JP3607587B2 - Magnetic head manufacturing apparatus and transport system used for the apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
In the manufacturing process of a magnetic head used in a magnetic recording apparatus such as an HDD (hard disk drive), the present invention is provided on an element used on a core of the magnetic head and actually used for recording and reproducing information and on the gimbal of the magnetic head. The present invention relates to an apparatus for electrically connecting wiring. More specifically, when electrical connection is made, a magnetic system that holds the magnetic head before connection and performs conveyance to a predetermined position for actually performing the connection work, and a magnetic head having the conveyance system It relates to a manufacturing apparatus.
[0002]
[Prior art]
In describing a conventional transport system, a magnetic head and a bonding apparatus for connecting an element and a wiring on a gimbal in the magnetic head will be described. As shown in FIG. 2, the magnetic head 1 is composed of a gimbal 2 and a core 10 attached to the tip thereof.
[0003]
The gimbal 2 includes a flexure 4 made of an insulating flexible resin thin plate on which a conductor pattern for wiring is formed, a load beam 3 made of an elastic metal thin plate to which the flexure 4 is bonded, and a base plate fixed to the base of the load beam 3 7. The core 10 is fixed to the core mounting portion 5 which is the tip portion of the flexure 4 arranged so as to overlap the load beam 3 at the tip portion of the load beam 3 without being bonded to the load beam 3. Is done. Note that the gimbal 2 is bent in the direction of the paper surface by a predetermined angle along the chain line in the figure in the vicinity of its tip, that is, in the vicinity of the core mounting portion 5. It is elastically deformed by the addition of etc. and the bending at a predetermined angle is recovered and used.
[0004]
An enlarged view of the tip of the magnetic head 1 is shown in FIG. The electrode 11 formed on the core 10 and the substrate land 8 formed on the flexure 4 (gimbal 2 side) are electrically connected by a ball 15 such as gold. The substrate land forming surface and the electrode 11 forming surface form an angle of approximately 90 °.
[0005]
The connection between the substrate land 8 and the electrode 11 by a ball such as gold is performed by a bonding apparatus whose outline is shown in FIG. In the bonding apparatus, the core 10 placed at a predetermined position on the flexure 4 (a predetermined position of the core mounting portion 5) is placed on the positioning table (backup unit 62) by the clamp means (clamp unit 61) together with the flexure 4. Press to fix. The ball 15 is formed at the tip of the capillary by melting a metal wire penetrating the inside of the capillary 17 at its tip and making it spherical by surface tension or the like.
[0006]
The capillary 17 approaches the intersection at an angle of about 45 ° with respect to the formation surface of the substrate land 8 and the formation surface of the electrode 11, and the intersection so as to contact the substrate land 8 and the electrode 11 with substantially the same pressure. Press the ball toward In this state, vibration having a frequency in the ultrasonic region is applied to the capillary 17, and these are joined using a frictional force generated between the ball 15, the substrate land 8, and the electrode 11.
[0007]
In order to perform the above-described bonding reliably and stably, the operation axis when the capillary 17 approaches the intersecting portion and the substrate land 8 and the electrode 11 which are bonded surfaces have an angle of 45 ° accurately. It is necessary to do. That is, when the magnetic head before bonding is disposed below the capillary operating axis, the magnetic head is required to be held and positioned at the above-described angle. In general, in order to shorten the manufacturing time of the magnetic head, a plurality of magnetic heads are simultaneously held and positioned, and the plurality of magnetic heads are simultaneously bonded by the same number of capillaries.
[0008]
The two types of transport systems that have been used in the past are specifically described below. The first transport system shown in FIG. 5 generally includes a holder 31 for holding a plurality of magnetic heads, a stage 32 including a holder standby unit 41 and a holder detaching unit 42, a holder driving unit 35, a holder inserting / extracting unit 36, and a cylinder. 25, a drive unit 26, a holder clamp unit 37, an air cylinder 38, and a stopper 39. The operation of each part in this system is described below.
[0009]
The plurality of magnetic heads are arranged on the holder 31 in a horizontal state, and the arranged holder 31 is fixed to the holder attaching / detaching portion 42 on the stage 32. The stage 32 is driven on the driving unit 26 by the cylinder 25, and the holder 31 on which the magnetic head is mounted is driven to the holder standby unit 41. The holder 31 is driven from the standby unit 41 to the lower side of the insertion / extraction unit 36 by the driving unit 35, and is held by the clamp unit 37 after being positioned and held by the insertion / extraction unit 36.
