CN1288627C - Stripping method for slug - Google Patents
Stripping method for slug Download PDFInfo
- Publication number
- CN1288627C CN1288627C CN 200410071362 CN200410071362A CN1288627C CN 1288627 C CN1288627 C CN 1288627C CN 200410071362 CN200410071362 CN 200410071362 CN 200410071362 A CN200410071362 A CN 200410071362A CN 1288627 C CN1288627 C CN 1288627C
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- CN
- China
- Prior art keywords
- slide block
- flexible carrier
- bonding agent
- thermmohardening
- stripping means
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- Expired - Fee Related
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- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
Abstract
To provide a slider stripping method by which a slider can be stripped easily from a flexure in a state in which thermosetting an adhesive is adhered to a slider side. In a magnetic head assembly including: a slider 11 having an electric/magnetic converting element 13 integrated with the slider; and a flexible flexure 21 to which the slider is adhered by thermosetting adhesive 15, 16, when a property of the slider 11 is defective, the thermosetting adhesive 15, 16 are heated from the flexure 21 side while cooled from the slider 11 side in advance, then the slider 11 is stripped from the flexure 21. Thereby, adhesion of the thermosetting adhesive 15, 16 and the flexure 21 is released, and the thermosetting adhesive 15, 16 are stripped from the flexure together with the slider 11. (C)2005,JPO&NCIPI.
Description
Technical field
The present invention relates in head stack the slide block stripping means of when the bad characteristic of slide block, carrying out for parts are utilized again.
Background technology
The so-called head stack that hard disk drive (HDD) uses, such as shown in Figure 7, possess such as be fixed on by spot welding carry on the beam 203, by having the flexible carrier 202 that flexible sheet metal constitutes, leading section at this flexible carrier 202, connecting the slide block 201 that is formed with magneto-resistance effect element, by the elastic force that carries beam 203, with the hydrokinetic balance that between the hard disk drive of the slide block 201 and the rotation of rotating, produces, keep ABS (the Air Bearing Surface) face of slide block 201 and the interval between the hard disc.On the surface of flexible carrier 202, the flexible printed circuit board 204 (Fig. 8) of the Circuits System of the device that connects slide block 201 (electromagnetic transformation element) and this head stack is installed is installed.
This head stack is at the dynamic characteristic check of row that advances that dispatches from the factory.Dynamic characteristic check is to be installed on the universal stage with the state that connects this slide block 201 on the flexible carrier 2021 that is fixed on year beam 203, and the inspection of carrying out under the state that makes the hard disc rotation.This dynamic characteristic check is final inspection, does not just think unacceptable product if therefore do not satisfy the benchmark of characteristic.At this moment, will think that the bad head stack of dynamic perfromance all scraps, yield rate is reduced, this is that we are undesirable.Therefore,, when bad reason is slide block 201, slide block is peeled off from flexible carrier 202, a flexible carrier 202 and a year beam 203 can also utilize again in the past.Fixedly slide block 201 generally adopts the thermosetting bonding agent with the bonding agent of flexible carrier 202.If peel off slide block 201 from being fixed in the flexible carrier 202 that carries the state on the beam 203, because it is extremely thin and fragile that flexible carrier 202 is compared with a year beam 203, be easy to generate distortion, and, worry that also the flexible printed circuit board in the mounted on surface of flexible carrier 202 can be stripped from down with slide block 201, therefore, such as, hope weakens the intensity of described thermosetting bonding agent by heating, and slide block 201 is stripped down from flexible carrier 201.
But, above-mentioned method in the past, opposite with the hope that slide block 201 and thermmohardening bonding agent are peeled off together sometimes, the thermmohardening bonding agent can remain in flexible carrier 202 1 sides (with reference to Fig. 8).If the thermmohardening bonding agent on flexible carrier 202 sides residual a certain amount of more than, with regard to new (substitute) slide block of bad loading, also just be difficult to utilize again flexible carrier 202 and carry beam 203.Therefore, just require to remove the stripping process of the thermmohardening bonding agent on the flexible carrier 202, but in stripping process,, just worry therefore and can damage by the generation secondary that this also is that we are undesirable because use solvent etc. are removed the thermmohardening bonding agent forcibly.
Summary of the invention
The present invention, in view of above-mentioned problem in the past, it is a kind of under with the state of thermmohardening bonding agent attached to the slide block side that its purpose is to provide, the slide block stripping means that can easily slide block be peeled off from flexible carrier.
The present invention, be conceived to: be clipped in the thermmohardening bonding agent between slide block and the flexible carrier, if to compare the slide block side bonding more strongly with the flexible carrier side, then when when flexible carrier is peeled off slide block, the thermmohardening bonding agent is attached to the slide block side and the situation of being stripped from this slide block easily.
