CN1274460C - Welding grease for electronic industry - Google Patents
Welding grease for electronic industry Download PDFInfo
- Publication number
- CN1274460C CN1274460C CN 200410022403 CN200410022403A CN1274460C CN 1274460 C CN1274460 C CN 1274460C CN 200410022403 CN200410022403 CN 200410022403 CN 200410022403 A CN200410022403 A CN 200410022403A CN 1274460 C CN1274460 C CN 1274460C
- Authority
- CN
- China
- Prior art keywords
- flux
- quality
- soldering paste
- perfluor
- electronic industry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003466 welding Methods 0.000 title claims abstract description 42
- 239000004519 grease Substances 0.000 title 1
- 230000004907 flux Effects 0.000 claims abstract description 93
- 239000000843 powder Substances 0.000 claims abstract description 28
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 25
- 239000000956 alloy Substances 0.000 claims abstract description 25
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- 239000003381 stabilizer Substances 0.000 claims abstract description 18
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 17
- 239000011737 fluorine Substances 0.000 claims abstract description 17
- 239000011347 resin Substances 0.000 claims abstract description 13
- 229920005989 resin Polymers 0.000 claims abstract description 13
- 238000000518 rheometry Methods 0.000 claims abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 13
- 239000004094 surface-active agent Substances 0.000 claims abstract description 12
- 150000001733 carboxylic acid esters Chemical class 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 43
- 238000005476 soldering Methods 0.000 claims description 31
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 14
- 239000012190 activator Substances 0.000 claims description 14
- -1 carboxylic acid fluoride Chemical class 0.000 claims description 11
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 claims description 6
- 229940107816 ammonium iodide Drugs 0.000 claims description 5
- CCUWGJDGLACFQT-UHFFFAOYSA-N 2,2,3,3,4,4-hexafluoropentanedioic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(O)=O CCUWGJDGLACFQT-UHFFFAOYSA-N 0.000 claims description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-N Betaine Natural products C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 claims description 4
- KWIUHFFTVRNATP-UHFFFAOYSA-O N,N,N-trimethylglycinium Chemical compound C[N+](C)(C)CC(O)=O KWIUHFFTVRNATP-UHFFFAOYSA-O 0.000 claims description 4
- 229960003237 betaine Drugs 0.000 claims description 4
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims description 4
- FRIYHISQFBWFCN-UHFFFAOYSA-N 10-[(2-methylpropan-2-yl)oxy]-10-oxodecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCC(O)=O FRIYHISQFBWFCN-UHFFFAOYSA-N 0.000 claims description 3
- SNOPFBNMUDQLMF-UHFFFAOYSA-N 6-[(2-methylpropan-2-yl)oxy]-6-oxohexanoic acid Chemical compound CC(C)(C)OC(=O)CCCCC(O)=O SNOPFBNMUDQLMF-UHFFFAOYSA-N 0.000 claims description 3
- WLXKXODDEKLXIG-UHFFFAOYSA-N CC(C)(C)OC(C(C(C(C(O)=O)(F)F)(F)F)(F)F)=O Chemical compound CC(C)(C)OC(C(C(C(C(O)=O)(F)F)(F)F)(F)F)=O WLXKXODDEKLXIG-UHFFFAOYSA-N 0.000 claims description 3
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 3
- 239000001361 adipic acid Substances 0.000 claims description 3
- 235000011037 adipic acid Nutrition 0.000 claims description 3
- SNGREZUHAYWORS-UHFFFAOYSA-N perfluorooctanoic acid Chemical compound OC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F SNGREZUHAYWORS-UHFFFAOYSA-N 0.000 claims description 3
- HXJXVFDFTKCNHP-UHFFFAOYSA-N tert-butyl 2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-pentadecafluorooctanoate Chemical compound CC(C)(C)OC(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F HXJXVFDFTKCNHP-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- 230000003213 activating effect Effects 0.000 abstract description 5
- 238000009736 wetting Methods 0.000 abstract description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract 3
- VTJUKNSKBAOEHE-UHFFFAOYSA-N calixarene Chemical class COC(=O)COC1=C(CC=2C(=C(CC=3C(=C(C4)C=C(C=3)C(C)(C)C)OCC(=O)OC)C=C(C=2)C(C)(C)C)OCC(=O)OC)C=C(C(C)(C)C)C=C1CC1=C(OCC(=O)OC)C4=CC(C(C)(C)C)=C1 VTJUKNSKBAOEHE-UHFFFAOYSA-N 0.000 abstract 1
