CN1273425A - Technology for making thermosensitive resistor for surface mount - Google Patents
Technology for making thermosensitive resistor for surface mount Download PDFInfo
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- CN1273425A CN1273425A CN 99113684 CN99113684A CN1273425A CN 1273425 A CN1273425 A CN 1273425A CN 99113684 CN99113684 CN 99113684 CN 99113684 A CN99113684 A CN 99113684A CN 1273425 A CN1273425 A CN 1273425A
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- metal layer
- thermosensitive resistor
- resistance chip
- electric conduction
- plate
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Abstract
A technology for preparing the thermosensitive resistor for surface mounting includes such steps as generating metallized layer on both surface of resistor chip by printing or sintering method, partially coating protective layer on the metallized layer and welding the electrode pieces to the metalized layer where there is no protective layer. It can prevent the high temp. of the thermosensitive resistor itself, resulting in adversification of high refractory performance and electric properties.
Description
The present invention relates to the resistor of resistance value, more specifically be meant a kind of manufacture craft that is used for the thermosensitive resistor for surface mount of electronics with variation of temperature.
Be used for electronics and generally be made into oblate column structure buttony as the thermosensitive resistor for surface mount (SMD-CPTC) of current protection, this thermistor mainly comprises resistance chip and electric conduction electrode-plate, electric conduction electrode-plate is welded in the upper and lower surface of resistance chip the two poles of the earth as thermistor, in the welding production technical process, during the scolder of the resistance chip of thermistor and electric conduction electrode-plate welding adopts, solder, its solution temperature is at 200 ℃-230 ℃, and when over-current shock, the thermistor self-heating, temperature can rise to more than 200 ℃, and, during installation, this resistance also can stand 230 ℃-250 ℃ high temperature, therefore with in this, the resistance to elevated temperatures of the thermistor that solder is made is poor; On the other hand; the surface metalation layer of electric conduction electrode-plate is to be made by zinc-Yin, nickel-Yin, ag material; this metal layer surface regular meeting is exposed in the air, is exposed to airborne metal layer oxidation and other chemical reaction can take place, and makes the mis-behave and the instability of thermistor.
For this reason, the present invention is directed to the shortcoming that exists in the manufacture craft of above-mentioned thermosensitive resistor for surface mount, propose a kind of manufacture craft of thermosensitive resistor for surface mount.
To achieve these goals, the present invention adopts following technical scheme, and this method may further comprise the steps:
Step 1 adopts the mode of printing or sintering to make metal layer in resistance chip upper and lower surface;
Step 2 on the metal layer of resistance chip surface, partly applies protective finish;
Step 3 is welded on electric conduction electrode-plate on the metal layer that does not have coated protective layer with high-temperature solder again.
Or:
Step 1 adopts the mode of printing or sintering to make metal layer in resistance chip upper and lower surface;
Step 2, with high-temperature solder up and down electric conduction electrode-plate be welded on the metal layer of upper and lower surface of resistance chip;
Step 3 does not have to apply protective finish in the dip-coating mode on the metal layer of soldered electric conduction electrode-plate in resistance chip upper and lower surface.
Because the present invention adopts the mode of printing or sintering to make metal layer on resistance chip two surfaces earlier, applies protective finish on ground, metal layer top then, electric conduction electrode-plate is welded in not to be had on the armor coated metal layer; Or earlier electric conduction electrode-plate is welded on the metal layer of upper and lower surface of resistance chip, apply protective finish in the dip-coating mode again; And adopt high-temperature solder replace original employing in, solder.Therefore, make thermosensitive resistor for surface mount with technology of the present invention and can overcome the thermistor self-heating effectively, temperature can rise to the thermistor resistance to elevated temperatures difference brought more than 200 ℃ and the phenomenon that electrical property that oxidation and other chemical reaction produce worsens can take place because of metal layer.
Below by embodiment, the present invention is described in further detail:
Method of the present invention adopts following steps respectively:
Step 1 adopts the mode of printing or sintering to make metal layer in resistance chip upper and lower surface, and metal layer adopts zinc-Yin, nickel-Yin or silver coating material.
