CN107393784A - It is a kind of can be resistant to high pressure from control type protector and preparation method thereof - Google Patents
It is a kind of can be resistant to high pressure from control type protector and preparation method thereof Download PDFInfo
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- CN107393784A CN107393784A CN201710800772.7A CN201710800772A CN107393784A CN 107393784 A CN107393784 A CN 107393784A CN 201710800772 A CN201710800772 A CN 201710800772A CN 107393784 A CN107393784 A CN 107393784A
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- 230000001012 protector Effects 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 72
- 230000004888 barrier function Effects 0.000 claims abstract description 57
- 239000000919 ceramic Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 6
- 238000005245 sintering Methods 0.000 claims description 24
- 239000002002 slurry Substances 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 9
- 239000011810 insulating material Substances 0.000 claims description 9
- 238000003475 lamination Methods 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 2
- 230000000052 comparative effect Effects 0.000 claims description 2
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 abstract description 7
- 229910001416 lithium ion Inorganic materials 0.000 abstract description 7
- 239000000463 material Substances 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 11
- 239000000956 alloy Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000035772 mutation Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 241001417527 Pempheridae Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- PSMFTUMUGZHOOU-UHFFFAOYSA-N [In].[Sn].[Bi] Chemical compound [In].[Sn].[Bi] PSMFTUMUGZHOOU-UHFFFAOYSA-N 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005520 electrodynamics Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H69/00—Apparatus or processes for the manufacture of emergency protective devices
- H01H69/02—Manufacture of fuses
- H01H69/022—Manufacture of fuses of printed circuit fuses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/046—Fuses formed as printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/0241—Structural association of a fuse and another component or apparatus
- H01H2085/0283—Structural association with a semiconductor device
Abstract
The present invention relates to it is a kind of can be resistant to high pressure from control type protector and preparation method thereof, category use for electronic products protects component from control type, and component is protected from control type especially suitable for lithium ion battery protection.It is a kind of can be resistant to high pressure from control type protector, including ceramic substrate, electrode, insulating barrier and main conductive circuit, wherein：Described ceramic substrate for rectangle, electrode one, two, three and four is arranged with four sides of the ceramic substrate, the relative electrode of one pair of which is at least connected with a heating layer, and insulating barrier is provided with the heating layer, is covered with electrode layer on the insulating layer；Barrier layer is provided with least on another pair electrode, main conductive circuit is connected by way of welding or printing and sinter between electrode layer and barrier layer, upper lid is bonded in above described ceramic substrate after fluxing agent is coated on the main conductive circuit.Not only there is the function of conventional power current fuse, while the function of thering is autonomous control main conductive circuit to fuse.
Description
Technical field
The present invention relates to it is a kind of can be resistant to high pressure from control type protector and preparation method thereof, category use for electronic products from
Control type protects component, and component is protected from control type especially suitable for lithium ion battery protection.
Background technology
Lithium ion battery since the advent of the world, in portable mobile apparatus such as mobile phone, notebook, tablet personal computer, digital cameras
In applied in large quantities, it is and just many in electric automobile, electric bicycle, unmanned plane, sweeper, electrodynamic balance car etc.
Application in new field.While lithium ion battery has various advantages energy, but still there is easy catching fire, quick-fried
The shortcomings of fried, particularly when being applied on electric car, because it is very huge using the quantity or volume of lithium ion battery, once
Generation is burnt or blast, or even has the danger for injuring life.
The charge and discharge protecting loop of widely used two-stage of lithium ion battery or more at present.First class of protection is added using IC mostly
MOSFET, it can substantially play every protection such as normal excessively stream, overvoltage, anti-reverse charging.But once first class of protection fails（Although this
Kind probability very little, but also still have this possibility）, it is necessary to second class protection plays necessary protective effect.Second class protection is more
MOSFET is added, from a variety of components such as control type protector using PTC, Breaker, SMD Fuse, Thermal Cutoffs, IC.On
State component only has over-pressed safeguard function from control type protector substantially.