- 150000001735 carboxylic acids Chemical class 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 150000002894 organic compounds Chemical class 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000005057 refrigeration Methods 0.000 description 6
- 239000004359 castor oil Substances 0.000 description 4
- 235000019438 castor oil Nutrition 0.000 description 4
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- SBNFWQZLDJGRLK-UHFFFAOYSA-N phenothrin Chemical compound CC1(C)C(C=C(C)C)C1C(=O)OCC1=CC=CC(OC=2C=CC=CC=2)=C1 SBNFWQZLDJGRLK-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004021 metal welding Methods 0.000 description 2
- ULWHHBHJGPPBCO-UHFFFAOYSA-N propane-1,1-diol Chemical class CCC(O)O ULWHHBHJGPPBCO-UHFFFAOYSA-N 0.000 description 2
- 229910000648 terne Inorganic materials 0.000 description 2
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 2
- RPAJSBKBKSSMLJ-DFWYDOINSA-N (2s)-2-aminopentanedioic acid;hydrochloride Chemical compound Cl.OC(=O)[C@@H](N)CCC(O)=O RPAJSBKBKSSMLJ-DFWYDOINSA-N 0.000 description 1
- OWRCNXZUPFZXOS-UHFFFAOYSA-N 1,3-diphenylguanidine Chemical compound C=1C=CC=CC=1NC(=N)NC1=CC=CC=C1 OWRCNXZUPFZXOS-UHFFFAOYSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 229910017944 Ag—Cu Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-UHFFFAOYSA-N Glutamic acid Natural products OC(=O)C(N)CCC(O)=O WHUUTDBJXJRKMK-UHFFFAOYSA-N 0.000 description 1
- WHUUTDBJXJRKMK-VKHMYHEASA-N L-glutamic acid Chemical compound OC(=O)[C@@H](N)CCC(O)=O WHUUTDBJXJRKMK-VKHMYHEASA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000002635 aromatic organic solvent Substances 0.000 description 1
- 229960005070 ascorbic acid Drugs 0.000 description 1
- 235000010323 ascorbic acid Nutrition 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- QBXJGGDHZLBZDS-UHFFFAOYSA-N butane-1,1-diamine;hydrochloride Chemical compound Cl.CCCC(N)N QBXJGGDHZLBZDS-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- QOHWJRRXQPGIQW-UHFFFAOYSA-N cyclohexanamine;hydron;bromide Chemical compound Br.NC1CCCCC1 QOHWJRRXQPGIQW-UHFFFAOYSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 235000013922 glutamic acid Nutrition 0.000 description 1
- 239000004220 glutamic acid Substances 0.000 description 1
- 229960003707 glutamic acid hydrochloride Drugs 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Abstract
The present invention relates to a welding paste for electronic industry, which is prepared from the following materials with the mass percentage of 85 to 94% of alloy welding powder and 6 to 15% of welding flux, wherein the welding flux comprises resin, solvents, rheology control agents, activating agents and stabilizing agents, wherein the resin content accounts for 40 to 60% of the quality of the welding flux, the solvent content accounts for 30 to 50% of the quality of the welding flux, the rheology control agent content accounts for 1 to 10% of the quality of the welding flux, the activating agent content accounts for 0.2 to 15% of the quality of the welding flux, and the stabilizing agent content accounts for 0.01 to 10% of the quality of the welding flux. The activating agents adopt carboxylic acids containing fluorine or organic compounds containing fluorine of carboxylic acid esters in order to improve the wetting property of the welding paste; the stabilizing agents adopt calixarene compounds in order to improve the storage stability of the welding paste. In addition, surface active agents containing fluorine can be also added in the welding flux so that the storage stability of the welding flux is further improved.
Description
Technical field
The present invention relates to the used in electronic industry soldering paste, particularly be used for the solder paste that electronic devices and components are installed, its alloy welding powder is Sn-Pb alloy or lead-free alloy.
Background technology
Soldering paste is made up of the spherical alloy welding powder and the solder flux of ultra-fine (20-75 micron).Solder flux makes soldering paste possess performances such as certain activity, viscoplasticity, thixotropy as the suspending carrier of welding powder.Solder flux comprises multiple compounds such as resin, solvent, activator, rheology control agent, stabilizing agent, and activator is generally the halogen acid salt of organic amine or the organic monobasic or the dicarboxylic acids of perhydro, and stabilizing agent is generally phenol compound or ascorbic acid.