[0010]
Next, the holder 31 is rotated and tilted around a predetermined rotation axis by the air cylinder 38 together with the clamp portion 37, and each magnetic head is fixed at a predetermined angle below the corresponding capillary (not shown) by the stopper 39. After the joining is completed, the holder 31 is returned to the holder standby unit 41 by performing the operations performed in the above order in the reverse order, and the stage 32 is driven on the driving unit 26 by the cylinder 25 so that the holder after the joining is obtained. Is positioned at the detachable portion 42, and a new holder is driven by the standby portion 41.
[0011]
The second transport system shown in FIG. 6 is different from the first transport system in that the stage 32 including the holder detaching portion 42 is inclined in advance at a predetermined angle (45 ° in this case), and the holder 31 is detachable. After being fixed to the part 42, it is driven by the drive part 35. The holder 31 that has been driven to a predetermined position is removed from the detachment section 42 by the insertion / extraction section 36 while maintaining a predetermined angle, and is positioned at a predetermined position below a capillary (not shown) by a holder positioning mechanism (backup unit) 62. .
[0012]
[Problems to be solved by the invention]
In the first transport system described above, the holder 31 after the joining process and the holder 31 before the joining process are handled by the holder standby part 41 and the holder detaching part 42 by using the stage 32 that moves in parallel. However, the fixing of the core 10 of the magnetic head and the flexure 4 on the holder 31 is not so strong, and there is a possibility that it is displaced by operations such as linear movement and clamping given to the holder 31 before the joining process. For this reason, these operations cannot be performed at high speed, and as a result, it is difficult to shorten the time required for conveyance.
[0013]
In the second transport system, the possibility that the core 10 and the flexure 4 on the holder 31 are displaced is smaller than that in the first transport system. However, when the holder 31 is tilted in advance to supply and take out the stage 32, in order to automate this operation, it is required to separately arrange a device for tilting the holder 31. Furthermore, in the configuration shown in the figure, the holder before the joining process cannot be placed in advance during the joining process, and the time required for exchanging the holder 31 is longer with respect to the first transport system. There was a drawback.
[0014]
In the actual joining process, the backup unit 62 that supports the magnetic head 1 and the like on the holder is pressed against the holder from the back surface of the holder 31 by an air cylinder or the like. For this reason, in the second transport system, for example, even if an attempt is made to use a form for rotating the stage, there is a problem that the mounting position of the mechanism for rotating the stage 32 and the backup unit 62 overlap.
[0015]
During actual bonding, the core 10 and the flexure 4 are fixed and held by a clamp so that the positional relationship is not shifted by the backup unit 62 and a clamp unit (not shown). The gimbal 2 is bent and deformed at a predetermined angle in advance. However, if these are clamped and fixed during transport, the core 10 and the flexure 4 may be displaced due to an impact received during transport, or the core 10 may be There is a risk of damage. For this reason, at the time of conventional conveyance, these magnetic heads are fixed so that their bent ends become free ends, and the free end portions are fixed immediately before bonding.
[0016]
When the conventional transfer device is used, the core 10 and the flexure 4 are likely to be displaced before contact with the backup unit 62 and the clamp unit at the time of clamping due to the above-described impact or the like applied to the magnetic head. There is a risk of becoming. For this reason, at the time of clamping, in order to maintain the above-described bending deformation as it is, a combination of a backup unit and a clamp unit corresponding to a predetermined angle of bending deformation, or a configuration in which the bending deformation at this predetermined angle is offset. It was necessary to use a different holder depending on the type of magnetic head.
[0017]
The present invention has been made in order to solve the above-mentioned problems, and is a transport system that reduces the impact and load caused by movement of the holder applied to the holder, and further reduces the transport time. The purpose is to provide. It is another object of the present invention to provide a transport system that can perform clamping at the time of bonding without particularly considering bending deformation given in advance to a magnetic head by reducing impact caused by moving the holder.
[0018]
[Means for Solving the Problems]
In order to solve the above-described problem, the transport system according to the present invention receives a holder on which an electronic component is placed at a first position when performing ball bonding on the electronic component. A transport system for moving the holder from the second position to the third position so that the electronic component is moved to a different position and moving the holder from the second position to the third position. On the first and second surfaces, having a first surface and a second surface that are inclined at a predetermined angle with respect to a surface perpendicular to the rotation axis and form a convex shape having the intersection line as a vertex. A stage that supports the holder and a rotating means that rotates the stage so that the holder on the first and second surfaces alternately moves between the first position and the second position about the rotation axis. Characterized by having That.
[0019]
Furthermore, in the transport system according to the present invention, it is desirable that the stage supports the holder horizontally on the first and second surfaces in the first position. Further, it is desirable to further include a backup unit that fixes the holder at the second position from a direction perpendicular to the surface of the stage and moves the holder to the third position. In addition, the electronic component is preliminarily bent to a predetermined position, and in the third position, the backup unit applies a light load to the predetermined position where the bending deformation is given together with the cooperating clamp unit. It is more preferable to apply elastic deformation at a predetermined position. Furthermore, as a magnetic head manufacturing apparatus for solving the above problems, a magnetic head manufacturing apparatus having the above-described transport system may be provided.