Just, slide block stripping means of the present invention, be in being provided with the slide block and head stack that one possesses electromagnetic transformation element with the flexible carrier of the flexibility of bonding this slide block of thermmohardening bonding agent, when described slide block bad characteristic, the method that this slide block is peeled off from described flexible carrier, it is characterized in that:, have the operation of cooling off from described slide block side when described thermmohardening bonding agent heated from described flexible carrier side when when described flexible carrier is peeled off described slide block.
Adopt this mode, the thermmohardening bonding agent in the damage that the slide block side can not be heated, has only the damage that the flexible carrier side heated and becomes fragile.That is, the slide block side becomes big than the bonding strength of flexible carrier.So, when when flexible carrier is peeled off slide block, the bonding disengaging between thermmohardening bonding agent and the flexible carrier, the thermmohardening bonding agent is stripped from slide block.Its result does not almost have residual heat sclerosis bonding agent having peeled off on the flexible carrier behind the slide block, therefore the resin that does not need to remove the thermmohardening bonding agent forcibly with solvent is removed operation, perhaps can reduce the process number that resin is removed operation.And, if after the bonding strength reduction with the flexible carrier side of thermmohardening bonding agent in advance, can suppress to be applied to the stress on the flexible carrier, therefore can not make flexible carrier produce distortion.So, in the slide block dynamic perfromance is checked,, peel off slide block in above-mentioned mode even be judged to be badly, can also utilize flexible carrier (comprise flexible printed circuit board and carry a beam) again, thereby improve yield rate.
Described thermmohardening bonding agent uses to be the bonding agent of cancellated resin material as main body by heating.As the resin of this main body, such as being epoxies, phenol, ammonia ester class etc., surpass its hardening temperature, it is well-known that the transition heating can make bonding strength weaken.And, as the thermmohardening bonding agent, also can adopt bonding agent with thermmohardening and two kinds of character of UV (ultraviolet ray) sclerosis.Bonding agent with two kinds of character of thermmohardening and UV sclerosis, be to have optical polymerism, and have present by heating cancellated character based on pre-polymerization zoarium or oligomer, such as using epoxy acrylate, phenol acrylate, unsaturated polyester (UP) etc.
The cooling of slide block side is actually and carries out providing cold wind more than 0 ℃ to described slide block.Here, the temperature limit of cold wind being decided to be more than 0 ℃, is to produce dewfall near not making slide block and slide block.Dewfall can make the electronic unit, the wiring that are provided with near slide block and the slide block produce corrosion and fault.Be limited to 20 ℃ on the cold wind temperature.
Cold wind to described slide block provides preferably takes place with vortex tube.Because the overburden operation of slide block normally carries out by hand, so small-sized, the light-duty cooling device as vortex tube, its operability and convenience are all fine.In addition, if adopt general cooling device,,, also be unpractical because cooling device is too big for slide block as the cooling object.
Preferably: described flexible carrier side is heated with the high temperature higher than the hardening temperature of described thermmohardening bonding agent.
On the surface of described flexible carrier, in fact the flexible printed circuit board that is electrically connected with described electromagnetic transformation element is installed.So, must described flexible carrier side be heated with the temperature that does not make installation portion flexible printed circuit board deterioration.Just, preferred: as, and the flexible carrier side to be heated than the low temperature of temperature that can make flexible printed circuit board generation deterioration with higher than the hardening temperature of this thermmohardening bonding agent.Particularly, heating-up temperature is 150 ℃～180 ℃ Celsius.After surpassing 180 ℃ Celsius, can be damaged owing to heating.To the heating of flexible carrier, such as adopting well heater.
In the described thermmohardening bonding agent, in fact comprise the thermmohardening bonding agent of the electric conductivity that described slide block is electrically connected with described flexible carrier.
Description of drawings
Fig. 1 is the vertical view of expression as embodiment objective for implementation, head stack (completion status) of slide block stripping means of the present invention.
Fig. 2 is the amplification plan view of the slide block periphery of presentation graphs 1.
Fig. 3 is the summary stereographic map of an embodiment that use, testing fixture in the dynamic chek of expression head stack.
Fig. 4 is the pattern cut-open view of an operation of expression slide block stripping means of the present invention.
Fig. 5 is the pattern cut-open view of the subsequent processing of expression operation shown in Figure 4.
Fig. 6 is the mode chart of the subsequent processing of expression operation shown in Figure 5.
Fig. 7 is a stereographic map of representing head stack in the past.