Soldering paste has a kind of the growth in time and the trend (all can hardening or solidify no matter whether use it) of hardening or solidifying between storage period, thereby can not store in a large number, must continuous feeding.For different types of soldering paste, in identical time range, harden or the speed of solidifying is different, harden or the speed of solidifying fast, it is poor then to be referred to as storage stability, harden or the speed of solidifying slow, it is good then to be referred to as storage stability.Miniaturization development along with electronic products needs the higher welding of fine degree, causes the average grain diameter of alloy welding powder constantly to reduce, and specific area increases, thereby makes the further variation of storage stability of solder paste.
Lead-free solder paste is the developing direction of soldering paste, be entitled as in the technical report of " prospect of the unleaded substitute of Reflow Soldering " at one piece, Benlih doctor Huang of American I ndium company etc. has studied the compatibility of lead-free alloy welding powder that kind surplus the terne metal welding powder and ten is rich in prospect and existing several different main flow solder flux.The result shows, at aspects such as solder ball, wetability, solder joint outward appearances, and the scoring 27.1 of terne metal welding powder (full marks 30), the scoring of several alloy welding powders of SnAg mainly is that wetability is low between 17-20.3 (full marks 30) in the lead-free systems.And the scoring of 89Sn8Zn3Bi only is 2.2 (full marks 30), and tracing it to its cause is that active metal Zn and flux reaction in the alloy welding powder causes, and makes the storage stability of the solder paste extreme difference that becomes.In sum, solder flux being improved is the key point that improves lead-free solder paste wetability and storage stability.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, improve the wetability and the storage stability of soldering paste, for the electronics industry welding provides a kind of novel soldering paste.
Technical scheme of the present invention is: the solder flux to existing soldering paste improves, by changing the activating agent of forming solder flux and wetability and the storage stability that stabilizing agent improves soldering paste.
Used in electronic industry soldering paste of the present invention is made up of alloy welding powder and solder flux, the mass percent 85～94% of alloy welding powder, the mass percent 6～15% of solder flux.Solder flux comprises resin, solvent, rheology control agent, activator, stabilizing agent, the content of resin is 40～60% of flux quality, the content of solvent is 30～50% of flux quality, the content of rheology control agent is 1～10% of flux quality, the content of activator is 0.2～15% of flux quality, and the content of stabilizing agent is 0.01～10% of flux quality.Alloy welding powder includes lead welding powder (Sn-Pb system) and leadless welding powder (Sn-Ag-Cu system, Sn-Ag-Bi system, Sn-Zn system).Resin in the solder flux can be a natural resin, also can be synthetic resin.Solvent in the solder flux can be alcohols, ethers, ester class or aromatic organic solvent, for example uses isopropyl alcohol, phenmethylol, methyl cellosolve, ethyl cellosolve, butyl carbitol, terpinol, DGDE, propane diols monophenyl ether etc.Rheology control agent in the solder flux is rilanit special or modified hydrogenated castor oil.In order to improve the wetability of soldering paste, activator is selected for use and is contained carboxylic acid fluoride or fluorine-containing carboxylic acid esters organic compound, concretely, comprise carbon number exactly and be 4～20 fluorine-containing or perfluor monocarboxylic acid, dicarboxylic acids and corresponding ester thereof, the pure residue preferred alkyl of these esters, pi-allyl, cycloalkyl, special preferred tertiary butyl, isopropyl, isobutyl group, these pure residues also can contain halogen atom in addition; Contain carboxylic acid fluoride and be at least a kind of in perfluoro caprylic acid, perfluor succinic acid, perfluoroglutaric acid, perfluor adipic acid, the perfluor decanedioic acid, contain fluorim carboxylic ester and be at least a kind of in the perfluoro caprylic acid tert-butyl ester, the perfluoroglutaric acid tert-butyl ester, the perfluor adipic acid tert-butyl ester, the perfluor decanedioic acid tert-butyl ester.Activator can also add a small amount of cyclohexylamine hydrobromide, butanediamine hydrochloride, glutamic acid hydrochloride, glutamic acid hydrobromate, diphenylguanidine hydrobromate etc. according to the height of wetability requirement.In order to improve the storage stability of soldering paste, stabilizing agent is selected the following calixarene compound of structural formula for use:
n＝4，6
R
1=H or phenyl or-CH
2CH
2COOEt
R
2=the H or the tert-butyl group or phenyl or-CH
2CH
2COOEt
Calixarene compound and other hindered phenol, hindered amine are composite, and effect is better.
