulicke & Soffa Investments | Method of forming a chip scale package, and a tool used in forming the chip scale package |
| JP3149893B2 (en) * | 1992-08-05 | 2001-03-26 | 東陶機器株式会社 | Sanitary washing equipment |
| CN1396799A (en) * | 2001-07-11 | 2003-02-12 | 三星电子株式会社 | Printed circuit board with improved pad structure |
-
2004
- 2004-11-24 CN CNB200410052359XA patent/CN1314509C/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3673681A (en) * | 1969-04-01 | 1972-07-04 | Inforex | Electrical circuit board wiring |
| JPH03149893A (en) * | 1989-11-06 | 1991-06-26 | Mitsubishi Electric Corp | Semiconductor device |
| JP3149893B2 (en) * | 1992-08-05 | 2001-03-26 | 東陶機器株式会社 | Sanitary washing equipment |
| US5950070A (en) * | 1997-05-15 | 1999-09-07 | Kulicke & Soffa Investments | Method of forming a chip scale package, and a tool used in forming the chip scale package |
| CN1396799A (en) * | 2001-07-11 | 2003-02-12 | 三星电子株式会社 | Printed circuit board with improved pad structure |
Non-Patent Citations (3)
| Title |
|---|
| 设计SMT焊盘应注意的若干问题 曾胜之，电子工艺技术，第24卷第3期 2003 * |
| 设计SMT焊盘的若干经验 孙越等，信息技术，第5期 2001 * |
| 设计SMT焊盘的若干经验 孙越等，信息技术，第5期 2001;设计SMT焊盘应注意的若干问题 曾胜之，电子工艺技术，第24卷第3期 2003 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1608783A (en) | 2005-04-27 |
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| C14 | Grant of patent or utility model | ||
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Address after: 510663 Guangzhou Science City, Luogang District science Avenue, science and technology development center, Department of the Department of the 1st Street, No. 5 Patentee after: Guangzhou Jinshengyang Science & Technology Co., Ltd. Address before: 510660, 2 floor, 6 Industrial Park, Huang Yi Road, Guangzhou, Guangdong, Tianhe District Patentee before: Guangzhou Jinshengyang Science & Technology Co., Ltd. |