CN1300638C

CN1300638C - Method for manufacturing micro mechanical components with different aspect ratio using X-ray exposure

Info

Publication number: CN1300638C
Application number: CNB200410084556XA
Authority: CN
Inventors: 李以贵; 宋康; 陈水良
Original assignee: Shanghai Jiaotong University
Current assignee: Shanghai Jiaotong University
Priority date: 2004-11-25
Filing date: 2004-11-25
Publication date: 2007-02-14
Anticipated expiration: 2024-11-25
Also published as: CN1632699A

Abstract

The present invention relates to a method for manufacturing micro-mechanical components with different depth ratios by x-ray exposure, which is applied to the technical field of micro-machining. In the method, the light intensity distribution of x-ray is in a Gaussian distribution mode, i.e. the concentration of x-ray beams is the function of positions of the x-ray beams and the amount of the x-ray is accurately controlled by the size of a Cape Town window. PMMA is used as photoresist, and the x-ray is used for exposure. At the same exposure time, exposure deep follows the change of the positions to be changed in a Gaussian distribution mode so as to obtain micro-mechanical components with different depth ratios on the photoresist. In the method, different positions in exposure can obtain different exposure amount, so that microstructures with different depth ratios can be obtained by single exposure. The method which can be applied to the manufacture of complicated micro-machines or micro-optical structures can reduce process steps and save manufacture cost of mask.

Description

Make the method for the micro-mechanical component of different form ratios with the x x ray exposure x

Technical field

The present invention relates to a kind of job operation of method of micro-mechanical component, the particularly a kind of x of using x ray exposure x is made the method for the micro-mechanical component of different form ratios, is used for micro processing field.

Background technology

Micro-mechanical component has great significance for the trend of device miniaturization.The mechanical property of micro-mechanical component plays a part very crucial for the Performance And Reliability of MEMS (micro electro mechanical system) (MEMS) device, a lot of microactrators are when being subjected to surface impacts (this impact may be to cause because of carelessness or itself be exactly the part of microactrator action), and the mechanical component of the inside can take place by nonvolatil destruction.The rigidity that reduces these mechanical components will improve their reliability and performance, but these mechanical components must have enough modulus effectively power to be transferred to another member from a member again simultaneously.Therefore the MEMS (micro electro mechanical system) mechanical component that needs a kind of method manufacturing of invention to have controlled depth-to-width ratio.On the other hand,, need have the right cylinder style of different depth and width in a large number, carry out a series of pressure test in order to grasp at the failure behaviour of micro-mechanical component under three-dimensional situation.Existing technology generally is to adopt the method for etching to make such assembly.

Find that by prior art documents publication is at " Micrometer-Nanometer Processing Technology " third phase in 2000 the, " O on the P39-43 ₂Reaction ion deep etching PMMA ", obtain the sample of different depth-to-width ratios in this article with the method for etching, obtain but need on different silicon chips, to change etching time respectively, for the situation of the different samples of a large amount of depth-to-width ratios of needs, cost is than higher.And etching itself is consuming time many.

Summary of the invention

The objective of the invention is to overcome deficiency of the prior art, a kind of method of making the micro-mechanical component of different form ratios with the x x ray exposure x is provided, make it only just can on same silicon chip, obtain depth-to-width ratio very on a large scale at variable mechanical component by size and the position that changes mask graph, and only need the x x ray exposure x one time, can produce in enormous quantities, overcome the shortcoming that prior art is consuming time, cost is high.

The present invention is achieved by the following technical solutions, because the light intensity of x ray is Gaussian distribution to the distribution of position, and the dosage of x ray can accurately be controlled in different positions, specifically can accurately control the dosage of x ray by the size of Cape Town window, therefore the enough polymethylmethacrylates of energy (PMMA) are as photoresist, use the x x ray exposure x, because in diverse location x transmitted intensity difference, so in the identical time shutter, the diverse location exposure depth is also different, thereby can obtain the different micro-mechanical component of depth-to-width ratio on photoresist.

By control x ray with the distribution of position or change the depth-to-width ratio that spacing between mask pattern changes micro-mechanical component.The specific implementation process of method is: obtain the x ray beam that energy surpasses 1.3kev with a Cape Town window, light beam passes through mask then, shine on the photoresist of polymethylmethacrylate (PMMA) and expose, to photoresist, the back of developing just can obtain the micro-mechanical component of different form ratios with the figure transfer of mask.

The present invention compares with the lithographic method that micro-mechanical component adopted of making different form ratios now, it only just can obtain the different member of depth-to-width ratio by the dose distribution of control x ray with the spacing that changes mask pattern, rather than the picture etching will be by changing etching time, once can only obtain the device of a specific depth-to-width ratio, therefore it has overcome the high and shortcoming consuming time of etching cost, can disposablely obtain depth-to-width ratio continually varying micro-mechanical component, a kind of manufacture method flexibly is provided, and the surfaceness of gained member is little, can use in the optical device.

Description of drawings

Fig. 1 is the rough schematic of x X-ray lithography X

Fig. 2 is the distribution plan of the light intensity of x ray with the position

Embodiment

Content and accompanying drawing in conjunction with the inventive method provide following examples:

As shown in Figure 1, the total length of the x beam of photoetching is 1.58m, Cape Town (kapton) window that beryllium (Be) that 200 μ m are thick and 50 μ m are thick (5mm * 30mm) be used as filtrator to obtain the hard x rays that photon energy surpasses 1.3kev.

X ray along the light distribution of mask vertical direction as shown in Figure 2.The size of the particle beams is 5mm (vertically) * 38mm (level), and for utilizing the vertical distribution of the particle beams, the size in mask pattern zone is designed to 5mm.In photoetching process, adjust the position of mask pattern by the position of mobile whirl coating platform, make the exposure energy of PMMA to modulate.

At first make a mask that is covered with polymkeric substance and gold absorption, mask image is that (5mm * 5mm), the spacing between the right cylinder is 300 μ m to cylindrical array, and external diameter and internal diameter are respectively 100 μ m and 30 μ m.Dosage approximately is 0.06Ah.Develop after the photoetching figure obtain electromicroscopic photograph as can be seen, having obtained depth-to-width ratio at last is 2.5,2.2,1.5,1.0,0.5 micro-mechanical component.The degree of depth of etching and the relation between the position and Gaussian curve are corresponding to.

In addition, the surfaceness of resulting member is less than 1/10th of wavelength in 30nm.Therefore the surface after developing is very smooth, can prepare the labyrinth in the optical lens in this way.

Claims

1, a kind of method of making the micro-mechanical component of different form ratios with the x x ray exposure x, it is characterized in that, because the light intensity of x ray is Gaussian distribution to the distribution of position, and the dosage of x ray is accurately controlled by the size of Cape Town window, with polymethylmethacrylate as photoresist, use the x x ray exposure x, because in diverse location x transmitted intensity difference, so in the identical time shutter, the diverse location exposure depth is also different, thereby obtains the different micro-mechanical component of depth-to-width ratio on photoresist.

2, the method for making the micro-mechanical component of different form ratios with the x x ray exposure x according to claim 1, it is characterized in that, its specific implementation process is: obtain the x ray beam that energy surpasses 1.3kev with a Cape Town window, light beam passes through mask then, shine on the photoresist of polymethylmethacrylate and expose, the figure transfer of mask to photoresist, has just been obtained the micro-mechanical component of different form ratios after the development.