US20050280940A1 - System and method for improving suspension-to-slider attachment in a hard disk drive - Google Patents

System and method for improving suspension-to-slider attachment in a hard disk drive Download PDF

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Publication number
US20050280940A1
US20050280940A1 US11/212,375 US21237505A US2005280940A1 US 20050280940 A1 US20050280940 A1 US 20050280940A1 US 21237505 A US21237505 A US 21237505A US 2005280940 A1 US2005280940 A1 US 2005280940A1
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Prior art keywords
slider
suspension
bond pads
pads
trailing
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US11/212,375
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Takehiro Kamigama
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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4853—Constructional details of the electrical connection between head and arm
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09081—Tongue or tail integrated in planar structure, e.g. obtained by cutting from the planar structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49025—Making disc drive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49027—Mounting preformed head/core onto other structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49027—Mounting preformed head/core onto other structure
    • Y10T29/4903—Mounting preformed head/core onto other structure with bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49021—Magnetic recording reproducing transducer [e.g., tape head, core, etc.]
    • Y10T29/49032—Fabricating head structure or component thereof
    • Y10T29/49036—Fabricating head structure or component thereof including measuring or testing
    • Y10T29/49041—Fabricating head structure or component thereof including measuring or testing with significant slider/housing shaping or treating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53165—Magnetic memory device

Definitions

  • the present invention relates to hard disk drives. More specifically, the invention relates to a system and method for improving slider attachment.
  • FIG. 1 graphically illustrates a typical head-gimbal assembly (HGA) of a hard disk drive with disk media as used in the art.
  • Hard disk drive storage devices typically include a rotating disk 9 containing concentric data tracks in which data is read from and written to by a slider 1 (containing a transducer head, not shown).
  • the slider 1 which ‘flies’ close to the surface of the rotating disk 9 , is typically attached to a load beam 8 by a suspension flexure 6 .
  • the slider (head) 1 is mounted to the flexure 6 by epoxy bonding 5 (See FIG. 2 ).
  • the suspension flexure 6 allows the slider 1 to pitch and roll with respect to the disk 9 while the load beam 8 provides loading force (by spring action) towards the disk 9 during flight (countering the slider's lift).
  • the load beam 8 provides resilient spring action, which biases the slider towards the surface of the disk 9 , while the flexure 6 provides pitch and roll flexibility for the slider as the slider rides on a cushion of air between the air bearing surface (slider 1 surface) and the rotating disk 9 .
  • FIG. 2 provides a perspective view of a typical slider-suspension flexure assembly as used in the art.
  • the slider 1 is epoxy-bonded to the suspension flexure 6 , and the head's 1 transducer leads are electrically coupled to leads formed on the suspension flexure 6 .
  • the electrical connections 3 between the slider pads 2 and the flexure trace pads 4 are typically created by gold ball, solder ball, or solder bump bonding. The fabrication of such a slider suspension assembly is time consuming and costly.
  • FIG. 3 illustrates the attachment of a slider to a suspension flexure as typically performed in the art.
  • a predetermined amount of epoxy 5 is placed on the tongue portion of the suspension flexure 6 where the slider 1 is to be located.
  • the slider 1 is subsequently positioned onto the suspension flexure 6 with an alignment device, such as a vacuum tube 21 .
  • an alignment device such as a vacuum tube 21 .
  • the epoxy hardens to a degree, e.g. by ultra-violet (UV) light
  • electrical connections such as by gold/solder ball or solder bump bonding
  • the epoxy 5 is then further hardened by a method such as oven baking.
  • FIG. 4 provides a graphical illustration of a slider mounted upon a suspension flexure as is typical in the art.
  • One problem involves the residual welding stress caused by the hardened epoxy 5 and soldered bump/gold ball 3 bonding.
  • FIG. 5 illustrates a slider mounted askew with respect to a suspension flexure as is common in the art.
  • the pitch 22 attitude angle of the slider 1 may seriously degrade while the epoxy 5 is curing.
  • FIG. 1 illustrates a typical head-gimbal assembly (HGA) as used in the art.
  • HGA head-gimbal assembly
  • FIG. 2 provides a perspective view of a typical slider-suspension flexure assembly as used in the art.
  • FIG. 3 illustrates the attachment of a slider to a suspension flexure as typically performed in the art.
  • FIG. 4 provides a graphical illustration of a slider mounted upon a suspension flexure as is typical in the art.
  • FIG. 5 illustrates a slider mounted askew with respect to a suspension flexure as is common in the art.
  • FIG. 6 illustrates the attachment of slider to suspension according to an embodiment of the present invention.
  • FIG. 7 illustrates a suspension flexure with suspension and circuitry according to an embodiment of the present invention.
  • FIG. 8 provides a perspective view of a slider attached to a suspension flexure according to an embodiment of the present invention.
  • FIG. 9 provides a perspective view of a slider attached to a suspension flexure according to an alternative embodiment of the present invention.
  • FIG. 6 illustrates slider-suspension attachment according to an embodiment of the present invention.
  • the slider 1 is mounted to the suspension flexure 6 by a simplified process.
  • improved Pitch Static Attitude (“PSA”) and Roll Static Attitude (“RSA”) are achieved by bonding (such as by gold ball, solder ball, or solder bump) the slider 1 to the suspension flexure 6 at the leading edge and the trailing edge.
  • PSA Pitch Static Attitude
  • RSA Roll Static Attitude
  • the process is simplified and less expensive as compared to the prior art. Because epoxy is not utilized, the tooling necessary is reduced.
  • transducer electrical bonding pads 2 of the slider 1 are coupled by a method such as gold ball, solder ball, or solder bump bonding to electrical bonding pads 4 of the suspension flexure 6 .
  • grounding bonding pads 11 of the slider 1 are coupled by a method such as gold ball, solder ball, or solder bump bonding to corresponding grounding bonding pads 9 of the suspension flexure 6 .
  • a placement device 21 is utilized to position (e.g., by vacuum tube) the slider 1 upon the suspension flexure 6 for the pads 2 , 4 , 9 , 11 to be bonded 3 by a method such as gold ball, solder ball, or solder bump bonding. Once the bonding 3 has cooled and hardened, in this embodiment the placement device 21 releases the slider 1 , and the slider 1 remains attached to the suspension flexure 6 in the appropriate orientation.
  • FIG. 7 illustrates a suspension flexure with circuitry according to an embodiment of the present invention.
  • four transducer electrical pads 4 and two grounding pads 9 are utilized.
  • two slots 12 are utilized for relieving any residual stress created in the flexure from slider assembly.
  • FIG. 8 provides a perspective view of a slider attached to a suspension flexure according to an embodiment of the present invention.
  • FIG. 9 provides a perspective view of a slider attached to a suspension flexure according to an alternative embodiment of the present invention.
  • the slider 1 is bonded to the suspension flexure 6 at the trailing edge, such as by gold ball, solder ball, or solder bump bonding, without bonding pads (i.e, for physical coupling only, not for electrical grounding).
  • the slider is bonded to the suspension flexure at the leading edge without bonding pads (not shown).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)

Abstract

A system and method are disclosed for improving suspension-to-slider attachment in a hard disk drive. A slider having a number of bond pads on its leading edge and a number of bond pads on its trailing edge is to be coupled to a suspension flexure having a number of leading bond pads and a number of trailing bond pads. The slider is to be coupled to the suspension flexure at the leading bond pads and the trailing bond pads by a method such as gold ball, solder ball, or solder bump bonding.

Description

    BACKGROUND INFORMATION
  • The present invention relates to hard disk drives. More specifically, the invention relates to a system and method for improving slider attachment.
  • FIG. 1 graphically illustrates a typical head-gimbal assembly (HGA) of a hard disk drive with disk media as used in the art. Hard disk drive storage devices typically include a rotating disk 9 containing concentric data tracks in which data is read from and written to by a slider 1 (containing a transducer head, not shown). The slider 1, which ‘flies’ close to the surface of the rotating disk 9, is typically attached to a load beam 8 by a suspension flexure 6. The slider (head) 1 is mounted to the flexure 6 by epoxy bonding 5 (See FIG. 2). The suspension flexure 6 allows the slider 1 to pitch and roll with respect to the disk 9 while the load beam 8 provides loading force (by spring action) towards the disk 9 during flight (countering the slider's lift).
  • Typically, the load beam 8 provides resilient spring action, which biases the slider towards the surface of the disk 9, while the flexure 6 provides pitch and roll flexibility for the slider as the slider rides on a cushion of air between the air bearing surface (slider 1 surface) and the rotating disk 9.
  • FIG. 2 provides a perspective view of a typical slider-suspension flexure assembly as used in the art. In a typical slider-suspension assembly, the slider 1 is epoxy-bonded to the suspension flexure 6, and the head's 1 transducer leads are electrically coupled to leads formed on the suspension flexure 6. The electrical connections 3 between the slider pads 2 and the flexure trace pads 4 are typically created by gold ball, solder ball, or solder bump bonding. The fabrication of such a slider suspension assembly is time consuming and costly.
  • FIG. 3 illustrates the attachment of a slider to a suspension flexure as typically performed in the art. Typically, a predetermined amount of epoxy 5 is placed on the tongue portion of the suspension flexure 6 where the slider 1 is to be located. The slider 1 is subsequently positioned onto the suspension flexure 6 with an alignment device, such as a vacuum tube 21. After the epoxy hardens to a degree, e.g. by ultra-violet (UV) light, electrical connections (such as by gold/solder ball or solder bump bonding) are made between the pads 2 of the slider head transducer and the suspension pads 4. The epoxy 5 is then further hardened by a method such as oven baking.
  • FIG. 4 provides a graphical illustration of a slider mounted upon a suspension flexure as is typical in the art. There are several disadvantages associated with the typical method of slider-suspension attachment. One problem involves the residual welding stress caused by the hardened epoxy 5 and soldered bump/gold ball 3 bonding. Typically in the art, it is difficult to apply the epoxy perfectly evenly, and as a result, the thick portion of the applied epoxy and the residual internal stress of the solder/gold ball bonding, cause changes in the slider 1 attitude angle and force the slider 1 to become askew with respect to the suspension flexure 6. (See also FIG. 5).
  • FIG. 5 illustrates a slider mounted askew with respect to a suspension flexure as is common in the art. The pitch 22 attitude angle of the slider 1 may seriously degrade while the epoxy 5 is curing.
  • It is therefore desirable to have a simplified system and method for manufacturing a hard disk drive slider-suspension assembly that avoids the above-mentioned problems, as well as having additional benefits.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 illustrates a typical head-gimbal assembly (HGA) as used in the art.