In addition, can also add fluorine-containing surfactant in the solder flux, with the storage stability of further raising soldering paste, the addition of fluorine-containing surfactant be flux quality 0.01-10%.Fluorine-containing surfactant is perfluor betaine or perfluorooctyl sulfonyl quaternary ammonium iodide.
Alloy welding powder that will meet fills a prescription requires and solder flux fully mix and promptly are prepared into soldering paste, and product should remain on refrigeration below 5 ℃.
Beneficial effect of the present invention:
1, owing to the preferred adding that reaches fluorine-containing surfactant of activating agent, stabilizing agent, soldering paste of the present invention has excellent wetting capacity and storage stability, according to standard J-STD-004, J-STD-006, MIL-STD-2000 detects, and wetability is the I level, and the rate of spread is greater than 65mm
2At 5 ℃ of stored refrigerated six months performance no changes.
2, soldering paste of the present invention not only has excellent wetting capacity and storage stability, and other performance all meets the requirements, according to standard J-STD-004, J-STD-006, MIL-STD-2000 detects, and aridity is qualified, and the bronze mirror corrosion test is qualified, the solder ball test is best, ionic pollution degree≤0.25 μ gNaCl/cm
2, slump the bridging phenomenon do not occur for＞0.15mm gap, 168 hours insulaion resistance＞1.8 * 10 after the welding
9Ω.
The specific embodiment
Embodiment 1
In the present embodiment, alloy welding powder is Sn63-Pb37, its content 90% (mass percent), the content 10% (mass percent) of solder flux.
The component of solder flux and each components contents are as follows:
35% of resin Foral flux quality
19% of superfine rosin flux quality
17% of solvent isopropyl alcohol flux quality
25.6% of terpinol flux quality
2.95% of the modified hydrogenated castor oil flux quality of rheology control agent
0.25% of activator perfluoro caprylic acid flux quality
0.15% of perfluoroglutaric acid flux quality
Stabilizing agent is to 0.05% of tert-butyl group cup [4] flux quality
Above-mentioned alloy welding powder and solder flux fully mixed promptly be prepared into soldering paste, product should remain on refrigeration below 5 ℃.
Embodiment 2
In the present embodiment, alloy welding powder is Sn95.5-Ag3.8-Cu0.7, its content 85% (mass percent), the content 15% (mass percent) of solder flux.
The component of solder flux and each components contents are as follows:
20% of resin polyacrylate flux quality
25% of polyurethane flux quality
40% of solvent DGDE flux quality
5% of rheology control agent rilanit special flux quality
4% of activator perfluoroglutaric acid tert-butyl ester flux quality
4% of perfluor adipic acid flux quality
Stabilizing agent is to 2% of tert-butyl group cup [6] flux quality
Above-mentioned alloy welding powder and solder flux fully mixed promptly be prepared into soldering paste, product should remain on refrigeration below 5 ℃.
Embodiment 3
In the present embodiment, alloy welding powder is Sn91.8-3.4Ag-4.8Bi, its content 94% (mass percent), the content 6% (mass percent) of solder flux.
The component of solder flux and each components contents are as follows:
45% of resin polymerization rosin flux quality
38.5% of solvent methyl cellosolve flux quality
8% of rheology control agent rilanit special flux quality
1.5% of activator perfluoroglutaric acid flux quality
3% of perfluor adipic acid tert-butyl ester flux quality
Stabilizing agent is to 3.95% of phenyl cup [4] flux quality
0.05% of fluorine-containing surfactant perfluor betaine flux quality
Above-mentioned alloy welding powder and solder flux fully mixed promptly be prepared into soldering paste, product should remain on refrigeration below 5 ℃.
Embodiment 4
In the present embodiment, alloy welding powder is Sn89-8Zn-3Bi, its content 90% (mass percent), the content 10% (mass percent) of solder flux.
The component of solder flux and each components contents are as follows:
40% of resin disproportionated rosin flux quality
34% of solvent ethyl cellosolve flux quality
6% of the modified hydrogenated castor oil flux quality of rheology control agent
6% of activator perfluor decanedioic acid flux quality
6% of perfluor decanedioic acid tert-butyl ester flux quality
Stabilizing agent is to 6% of phenyl cup [6] flux quality
2% of fluorine-containing surfactant perfluorooctyl sulfonyl quaternary ammonium iodide flux quality
Above-mentioned alloy welding powder and solder flux fully mixed promptly be prepared into soldering paste, product should remain on refrigeration below 5 ℃.