Step 2 on the metal layer of resistance chip upper and lower surface, partly applies protective finish,, does not apply protective finish in the place of needs welding electric conduction electrode-plate that is, and electric conduction electrode-plate directly is welded on the metal layer.Then need to apply protective finish in the place of not welding electric conduction electrode-plate.
Step 3 is welded on electric conduction electrode-plate on the metal layer that does not have coated protective layer with high-temperature solder again, and the high-temperature solder that is adopted is that fusion temperature is 250 ℃-280 ℃ a scolder.
As the embodiment of armor coated mode, in described step 2, apply the coating method that protective finish adopts the coating method of silk screen printing or adopts bat printing on the ground, metal layer top of resistance chip upper and lower surface.
Above-mentioned silk screen printing and pad printing method all are known surface treatment method.
Method of the present invention also can adopt following step:
Step 1 adopts the mode of printing or sintering to make metal layer in resistance chip upper and lower surface, and same, metal layer adopts zinc-Yin, nickel-Yin or silver-colored material coating material.
Step 2, with high-temperature solder up and down electric conduction electrode-plate be welded on the metal layer of upper and lower surface of resistance chip, the high-temperature solder that is adopted is that fusion temperature is 250 ℃-280 ℃ a scolder.
Step 3; do not have on the metal layer of soldered electric conduction electrode-plate in resistance chip upper and lower surface; apply protective finish in the dip-coating mode; in dip-coating; protective finish on just can dip-coating on the soldered metal layer that electric conduction electrode-plate arranged, and do not have on the soldered metal layer that electric conduction electrode-plate arranged will be by dip-coating on protective finish.
Equally, dip-coating mode also is the method for known general-purpose.
Claims (6)
1, a kind of manufacture craft of thermosensitive resistor for surface mount is characterized in that:
Step 1 adopts the mode of printing or sintering to make metal layer in resistance chip upper and lower surface;
Step 2 on the metal layer of resistance chip upper and lower surface, partly applies protective finish;
Step 3 is welded on electric conduction electrode-plate on the metal layer that does not have coated protective layer with high-temperature solder again.
2, the manufacture craft of thermosensitive resistor for surface mount as claimed in claim 1 is characterized in that: in the described step 2, apply the coating method that protective finish adopts silk screen printing on the ground, metal layer top of resistance chip upper and lower surface.
3, the manufacture craft of thermosensitive resistor for surface mount as claimed in claim 1 is characterized in that: in the described step 2, apply the coating method that protective finish adopts bat printing on the metal layer top of resistance chip upper and lower surface.
4, as the manufacture craft of each described thermosensitive resistor for surface mount of claim 1 to 3; it is characterized in that: in described step 3, to be welded in the high-temperature solder that is adopted on the metal layer that does not have coated protective finish be that fusion temperature is 250 ℃-280 ℃ a scolder to electric conduction electrode-plate up and down.
5, a kind of manufacture craft of thermosensitive resistor for surface mount is characterized in that:
Step 1 adopts the mode of printing or sintering to make metal layer in resistance chip upper and lower surface;
Step 2, with high-temperature solder up and down electric conduction electrode-plate be welded on the metal layer of upper and lower surface of resistance chip;
Step 3 does not have to apply protective finish in the dip-coating mode on the metal layer of soldered electric conduction electrode-plate in resistance chip upper and lower surface.
6, the manufacture craft of thermosensitive resistor for surface mount as claimed in claim 5; it is characterized in that: in described step 2, to be welded in the high-temperature solder that is adopted on the metal layer that does not have coated protective finish be that fusion temperature is 250 ℃-280 ℃ a scolder to electric conduction electrode-plate up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99113684 CN1273425A (en) | 1999-05-06 | 1999-05-06 | Technology for making thermosensitive resistor for surface mount |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 99113684 CN1273425A (en) | 1999-05-06 | 1999-05-06 | Technology for making thermosensitive resistor for surface mount |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1273425A true CN1273425A (en) | 2000-11-15 |
Family
ID=5276847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 99113684 Pending CN1273425A (en) | 1999-05-06 | 1999-05-06 | Technology for making thermosensitive resistor for surface mount |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1273425A (en) |
-
1999
- 1999-05-06 CN CN 99113684 patent/CN1273425A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |