CN1298035C - Water testing parameter analytical method - Google Patents
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- CN1298035C CN1298035C CN 02158152 CN02158152A CN1298035C CN 1298035 C CN1298035 C CN 1298035C CN 02158152 CN02158152 CN 02158152 CN 02158152 A CN02158152 A CN 02158152A CN 1298035 C CN1298035 C CN 1298035C
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- 238000012360 testing method Methods 0.000 title claims abstract description 101
- 238000004458 analytical method Methods 0.000 title claims description 98
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title 1
- 238000000034 method Methods 0.000 claims abstract description 137
- 230000008569 process Effects 0.000 claims abstract description 126
- 238000001514 detection method Methods 0.000 claims abstract description 17
- 230000007547 defect Effects 0.000 claims description 60
- 230000002950 deficient Effects 0.000 claims description 46
- 238000009826 distribution Methods 0.000 claims description 29
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- 238000005516 engineering process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
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- 230000002159 abnormal effect Effects 0.000 description 1
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Abstract
The present invention discloses a method for analyzing wafer testing parameters, which is used for analyzing batches of products with batch numbers respectively. The method of the present invention comprises the following steps: dividing products into a product group with a high yield and a product group with a low yield according to the yield; generating a first standard value according to wafer testing parameter values of the product group with a high yield; comparing the product group with a low yield with the first standard value to delete product batch numbers which are not lower than the first standard value from the product group with a low yield; judging whether the quantity of the residual batch numbers of the product group with a low yield is zero; searching sample testing items, on-line quality detection items or stations of technological processes relevant to the wafer testing item from a database when the quantity is not zero; stopping the searching operation when the quantity is zero.
Description
Technical field
The present invention relates to a kind of technological parameter analytical method, particularly a kind of analytical method of wafer sort parameter.
Background technology
In semiconductor fabrication, finish the semiconductor product and will pass through many technologies, for example lithography process, etch process, ion implantation technology etc. usually; That is in semiconductor fabrication, must be applied to the board of huge quantity and many red tapes.Therefore, those skilled in the art are devoted to all to guarantee that the board running is normal, keep or improve the finished product rate, detect operations such as confirming problem points and board maintenance, can conform with customer demand in the hope of speed of production and the quality that makes semiconductor product.
Generally speaking, the problem of inquiring into semiconductor technology can comprise attribute test on technological parameter data, the line (In-line QC) data, defects detection (defect inspection) data, sample test (sample test) data, wafer sort (wafer test) data and encapsulation back test (final test) data from following columns item number according to setting about analyzing.Wherein, the wafer sort data are that wafer is carried out characteristic test (pause refresh test), functional test (functiontest) and power supply supply of current test (IDDQ test) resulting test value.
In original technology, please refer to shown in Figure 1ly, at first carry out step 101, this moment, the technical staff can carry out the test of every wafer sort project at each wafer, as characteristic test, functional test and the test of power supply supply of current.
Then, in step 102, the technical staff can observe the result of every wafer sort project of each wafer, so that find out wafer sort result product devious; As shown in Figure 2, can cut into a plurality of tube cores (die) in a wafer 2, comprising a plurality of substandard products tube cores 21 (with black display) and a plurality of qualified tube core 22 (showing with white) are arranged, and Fig. 2 promptly represents the distribution map of wafer sort parameter value.
In step 103, by the technical staff rule of thumb, and in step 102 the wafer sort parameter value distribution map of selected abnormal products, judge may problematic technological process station other, as lithography process flow process, etch process flow process, ion implantation technology flow process etc.
At last, in step 104, the technical staff checks each board during technological process station that step 103 judges is not, so that find out unusual board.For example, according to distribution map shown in Figure 2, the technical staff can judge problematic technological process station not for the forming process of a certain metal level has problem, so it is other to search for the technological process station that forms this metal level, and check out unusual board, as deposition machine, etching machine etc.
Yet, owing to be to utilize the personal experience to judge to decide analysis result (step 103) in original technology, so the result's that ultimate analysis is come out accuracy and confidence level will remain to be discussed; The personnel that add semiconductor manufacturing industry alternate frequently, experience accumulation before and after causing between the phase engineer, teach difficult, and each engineer is limited in one's ability, can't take into account the mode of operation of all boards of plant area, so when the test result of semiconductor product takes place when unusual, the engineer may not be certain to have enough experiences fast and to judge rightly out be which link goes wrong, thereby may must expend many times and carry out correlative study, even might do the judgement that makes mistake, thus, not only reduce the efficient of technological process, increase production cost, also can't in time improve on the line production situation to improve rate of finished products.
Therefore, how to provide a kind of and can take place in the wafer sort data of semiconductor product when unusual, fast and to judge rightly out be the analytical method which link goes wrong, one of important topic of current semiconductor fabrication just.
Summary of the invention
Because above-mentioned problem, purpose of the present invention can take place in the wafer sort data of semiconductor product when unusual for providing a kind of, fast and to judge rightly out be the wafer sort parameters analysis method which link goes wrong.
Feature of the present invention system is a control group with the high product of rate of finished products, and other technological process item record that will be relevant with every wafer sort project is in database.
