CN1301614C - Position regulating structure of sensitization element of scanner and its manufacturing method - Google Patents
Position regulating structure of sensitization element of scanner and its manufacturing method Download PDFInfo
- Publication number
- CN1301614C CN1301614C CNB031594263A CN03159426A CN1301614C CN 1301614 C CN1301614 C CN 1301614C CN B031594263 A CNB031594263 A CN B031594263A CN 03159426 A CN03159426 A CN 03159426A CN 1301614 C CN1301614 C CN 1301614C
- Authority
- CN
- China
- Prior art keywords
- hole
- aligning structure
- scanner
- circuit board
- contrapositions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
The present invention relates to a position adjusting structure of a sensitizing element of a scanner and a manufacturing method thereof. The present invention comprises the following procedures: (a) two position adjusting holes are drilled out on a circuit board of an optical assembly of the scanner by a one-time drilling method, and (b) a light reflecting layer is formed on the periphery of both of the position adjusting holes, wherein when the light reflecting layer is used for reflecting light, a contrast color different from the color of the position adjusting holes is generated for confirming the position of the position adjusting structure, so the position of the sensitizing element of the scanner is adjusted when the sensitizing element of the scanner is fixed to the circuit board.
Description
(1) technical field
Aligning structure of the relevant a kind of scanner light sensing element of the present invention and preparation method thereof refers to a kind of use contact-type image sensor (Contact Image Sensor, CIS) aligning structure of the scanner light sensing element of technology and preparation method thereof especially.
(2) background technology
The operation principle of scanner (Scanner) is that irradiate light that light source is produced is to contribution to be scanned, reflection through lens set, reassociate in charge coupled cell (Charge-Coupled Device, CCD) or CMOS (Complementary Metal Oxide Semiconductor) (Complementary Metal Oxide Semiconductor, CMOS) after receiving by it on, the photo-sensitive cell that utilizes this type is the signal transition of the light signal for electricity, and then produces analog or digital pixel (Pixel) data.In the process that scans, since CCD can detected image on zones of different reflect the light of varying strength, therefore utilize the principle of the more light of the less light of regional reflex darker on the paper, brighter regional reflex, the light wave that CCD reflected can be converted to the analog or digital data, this telecommunication signal can be directly proportional with light intensity, at last, re-use literal compatible or image and scan software and read in these data, and it is reassembled as the computerized image file with scanner.
Because ripe photocontrol technology is dependent in excellent scanner capture performance, so the quality of optical module is not only important, influence one of main element of scanner running performance especially.
At present the scanner view finding method of main flow is a kind ofly to be called contact-type image sensor (it is with the Componentized kenel for Contact ImageSensor, technology CIS), and light source, lens pillar, sensing substrate and shell etc. are combined.
Please refer to Fig. 1 (a), it is the optical assembly structure figure that uses the scanner of contact-type image sensor technology in the known techniques.Wherein, CIS modular construction 10 is by diode light-source 11, lens pillar (Rod Lens) 12, housing (Housing) 13 and 14 common be combined intos of circuit board; And also have a photo-sensitive cell 141 that constitutes by CCD or CMOS on the circuit board 14, shown in Fig. 1 (b).
Because using the optical module of the scanner of contact-type image sensor technology need be by lens pillar 12 when running, the light-ray condensing that will come from waiting to scan the object reflection is on photo-sensitive cell 141, therefore the relative position of center line is just extremely important each other for lens pillar 12 and photo-sensitive cell 141, that is to say, if lens pillar 12 and photo-sensitive cell 141 the relative position difference of center line each other are excessive, will cause the bad problem of capturing images quality.
Demand for adapt sense optical element 141 location, therefore general photo-sensitive cell with circuit board 14 secure bond (bonding) before, most likely make the mark 142 that one group of contraposition is used in the appropriate location of circuit board 14, in order to the usefulness of board contraposition when being fixed in photo-sensitive cell 141 on the circuit board 14, shown in Fig. 1 (b).
