CN1284222C - Precisively positioning device for IC chip package - Google Patents
Precisively positioning device for IC chip package Download PDFInfo
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- CN1284222C CN1284222C CN 200410093662 CN200410093662A CN1284222C CN 1284222 C CN1284222 C CN 1284222C CN 200410093662 CN200410093662 CN 200410093662 CN 200410093662 A CN200410093662 A CN 200410093662A CN 1284222 C CN1284222 C CN 1284222C
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- voice coil
- coil motor
- positioning table
- linear voice
- linear
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Abstract
The present invention relates to a high-speed and high-accuracy positioning platform of a two-dimensional driving system, which is a precise positioning device used for packaging IC chips. An X direction linear voice coil motor and a Y direction linear voice coil motor are fixedly installed on a base, an X positioning working table and a Y positioning working table are respectively driven by the X direction linear voice coil motor and the Y direction linear voice coil motor to determine the position of a welding head on an X-Y plane, the movement of the X direction linear voice coil motor and the Y direction linear voice coil motor is combined with the movement of the welding head driven by the linear voice coil motors in a Z direction, three dimensional movement of the welding head is realized, and tasks of positioning and welding are completed. The Y positioning working table is connected with a Y direction drive motor by a gapless decoupling mechanism, the mechanism has the characteristics of traditional XY positioning table kinematics decoupling, the X positioning working table and the Y positioning working table adopt linear grating rulers as terminal position feedback elements, and high-speed and high-accuracy movement of the system is ensured. The present invention can be used for the micro-jointing and the micropackage of MEMS devices besides the package of IC chips.
Description
Technical field
The invention belongs to MEMS processing and manufacturing field, particularly the drive system of bidimensional, i.e. 2DOF cartesian coordinate type high-peed and high-precision positioning platform.
Background technology
Be widely used in the XY locating platform that needs in the precision positioning IC chip encapsulating device at present, owing to can realize the bidimensional actuation movement, and have the flexible characteristics of control, especially install soldering tip after, can realize the Three Degree Of Freedom reciprocating motion, so be the important device in the MEMS manufacture field.Existing this type of equipment is as wire bonder and the most straight line workbench that adopt tandem type of die bonder, i.e. motor-leading screw-nut body form.Under traditional ball-screw type of drive, rotatablely moving of servomotor transfers rectilinear motion to by leading screw, speed still is that acceleration is all very limited, and it is big etc. that maximum weak point also is embodied in movement clearance, inertia, limited the further raising of precision, speed and acceleration thus.Directly drove for head it off once adopts linear electric motors, and because detent mechanism is the primary factor that guarantees that end effector accurately moves at a high speed, directly drove back speed with linear electric motors and can reach more than the 160m/min, acceleration can reach more than the 2.5g.Adopt fast, accurate, reach long linear electric motors of reliability height and life-span at a high speed, can avoid the shortcomings such as backlass, inertia, frictional force and insufficient rigidity in the ball-screw transmission, realize that contactless direct driving obtains high accuracy, high-speed displacement movement and good stable.But the problem that exists is at present, no matter adopts above-mentioned which kind of motor-driven structure form, all has not enough problem such as hysteresis, finite response, limited jerk and speed in various degree, has limited the raising of locating platform precision in various degree.
Summary of the invention
The purpose of this invention is to provide the high-speed, high precision positioner that a kind of 2DOF cartesian coordinate type that is directly driven by linear voice coil motor is used for the IC Chip Packaging.The design feature of this device is to adopt novel decoupling-structure, driver part is placed on the base, reduced motion of mechanism inertia, improved the dynamic characteristic of system, the characteristics that have the decoupling zero of traditional X-ray Y working table movement simultaneously, linear grating feeds back as terminal position, can guarantee the high-speed, high precision of system preferably.
The present invention is achieved by the following technical programs.The precision positioning device (with reference to the accompanying drawings) that is used for the IC Chip Packaging has Y and intersects roller guide rail 13, X guiding intersection roller guide rail 14, X to linear grating chi 15, preceding needle bearing 18, rolling guide 19, back needle bearing 20, spring 22 to linear voice coil motor 10, soldering tip 11, Y to linear grating chi 12, Y guiding with linear voice coil motor 9, X to linear voice coil motor 1, driving soldering tip.Adopt Y to linear voice coil motor 1 drive Y to positioning table 16 along Y to moving, adopt X to linear voice coil motor 10 drive X to positioning table 17 along X to moving.Be X to all adopting linear voice coil motor directly to drive to the motion of positioning table with Y, saved transmission link, and voice coil motor has unlimited resolution in theory, have and do not have characteristics such as lag behind, high response, high-speed and high acceleration, control are convenient.X all is fixedly mounted on the pedestal 23 to linear voice coil motor 1 to linear voice coil motor 10 and Y, has alleviated the weight of moving component, has reduced inertia.X is connected with pedestal 23 by a pair of X guiding intersection roller guide rail 14 to positioning table 17, and Y places X to positioning table 17 tops to positioning table 16, is connected to positioning table 17 with X by a pair of Y guiding intersection roller guide rail 13.X to positioning table 17 and X between linear voice coil motor 10 for being rigidly connected.Y is connected by no gap decoupling mechanism between drive motors with Y to positioning table, and design has the characteristics of traditional X-ray Y positioning table kinematic decoupling like this.Y links to each other by the elasticity decoupling-structure between linear voice coil motor 1 with Y to positioning table 16.
