CN1288079A - Method for growing gallium nitride single crystal by molten salt growth method - Google Patents
Method for growing gallium nitride single crystal by molten salt growth method Download PDFInfo
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- CN1288079A CN1288079A CN 99119067 CN99119067A CN1288079A CN 1288079 A CN1288079 A CN 1288079A CN 99119067 CN99119067 CN 99119067 CN 99119067 A CN99119067 A CN 99119067A CN 1288079 A CN1288079 A CN 1288079A
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- crucible
- gan
- gallium nitride
- single crystal
- molten
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- 239000013078 crystal Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000012010 growth Effects 0.000 title claims abstract description 20
- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 17
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 title claims abstract description 12
- 150000003839 salts Chemical class 0.000 title claims abstract description 10
- 239000002994 raw material Substances 0.000 claims abstract description 17
- 239000000126 substance Substances 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims abstract description 3
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims abstract 5
- 229910052744 lithium Inorganic materials 0.000 claims abstract 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 10
- 229910052733 gallium Inorganic materials 0.000 claims description 9
- 239000012153 distilled water Substances 0.000 claims description 8
- 238000007654 immersion Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 8
- 238000005086 pumping Methods 0.000 claims description 8
- 238000010792 warming Methods 0.000 claims description 8
- 238000005303 weighing Methods 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 229910001416 lithium ion Inorganic materials 0.000 claims description 2
- 229910052750 molybdenum Inorganic materials 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- -1 Li 3N Chemical compound 0.000 claims 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- CKHJYUSOUQDYEN-UHFFFAOYSA-N gallium(3+) Chemical compound [Ga+3] CKHJYUSOUQDYEN-UHFFFAOYSA-N 0.000 claims 1
- 230000007773 growth pattern Effects 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 238000000935 solvent evaporation Methods 0.000 claims 1
- 238000007796 conventional method Methods 0.000 abstract 1
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 238000010583 slow cooling Methods 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 6
- 238000001291 vacuum drying Methods 0.000 description 6
- 238000009413 insulation Methods 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241001044684 Amadina fasciata Species 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- 238000002441 X-ray diffraction Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007716 flux method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000007648 laser printing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention relates to a method for growing gallium nitride single crystals by using a molten salt growth method. The present invention selects fluxing agent with certain solubility to gallium nitride, i.e. lithium simple substance or lithium-containing compound, and mixes them with raw material according to a certain proportion, so that it can make GaN single crystal growth according to conventional method (for example slow cooling method) at lower temp. (680-900 deg.C) and normal pressure (0.5-10 atm). The invention has simple equipment, cheap raw materials and low cost, and can be used for large-scale production.
Description
The present invention relates to a kind of method of growing single-crystal, particularly relate to a kind of method of utilizing molten-salt growth GaN monocrystalline.
Gan (GaN) is a kind of wide bandgap semiconductor materials of excellence, under the room temperature its band gap wide be 3.4ev, be the ideal material of manufacturing indigo plant, green photodiode (LED) and laser diode (LD).This class light source has wide application prospect and huge market potential at aspects such as the storage of high-density optical information, high-rate laser printing, panchromatic dynamic high-luminance light demonstration, solid light source, acquisition of signal, optical communications.Its distinctive bandgap range, good optics, electrical properties and good chemical stability make it in general application prospects in the side of having, field such as high-power, high temperature, high-frequency electron device and extraordinary semiconducter device.Current, to being the development and the exploitation of the third generation semiconductor material and the device thereof of representative with GaN, become the focus of a cut-throat competition in global high-tech sector and the corresponding economic field.
At present, along with the development of heterogeneous epitaxial technology, prepared blue-ray LED product (document 1:S.Nakamura, Science 281,956 (1998)) based on the III group-III nitride of GaN with commercial value.But because the problems such as lattice mismatch of selected substrate and GaN film make it can't be used to prepare high quality, high efficiency laser diode (LD).As the desirable substrate of GaN film, the GaN crystal is undoubtedly preferred material.Simultaneously, develop high-power integrated circuit of new generation and also press for GaN body monocrystal material.