Generally when making mark 142, the method of being taked be mostly utilize the mode of exposure imaging make non-boring to bit pattern (pattern), shown in Fig. 1 (b), be to allow glutinous brilliant (die bond) board carry out contraposition to reflection of light degree difference wherein by golden face that is had on the circuit board ground 1421 and 1421 on every side or tin face 1422 (can be circle or square) to bit pattern 142
Yet general exposure imaging is once boring (the non-conduction hole that utilizes pcb board limit (Tooling system); NPTH),, this accuracy tolerance to bit pattern 142 up adds (the non-conduction hole of generally once holing again so being based on a drilling accuracy worker difference as datum mark; NPTH) precision worker is poor in positive and negative 0.05mm, but if add the making error of the figure of exposure imaging, the promptly positive and negative nearly 0.075mm of its accuracy tolerance, its error is not little.In addition, that utilizes that exposure imaging makes can cause other problems because of the quality of PCB processing procedure control to bit pattern, complete as to bit patterns, whether excessive or too small, because the precision of glutinous brilliant board when doing photo-sensitive cell in conjunction with (bonding) processing procedure is along with the positional precision of contraposition with mark, dimensional accuracy and integrity of shape and different, have influence on the position of photo-sensitive cell, its consequence is when the position of photo-sensitive cell is offset to some extent, the light that comes from waiting to scan the object reflection is behind process lens 12, the image space that is focused on the photo-sensitive cell 141 is offset to some extent, formation enters the light luminance deficiency of photo-sensitive cell 141, or the non-homogeneous of the photo sensitivity of image (PhotoResponse Non Uniformity, the situation that value PRNU) is not good.
Desire solves this problem, can improve the processing procedure control ability of circuit board, make the accuracy and the integrality of alignment mark improve, yet circuit board manufacturer must be with its several process parameter optimizations, or purchase equipment with more senior processing procedure ability, and must can obtain achievement through repetition test, both having wasted time and energy also to consume considerable money cost.
(3) summary of the invention
The objective of the invention is aligning structure that proposes a kind of scanner light sensing element and preparation method thereof, it is the hole that forms in the mode of using once boring main body as aligning structure, cooperate the hole reflective characteristic of reflector layer on every side again, the site error that is produced when utilizing aligning structure to be fixed on the optical module circuit board to scanner light sensing element with improvement.
Propose a kind of aligning structure of scanner light sensing element according to an aspect of the present invention, it is to be arranged on the circuit board (PCB) of a scanner optical module, and this aligning structure comprises: two contraposition holes are positioned on this circuit board; And a reflector layer, be positioned at this two contrapositions hole respectively around; Wherein, produce the position that the contrastive colours different with this two contrapositions hole are confirmed this aligning structure when utilizing this reflector layer reflective, the usefulness of contraposition when providing this scanner light sensing element to be fixed in this circuit board.According to above-mentioned conception, wherein this scanner optical module is to be use contact-type image sensor (Contact Image Sensor, CIS) the scanner optical module of technology.
According to above-mentioned conception, wherein this scanner light sensing element is to be charge coupled cell (Charge-CoupledDevice, CCD), CMOS (Complementary Metal Oxide Semiconductor) (Complementary Metal OxideSemiconductor, CMOS) or the element of other tool light transfer characteristics one of them.
According to above-mentioned conception, wherein the diameter of this two contrapositions hole is between 0.1～0.5mm.
According to above-mentioned conception, wherein this two contrapositions hole is to be all a blind hole.
According to above-mentioned conception, wherein this two contrapositions hole is to be all a through hole.
According to above-mentioned conception, wherein this two registration holes can be a blind hole and a through hole.
According to above-mentioned conception, wherein this reflector layer comprises a copper foil layer and a gold medal layer (Au), and should the gold layer be to be positioned on this copper foil layer.
Propose a kind of aligning structure manufacture method of scanner light sensing element according to another aspect of the invention, comprise the following steps: that (a) gets out two contraposition holes in brill mode once on a circuit board of a scanner optical module; (b) around this two contrapositions hole respectively, form a copper foil layer; And (c) on this copper foil layer, form a gold medal layer; Wherein, produce the position that the contrastive colours different with this circuit board are confirmed this aligning structure when utilizing this gold layer (Au) reflective, the usefulness of contraposition when providing this scanner light sensing element to be fixed in.