The elasticity decoupling-structure is: Y is rigidly connected to linear voice coil motor 1 and blade fin 3, preceding needle bearing 18 is installed on blade fin 3 by front roller shaft 6, back needle bearing 20 also is installed on blade fin 3 by back guide wheel shaft 4, and blade fin 3 is connected with pedestal 23 by rolling guide 19.Front jocket wheel abrasive sheet 7 is all fixedlyed connected with elastic hinge 5 with back guide wheel abrasive sheet 21, and elastic hinge 5 is fixed in Y to positioning table 16, and pretension connecting rod 2 passes through back guide wheel shaft 4 and links to each other with spring 22 on the blade fin 3.Preceding needle bearing 18 rolls with front jocket wheel abrasive sheet 7 and contacts, and back needle bearing 20 rolls with back guide wheel abrasive sheet 21 and contacts.
X is installed in pedestal 23 middle parts as the feedback element of X to positioning table 17 terminal positions to linear grating chi 15, Y to linear grating chi 12 also be installed in X to the middle part of positioning table 17 as the feedback element of Y to positioning table 16 terminal positions.Adopt the linear grating chi as the terminal position feedback element, the assurance system realizes the high-speed, high precision motion.Soldering tip 11 is fixedly installed in Y to positioning table 16 by soldering tip supporter 8, drives along Z to moving with linear voice coil motor 9 by driving soldering tip.
Description of drawings
Accompanying drawing is a three-dimensional structure diagram of the present invention.
Among the figure: Y is to linear voice coil motor-1; Pretension connecting rod-2; Blade fin-3; Back guide wheel shaft-4; Elastic hinge-5; Front roller shaft-6; Front jocket wheel abrasive sheet-7; Soldering tip supporter-8; Drive soldering tip linear voice coil motor-9; X is to linear voice coil motor-10; Soldering tip-11; Y is to linear grating chi-12; Y guiding intersection roller guide rail-13; X guiding intersection roller guide rail-14; X is to linear grating chi-15; Y is to positioning table-16; X is to positioning table-17; Preceding needle bearing-18; Rolling guide-19; Back needle bearing-20; Back guide wheel abrasive sheet-21; Spring-22; Pedestal-23.
Embodiment
Below in conjunction with the drawings and specific embodiments formation of the present invention is described further.
As shown in the figure, X is fixedly mounted on the pedestal 23 to linear voice coil motor 1 to linear voice coil motor 10 and Y.X is connected with pedestal 23 by X guiding intersection roller guide rail 14 to positioning table 17, and X is rigidly connected between positioning table 17 to linear voice coil motor 10 and X, moves on directions X to positioning table 17 thereby drive X.With screw that blade fin 3 is fixing to linear voice coil motor 1 with Y, rolling guide 19 is fixed on the pedestal 23.Front roller shaft 6 is fixed in blade fin 3, and blade fin 3 is installed on rolling guide 19 again and can moves on the Y direction.Y is connected to positioning table 16 with Y by elastic link to linear voice coil motor 1, before needle bearing 18 be sleeved on the front roller shaft 6 and be fixed on the front jocket wheel abrasive sheet 7 of Y on positioning table 16 and fit, and preceding needle bearing 18 can realize that thus Y travels forward and motion of workbench Y direction and the decoupling zero of X to motion to positioning table 16 in the 7 surface rollings of front jocket wheel abrasive sheet on the Y direction.Back guide wheel shaft 4 is fixed in blade fin 3, and back needle bearing 20 is set on the guide wheel shaft 4 of back and with back guide wheel abrasive sheet 21 and fits, and makes back needle bearing 20 roll on back guide wheel abrasive sheet 21 surfaces.Realize that thus Y is to positioning table 16 motion backward on the Y direction.Blade fin 3 and fixing with back guide wheel shaft 4 with screw is fixed in the end of pretension connecting rod 2, and the other end of pretension connecting rod 2 links to each other with spring 22 on being fixed on blade fin 3.Front jocket wheel abrasive sheet 7 is fixedlyed connected with elastic hinge 5 with back guide wheel abrasive sheet 21 usefulness screws.Be fixedly mounted on the blade fin 3, soldering tip 11 is fixedly mounted on Y on positioning table 16 by soldering tip supporter 8, drives with linear voice coil motor 9 by driving soldering tip, can go up motion in Z direction (vertical direction).The X that is driven to linear voice coil motor 10 by X is to the motion of positioning table 17 on directions X, with synthetic to the Y that linear voice coil motor 1 drives, just determined to be installed in soldering tip 11 the position on X-Y plane of Y on positioning table 16 to the motion of positioning table 16 on the Y direction by Y.The motion of soldering tip 11 on the Z direction that drives linear voice coil motor 9 drivings with soldering tip combines, and realizes the three-degree-of-freedom motion of soldering tip 11, finishes location and weld task.