  • FIG. 2 provides a perspective view of a typical slider-suspension flexure assembly as used in the art.
  • FIG. 3 illustrates the attachment of a slider to a suspension flexure as typically performed in the art.
  • FIG. 4 provides a graphical illustration of a slider mounted upon a suspension flexure as is typical in the art.
  • FIG. 5 illustrates a slider mounted askew with respect to a suspension flexure as is common in the art.
  • FIG. 6 illustrates the attachment of slider to suspension according to an embodiment of the present invention.
  • FIG. 7 illustrates a suspension flexure with suspension and circuitry according to an embodiment of the present invention.
  • FIG. 8 provides a perspective view of a slider attached to a suspension flexure according to an embodiment of the present invention.
  • FIG. 9 provides a perspective view of a slider attached to a suspension flexure according to an alternative embodiment of the present invention.
    • DETAILED DESCRIPTION
  • FIG. 6 illustrates slider-suspension attachment according to an embodiment of the present invention. In one embodiment, the slider 1 is mounted to the suspension flexure 6 by a simplified process. In this embodiment, improved Pitch Static Attitude (“PSA”) and Roll Static Attitude (“RSA”) are achieved by bonding (such as by gold ball, solder ball, or solder bump) the slider 1 to the suspension flexure 6 at the leading edge and the trailing edge. In addition to a more stable bond (reduced likelihood of shifting out of alignment), the process is simplified and less expensive as compared to the prior art. Because epoxy is not utilized, the tooling necessary is reduced.
  • In one embodiment of the present invention, transducer electrical bonding pads 2 of the slider 1 are coupled by a method such as gold ball, solder ball, or solder bump bonding to electrical bonding pads 4 of the suspension flexure 6. In addition, in this embodiment grounding bonding pads 11 of the slider 1 are coupled by a method such as gold ball, solder ball, or solder bump bonding to corresponding grounding bonding pads 9 of the suspension flexure 6. By utilizing bonds 3 at the leading edge and the trailing edge of the slider 1, the need for epoxy is eliminated. Further, in this embodiment the utilization of the grounding pad 11, 9 coupling reduces the likelihood of damage to the slider 1 transducer head caused by Electro-Static Discharge (ESD).
  • In one embodiment, a placement device 21 is utilized to position (e.g., by vacuum tube) the slider 1 upon the suspension flexure 6 for the pads 2, 4, 9, 11 to be bonded 3 by a method such as gold ball, solder ball, or solder bump bonding. Once the bonding 3 has cooled and hardened, in this embodiment the placement device 21 releases the slider 1, and the slider 1 remains attached to the suspension flexure 6 in the appropriate orientation.
  • FIG. 7 illustrates a suspension flexure with circuitry according to an embodiment of the present invention. In one embodiment, four transducer electrical pads 4 and two grounding pads 9 are utilized. In one embodiment, two slots 12 are utilized for relieving any residual stress created in the flexure from slider assembly.
  • FIG. 8 provides a perspective view of a slider attached to a suspension flexure according to an embodiment of the present invention.
  • FIG. 9 provides a perspective view of a slider attached to a suspension flexure according to an alternative embodiment of the present invention. In this alternative embodiment of the present invention, the slider 1 is bonded to the suspension flexure 6 at the trailing edge, such as by gold ball, solder ball, or solder bump bonding, without bonding pads (i.e, for physical coupling only, not for electrical grounding). In another alternative embodiment, the slider is bonded to the suspension flexure at the leading edge without bonding pads (not shown).
  • Although several embodiments are specifically illustrated and described herein, it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention.