According to above-mentioned conception, wherein this scanner optical module is to be use contact-type image sensor (Contact Image Sensor, CIS) the scanner optical module of technology.
According to above-mentioned conception, wherein step (a) is to hole with a mechanical system; Use the mode of once boring on this circuit board, to get out this two contrapositions hole.
According to above-mentioned conception, wherein step (a) is to hole with a laser mode; Use the mode of once boring on this circuit board, to get out this two contrapositions hole.
According to above-mentioned conception, wherein step (b) be in this two contrapositions hole around electro-coppering to form this copper foil layer.
According to above-mentioned conception, wherein step (c) be on this this copper foil layer electrogilding to form this gold layer.
According to above-mentioned conception, wherein step (c) be on this this copper foil layer chemical gilding to form this gold layer
Propose a kind of aligning structure manufacture method of scanner light sensing element according to a further aspect of the present invention, comprise the following steps: that (a) gets out two contraposition holes once to bore mode on a circuit board of a scanner optical module; And (b) around this two hole respectively, form a reflector layer; Wherein, produce the position that the contrastive colours different with this registration holes are confirmed this aligning structure when utilizing this reflector layer reflective, the usefulness of contraposition when providing this scanner light sensing element to be fixed in this circuit board.
According to above-mentioned conception, wherein this scanner optical module is to be use contact-type image sensor (Contact Image Sensor, CIS) the scanner optical module of technology.
According to above-mentioned conception, wherein step (a) is to hole with a mechanical system; Use the mode of once boring on this circuit board, to get out this two contrapositions hole.
According to above-mentioned conception, wherein step (a) is to hole with a laser mode; Use the mode of once boring on this circuit board, to get out this two contrapositions hole.
According to above-mentioned conception, wherein step (b) comprises that also step is as follows: electro-coppering in regular turn and electrogilding (Au) are to form this reflector layer around this two hole.
According to above-mentioned conception, wherein step (b) comprises that also step is as follows: electro-coppering in regular turn and chemical gilding (Au) are to form this reflector layer around this two hole.
The present invention must can obtain more deep understanding by following accompanying drawing and detailed description:
(4) description of drawings
Fig. 1 (a) is the optical assembly structure figure that uses the scanner of contact-type image sensor technology in the known techniques;
Fig. 1 (b) is the circuit board vertical view of being painted according to Fig. 1 (a); And
Fig. 2 is the vertical view of aligning structure one preferred embodiment of the present invention.
(5) embodiment
See also Fig. 2, it is the vertical view for aligning structure one preferred embodiment of the present invention; Wherein, aligning structure 20 is to be positioned at one to use contact-type image sensor (Contact Image Sensor, CIS) on the circuit board 21 of the scanner optical module of technology, the usefulness of contraposition when being fixed in circuit board 21 so that scanner light sensing element 22 to be provided by aligning structure 20, and scanner light sensing element 22 can be charge coupled cell (Charge-Coupled Device, CCD), CMOS (Complementary Metal Oxide Semiconductor) (ComplementaryMetal Oxide Semiconductor, CMOS) or the element of other tool light transfer characteristics one of them.
Owing to the aforesaid shortcoming of commonly using alignment mark is its accuracy tolerance is that the boring and the tolerance addition of exposure imaging obtain, so error is bigger; Therefore, the aligning structure 20 that the present invention taked is the holes 201 of holing based on once, be engaged in again hole around form a reflector layer 202, utilize reflector layer 202 when reflective, to produce the position that the contrastive colours different with registration holes 201 are confirmed aligning structure 20, so that the usefulness of board contraposition when scanner light sensing element 22 is fixed in circuit board 21 to be provided, its detailed production process is as described below.
At first, the appropriate location of mode on circuit board 21 with once boring forms one group of hole 201 earlier, and wherein, the method that so-called once boring is taked can be machine drilling, can also be laser drill; And so-called appropriate location is meant and can not has influence on photo-sensitive cell 22 for the normal position that receives of incident ray; Kenel as for hole 201 can be through hole or blind hole, and its size is different along with the drill bit of use different size, but diameter is the scope of application with 0.1 ~ 0.5mm.