[0020]
Furthermore, in order to solve the above-mentioned problem, when ball bonding is performed on an electronic component to which bending deformation is applied at the tip portion, the electronic component placed on the holder is arranged in a conveyance system that conveys the entire holder. An electronic component holding device comprising a backup unit and a clamp unit for transporting the holder to a bonding position and clamping the electronic component, and applying a light load to the electronic component when clamping the electronic component Further, it is characterized in that a further elastic deformation is applied to the given bending deformation to temporarily eliminate the bending deformation.
[0021]
【Example】
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a schematic configuration when the transport system according to the present invention is viewed from the side. The transport system according to the present invention includes a stage composed of a first surface and a second surface that can rotate around an axis A, a rotary actuator that is a rotating means for rotating the stage, a backup unit, and a clamp unit. Composed.
[0022]
The first surface 50 and the second surface 51 on the stage 32 are formed to be inclined at a predetermined angle with respect to the surface perpendicular to the axis A, respectively, so that the intersection line when each surface is extended becomes the top. It arrange | positions so that it may become convex on the surface side. Moreover, it is preferable that the 1st surface 50 and the 2nd surface 51 have the shape which becomes object centering on the axis | shaft A. As shown in FIG. In the present embodiment, the holder 31 is supported horizontally at the first position shown as being supported on the first surface 50 in the figure. Therefore, in the second position shown supported on the second surface 51 in the drawing, the holder 31 is supported by being inclined with respect to the horizontal plane twice the predetermined angle. The axis A is inclined at a predetermined angle with respect to the perpendicular.
[0023]
The movement of the holder 31 on which an electronic component such as a magnetic head is actually placed will be described next. The holder 31 is transferred to the first position on the stage 32 by a transfer unit (not shown). Next, the stage 32 is rotated around the axis A by the rotary actuator 52, and the holder 31 is transferred from the first position to the second position.
[0024]
Further, when the holder 31 is in the second position, the backup unit 62 driven by the air cylinder 63 approaches from the direction perpendicular to the second surface toward the back surface of the holder 31, so that the holder 31 is After fixing to the front end of the unit, the holder 31 is moved to a third position where bonding is performed. In the third position, the clamp unit 61 operates to position the electronic components such as the magnetic head on the holder in a state where they can be bonded, and fix and hold them.
[0025]
At that time, the bending deformation applied to the gimbal 2 is elastically deformed by the backup unit 62 or the like, and is fixed and held without bending. As a result, regardless of the type of the magnetic head, the bonding surface can always be fixed and held while maintaining a predetermined angle with respect to the capillary lowering direction. Thereafter, a capillary of a bonding apparatus (not shown) is lowered with respect to the bonding surface of the magnetic head, and a bonding operation is performed.
[0026]
After the bonding is completed, the clamp unit 61 releases the clamp and the backup unit 62 returns to the origin, and the holder 31 is returned to the second position. During this bonding operation, the holder 31 on which the magnetic head before bonding is placed is transferred onto the second surface existing at the first position. The holder 31 after bonding and the holder 31 before bonding are transferred from the second position to the first position and from the first position to the second position by the rotation of the stage 32, respectively. The holder 31 after bonding is transported toward a further process by a transfer unit (not shown), and the bonding operation is performed on the holder 31 before bonding according to the above procedure.
[0027]
By carrying out the present invention, it is possible to transport the holder in a horizontal state between the respective apparatuses with respect to production equipment for electronic components such as a magnetic head, and the construction of a production line is facilitated. Further, the structure of the transfer system is simplified, and the waiting time for holder replacement before and after the bonding process can be shortened, so that the production efficiency can be improved. Furthermore, it is possible to mount a magnetic head etc. with the holder horizontal, and since it is possible to fix the bonding surface immediately before bonding, the magnetic head to be handled, for example, bending deformation is added to the gimbal, etc. It is possible to easily cope with the case where the types of are different.
[0028]
In this embodiment, when performing ball bonding, the capillary is brought into contact with each of the electrode and the substrate land at an angle of 45 °. In this embodiment, a capillary (not shown) is driven in the vertical direction. Therefore, in the second position described above, the electrode and the substrate land form an angle of 45 ° with respect to the perpendicular, that is, in the second position, the holder forms an angle of 45 ° with the perpendicular. The predetermined angle described above is 22.5 °. However, the present embodiment is not limited to this angle, and is preferably set arbitrarily according to the driving direction of the capillary or the included angle formed by the formation surface of the electrode and the substrate land.