Yet because the theoretical fusing point of GaN under normal pressure be up to 2500 ℃, and it decomposes in the time of 900 ℃, therefore, be difficult to adopt common from the GaN melt method of growing large-size GaN monocrystalline.Up to now, having only the comparatively successful report of an example (document 2:Porowski et al Journal Crystal Growth 178 (1997) 1 74-188) in the world, is that the people reported Polish Porowski etc. that to grow area under 1 5-20kbar and 1300-1600 ℃ of condition be 1cm
2About, the thick GaN monocrystalline that is about 0.5mm.But the perfection of crystal that grows is relatively poor, and crystal mass still remains to be improved; On the other hand,, make it to be difficult to obtain promote, also can't satisfy batch production requirement in the future owing to equipment complexity, growth conditions harshness.In addition, people from Japan (document 3:H.Yamane et al Journal Crystal Growth 186 (1998) 8-12) such as Yamane utilizes the Na case of flux methods to be incubated 100h under 750 ℃ and 100 atmospheric nitrogen pressures, prepared irregular small size GaN monocrystalline (diameter is about about 0.4-0.7mm) in high pressure vessel.
The objective of the invention is to overcome the shortcoming and defect of prior art, can dissolve the fusing assistant of GaN, under low-temperature atmosphere-pressure, carry out the GaN single crystal growing by selecting a class, thus the GaN monocrystalline that grows large-size (~φ 5mm), has practical value.The present invention is with low cost, equipment is simple, be easy to popularization, can carry out scale operation.
The object of the present invention is achieved like this:
The present invention selects suitable fusing assistant that the temperature of GaN crystal growth is reduced to it to grow below decomposition temperature, simultaneously, and the variation of the solubility with temperature of GaN in this fusing assistant and changing.Selected fusing assistant is that compound that GaN is had the Li simple substance of certain solubleness or contains Li is (as Li
3N, Li
3GaN
2, LiGa), can be that one or more use simultaneously.
May further comprise the steps:
1, with raw material, crucible (as Al
2O
3, W, Mo crucible) put into anoxybiotic, exsiccant vacuum glove box, the vacuum tightness of this glove box is reached below the 1Pa, raw material is high purity metal gallium, gan and fusing assistant, wherein high purity metal gallium and powder gan can use separately, also can use simultaneously;
2, in vacuum glove box, take by weighing raw material by a certain percentage and put into crucible, ratio is: Li element in the fusing assistant or Li ion: Ga or Ga ion=12: 1~1: 9 (mol);
3, crucible is put into the exsiccant molten salt furnace rapidly;
4, pumping high vacuum to 10
-3Pa fills then with 0.5~10 atmospheric high-purity N
2Gas or NH
3Gas with as protective atmosphere, and provides partial nitrogen source simultaneously;
5, system slowly is warming up to 680-900 ℃, carry out the crystal growth (as adopting top-seeded solution growth, temperature gradient method, crucible rotational method, seed crystal rotational method and slow falling temperature method etc.) of certain hour (about 2-7 days);
6, be cooled to room temperature rapidly, crucible is taken out, with distilled water immersion, wash products, can obtain water white hexagonal flake GaN body monocrystalline (size~φ 5mm) after the oven dry, the X one ray thing identification of phases shows that product is pure GaN phase, does not have any impurity.
The present invention can be lower than 1000 ℃ and carry out the growth of GaN monocrystalline under 0.5-10 atmospheric condition, and equipment is simple, raw material is inexpensive, and mode is produced on a large scale cheaply.
The present invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is the X-ray diffraction spectral line of the GaN powder of the gallium nitride single crystal that grows of the present invention and spontaneous nucleation,
Fig. 2 is the photo in kind of the gallium nitride single crystal that grows of the present invention.
Embodiment 1
Raw material, crucible are put into a vacuum-drying glove box, the vacuum tightness of this glove box is reached below the 1Pa; In vacuum glove box, take by weighing the high pure metal Ga of 24g and the Li of 64g
3The GaN powder of N and 8g is put into φ
In=30mm is in the W crucible of H=60mm; Crucible is put into the exsiccant molten salt furnace rapidly; Pumping high vacuum to 10
-3Pa fills then with 0.5 atmospheric high-purity N
2, slowly be warming up to 900 ℃; After 10 hours, slowly be cooled to 600 ℃ in insulation under this temperature, be cooled to room temperature then rapidly with the speed of 5 ℃/h.Crucible is taken out,, after the oven dry, can obtain the hexagonal flake GaN monocrystalline that diameter reaches 3mm with distilled water immersion, wash products.