Secondly, promptly be electronic circuit processing procedure and the anti-welding procedue that circuit board 21 is correlated with, when doing circuit, 202 electroplate one deck Copper Foils around hole simultaneously, make hole 201 around form a copper foil layer.
At last, for the fixing electric charge coupling (CCD of board of adapt sense optical element, Charge-CoupledDevice) camera lens must read the difference ability recognizing site of color contrast, therefore must be on copper foil layer again to electroplate or the mode of chemical plating plates a gold medal layer (Au), to finish the processing procedure of reflector layer 202 and whole aligning structure 20.
In sum, the aligning structure that manufacture method made of the present invention comes out is to be as the criterion with the position of once holing purely, and its accuracy tolerance and known techniques are comparatively simple by comparison, and be therefore also more accurate.Utilize again photo-sensitive cell fixedly the electric charge coupling camera lens of board to photosensitive layer when reflective and the contrastive colours that produced between the circuit board confirming the position of aligning structure, and by this photo-sensitive cell accurately is fixed on the circuit board.At least can improve more than the 0.025mm as the photo-sensitive cell secure bond in the accuracy of circuit board in this way, therefore when the scanner optical module is tested, the non-homogeneous of the photo sensitivity of its image (Photo ResponseNon Uniformity, value PRNU) will be better; Error when locating because of photo-sensitive cell in addition reduces, make the relative position of itself and lens pillar (Rod Lens) more near a straight line, more significantly reduced the probability that lens pillar effect (Rod Lens Effect) produces, made that the image quality of scanner is more excellent.
Claims (13)
1. the aligning structure of a scanner light sensing element, it is to be arranged on the circuit board of a scanner optical module, this aligning structure comprises:
Two contraposition holes are positioned on this circuit board; And
One reflector layer, be positioned at this two contrapositions hole respectively around;
Wherein, produce the position that the contrastive colours different with this two contrapositions hole are confirmed this aligning structure when utilizing this reflector layer reflective, the usefulness of contraposition when providing this scanner light sensing element to be fixed in this circuit board.
2. aligning structure as claimed in claim 1 is characterized in that this scanner optical module is the scanner optical module for a use contact-type image sensor technology.
3. aligning structure as claimed in claim 1, it is characterized in that this scanner light sensing element be for charge coupled cell, CMOS (Complementary Metal Oxide Semiconductor) or other have light transfer characteristic element one of them.
4. aligning structure as claimed in claim 1 is characterized in that the diameter of this two contrapositions hole is between 0.1～0.5mm.
5. aligning structure as claimed in claim 1 is characterized in that this two contrapositions hole is to be all blind hole or through hole.
6. aligning structure as claimed in claim 1 is characterized in that this two contrapositions hole is to be a through hole and a blind hole.
7. aligning structure as claimed in claim 1 is characterized in that this reflector layer comprises a copper foil layer and a gold medal layer, and should the gold layer be to be positioned on this copper foil layer.
8. the aligning structure manufacture method of a scanner light sensing element comprises the following steps:
(a) on a circuit board of a scanner optical module, get out two contraposition holes in brill mode once;
(b) around this two contrapositions hole respectively, form a copper foil layer; And
(c) on this copper foil layer, form a gold medal layer;
Wherein, produce the position that the contrastive colours different with this circuit board are confirmed this aligning structure when utilizing this gold layer reflective, the usefulness of contraposition when providing this scanner light sensing element to be fixed in.
9. aligning structure manufacture method as claimed in claim 8 is characterized in that step (a):
Be to hole with a mechanical system; Use the mode of once boring on this circuit board, to get out this two contrapositions hole; Or
Be to hole with a laser mode; Use the mode of once boring on this circuit board, to get out this two contrapositions hole.
10. aligning structure manufacture method as claimed in claim 8, it is characterized in that step (b) be in this two contrapositions hole around electro-coppering to form this copper foil layer.
11. aligning structure manufacture method as claimed in claim 8, it is characterized in that step (c) be on this copper foil layer electrogilding or chemical gilding to form this gold layer.