Embodiment 5
In the present embodiment, alloy welding powder is Sn91-9Zn, its content 85% (mass percent), the content 15% (mass percent) of solder flux.
The component of solder flux and each components contents are as follows:
40% of resin Foral flux quality
38% of solvent propane diols monophenyl ether flux quality
2% of the modified hydrogenated castor oil flux quality of rheology control agent
10% of activator perfluoro caprylic acid tert-butyl ester flux quality
Stabilizing agent is to 4% of phenyl cup [6] flux quality
6% of fluorine-containing surfactant perfluorooctyl sulfonyl quaternary ammonium iodide flux quality
Above-mentioned alloy welding powder and solder flux fully mixed promptly be prepared into soldering paste, product should remain on refrigeration below 5 ℃.
Claims (7)
1, a kind of used in electronic industry soldering paste, form by alloy welding powder and solder flux, the mass percent 85～94% of alloy welding powder, the mass percent 6～15% of solder flux, solder flux comprises resin, solvent, rheology control agent, activator, stabilizing agent, the content of resin is 40～60% of flux quality, the content of solvent is 30～50% of flux quality, the content of rheology control agent is 1～10% of flux quality, the content of activator is 0.2～15% of flux quality, the content of stabilizing agent is 0.01～10% of flux quality, it is characterized in that activator is for containing carboxylic acid fluoride or fluorine-containing carboxylic acid esters organic compound.
2, used in electronic industry soldering paste according to claim 1, it is characterized in that containing carboxylic acid fluoride and be at least a kind of in perfluoro caprylic acid, perfluor succinic acid, perfluoroglutaric acid, perfluor adipic acid, the perfluor decanedioic acid, contain fluorim carboxylic ester and be at least a kind of in the perfluoro caprylic acid tert-butyl ester, the perfluoroglutaric acid tert-butyl ester, the perfluor adipic acid tert-butyl ester, the perfluor decanedioic acid tert-butyl ester.
3, used in electronic industry soldering paste according to claim 1 and 2 is characterized in that stabilizing agent is a calixarene compound, and structural formula is as follows:
n＝4.6
R
1=H or phenyl or-CH
2CH
2COOEt
R
2=the H or the tert-butyl group or phenyl or-CH
2CH
2COOEt
4, used in electronic industry soldering paste according to claim 1 and 2 is characterized in that can also adding the fluorine-containing surfactant that improves storage stability in the solder flux, and its addition is 0.01～10% of a flux quality.
5, used in electronic industry soldering paste according to claim 3 is characterized in that can also adding the fluorine-containing surfactant that improves storage stability in the solder flux, and its addition is 0.01～10% of a flux quality.
6, used in electronic industry soldering paste according to claim 4 is characterized in that fluorine-containing surfactant is perfluor betaine or perfluorooctyl sulfonyl quaternary ammonium iodide.
7, used in electronic industry soldering paste according to claim 5 is characterized in that fluorine-containing surfactant is perfluor betaine or perfluorooctyl sulfonyl quaternary ammonium iodide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410022403 CN1274460C (en) | 2004-04-27 | 2004-04-27 | Welding grease for electronic industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410022403 CN1274460C (en) | 2004-04-27 | 2004-04-27 | Welding grease for electronic industry |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1569384A CN1569384A (en) | 2005-01-26 |
| CN1274460C true CN1274460C (en) | 2006-09-13 |
Family
ID=34480092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410022403 Expired - Lifetime CN1274460C (en) | 2004-04-27 | 2004-04-27 | Welding grease for electronic industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1274460C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101733573B (en) * | 2009-11-04 | 2012-09-19 | 昆山成利焊锡制造有限公司 | Lead-free and halogen-free environmental soldering paste for electronic industry |
| JP5486281B2 (en) * | 2009-12-08 | 2014-05-07 | 荒川化学工業株式会社 | Solder paste |
| CN102785039B (en) * | 2012-07-30 | 2015-04-15 | 东莞永安科技有限公司 | Solder paste and preparation method thereof |
-
2004
- 2004-04-27 CN CN 200410022403 patent/CN1274460C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1569384A (en) | 2005-01-26 |
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