Therefore, for reaching above-mentioned purpose, according to wafer sort parameters analysis method of the present invention is in order to analyze the many batches of products that have a lot number respectively, it is obtained through a plurality of boards, and each wafer in the every batch of product at least through the detection of a wafer sort project to produce a wafer sort parameter value, a Quality Detection project and a technological process station are not stored in the database on wafer sort project and parameter value thereof and a sample test event relevant with the wafer sort project, the line, and this method comprises following a plurality of steps:
According to rate of finished products many batches of product differentiations are at least two product groups, comprise one first rate of finished products group and one second rate of finished products group, the rate of finished products value of the product that the first rate of finished products group is comprised is higher than the second rate of finished products group;
The wafer sort parameter value of each batch product of the foundation first rate of finished products group produces one first standard value in the statistical analysis mode;
Carry out contrasting for the first time the wafer sort parameter value and first standard value of each batch product of the second rate of finished products group, in the lot number of each batch product of the second rate of finished products group, to delete the lot number of the product that is parity with or superiority over first standard value;
After deletion action, judge whether one first quantity of the residue lot number of the second rate of finished products group is zero;
When first quantity of the residue lot number of judging the second rate of finished products group is non-vanishing, carry out the following step:
In database, carry out on first search sample test project relevant, the line Quality Detection project or technological process station not wherein one of at least with the wafer sort project; As the result of first search of this database when showing that this wafer sort project is relevant with this sample test project, the result according to the sample test project of each batch product of this first rate of finished products group produces one second standard value in the statistical analysis mode;
Carry out contrasting for the second time result and this second standard value of the sample test project of the product of residue lot number in this second rate of finished products group, delete the lot number of this batch product that is parity with or superiority over this second standard value in the residue lot number with this second rate of finished products group certainly;
After deletion action, judge whether one second quantity of the residue lot number of this second rate of finished products group is zero;
When this second quantity of the residue lot number of judging this second rate of finished products group is non-vanishing, carry out the following step:
Carry out second search in this database, search for one of them content of following content: Quality Detection project and this technological process station are other on this line relevant with this sample test project;
As result of this second search of this database when showing that this sample test project is relevant with quality test event on this line, the result according to quality test event on the line of each batch product of this first rate of finished products group produces one the 3rd standard value in the statistical analysis mode;
Contrast in this second rate of finished products group result and the 3rd standard value of quality test event on the line of product of residue lot number, delete the lot number of this batch product that is parity with or superiority over the 3rd standard value in the residue lot number with this second rate of finished products group certainly;
After deletion action, judge whether one the 3rd quantity of the residue lot number of this second rate of finished products group is zero;
When the 3rd quantity of the residue lot number of judging this second rate of finished products group is non-vanishing, carry out the following step:
In this database, carry out the 3rd search this technological process station relevant with quality test event on this line other wherein at least one stands other; As the result of the 3rd search of this database when showing that the quality test event is not relevant with this technological process station on this line, search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station;
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability; And
When the 3rd quantity of the residue lot number of judging this second rate of finished products group is zero, stop the 3rd search; And
When this second quantity of the residue lot number of judging this second rate of finished products group is zero, stop second search; And
When this first quantity of the residue lot number of judging this second rate of finished products group is zero, stop first search.
In addition, the present invention also provides another kind of wafer sort parameters analysis method, it is in order to analyze the many batches of products that have a lot number respectively, it is obtained through a plurality of boards, and each wafer in the every batch of product at least through the detection of a wafer sort project to produce a wafer sort parameter value, this wafer sort project comprises that each tube core to each wafer carries out multiple Electronic Testing, and the wafer sort parameter value is the statistics of various Electronic Testings, and this method comprises following a plurality of steps:
According to rate of finished products many batches of product differentiations are at least two product groups, it comprises one first rate of finished products group and one second rate of finished products group;
The wafer sort parameter value of each batch product of the foundation first rate of finished products group produces one first standard value in the statistical analysis mode;
Carry out the wafer sort parameter value and first standard value of each batch product of first contrast, the second rate of finished products group, be parity with or superiority over the batch number of first standard value with deletion in the lot number of the second rate of finished products group;
After deletion action, judge whether first quantity of the residue lot number of the second rate of finished products group is zero;
When first quantity of the residue lot number of judging the second rate of finished products group is non-vanishing, carry out the following step:
Search for the various Electronic Testing values of each tube core of each wafer of the second rate of finished products group; Defining the tube core that does not conform with various Electronic Testing specifications on each wafer is the target tube core, and obtains a target tube core distribution map of each wafer; The target tube core distribution map and the wafer sort parameter value distribution map of each wafer are folded graphic operation; Overlapping ratio chosen greater than the wafer of one second standard value and be defined as an aimed wafer; The number that comprises aimed wafer in the second rate of finished products group is chosen greater than the lot number of the product of one the 3rd standard value; In database, carry out the first search sample test project relevant or technological process station not wherein one of at least,, stop analysis operation when this first quantity of the residue lot number of this second rate of finished products group of judgement when being zero with the wafer sort project.
As mentioned above, because of being control group with the high product of rate of finished products according to wafer sort parameters analysis method of the present invention system, and other technological process item record that will be relevant with every wafer sort project is in database, thereby the problematic technological process station that can judge rightly out is other, and then find out unusual board, improve so can reduce the mistake of artificial judgement effectively technological process efficient, reduce production cost, and in time improve on the line production situation to improve rate of finished products.
Description of drawings
Fig. 1 is a flow chart, shows the flow process of the wafer sort parameters analysis method of original technology;
Fig. 2 is a schematic diagram, the wafer sort parameter value distribution map of shows wafer;
Fig. 3 is a flow chart, shows the flow process according to the wafer sort parameters analysis method of the present invention's first preferred embodiment;
Fig. 4 is a flow chart, shows the flow process of the flow chart shown in Figure 3 that continues;
Fig. 5 is a flow chart, shows the flow process of the flow chart shown in Figure 4 that continues;
Fig. 6 is a flow chart, shows the flow process according to the wafer sort parameters analysis method of the present invention's second preferred embodiment;
Fig. 7 is a flow chart, shows the flow process of the flow chart shown in Figure 6 that continues;
Fig. 8 is a schematic diagram, the target tube core distribution map of shows wafer;
Fig. 9 is a flow chart, shows the flow process of the flow chart shown in Figure 7 that continues;
Figure 10 is a flow chart, shows the flow process of the flow chart shown in Figure 9 that continues;
Figure 11 is a flow chart, shows the flow process according to the wafer sort parameters analysis method of the present invention's the 3rd preferred embodiment; And
Figure 12 is a flow chart, shows the flow process of the flow chart shown in Figure 11 that continues.