Fig. 8 represents that in the past stripping means peels off the pattern cut-open view of the situation of slide block.
Among the figure: 1-head stack, 11-slide block, 13-electromagnetic transformation element (magnetic head), the 15-first thermmohardening bonding agent, the 16-second thermmohardening bonding agent, 21-flexible carrier, 22,23-flexible printed circuit board (DPC), 22a, 23a, 22b, 23b-portion of terminal, 24-relaying flexible printed circuit board, 25-metal ball bonding (GBB), 26-flexible carrier briquetting, 31-carries beam, the 40-well heater, the 50-vortex tube, the 100-testing fixture.
Embodiment
Fig. 1 is the vertical view of expression as embodiment applicable object, hard disk drive usefulness head stack (completion status) of slide block stripping means of the present invention.Head stack 1 possesses: group has been gone into the slide block 11 of electromagnetic transformation element (magnetic head) 13, with the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 (flexible carrier 21 at the back side of bonding this slide block 11 of Fig. 2, Fig. 4～Fig. 6).
The first thermmohardening bonding agent 15 will be cancellated resin material by heating as material of main part, become the resin of this main body, such as being epoxy resin, phenol, ammonia ester class etc.This first thermmohardening bonding agent 15 also can have two character of thermmohardening and UV (ultraviolet ray) sclerosis.Bonding agent with two kinds of character of thermmohardening and UV sclerosis, has optical polymerism, and be to be main body, such as using epoxy acrylate, phenol acrylate, unsaturated polyester (UP) etc. with having the performed polymer that is cancellated character through heating or oligomer.The hardening temperature of the first thermmohardening bonding agent 15 of Shi Yonging is about 120 ℃ in the present embodiment.
The second thermmohardening bonding agent 16 is thermmohardening bonding agents of the electric conductivity that slide block 11 can be electrically connected with flexible carrier 21.This second thermmohardening bonding agent 16 forms such as conductive materials such as sneaking into Au, Ag, Cu having in the same thermosetting adhesive resin material with the described first thermmohardening bonding agent 15.The hardening temperature of the second thermmohardening bonding agent 16 of Shi Yonging is about 120 ℃ in the present embodiment.
Flexible printed circuit board 22,23, shown in Fig. 2 amplifies, separately extend along both sides of the edge portion the back to both sides of the edge portion from portion of terminal 22a, 22b, 23a, the 23b of the leading section that is configured in flexible carrier 21, further draw from the back edge portion of flexible carrier 21, be situated between and converge into one with flexible printed circuit board 24 by relaying.On the control circuit (electronic unit) of the hard disk assembly that loads head stack 1, connect relaying each terminal with the end of flexible printed circuit board 24.Slide block 11 is bonded on each portion of terminal 22a, 22b, 23a, the 23b of flexible printed circuit board 22,23 by metal ball bonding (GBB) 25.
Then, the dynamic perfromance of head stack 1 is checked that operation describes.
The dynamic perfromance inspection of head stack 1 is that the head stack 1 that will be installed to flexible carrier 21 carries the completion status of beam 31 is installed on the inspection machine of universal stage etc. and implements.The result that dynamic perfromance is checked, 1 of the head stack that is judged to be good product becomes product.
Fig. 3 is the embodiment of the testing fixture during the expression dynamic perfromance is checked.Testing fixture 100 is to being used for recorded information on magnetic recording medium (to call disk in the following text) 103 in plate-like, or the magnetic head of the information of this disk 103 of regenerating, so that disk 103 rotations and come-up state thereon, carries out the device of characteristic check.This testing fixture 100, as represent the shown in Figure 3 of its main position, have: rotation drives the arm 105 of Spindle Motor 101, the fixed head assembly of disk 103, as motor 107, motion changing mechanism portion 109 and the roller platform 111 that intersects of the driver of accurate transfer arm.In addition, these parts are installed in does not have on the illustrated underframe.
As mentioned above, be installed at head stack under the state of testing fixture 100, by this testing fixture 100, with slide block 11 be driven into disk 103 decide magnetic track, by writing/read in portion 131, control 11 pairs of magnetic heads of slide block writing/reading in to disk 103.And then the signal that reads in from the magnetic head by slide block 11 in analysis unit 132 is resolved the characteristic of slide block 1 grade, at least also can with whether satisfy the analysis result of fixed characteristic be shown to as a result on the display part 133 as check result.In addition, display result not only also can record on the recording medium or prints.
The check result of this testing fixture if judge when slide block 11 is bad, is peeled off slide block 11 and discarded from flexible carrier 21, with flexible carrier 21 and carry beam 31 and utilize as utilization product more again.