Embodiment 2
Similar to embodiment 1, raw material, crucible are put into a vacuum-drying glove box, the vacuum tightness of this glove box is reached below the 1Pa; In vacuum glove box, take by weighing the GaN of 30g, the Li of 30g
3The metal Li of N and 6g puts into φ
In=30mm, the Al of H=60mm
2O
3In the crucible; Crucible is put into the exsiccant molten salt furnace rapidly; Pumping high vacuum to 10
-3Pa fills then with 0.8 atmospheric high-purity N
2, slowly be warming up to 880 ℃; Pass to the N that flows in the crucible bottom
2Gas, control N
2Airshed makes the crucible bottom temp than low 60 ℃ approximately of the temperature of middle sample position, in insulation under this temperature after 10 hours, slowly is cooled to 620 ℃ with the speed of 2.5 ℃/h, is cooled to room temperature then rapidly.Crucible is taken out,, after the oven dry, can obtain diameter greater than 3mm GaN body monocrystalline with distilled water immersion, wash products.
Embodiment 3
Similar to embodiment 1, raw material, crucible are put into a vacuum-drying glove box, the vacuum tightness of this glove box is reached below the 1Pa; In vacuum glove box, take by weighing the GaN powder of 40g and the Li of 10g
3N puts into φ
In=30mm is in the Mo crucible of H=60mm; Crucible is put into the exsiccant molten salt furnace rapidly; Pumping high vacuum to 10
-3Pa fills then with 10 atmospheric high-purity N
2, slowly be warming up to 760 ℃; Pass to colder mobile N in the crucible bottom
2Gas, control N
2Airshed makes the crucible bottom temp hang down 80 ℃ approximately than the temperature of sample position.While is with the speed crucible rotating of 30 commentaries on classics/min.Insulation is 10 days under this temperature, is cooled to room temperature then rapidly.Crucible is taken out,, after the oven dry, can obtain the GaN body monocrystalline of diameter greater than 5mm with distilled water immersion, wash products.
Embodiment 4
Similar to embodiment 1, raw material, crucible are put into a vacuum-drying glove box, the vacuum tightness of this glove box is reached below the 1Pa; In vacuum glove box, take by weighing the Li of 30g
3GaN
2, the LiGa of 12g and the GaN powder of 10.5g put into φ
In=30mm is in the W crucible of H=60mm; Crucible is put into the exsiccant molten salt furnace rapidly; Put a GaN seed crystal at the crucible top; Pumping high vacuum to 10
-3Pa fills then with 1 atmospheric high-purity N
2, slowly be warming up to 860 ℃; Pass to the N that flows in the position corresponding, crucible top with seed crystal
2Gas, control N
2Airshed makes the crucible upper temp hang down 60 ℃ approximately than the temperature of sample position; Simultaneously crucible is periodically quickened and the rotation of slowing down, to reach the purpose that stirs; After protecting 10 hours under this temperature, seed crystal is placed on the liquidus surface rotation seed crystal; Speed with 2.5 ℃/h slowly is cooled to 620 ℃; Be cooled to room temperature then rapidly.Crucible is taken out,, after the oven dry, can obtain the GaN body monocrystalline of diameter greater than 5mm with distilled water immersion, wash products.
Embodiment 5
Raw material, crucible are put into a vacuum-drying glove box, the vacuum tightness of this glove box is reached below 1 Pa; In vacuum glove box, take by weighing the GaN of high pure metal Ga, 50g of 100g and the Li of 26g
3N puts into φ
In=30mm is in the W crucible of H=60mm; Crucible is put into the exsiccant molten salt furnace rapidly; Pumping high vacuum to 10
-3Pa fills then with 0.5 atmospheric high-purity N H
3Gas slowly is warming up to 680 ℃; After 10 hours, slowly be cooled to 600 ℃ in insulation under this temperature with the speed of 2 ℃/h; Be cooled to room temperature then rapidly.Crucible is taken out,, after the oven dry, can obtain the GaN body monocrystalline of diameter greater than 3mm with distilled water immersion, wash products.