Embodiment
Hereinafter with reference to relevant drawings, the wafer sort parameters analysis method of the preferred embodiment according to the present invention is described, wherein identical assembly will be illustrated with identical reference marks.
Please refer to Fig. 3 to Fig. 5, show the flow chart of the present invention's first preferred embodiment among the figure.This embodiment utilizes the result of wafer sort project A to analyze, and estimates to find out the problem board.
As shown in Figure 3, at first, in step 301, the wafer sort parameters analysis method of preferred embodiment according to the present invention, search for the rate of finished products of several batches of products earlier, then in step 302, rate of finished products is set at A group (the first rate of finished products group) product more than or equal to several batches of products of a default value (as 70%), for example comprise lot number 1,2,3,4, and 5 (shown in steps 303); And the several batches of products that rate of finished products is lower than default value (as 70%) are set at B group (the second rate of finished products group) product, for example comprise lot number 6,7,8,9, and 10 (shown in steps 304), wherein the rate of finished products value of the product that comprised of the first rate of finished products group is higher than the second rate of finished products group.
Wherein, each batch (lot) product has a lot number (lot number), and every batch of product includes 25 wafer, and the every batch of product all passes through a plurality of boards of multiple tracks technological process.With regard to a wafer sort project, project A for example carries out the multiple tracks Electronic Testing to each tube core (die) of every wafer, and obtains the Electronic Testing parameter value of each tube core.For every kind of Electronic Testing project, all be provided with a control criterion (control spec).When the Electronic Testing parameter value of a tube core conforms with control criterion, then think by this Electronic Testing project; And do not conform with control criterion when a tube core, then think and can't pass through this Electronic Testing project, and in this stage, the wafer sort project A of this tube core is with regard to defective (fail) at last.Hereat, after all tube cores Electronic Testing process that all process wafer sort project A is comprised of a wafer, the technical staff promptly can obtain the wafer sort parameter distribution figure of this wafer, as shown in Figure 2.In addition, the technical staff can divided by total tube core number, and obtain a numerical value with the qualified tube core number of the wafer sort project A of this wafer, and this numerical value is called the wafer sort parameter value of this wafer.The wafer sort parameter value of a collection of product (onelot) then is the mean value of the wafer sort parameter value of its total wafer number that comprises.
As for the rate of finished products of a collection of product, then be by all test events, comprise the typical value of the product quality that Quality Detection project on wafer sort project, the line, sample test project or the like test back is obtained.
See also the step 305 of Fig. 3, can carry out statistical analysis with regard to the wafer sort data of A set product earlier, find out wafer sort parameter value K representative in the A set product
A(first standard value).Then, referring to step 306, in the B set product, with K
ACarry out the contrast first time as standard, the wafer sort parameter value is parity with or superiority over K in the deletion B set product
AThe product of value, that is in this second rate of finished products group, filtering out by wafer sort project A (is that its wafer sort parameter value is better than K
A) batch number.Afterwards, step 307 judges whether lot number (first quantity) remaining in the B set product is zero, if zero, then stop analysis operation.If lot number is non-vanishing, then go to Fig. 4, it should be noted that herein when lot number is non-vanishing, represent these several remaining products in the B set product, the reason that its rate of finished products is low may be relevant with its wafer sort project A defective (fail).
Referring to step 401 among Fig. 4, to demonstrate the aforementioned product that remaining rate of finished products is low in the B set product and wafer sort project A defective when relevant as the result of Fig. 3, will carry out first search in an experience cumulative data storehouse, obtains relevant information available.According to experience in the past, when experienced engineer follows the trail of problem, can judge according to its experience: " when wafer sort project A is defective; may be relevant? " with which kind of reason, its answer may be: " should follow the trail of sample test project (sample test) some projects or should trace lines on the Quality Detection project some projects or can directly judge not relevant with which technological process station." hereat, this experience cumulative data storehouse is imported described system by experienced engineer with its experience, judges the direction of following the trail of the path automatically in order to a kind of computer to be provided.Certainly, this experience cumulative data storehouse also can be upgraded by computer self, thereby the experience that is obtained in the contingency question tracing process is stored so far in the experience cumulative data storehouse voluntarily.
In the step 402, when this experience cumulative data storehouse shows wafer test event A is relevant with a sample test event, then carry out step 403, this sample test project data with search A set product, similarly, carry out the statistical analysis operation, to obtain its representative sample test parameter value (second standard value can be a mean value) v
AThen, step 404 is with v
AValue is standard, carries out the contrast second time, and the sample test result of the product that B set product process step 306 back is remaining is parity with or superiority over v
AThe batch number deletion of value.Then, step 405 judges whether remaining batch number (second quantity) is zero, if zero, then stop analysis operation; If non-vanishingly then carry out step 406, its in experience cumulative data storehouse, carry out second search when the sample test project is defective the project that should follow the trail of.Should follow the trail of a technological process station not (step 408) if experience cumulative data storehouse shows, then go to the flow process of Fig. 5.Should follow the trail of Quality Detection project (step 407) on the line if experience cumulative data storehouse shows, then go to step 410.