Below, an embodiment of the stripping means of the slide block 11 of characteristic of the present invention is described.
At first, as shown in Figure 4, in the rear end side of slide block 11, by flexible carrier briquetting 26 fixing flexible framves 21.On flexible carrier briquetting 26, apply the heavy burden of the appropriateness that is used for fixing flexible carrier 21.
Then, in metal ball bonding (GBB) 25,, the metal ball bonding (GBB) and the bonding strength of flexible printed circuit board 22,23 are weakened such as forming otch etc.
When then, heating, from first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 of slide block 11 sides cooling between slide block 11 and flexible carrier 21 from flexible carrier 21 sides.More particularly, as shown in Figure 5, from rear side heating flexible carrier 21, provide cold wind to cool off slide block 11 with turbine pipe (ultra-low temperature air generator) 50 with well heater 40.Heating-up temperature is than the high temperature of the hardening temperature of the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 (present embodiment is 120 ℃), it is low to can be compared to most the fail temperature that makes the resin material (such as polyamide) that constitutes flexible printed circuit board 22,23 that deterioration take place, and is about 150 ℃～180 ℃ in the present embodiment.And if surpass 180 ℃, the damage that flexible carrier 21 can be heated, and generation deterioration.Chilling temperature (the cold wind temperature of supplying with from vortex tube 50) is set at 0 ℃～20 ℃ in order not only to prevent on limited slip block 11 or the flexible carrier 21 dewfall but also can to cool off efficiently.In the present embodiment, because the scope of heating and cooling (near the areal extent the slide block 11) is 1mm
2About, very narrow, and slide block 11 be by the y thermal conductance electrically well the compound substance of aluminium oxide-titanium carbide forms, heat and cool time with several seconds for well.In addition, well heater 40 and vortex tube 50 can use general known device, therefore omit its explanation.
The first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 be in the damage that slide block 11 sides can not heated owing to this heating and cooling operation, has only flexible carrier 21 sides (flexible printed circuit board 22,23 sides on the flexible carrier 21) because heating is damaged becomes fragile.So the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 are weakened with the bonding of flexible carrier 21, become big compared with the bonding strength of its slide block 11 sides of flexible carrier 21 sides in the good bonding of keeping with slide block 11.
After having carried out described heating and refrigerating work procedure, as shown in Figure 6, the side 11a of clamping slide block 11 also makes it to stand up, and applies impulsive force and draws back slide block 11 to the graphic direction of arrow.So the bonding of the flexible carrier 21 and the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 breaks away from respectively, slide block 11 is peeled off from flexible carrier 21 with the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16.Its result hardly can the residual first thermmohardening bonding agent 15 on flexible carrier 21, the second thermmohardening bonding agent 16.And in the present embodiment, the bonding strength of metal ball bonding 25 owing to weakened in advance with flexible carrier 21, therefore also easily metal ball bonding 25 is peeled off from flexible carrier 21 with slide block 11, can the metal ball bonding 25 more than the residual necessary amount on flexible carrier 21 and flexible printed circuit board 22,23.
In above present embodiment, when slide block 11 is peeled off from flexible carrier 21, when heating the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 from flexible carrier 21 sides, cool off from slide block 11 sides, therefore, the bonding strength of the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 becomes big in slide block 11 sides than flexible carrier 21 and flexible printed circuit board 22,23 sides.So the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 become easily and slide block 11 one are peeled off, hardly can the residual first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 on the flexible carrier 21 after having peeled off slide block 11.And after the bonding strength of flexible carrier 21 sides of the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 was weakened in advance, owing to the stress that can suppress to apply to flexible carrier 21, so flexible carrier 21 can not be out of shape yet.So, in the dynamic perfromance of slide block 11 is checked,, peel off slide block 11 even be judged as when bad, can also and carry a beam 31 to flexible carrier 21 (comprising flexible printed circuit board 22,23) and utilize again, thereby improve yield rate.
And if do not have the residual first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 on flexible carrier 21, also the resin that does not just need to remove the first thermmohardening bonding agent 15 and the second thermmohardening bonding agent 16 forcibly with solvent is removed operation.Perhaps can reduce the process number that resin is removed operation.Thus, damage such as avoiding removing the secondary that operation causes by the resin that described solvent such as is damaged at flexible carrier 21 or flexible printed circuit board 22,23.In addition, Fig. 8 has represented not cool off slide block 201 sides and has only heated flexible carrier 202 sides, comes to peel off flexible carrier surface behind the slide block 201 from flexible carrier 202.At this moment, on flexible carrier 201 residual thermmohardening bonding agent more than the necessary amount (the profile line part of Fig. 8), this flexible printed circuit board 204 and flexible carrier 202 can not utilize again so, perhaps also must carry out above-mentioned resin and remove operation.