Beneficial effect of the present invention is: adopt linear voice coil motor directly to drive X, Y workbench, saved transmission ring Joint, and voice coil motor has unlimited resolution ratio has more and has or not hysteresiss, highly responds, reaches at a high speed high acceleration, volume The characteristics such as little, that force characteristic good, control is convenient have improved the performance of this positioner effectively. The Y-direction positioning table and Connected by the gapless decoupling mechanism between the Y-direction drive motors, make mechanism not only have traditional X-ray Y positioning table kinematic solution The characteristics of coupling, and the drive motors of X-direction and Y-direction positioning table all can be placed on the base, motion alleviated The weight of parts has reduced inertia. And X, Y positioning table adopt the linear grating chi as terminal position feedback unit Part, the assurance system realizes the high-speed, high precision motion. The present invention also can be used for the MEMS device except being applicable to the IC chip package Little connection of part and little assembling.
Claims (5)
1. the precision positioning device that is used for the IC Chip Packaging, has Y to linear voice coil motor (1), drive soldering tip linear voice coil motor (9), X is to linear voice coil motor (10), soldering tip (11), Y is to linear grating chi (12), Y guiding intersection roller guide rail (13), X guiding intersection roller guide rail (14), X is to linear grating chi (15), preceding needle bearing (18), rolling guide (19), back needle bearing (20), spring (22), it is characterized in that adopting Y to linear voice coil motor (1) drive Y to positioning table (16) along Y to moving, adopt X to linear voice coil motor (10) drive X to positioning table (17) along X to moving, X all is fixedly mounted on the pedestal (23) to linear voice coil motor (1) to linear voice coil motor (10) and Y, X is connected with pedestal (23) by a pair of X guiding intersection roller guide rail (14) to positioning table (17), Y places X to positioning table (17) top to positioning table (16), be connected to positioning table (17) with X by a pair of Y guiding intersection roller guide rail (13), Y links to each other by the elasticity decoupling-structure between linear voice coil motor (1) with Y to positioning table (16), X is installed in pedestal (23) middle part as the terminal position feedback element of X to positioning table (17) to linear grating chi (15), Y to linear grating chi (12) be installed in X to positioning table (17) middle part as the terminal position feedback element of Y to positioning table (16), soldering tip (11) is fixedly installed in Y to positioning table (16) by soldering tip supporter (8), drives along Z to moving with linear voice coil motor (9) by driving soldering tip.
2. according to the described precision positioning device that is used for the IC Chip Packaging of claim 1, it is characterized in that described elasticity decoupling-structure: Y is rigidly connected to linear voice coil motor (1) and blade fin (3), preceding needle bearing (18) is installed on blade fin (3) by front roller shaft (6), back needle bearing (20) also is installed on blade fin (3) by back guide wheel shaft (4), and blade fin (3) is connected with pedestal (23) by rolling guide (19).
3. according to the described precision positioning device that is used for the IC Chip Packaging of claim 1, it is characterized in that described elasticity decoupling-structure also comprises: front jocket wheel abrasive sheet (7) is all fixedlyed connected with elastic hinge (5) with back guide wheel abrasive sheet (21), elastic hinge (5) is fixed in Y to positioning table (16), and pretension connecting rod (2) links to each other with spring (22) on the blade fin (3) by described back guide wheel shaft (4).
4. according to the described precision positioning device that is used for the IC Chip Packaging of claim 1, it is characterized in that described preceding needle bearing (18) contacts with front jocket wheel abrasive sheet (7) rolling, back needle bearing (20) rolls with back guide wheel abrasive sheet (21) and contacts.
5. according to the described precision positioning device that is used for the IC Chip Packaging of claim 1, it is characterized in that described X to positioning table (17) and X between linear voice coil motor (10) for being rigidly connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410093662 CN1284222C (en) | 2004-11-29 | 2004-11-29 | Precisively positioning device for IC chip package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410093662 CN1284222C (en) | 2004-11-29 | 2004-11-29 | Precisively positioning device for IC chip package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1614761A CN1614761A (en) | 2005-05-11 |
| CN1284222C true CN1284222C (en) | 2006-11-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410093662 Expired - Fee Related CN1284222C (en) | 2004-11-29 | 2004-11-29 | Precisively positioning device for IC chip package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1284222C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1319892C (en) * | 2005-11-30 | 2007-06-06 | 哈尔滨工业大学 | Automatic bonding machine for MEMS high temp. pressure sensor |
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2004
- 2004-11-29 CN CN 200410093662 patent/CN1284222C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1614761A (en) | 2005-05-11 |
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Granted publication date: 20061108 Termination date: 20091229 |