Referring to shown in the step 409, after this step was searched for experience cumulative data storehouse through step 401, shows wafer test event A was relevant with Quality Detection project on the line.In step 410, quality test data on the line of search A set product, and carry out statistical analysis, obtain quality test parameter value on its representative line (the 3rd standard value can be a mean value) μ
AThen, in step 411, with μ
AValue is for standard, with the B set product through quality test data on the line of the remaining product in step 306 back be parity with or superiority over the batch number deletion.In step 412, judge whether remaining batch number (the 3rd quantity) is zero again.If zero, then stop analysis operation; If non-vanishing, then carry out step 413, so that in experience cumulative data storehouse, carry out the 3rd search when the quality test result does not meet the specification on the line, should follow the trail of which technological process station not (step 414), go to the flow process of Fig. 5 then.
Referring to step 415, after this step was searched for experience cumulative data storehouse through step 401, when shows wafer test event A was defective, the project that should follow the trail of was that a technological process station is other, and go to the flow process of Fig. 5 to carry out subsequent step this moment.
Please refer to Fig. 5, in step 501, which board it does not earlier all comprise in the tracked technological process station of search, E1 for example, E2, E3 ...Then, step 502 is calculated in the B set product, and through after the deletion action of step 306, step 404 or step 411, the product of surplus products lot number is through the probability of this other this board of technological process station.In addition, step 503 is then calculated the probability of A set product through this other this board of technological process station.Then, in step 504, utilize the intercommunity analytical method, find out through after the deletion action of step 306, step 404 or step 411, the product of the surplus products lot number of B set product is through the highest board of probability.The product of these B set product surplus products lot numbers of being tried to achieve by step 504 is through the highest board of probability, exactly the possible problematic board that is analyzed according to the wafer sort parameters analysis method of preferred embodiment of the present invention.
In addition, see also Fig. 6 to Figure 10, show flow chart among the figure according to the wafer sort parameters analysis method of the present invention's second preferred embodiment.As seen from Figure 6, identical with the flow process of Fig. 3 from step 601 to step 607, so repeat no more, wherein, when judging that as if step 607 lot number (first quantity) remaining in the B set product is non-vanishing, then go to Fig. 7.This second preferred embodiment system is in order to analyze another wafer sort project, for example method of wafer sort item B.
Referring to Fig. 7, step 701 search is through the product of residue lot number in the B set product after the deletion action of step 606, the multiple electrical test data of each tube core on each wafer in every batch of being searched for the to obtain product.In the present embodiment, some Electronic Testing project system does not test according to layer, therefore can obtain the Electronic Testing parameter value of each layer.Then, in step 702, the tube core that will not conform to test specification is defined as target tube core " a ", can obtain simultaneously the target tube core distribution map of every wafer, as shown in Figure 8, wherein, target tube core 81 is with " a " expression, and other tube core 82 is represented (promptly blank) with white; It should be noted that because of multiple Electronic Testing project and a plurality of layer being arranged not, so every wafer will have the mark tube core distribution map of opening one's eyes wide more, in other words, each of each wafer layer target tube core distribution map that all can have a correspondence.Then, step 703 is folded graphic operation with the target tube core distribution map (as shown in Figure 8) of every wafer with its wafer sort parameter value distribution map (as shown in Figure 2).
Referring to step 704, whether its overlapping ratio of judging the target tube core distribution map of every wafer and wafer sort parameter value distribution map greater than a default value (the 3rd standard value), and for example 30%.If not, this wafer do not mark (step 705) then; If then this wafer is labeled as aimed wafer " z " (step 706).Then, whether the quantity that step 707 is judged the aimed wafer that is comprised in every batch of product more than or equal to the certain proportion of its total sheet number, for example more than or equal to 50%, more than.If not, then carry out step 708 to delete this batch number; If then keep this batch number (step 709), and then go to the flow process of Fig. 9.
Referring to step 901 shown in Figure 9, it is other to carry out first search sample test project or the technological process station relevant with the wafer sort item B according to the wafer sort parameters analysis method of the present invention's second preferred embodiment system in experience cumulative data storehouse.In step 902, when this experience cumulative data storehouse shows wafer test event B is relevant with a sample test event, then carry out step 903.And step 903 can be searched for the sample test data of A set product, and carries out statistical analysis to obtain generation tabular value (second standard value), for example mean value v
AThen, in step 904, with mean value v
ABe standard, the sample test result who the B set product is passed through the batch number that is kept after the step 707 is parity with or superiority over v
AThe batch number deletion of value.In step 905, judge whether second quantity through residue lot number after the deletion action of step 904 is zero then.If zero, then stop analysis operation; If non-vanishing, then carry out step 906, to search for the relevant technological process station of sample test project therewith other so that carry out second in experience cumulative data storehouse.When experience cumulative data storehouse shows that this sample test project is not relevant with a technological process station (step 907), then go to flow process as shown in figure 10.
In addition, shown in step 909, when through step 901 and search experience cumulative data storehouse, demonstrate the wafer sort item B when not relevant, then go to flow process as shown in figure 10 with a technological process station.
Please refer to Figure 10, (step S01～S04) identical with step 501～504 of Fig. 5 is so locate to repeat no more for its analysis process.Therefore, according to the analysis process of Fig. 6, Fig. 7, Fig. 9 and Figure 10, can search out according to the wafer sort parameters analysis method of the present invention's second preferred embodiment may problematic board.
At last, please refer to Figure 11 and shown in Figure 12, it shows the wafer sort parameters analysis method according to the present invention's the 3rd preferred embodiment.