In the present embodiment, slide block 11 and flexible printed circuit board 22,23 are joined together, but slide block 11 and flexible printed circuit board 22,23 also can be joined together by the electroconductive resin bonding agent the same with the second thermmohardening bonding agent 16 by metal ball bonding 25.
More than, describe the present invention with reference to the embodiment of accompanying drawing, but can exceeding the restriction of this scope, the present invention changes, be not subjected to the qualification of graphic embodiment.
Adopt slide block stripping means of the present invention, when slide block is peeled off from flexible carrier, when the thermmohardening bonding agent of bonding slide block and flexible carrier being heated from the flexible carrier side, cool off from the slide block side, therefore, the bonding of thermmohardening bonding agent and flexible carrier weakened, and the bonding strength of thermmohardening bonding agent becomes big in the slide block side than flexible carrier side.Its result with the state of thermmohardening bonding agent attached to the slide block side, can easily peel off slide block from flexible carrier, make flexible carrier (comprising flexible printed circuit board) and carry beam to utilize again.
Claims (8)
1. slide block stripping means, be in being provided with the slide block and head stack that one possesses electromagnetic transformation element with the flexible carrier of the flexibility of bonding this slide block of thermmohardening bonding agent, when described slide block bad characteristic, the method with this slide block is peeled off from described flexible carrier is characterized in that:
When described flexible carrier is peeled off described slide block, have the operation of cooling off from described slide block side when described thermmohardening bonding agent heated from described flexible carrier side, and heat from described flexible carrier side and to utilize well heater to carry out.
2. slide block stripping means as claimed in claim 1 is characterized in that: described thermmohardening bonding agent is to be the bonding agent of cancellated resin material by heating.
3. slide block stripping means as claimed in claim 1 is characterized in that: to the cold wind of described slide block supply more than 0 ℃.
4. slide block stripping means as claimed in claim 3 is characterized in that: to the cold wind that described slide block is supplied with, utilize vortex tube to produce.
5. slide block stripping means as claimed in claim 1 is characterized in that: with the high temperature higher than the hardening temperature of described thermmohardening bonding agent described flexible carrier side is heated.
6. slide block stripping means as claimed in claim 5, it is characterized in that: on the surperficial part of described flexible carrier, the flexible printed circuit board that bonding and described electromagnetic transformation element is electrically connected heats described flexible carrier side with the low temperature lower than the temperature that can make this flexible printed circuit board deterioration.
7. slide block stripping means as claimed in claim 6 is characterized in that: the hardening temperature of described thermmohardening bonding agent is more than 150 ℃ below 180 ℃.
8. slide block stripping means as claimed in claim 6 is characterized in that: in described thermmohardening bonding agent, contain the thermmohardening bonding agent of the electric conductivity that described slide block is electrically connected with described flexible carrier.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003200255A JP3805760B2 (en) | 2003-07-23 | 2003-07-23 | Slider peeling method |
| JP2003200255 | 2003-07-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1577491A CN1577491A (en) | 2005-02-09 |
| CN1288627C true CN1288627C (en) | 2006-12-06 |
Family
ID=34260720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410071362 Expired - Fee Related CN1288627C (en) | 2003-07-23 | 2004-07-20 | Stripping method for slug |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3805760B2 (en) |
| CN (1) | CN1288627C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5249639B2 (en) | 2008-06-09 | 2013-07-31 | 日本発條株式会社 | Head suspension regeneration method and manufacturing method, and workpiece regeneration method |
| JP5922484B2 (en) * | 2012-05-07 | 2016-05-24 | 日本発條株式会社 | How to remove the slider |
| JP6903486B2 (en) | 2017-05-12 | 2021-07-14 | 日本発條株式会社 | How to regenerate the suspension |
-
2003
- 2003-07-23 JP JP2003200255A patent/JP3805760B2/en not_active Expired - Fee Related
-
2004
- 2004-07-20 CN CN 200410071362 patent/CN1288627C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1577491A (en) | 2005-02-09 |
| JP3805760B2 (en) | 2006-08-09 |
| JP2005044399A (en) | 2005-02-17 |
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Owner name: TDK CORP. Free format text: FORMER OWNER: ALPS ELECTRIC CO., LTD. Effective date: 20080125 |
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Effective date of registration: 20080125 Address after: Tokyo, Japan, Japan Patentee after: TDK Corp. Address before: Tokyo, Japan, Japan Patentee before: Alps Electric Co., Ltd. |
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| CF01 | Termination of patent right due to non-payment of annual fee |