In the market from control type protector, determined by the battery core quantity of the lithium ion battery of its corresponding protection
Its model, different application scenarios have different size of protection voltage requirements, cause the model from control protector especially numerous and diverse
（From 1 string to 14 strings etc.）, in actual use material easily malfunction.Has producer on the market using low string number from control type
Protector is applied to high pressure scene, reduces material procurement model.According to formula P=U2/ R, voltage is bigger, and heating power is bigger, more
Be advantageous to main conductive circuit（6）Fuse protection battery core, but have been found that heating layer hinders under high heating power in practical application
It is worth the PTC effects risen.
So market need it is a kind of can be resistant to high pressure from control type protector, you can to realize over-voltage protecting function again
High pressure scene can be used for low string number model, reduce material model.
The content of the invention
Present invention aims at provide it is a kind of can be resistant to high pressure from control type protector,
Another object of the present invention is：A kind of preparation from control type protector that can be resistant to high pressure is provided.
The object of the invention is realized by following proposal：It is a kind of can be resistant to high pressure from control type protector, including ceramics
Substrate, electrode, insulating barrier and main conductive circuit, wherein：Described ceramic substrate for rectangle, on four sides of the ceramic substrate
On be arranged with electrode one, two, three and four, the relative electrode of one pair of which is at least connected with a heating layer, on the heating layer
Provided with insulating barrier, electrode layer is covered with the insulating layer；Barrier layer is provided with least on another pair electrode, in electrode layer and barrier layer
Between connect main conductive circuit by way of welding or printing and sinter, on the main conductive circuit coat fluxing agent after will be upper
Lid is bonded in above described ceramic substrate.
The present invention has the function of conventional power current fuse, while the function of having autonomous control main conductive circuit to fuse.It is special
It is not that the design of heating layer uses parallel connection, series connection or the parallel connection of lamination side by side etc. mode, is ensureing that overall resistance is constant
In the case of, increase the resistance of a certain resistive layer or reduce resistive layer and bear voltage per unit, reach electricity when reduction is powered
The hot face temperature of resistance layer, so as to lift total withstanding voltage of product, and then realize the low string number from control type protector
Model is common to high voltage protection scene.
Ceramic substrate thickness of the present invention is not more than 0.5mm.It can be process with thin ceramic baseplate material, can be with
Be aluminum oxide, zirconium oxide etc. be primary raw material base material it is stamped or laser cutting etc. technique be processed into thickness in below 0.5mm
Ceramic substrate.
Two can be provided with described ceramic substrate or more than two heating layers are in parallel with parallel, series connection or lamination
Form, such as：Can be two resistive layers composing in parallel side by side, or more than two resistive layers being composed in series side by side,
Or more than two resistance layer laminates compose in parallel form and are connected to on a pair of comparative electrodes.
Described ceramic substrate sets the first heating layer, sets the second heating layer on described upper lid, the opposite side covered on described
A pair of electrodes is provided with, the second heating layer is connected to this and described pottery is bonded in after the second insulating barrier on electrode, being then covered with
Porcelain surface.To protect internal components.
Present invention offer is a kind of according to the above-mentioned preparation method from control type protector that can be resistant to high pressure, according to following
Step：
1）The surface of ceramic substrate symmetrical printed conductor slurry along four sides, the and of electrode one, two, three is formed after high temperature sintering
Four；
2）The printed resistor slurry between electrode three and four, forms heating layer after high temperature sintering；
3）The printed medium slurry above heating layer, insulating barrier is formed by high temperature sintering；
4）Square printed conductor slurry on the insulating layer, electrode layer is formed by high temperature sintering；
5）Either sputtering or sprays insulating material are printed on electrode one and two, high temperature sintering is used according to insulating materials species
Or low-temperature setting forms barrier layer one, two；
6）Main conductive circuit is connected by way of welding or printing and sinter between electrode layer and barrier layer one, two, in master
Fluxing agent is added above galvanic circle or does not add fluxing agent；
7）Bond and cover above ceramic substrate.