As shown in figure 11, wherein step S11～S17 is identical with step 301 shown in Figure 3～307, so locate to repeat no more.Then, in step S18, whether every batch of remaining product has defective (defect) behind the search process step S16; In the present embodiment, this search step system is searched at every wafer of every batch of product, if comprise the above wafer with defective of a slice in a collection of product, judges that then this batch product is the product with defective.If not, then stop to analyze; If, then carry out step S19, choose batch number with defective.Then, in step S20, find out the defect map of wafer with defective; It should be noted that a wafer may all have defective on different layers, this moment, this wafer can have the defect map more than.
Then, in step S21, the defect map that it utilizes the mode of folded figure to contrast to be found out by step S20 and the wafer sort parameter value distribution map of this wafer, and calculate the overlapping ratio of two distribution maps.Then, judge that in step S22 overlapping ratio whether more than or equal to a default value (the 5th standard value), for example is 50%, if not, then skip over this layer, when all slightly out-of-date the stopping of all layers analyzed; If then carry out step S26, and this layer be denoted as one first defect layer.
Simultaneously, referring to step S23, it calculates other defective number of every each layer of wafer.Again in step S24, the defective number that step S23 is calculated does not conform to the tube core number (dies) of wafer sort specification divided by this wafer, in the hope of a ratio.Then, in step S25, whether the ratio that determining step S24 is tried to achieve more than or equal to a default value (the 6th standard value), as more than or equal to 50%; If not, then skip over this layer of wafer; If then carry out step S26, and this layer be denoted as one second defect layer.
In step S26, it will be chosen through data such as the batch number after the above-mentioned steps analysis, the other data of layer and defective numbers, so that go to flow process shown in Figure 12 afterwards.
See also Figure 12, at step S31, according to step S26 chose the layer of Figure 12 not, in experience cumulative data storehouse search therewith layer not Xiang Guan the technological process station other, and after the search of step S32 demonstration through step S31, the project that should follow the trail of is that a technological process station is other.As shown in Figure 12, step S33～S36 is identical with step 501～504 flow processs of Fig. 5, so locate no longer repeated description.Therefore, by the analysis process of step S31 to step S36, can search out according to the wafer sort parameters analysis method of the present invention's second preferred embodiment may problematic board.
Simultaneously, according to the defective number that step S26 obtained of Figure 11, step S37 can carry out the statistical analysis operation as shown in figure 12, and it obtains the defective number control criterion that a typical value (the 4th standard value, or the 7th standard value) is used as this layer.Simultaneously, in step S38,, can in this other product of layer of follow-up making, predict the rate of finished products of this product according to the wafer sort parameters analysis method of preferred embodiment of the present invention according to this defective number control criterion.
In sum, owing to comply with wafer sort parameters analysis method of the present invention with statistical analysis and intercommunity analytical wafer sort supplemental characteristic, and then the problematic technological process station that judges rightly out is other, thereby find out problematic board, so can reduce the mistake of artificial judgement effectively, improve technological process efficient, reduce production cost, and in time improve on the line production situation to improve rate of finished products.
The above only is an illustrative, but not is restricted person.Anyly do not break away from spirit of the present invention and category, and, all should be contained in the appended claims scope its equivalent modifications of carrying out or change.
Claims (33)
1, a kind of wafer sort parameters analysis method, it is in order to analyze the many batches of products that have a lot number respectively, these many batches of products are obtained through a plurality of boards, and each wafer in the every batch of product is at least through the detection of a wafer sort project and produce a wafer sort parameter value, a Quality Detection project and a technological process station are not stored in the database on this wafer sort project and a sample test event relevant with this wafer sort project, the line, this database also stores this wafer sort parameter value, and described wafer sort parameters analysis method comprises:
Should be at least two product groups by many batches of product differentiations according to rate of finished products, this product group comprises one first rate of finished products group and one second rate of finished products group, and the rate of finished products value of the product that the first rate of finished products group is comprised is higher than the second rate of finished products group;
Wafer sort parameter value according to each batch product of this first rate of finished products group produces one first standard value in the statistical analysis mode;
Carry out contrasting for the first time wafer sort parameter value and this first standard value of each batch product of this second rate of finished products group, delete the lot number of this batch product that is parity with or superiority over this first standard value in the lot number with each batch product of this second rate of finished products group certainly;
After deletion action, judge whether one first quantity of the residue lot number of this second rate of finished products group is zero;
When this first quantity of the residue lot number of judging this second rate of finished products group is non-vanishing, carry out the following step:
Carry out first search in this database, search for one of them content of following content: Quality Detection project and this technological process station are other on this sample test project relevant with this wafer sort project, this line;
As the result of first search of this database when showing that this wafer sort project is relevant with this sample test project, the result according to the sample test project of each batch product of this first rate of finished products group produces one second standard value in the statistical analysis mode;
Carry out contrasting for the second time result and this second standard value of the sample test project of the product of residue lot number in this second rate of finished products group, delete the lot number of this batch product that is parity with or superiority over this second standard value in the residue lot number with this second rate of finished products group certainly;
After deletion action, judge whether one second quantity of the residue lot number of this second rate of finished products group is zero;
When this second quantity of the residue lot number of judging this second rate of finished products group is non-vanishing, carry out the following step:
Carry out second search in this database, search for one of them content of following content: Quality Detection project and this technological process station are other on this line relevant with this sample test project;
As result of this second search of this database when showing that this sample test project is relevant with quality test event on this line, the result according to quality test event on the line of each batch product of this first rate of finished products group produces one the 3rd standard value in the statistical analysis mode;
Contrast in this second rate of finished products group result and the 3rd standard value of quality test event on the line of product of residue lot number, delete the lot number of this batch product that is parity with or superiority over the 3rd standard value in the residue lot number with this second rate of finished products group certainly;
After deletion action, judge whether one the 3rd quantity of the residue lot number of this second rate of finished products group is zero;
When the 3rd quantity of the residue lot number of judging this second rate of finished products group is non-vanishing, carry out the following step:
In this database, carry out the 3rd search this technological process station relevant with quality test event on this line other wherein at least one stands other; As the result of the 3rd search of this database when showing that the quality test event is not relevant with this technological process station on this line, search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station;
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability; And
When the 3rd quantity of the residue lot number of judging this second rate of finished products group is zero, stop the 3rd search; And
When this second quantity of the residue lot number of judging this second rate of finished products group is zero, stop second search; And
When this first quantity of the residue lot number of judging this second rate of finished products group is zero, stop first search.
2, wafer sort parameters analysis method as claimed in claim 1, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
3, wafer sort parameters analysis method as claimed in claim 1, wherein when second result who searches for of this database showed that this wafer sort project is relevant with quality test event on this line, described wafer sort parameters analysis method further comprised:
Result according to quality test event on the line of each batch product of this first rate of finished products group produces one the 3rd standard value in the statistical analysis mode;
Contrast in this second rate of finished products group result and the 3rd standard value of quality test event on the line of product of residue lot number, delete the lot number of this batch product that is parity with or superiority over the 3rd standard value in the residue lot number with this second rate of finished products group certainly;
After deletion action, judge whether one the 3rd quantity of the residue lot number of this second rate of finished products group is zero;
When the 3rd quantity of the residue lot number of judging this second rate of finished products group was non-vanishing, it was other to carry out the 3rd search this technological process station relevant with quality test event on this line certainly in this database; And
When the 3rd quantity of the residue lot number of judging this second rate of finished products group is zero, stop the 3rd search operation.
4, wafer sort parameters analysis method as claimed in claim 3, wherein when the 3rd result who searches for of this database showed that the quality test event is not relevant with this technological process station on this line, described wafer sort parameters analysis method further comprised:
Search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station; And
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
5, wafer sort parameters analysis method as claimed in claim 4, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
6, wafer sort parameters analysis method as claimed in claim 1, wherein when first result who searches for of this database showed that this wafer sort project is not relevant with this technological process station, described wafer sort parameters analysis method further comprised:
Search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station; And
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
7, wafer sort parameters analysis method as claimed in claim 6, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
8, wafer sort parameters analysis method as claimed in claim 1, wherein when first quantity of the residue lot number of judging this second rate of finished products group was non-vanishing, described wafer sort parameters analysis method further comprised:
Whether the product of judging in this second rate of finished products group the residue lot number defectiveness;
When in judging this second rate of finished products group, remaining the product zero defect of lot number, stop search;
When in judging this second rate of finished products group, remaining the product defectiveness of lot number, obtain the lot number of product with defective;
In this batch product with defective, obtain on each wafer at defective place a plurality of layers not, wherein each layer do not have a defect map respectively;
Analysis has the wafer sort parameter value distribution map of each wafer of this batch product of defective;
Should be a plurality of other defect map of layer fold graphic operation with this wafer sort parameter value distribution map, with the overlapping ratio of foundation certainly these a plurality of layers to obtain at least one overlapping ratio destination layer high than one the 5th standard value in not other; And
It is other to carry out the 4th search technological process station not relevant with this destination layer in this database.
9, wafer sort parameters analysis method as claimed in claim 8, wherein when the 4th result who searches for of this database showed that this destination layer is not relevant with this technological process station, described wafer sort parameters analysis method further comprised:
Search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station; And
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
10, wafer sort parameters analysis method as claimed in claim 9, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
11, wafer sort parameters analysis method as claimed in claim 8 further comprises:
According to other defective number of this destination layer, produce the 4th standard value as other defective control criterion of this destination layer in the statistical analysis mode.
12, wafer sort parameters analysis method as claimed in claim 11 further comprises:
Predict in subsequent technique according to the 4th standard value, proceed to the rate of finished products of this other product of destination layer.
13, wafer sort parameters analysis method as claimed in claim 1, wherein when first quantity of the residue lot number of judging this second rate of finished products group was non-vanishing, described wafer sort parameters analysis method further comprised:
Whether the product of judging in this second rate of finished products group the residue lot number defectiveness;
When in judging this second rate of finished products group, remaining the product zero defect of lot number, stop search;
When in judging this second rate of finished products group, remaining the product defectiveness of lot number, obtain the lot number of product with defective;
In this batch product, obtain with defective on each wafer at defective place a plurality of layers not, wherein each layer do not have a defect map respectively;
Calculate the defective number that these a plurality of layers are not gone up;
Analysis has the wafer sort parameter value distribution map of each wafer of this batch product of defective;
Should be a plurality of other defect map of layer and this wafer sort parameter value distribution map fold graphic operation, to obtain its overlapping ratio;
Calculate the ratio of the tube core number that defective number that a plurality of layer of each wafer do not go up and wafer sort parameter value do not meet the specification respectively;
Judge that whether this overlapping ratio is more than or equal to one the 5th standard value;
When judging this overlapping ratio less than the 5th standard value, it is other to skip over this layer;
When judging this overlapping ratio, should not be denoted as one first defect layer by layer more than or equal to the 5th standard value;
Judge that whether this ratio is more than or equal to one the 6th standard value;
When judging this ratio less than the 6th standard value, it is other to skip over this layer;
When judging this ratio, should not be denoted as one second defect layer by layer more than or equal to the 6th standard value;
Carry out the 4th search and include one of them this batch product and the lot number thereof of wafer that has this first defect layer and this second defect layer at least; And
Search is other with one of them this relevant technological process station of this first defect layer and this second defect layer at least in this database.