[0029]
The shape of the first surface and the second surface of the stage is preferably U-shaped or B-shaped so that the backup unit can easily approach the holder from its back surface. The shape may be changed to an arbitrary shape according to the shape and number of parts. Further, although no particular mention is made regarding the rotation operation in the rotating means, it is preferable to change the rotation speed in a multi-step manner, for example, in a stepped manner in order to alleviate the impact applied to the magnetic head by the holder transfer.
[0030]
In the present embodiment, the backup unit and the clamp unit apply a light load or an addition that corrects the bending deformation applied to the magnetic head, and each magnetic head is fixed and held. For this reason, even if the amount of bending deformation differs for each type of magnetic head, it is not necessary to consider this difference during bonding. These configurations are more preferably combined with the transport unit according to the present invention that can reduce the impact applied to the magnetic head fixed on the holder as much as possible. However, it is also possible to combine only this configuration with a conventional transport unit.
[0031]
In this embodiment, the electrode and the substrate land are bonded by ball bonding. However, the present invention is not limited to ball bonding, and can be applied to a bonding process using a molten metal such as solder. It is. Furthermore, in this case, it is preferable to select the predetermined angle in consideration of wettability of the electrodes to be bonded to the molten metal for bonding.
[0032]
[Effect of the present invention]
By carrying out the present invention, it is possible to provide a transport system that reduces the impact and load caused by movement of the holder applied to the holder, and further reduces the transport time. Further, by reducing the impact due to the movement of the holder or the like, it becomes possible to perform the clamping at the time of bonding without particularly considering the bending deformation given in advance to the magnetic head.
[Brief description of the drawings]
FIG. 1 is a side view showing a schematic configuration of a transport system according to the present invention.
FIG. 2 is a plan view showing a schematic configuration of a magnetic head.
FIG. 3 is a diagram showing a tip portion of a magnetic head.
FIG. 4 is a diagram showing a positional relationship between the tip of a magnetic head and a capillary when ball bonding an electrode and a substrate land.
FIG. 5 is a side view showing a schematic configuration of a conventional transport system.
FIG. 6 is a side view showing a schematic configuration of a conventional transport system.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Magnetic head 2 Gimbal 3 Load beam 4 Flexure 5 Core mounting part 7 Base plate 8 Substrate land 10 Core 11 Electrode 15 Ball 17 Capillary 25 Cylinder 26 Drive part 31 Holder 32 Stage 35 Holder drive part 36 Holder insertion and extraction part 37 Holder clamp part 38 Air cylinder 39 Stopper 41 Holder standby part 42 Holder detaching part 43 Rotating part 50 First surface 51 Second surface 52 Rotary actuator 61 Clamp unit 62 Backup unit 63 Air cylinder

Claims (3)

When performing ball bonding on an electronic component, the holder on which the electronic component is placed is received at a first position, moved to a second position different from the first position, and the electronic component is bonded. A transport system for moving the holder from the second position to a third position so as to be disposed at a position;
First and second surfaces that are formed with respect to the rotation axis, each of which forms a convex shape having a vertex at the intersection line with a predetermined angle with respect to a surface perpendicular to the rotation axis. A stage for supporting the holder on the first and second surfaces and horizontally supporting the holder on the first and second surfaces at the first position ;
Rotating means for rotating the stage so that the holder on the first and second surfaces alternately moves between the first position and the second position around the rotation axis ;
The second position is disposed on the back surface of the first and second surfaces at the second position and perpendicular to the first and second surfaces at the second position. And a backup unit that fixes the holder in a direction perpendicular to the surface of the stage and moves the holder to the third position . When performing ball bonding on an electronic component, the holder on which the electronic component is placed is received at a first position, moved to a second position different from the first position, and the electronic component is bonded. A transport system for moving the holder from the second position to a third position so as to be disposed at a position;
First and second surfaces that are formed with respect to the rotation axis, each of which forms a convex shape having a vertex at the intersection line with a predetermined angle with respect to a surface perpendicular to the rotation axis. A stage for supporting the holder on the first and second surfaces and horizontally supporting the holder on the first and second surfaces at the first position;
Rotating means for rotating the stage so that the holder on the first and second surfaces alternately moves between the first position and the second position around the rotation axis; A backup unit for fixing the holder in the second position from a direction perpendicular to the surface of the stage and moving the holder to the third position;
The electronic component is preliminarily subjected to bending deformation at a predetermined position, and at the third position, the backup unit and the clamping unit cooperating with each other are lightly loaded at the predetermined position where the bending deformation is applied. Is added to elastically deform the predetermined position. An apparatus for manufacturing a magnetic head, comprising the transport system according to claim 1 .

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