12. the aligning structure manufacture method of a scanner light sensing element comprises the following steps:
(a) on a circuit board of a scanner optical module, get out two contraposition holes once to bore mode; And
(b) around this two hole respectively, form a reflector layer;
Wherein, produce the position that the contrastive colours different with this registration holes are confirmed this aligning structure when utilizing this reflector layer reflective, the usefulness of contraposition when providing this scanner light sensing element to be fixed in this circuit board.
13. aligning structure manufacture method as claimed in claim 12 is characterized in that step (b) also comprises the steps:
Electro-coppering in regular turn and electrogilding are to form this reflector layer around this two hole; Or
Electro-coppering in regular turn and chemical gilding are to form this reflector layer around this two hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031594263A CN1301614C (en) | 2003-09-17 | 2003-09-17 | Position regulating structure of sensitization element of scanner and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031594263A CN1301614C (en) | 2003-09-17 | 2003-09-17 | Position regulating structure of sensitization element of scanner and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1599402A CN1599402A (en) | 2005-03-23 |
| CN1301614C true CN1301614C (en) | 2007-02-21 |
Family
ID=34660643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031594263A Expired - Lifetime CN1301614C (en) | 2003-09-17 | 2003-09-17 | Position regulating structure of sensitization element of scanner and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1301614C (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152861A (en) * | 1984-08-24 | 1986-03-15 | 松下電器産業株式会社 | Ultrasonic probe |
| CN1413080A (en) * | 2001-10-12 | 2003-04-23 | 矽峰光电科技股份有限公司 | Justification method of influence sensor and its equipment |
-
2003
- 2003-09-17 CN CNB031594263A patent/CN1301614C/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152861A (en) * | 1984-08-24 | 1986-03-15 | 松下電器産業株式会社 | Ultrasonic probe |
| CN1413080A (en) * | 2001-10-12 | 2003-04-23 | 矽峰光电科技股份有限公司 | Justification method of influence sensor and its equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1599402A (en) | 2005-03-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5995229A (en) | Optical displacement measuring apparatus | |
| CN1306627C (en) | Light-emitting diode light source unit | |
| CN1838049B (en) | Compact and low profile optical navigation device and its usage method | |
| KR100955626B1 (en) | Image photographing device and image photographing method for bonding device | |
| US4473842A (en) | Apparatus and method for examining printed circuit board provided with electronic parts | |
| CN1599428A (en) | Compact imaging module | |
| JP4434417B2 (en) | Inspection equipment for printed wiring boards | |
| CN102077577A (en) | Image pickup unit | |
| CN1649114A (en) | Method for producing wiring base board | |
| CN1669303A (en) | Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module | |
| CN1301614C (en) | Position regulating structure of sensitization element of scanner and its manufacturing method | |
| KR100955623B1 (en) | Image photographing device and image photographing method for bonding device | |
| JP2698213B2 (en) | Circuit board and circuit board position recognition method | |
| CN114390152B (en) | Contact type image sensor for detecting micro concave-convex and application | |
| JPH0961239A (en) | Light-quantity detecting member and image input device mounting this member | |
| CN115629076A (en) | Array type image detection device | |
| CN1945857A (en) | Wafer grade image module | |
| CN105306795A (en) | Bar code photographing device controlled by global electronic shutter | |
| JP2001007460A (en) | Recognition mark structure for flexible substrate | |
| CN1413080A (en) | Justification method of influence sensor and its equipment | |
| TW594932B (en) | Alignment structure for an image photosensitive device of a scanner and its manufacturing method | |
| CN110658698B (en) | Exposure positioning method of COF substrate | |
| KR100696396B1 (en) | Laser beam processing apparatus | |
| CN1669302A (en) | Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module | |
| KR100461025B1 (en) | Laser marking method using eccentric camera lens |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: WUXI LINGGUANG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LINGGUANG SCIENCE CO., LTD. Effective date: 20090731 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090731 Address after: Block 93, Wuxi hi tech Industrial Development Zone, Jiangsu, A4 Patentee after: Wuxi Creative Sensor Technology Co.,Ltd. Address before: 6 floor, Lane 235, Lane 128, Baoshan Road, Taipei County, Taiwan Patentee before: CREATIVE SENSOR INC. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20070221 |
|
| CX01 | Expiry of patent term |