Conductor paste can be printed on after ceramic substrate and be formed after high temperature sintering by electrode using silk screen printing process, conductor paste
It can be made up of the one or more of the metal with good conductivity such as silver, platinum, palladium, gold, copper, zinc, aluminium and its oxide
Resistance slurry is printed on after ceramic substrate and formed after high temperature sintering by heating layer using silk screen printing process, and resistance slurry can be with
Ruthenium base, platinum base, one or more compositions of palladium base, heating layer can be two or more resistive layer side by side and
Connection composition, or two or more resistive layers being composed in series side by side, also or two or more resistance
Layer laminate composes in parallel.By such design in the case where ensureing that overall resistance is constant, increase a certain resistive layer resistance or
Person reduces resistive layer and bears voltage per unit, reaches the hot face temperature for reducing resistive layer when being powered, so as to lift product
Total withstanding voltage.
After dielectric paste is printed on ceramic substrate by described insulating barrier with silk screen printing process, formed after high temperature sintering.It is situated between
Chylema material can be that the inorganic non-metallic such as glass paste, ceramic slurry, glass glaze insulating materials is formed.
Described barrier layer can be lines, can be annulus, also or other irregular shapes.According to the material of selection
Difference, can either insulating materials be covered in electrode one, two, three and four by spraying coating process or sputtering technology with silk screen printing process
On, insulating materials can be the solder resist materials such as dielectric paste, solder mask, insulating resin.Reflow Soldering attachment can be crossed in product
Shi Youxiao prevents to climb tin influence main conductive circuit, so as to which safety crosses Reflow Soldering.
Described main conductive circuit can be macromolecular PTC thermistor, bimetal leaf, low-melting alloy（Such as bismuth indium tin
Alloy）, high-melting-point alloy（Such as tin-lead, Xi Yin, mischzinn）, fuse-link metal material（Silver, platinum, palladium, gold, copper, zinc, aluminium
Etc. metal with good conductivity and its oxide）, surface mount pattern electrical fuse element etc. or alloy surface it is silver-plated
Or tin plating composite alloy.
Described fluxing agent, it is different according to design, the melting of maleic rosin Ester can be selected to be covered in leading electricity and returned
On road or diameter ＜ 0.15mm silver-coated copper wire or nickel wire etc. are inhaled solder and are welded on above main conductive circuit.
Described upper lid selection has the characteristics that fire-retardant, high temperature resistant material, can be industrialization liquid crystal polymer LCP,
Also or ceramic substrate, epoxy resin board etc. material.
The present invention is advantageous in that：Not only there is the function of conventional power current fuse, while have the leading electricity of autonomous control
The function of loop fusing.Especially by heating layer structure design, in the case where ensureing that overall resistance is constant, increase a certain electricity
The resistance of resistance layer or the hot face temperature for bearing voltage, reaching resistive layer when reducing energization for reducing the every unit of resistive layer,
So as to lift total withstanding voltage of product, and then realize from the low string number model of control type protector and be common to high voltage protection
Scene.
Brief description of the drawings
Electrode one, two, three, four has been printed on Fig. 1 ceramic substrates；
Fig. 2 is connected with side by side and first, second heating layer in parallel between electrode three and electrode four；
Fig. 3 is covered with insulating barrier on first, second heating layer；
Fig. 4 is respectively equipped with barrier layer one, two on electrode one, two；
Fig. 5 has electrode layer on the insulating layer；
Fig. 6 is connected to main conductive circuit between electrode layer and barrier layer one, two；
Fig. 7 helps flux layer on the basis of Fig. 6 on main conductive circuit；
Fig. 8 prints electrode six, seven on upper lid in face of title；
Fig. 9 connects the second heating layer between electrode six, seven, and is covered with insulating barrier on the second heating layer；
The heating layers of Figure 10 first, second have been connected in series between side by side between electrode three and electrode four；
The heating layers of Figure 11 first, second are laminations and parallel form is connected between electrode three and electrode four；
The heating layers of Figure 12 first, second are respectively provided on ceramic substrate and upper lid.