14, wafer sort parameters analysis method as claimed in claim 13, wherein show that this first defect layer and this second defect layer are wherein at least one when not relevant with this technological process station as the result of the 4th search of this database, described wafer sort parameters analysis method further comprises:
Search for the board of this first rate of finished products group other process at this technological process station;
Search includes the board of one of them this batch product of wafer other the process at this technological process station that has this first defect layer and this second defect layer at least; And
Judge that include one of them this batch product of wafer that has this first defect layer and this second defect layer at least is higher than the board of this first rate of finished products group through probability through probability.
15, wafer sort parameters analysis method as claimed in claim 14, it is to utilize the intercommunity analytical method to judge to include one of them this batch product of wafer that has this first defect layer and this second defect layer at least to be higher than the board of this first rate of finished products group through probability through probability.
16, wafer sort parameters analysis method as claimed in claim 13 further comprises:
According to the defective number of one of them at least of this first defect layer and this second defect layer, produce the 7th standard value of the defective control criterion of one of them at least as this first defect layer and this second defect layer in the statistical analysis mode.
17, wafer sort parameters analysis method as claimed in claim 16 further comprises:
Predict in subsequent technique according to the 7th standard value, proceed to one of them the rate of finished products of this batch product of this first defect layer and this second defect layer.
18, a kind of wafer sort parameters analysis method, it is in order to analyze the many batches of products that have a lot number respectively, these many batches of products are obtained through a plurality of boards, and each wafer in the every batch of product at least through the detection of a wafer sort project to produce a wafer sort parameter value, each tube core that this wafer sort project comprises each wafer carries out multiple Electronic Testing, and the statistics that this wafer sort parameter value is this multiple Electronic Testing, this wafer sort project and a sample test event relevant with this wafer sort project, Quality Detection project and technological process station are not stored in the database on one line, this database also stores this wafer sort parameter value, and described wafer sort parameters analysis method comprises:
Should be at least two product groups by many batches of product differentiations according to rate of finished products, this product group comprises one first rate of finished products group and one second rate of finished products group;
Wafer sort parameter value according to each batch product of this first rate of finished products group produces one first standard value in the statistical analysis mode;
Contrast wafer sort parameter value and this first standard value of each batch product of this second rate of finished products group, be parity with or superiority over the lot number of this batch product of this first standard value with deletion in the lot number of each batch product of this second rate of finished products group certainly;
After deletion action, judge whether one first quantity of the residue lot number of this second rate of finished products group is zero;
When this first quantity of the residue lot number of judging this second rate of finished products group is non-vanishing, carry out the following step:
Search for this multiple Electronic Testing value of each tube core on each wafer in this second rate of finished products group,
Defining the tube core that does not conform with this multiple Electronic Testing specification on each wafer is the target tube core, and obtains a target tube core distribution map of each wafer,
This target tube core distribution map and this wafer sort parameter value distribution map of each wafer are folded graphic operation,
Overlapping ratio chosen greater than the wafer of one second standard value and be defined as an aimed wafer,
The number that comprises this aimed wafer in this second rate of finished products group is chosen greater than the lot number of the product of one the 3rd standard value,
Carry out first search in this database, search for one of them content of following content: this sample test project and this technological process station relevant with this wafer sort project are other,
When this first quantity of the residue lot number of judging this second rate of finished products group is zero, stop analysis operation.
19, wafer sort parameters analysis method as claimed in claim 18, wherein when the result of the search operation of this database showed that this wafer sort project is relevant with this sample test project, described wafer sort parameters analysis method further comprised:
Result according to the sample test project of each batch product of this first rate of finished products group produces one second standard value in the statistical analysis mode;
Contrast in this second rate of finished products group result and this second standard value of sample test project of the product of residue lot number, delete the lot number of this batch product that is parity with or superiority over this second standard value in the residue lot number with this second rate of finished products group certainly;
After deletion action, judge whether one second quantity of the residue lot number of this second rate of finished products group is zero;
When this second quantity of the residue lot number of judging this second rate of finished products group was non-vanishing, it was other to carry out second search this technological process station relevant with this sample test project certainly in this database.
20, wafer sort parameters analysis method as claimed in claim 19, wherein when the result of the search operation of this database showed that this sample test project is not relevant with this technological process station, described wafer sort parameters analysis method further comprised:
Search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station; And
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
21, wafer sort parameters analysis method as claimed in claim 20, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
22, wafer sort parameters analysis method as claimed in claim 18, wherein when the result of the search operation of this database showed that this wafer sort project is not relevant with this technological process station, described wafer sort parameters analysis method further comprised:
Search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station; And
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
23, wafer sort parameters analysis method as claimed in claim 22, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
24, wafer sort parameters analysis method as claimed in claim 18, wherein when this first quantity of the residue lot number of judging this second rate of finished products group was non-vanishing, described wafer sort parameters analysis method further comprised:
Whether the product of judging in this second rate of finished products group the residue lot number defectiveness;
When remaining the product zero defect of lot number in this second rate of finished products group of search, operation stops search;
When in judging this second rate of finished products group, remaining the product defectiveness of lot number, obtain the lot number of product with defective;
In this batch product, obtain with defective on each wafer at defective place a plurality of layers not, wherein each layer do not have a defect map respectively;
Analysis has the wafer sort parameter value distribution map of each wafer of this batch product of defective;
Should be a plurality of other defect map of layer fold graphic operation with this wafer sort parameter value distribution map, with the overlapping ratio of foundation certainly these a plurality of layers to obtain at least one overlapping ratio destination layer high than the 5th standard value in not other; And
It is other to carry out second search technological process station not relevant with this destination layer in this database.