Embodiment 6
Raw material, crucible are put into a vacuum-drying glove box, the vacuum tightness of this glove box is reached below the 1Pa; In vacuum glove box, take by weighing the high pure metal Ga of 8g and the Li of 20g and the GaN powder of 12g and put into φ
In=30mm, the bottom of H=60mm is in the W crucible of V-arrangement; Crucible is put into the exsiccant molten salt furnace rapidly; Pumping high vacuum to 10
-3Pa fills then with 1 atmospheric high-purity N
2, slowly be warming up to 860 ℃; Insulation is 100 hours under this temperature, carries out solvent evaporates, and the speed with 5 ℃/h is cooled to 600 ℃ then, is cooled to room temperature then rapidly.Crucible is taken out,, after the oven dry, can obtain the GaN monocrystalline of hexagonal flake diameter greater than 5mm with distilled water immersion, wash products.
Be noted that the above embodiments just illustrate the present invention with six concrete examples, it should not be a limitation of the present invention.Simultaneously, be familiar with all knowing of this technology, on basis of the present invention, do not have the various improvement of description in the text all at this patent protection domain what the present invention carried out.
Claims (6)
1, a kind of method of utilizing the molten-salt growth gallium nitride single crystal is characterized in that: may further comprise the steps:
(1) raw material, crucible are put into anoxybiotic, exsiccant vacuum glove box, the vacuum tightness of this glove box is reached below the 1Pa, raw material is high purity metal gallium, powder gan and lithium simple substance fusing assistant;
(2) take by weighing raw material by a certain percentage in vacuum glove box and put into crucible, ratio is: the Li element in the fusing assistant: Ga or Ga ion=12: 1~1: 9 (mol);
(3) crucible is put into the exsiccant molten salt furnace rapidly;
(4) pumping high vacuum to 10
-3Pa fills then with 0.5~10 atmospheric high-purity N
2Gas or NH
3Gas;
(5) system slowly is warming up to 680-900 ℃, carries out the crystal growth of certain hour (about 2-7 days);
(6) be cooled to room temperature rapidly, crucible is taken out,, can obtain water white hexagonal flake GaN body monocrystalline after the oven dry with distilled water immersion, wash products.
2, by the described method of utilizing the molten-salt growth gallium nitride single crystal of claim 1, it is characterized in that: described raw material high purity metal gallium and powder gan, can also use separately.
3, by the described method of utilizing the molten-salt growth gallium nitride single crystal of claim 1, it is characterized in that: described fusing assistant can also be the compound of lithium, i.e. Li
3N, Li
3GaN
2Or LiGa.
4, by claim 1, the 3 described methods of utilizing the molten-salt growth gallium nitride single crystal, it is characterized in that: fusing assistant can also be that two or more use simultaneously, and wherein the mol ratio of gallium or gallium ion is constant in elemental lithium or lithium ion and the raw material.
5, by the described method of utilizing the molten-salt growth gallium nitride single crystal of claim 1, it is characterized in that: used crucible material is W, Mo or Al
2O
3
6, by the described method of utilizing the molten-salt growth gallium nitride single crystal of claim 1, it is characterized in that: wherein the crystal growth pattern of step (5) can be known slow falling temperature method, top-seeded solution growth, temperature gradient method, the crucible rotational method, seed crystal rotational method and solvent evaporation method.
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JP2005263511A (en) * | 2004-03-16 | 2005-09-29 | Ricoh Co Ltd | Crystal growth method of group iii nitride, group iii nitride crystal and semiconductor device |
WO2007023699A1 (en) | 2005-08-24 | 2007-03-01 | Mitsubishi Chemical Corporation | Method for producing group 13 metal nitride crystal, method for manufacturing semiconductor device, and solution and melt used in those methods |
CN1327044C (en) * | 2002-07-31 | 2007-07-18 | 财团法人大阪产业振兴机构 | Method for producing group III element nitride single crystal and group III element nitride transparent single crystal prepared thereby |
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US7905958B2 (en) | 2004-05-19 | 2011-03-15 | Sumitomo Electric Industries, Ltd. | Group III-nitride semiconductor crystal and manufacturing method thereof, and group III-nitride semiconductor device |
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CN104445108A (en) * | 2014-11-28 | 2015-03-25 | 中国科学院物理研究所 | GaN microcrystalline and synthetic method thereof |
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1999
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