Claims (19)

1-12. (canceled)
13. A system for manufacturing a hard disk drive arm comprising:
a slider element, having a number of slider bond pads on its leading edge and a number of slider bond pads on its trailing edge, to be coupled to a hard drive arm suspension element, having a number of leading suspension bond pads and a number of trailing suspension bond pads, wherein
said slider element is to be coupled to said hard drive arm suspension element at said leading bond pads and said trailing bond pads.
14. The system of claim 13, further comprising a placement device to position said slider element onto said suspension element.
15. The system of claim 13, wherein said slider element includes a magneto-resistive (MR) transducer head element.
16. The system of claim 13, wherein said suspension element is a hard drive arm suspension flexure.
17. The system of claim 13, wherein said coupling is by gold ball bonding.
18. The system of claim 13, wherein said coupling is by solder ball bonding.
19. The system of claim 13, wherein said coupling is by solder bump bonding.
20. The system of claim 13, wherein said leading edge slider electrical pads and said leading suspension electrical pads are grounding pads.
21. The system of claim 13, wherein said number of leading edge slider bond pads is two, and said number of leading suspension bond pads is two.
22. The system of claim 13, wherein said trailing edge slider electrical pads and said trailing suspension electrical pads are transducer pads.
23. The system of claim 13, wherein said number of trailing edge slider bond pads is four, and said number of trailing suspension bond pads is four.
24. A system for manufacturing a hard disk drive arm comprising:
a hard disk slider, having a number of slider bond locations on its leading edge and a number of slider bond pads on its trailing edge, to be coupled to a hard drive arm suspension flexure, having a number of leading suspension bond locations and a number of trailing suspension bond pads, wherein
said slider is to be coupled to said flexure at said leading bond locations and said trailing bond pads.
25. The system of claim 24, wherein said number of leading edge slider bond locations is two, and said number of leading flexure bond locations is two.
26. The system of claim 24, wherein said number of trailing edge slider bond pads is four, and said number of trailing suspension bond pads is four.
27. A system for manufacturing a hard disk drive arm comprising:
a hard disk slider, having a number of slider bond pads on its leading edge and a number of slider bond locations on its trailing edge, to be coupled to a hard drive arm suspension flexure, having a number of leading suspension bond pads and a number of trailing suspension bond locations, wherein
said slider is to be coupled to said flexure at said leading bond pads and said trailing bond locations.
28. The system of claim 27, wherein said coupling is by gold ball bonding.
29. The system of claim 27, wherein said coupling is by solder ball bonding.
30. The system of claim 27, wherein said coupling is by solder bump bonding.
US11/212,375 2003-01-27 2005-08-26 System and method for improving suspension-to-slider attachment in a hard disk drive Abandoned US20050280940A1 (en)

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US11/212,375 US20050280940A1 (en) 2003-01-27 2005-08-26 System and method for improving suspension-to-slider attachment in a hard disk drive

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US10/352,569 US7681302B2 (en) 2003-01-27 2003-01-27 Method for manufacturing a hard disk drive arm
US11/212,375 US20050280940A1 (en) 2003-01-27 2005-08-26 System and method for improving suspension-to-slider attachment in a hard disk drive

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US10/352,569 Division US7681302B2 (en) 2003-01-27 2003-01-27 Method for manufacturing a hard disk drive arm

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