25, wafer sort parameters analysis method as claimed in claim 24, wherein when the result of the search operation of this database showed that this destination layer is not relevant with this technological process station, described wafer sort parameters analysis method further comprised:
Search for the board of this first rate of finished products group other process at this technological process station;
The board of the product of searching in this second rate of finished products group the residue lot number other process at this technological process station; And
The product of judging residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
26, wafer sort parameters analysis method as claimed in claim 25, it is to utilize the intercommunity analytical method to judge that the product of residue lot number in this second rate of finished products group is higher than the board of this first rate of finished products group through probability through probability.
27, wafer sort parameters analysis method as claimed in claim 24 further comprises:
According to other defective number of this destination layer, produce the 4th standard value as other defective control criterion of this destination layer in the statistical analysis mode.
28, wafer sort parameters analysis method as claimed in claim 27 further comprises:
In subsequent technique, proceed to the rate of finished products of this other product of destination layer according to the prediction of the 4th standard value.
29, wafer sort parameters analysis method as claimed in claim 18, wherein when the quantity of the residue lot number of judging this second rate of finished products group was non-vanishing, described wafer sort parameters analysis method further comprised:
Whether the product of judging in this second rate of finished products group the residue lot number defectiveness;
When remaining the product zero defect of lot number in this second rate of finished products group of search, operation stops search;
When in judging this second rate of finished products group, remaining the product defectiveness of lot number, obtain the lot number of product with defective;
In this batch product, obtain with defective on each wafer at defective place a plurality of layers not, wherein each layer do not have a defect map respectively;
Calculate the defective number that these a plurality of layers are not gone up;
Analysis has the wafer sort parameter value distribution map of each wafer of this batch product of defective;
Should be a plurality of other defect map of layer and this wafer sort parameter value distribution map fold graphic operation, to obtain its overlapping ratio;
Calculate the ratio of the tube core number that defective number that a plurality of layer of each wafer do not go up and wafer sort parameter value do not meet the specification respectively;
Judge that whether this overlapping ratio is more than or equal to one the 5th standard value;
When judging this overlapping ratio less than the 5th standard value, it is other to skip over this layer;
When judging this overlapping ratio, should not be denoted as one first defect layer by layer more than or equal to the 5th standard value;
Judge that whether this ratio is more than or equal to one the 6th standard value;
When judging this ratio less than the 6th standard value, it is other to skip over this layer;
When judging this ratio, should not be denoted as one second defect layer by layer more than or equal to the 6th standard value;
Search includes and has one of them this batch product and the lot number thereof of wafer of this first defect layer and this second defect layer at least; And
Search is other with one of them this relevant technological process station of this first defect layer and this second defect layer at least in this database.
30, wafer sort parameters analysis method as claimed in claim 29, wherein when the result of the search operation of this database show this first defect layer and this second defect layer one of them is not relevant with this technological process station at least the time, described wafer sort parameters analysis method further comprises:
Search for the board of this first rate of finished products group other process at this technological process station;
Search includes the board of one of them this batch product of wafer other the process at this technological process station that has this first defect layer and this second defect layer at least; And
Judge that include one of them this batch product of wafer that has this first defect layer and this second defect layer at least is higher than the board of this first rate of finished products group through probability through probability.
31, wafer sort parameters analysis method as claimed in claim 30, it is to utilize the intercommunity analytical method to judge to include one of them this batch product of wafer that has this first defect layer and this second defect layer at least to be higher than the board of this first rate of finished products group through probability through probability.
32, wafer sort parameters analysis method as claimed in claim 29 further comprises:
According to the defective number of one of them at least of this first defect layer and this second defect layer, produce the 7th standard value of the defective control criterion of one of them at least as this first defect layer and this second defect layer in the statistical analysis mode.
33, wafer sort parameters analysis method as claimed in claim 32 further comprises:
In subsequent technique, proceed to one of them the rate of finished products of this batch product of this first defect layer and this second defect layer according to the 7th standard value prediction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02158152 CN1298035C (en) | 2002-12-23 | 2002-12-23 | Water testing parameter analytical method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02158152 CN1298035C (en) | 2002-12-23 | 2002-12-23 | Water testing parameter analytical method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1510729A CN1510729A (en) | 2004-07-07 |
| CN1298035C true CN1298035C (en) | 2007-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02158152 Expired - Fee Related CN1298035C (en) | 2002-12-23 | 2002-12-23 | Water testing parameter analytical method |
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| Country | Link |
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| CN (1) | CN1298035C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100395878C (en) * | 2005-09-29 | 2008-06-18 | 中芯国际集成电路制造(上海)有限公司 | Method and system for semiconductor device reliability similarity |
| CN102024672B (en) * | 2009-09-22 | 2012-06-20 | 中芯国际集成电路制造(上海)有限公司 | Method for analyzing reference yield value of semiconductor products |
| CN102117730B (en) * | 2009-12-31 | 2012-10-31 | 中芯国际集成电路制造(上海)有限公司 | Method for processing parameter data of machine station in manufacturing process of semiconductor and device thereof |
| CN102842654B (en) * | 2012-08-24 | 2015-08-12 | 四川汉能光伏有限公司 | A kind of amorphous silicon thin-film solar cell low-power chip analysis processing method |
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| CN1510729A (en) | 2004-07-07 |
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