Label declaration in figure：
11st, 12,13,14 --- electrode one, two, three, four；
15 --- electrode layer；
16th, 17 --- electrode six, seven；
2 --- ceramic substrate；
31st, 31 ', 31 ' ', 31 ' ' ' --- the first heating layer；
32nd, 32 ', 32 ' ', 32 ' ' ' --- the second heating layer；
4 --- insulating barrier；41st, 42 --- first, second-insulating barrier；
51st, 52 --- barrier layer one, two；
6 --- main conductive circuit；
7 --- fluxing agent；8 --- upper lid.
Embodiment
Embodiment 1
As printed on Fig. 1 ceramic substrates electrode one, two, three, four, Fig. 2 be connected between electrode three and electrode four side by side and
First, second heating layer in parallel, Fig. 3 are covered with insulating barrier on first, second heating layer, and Fig. 4 is set respectively on electrode one, two
There are barrier layer one, two and Fig. 5 to have on the insulating layer shown in electrode layer：
As shown in figure 1, electrode one, two, three, 4 11,12,13,14 is printed with ceramic substrate 2.
As shown in Fig. 2,3,4,5, passed through after resistance slurry is printed on into ceramic substrate 2 between electrode 3 13 and electrode 4 14
Formed with resistive layer as first, second heating layer 31,32 after high temperature sintering, the first heating layer 31 and the second heating layer 32 are simultaneously
Arrange and parallel form is connected between electrode 3 13 and electrode 4 14.Insulating barrier 4 is printed on first, second heating layer 31,32,
Barrier layer 1 and barrier layer 2 52 have been printed respectively on electrode 1 and electrode 2 12, and print electrode layer on insulating barrier 4
15。
As Fig. 6 is connected to main conductive circuit and Fig. 7 on the basis of Fig. 6 leading between electrode layer and barrier layer one, two
Helped on electrical circuit shown in flux layer：Print solder paste welding alloy forms master between electrode layer 15 and barrier layer one, 2 51,52
Galvanic circle 6, it is fluxing rosin that fluxing agent 7 has been added on alloy, then, can be on ceramic substrate 2 to protect interiors of products
Covered in bonding.
Such as, it is assumed that keep the total resistance of heating layer（5Ω）In the case of constant, two resistive layer resistances can all be 10 Ω,
In the case where the voltage at the techniques such as the thickness material of resistive layer with loading both ends is constant, resistive layer hot face temperature declines
20-50%
Under the case, there can also be heating layer for three and its mutation situation of above number.
Embodiment 2
Other are same as Example 1 for the present embodiment, simply if the heating layers one, two of Figure 10 first, second are cascades side by side
Shown in being connected between electrode three and electrode four, heating layer structure design is different.
As shown in figure 1, electrode one, two, three, 4 11,12,13,14 is printed on ceramic substrate 2.
As shown in Figure 10,3,4,5, printed between electrode 3 13 and electrode 4 14 first, second heating layer 31 ',
32 ', first, second heating layer 31 ', 32 ' is side by side and is connected in series between electrode 3 13 and electrode 4 14.
First, be printed with insulating barrier 4 on the second heating layer 31 ', 32 ', printed respectively on electrode one, 2 11,12 barrier layer one, 2 51,
52, print electrode layer 15 on insulating barrier 4.
As shown in Figure 6,7, between electrode layer 15 and barrier layer one, 2 51,52 print solder paste welding alloy formed it is leading
Electrical circuit 6, fluxing rosin 7 is added on alloy.To protect interiors of products, lid 8 can be bonded on ceramic substrate 2.
Such as, it is assumed that keep the total resistance of heating layer（5Ω）In the case of constant, two resistive layer resistances can all be 2.5 Ω,
In the case where the voltage at the techniques such as the thickness material of resistive layer with loading both ends is constant, resistive layer hot face temperature declines
10-30%。
Under the case, there can also be heating layer for three and its mutation situation of above number.
Embodiment 3
Other are same as Example 1 for the present embodiment, simply if the heating layers one, two of Figure 11 first, second are lamination and parallel form
Shown in being connected between electrode three and electrode four, heating layer structure design is different.
As shown in figure 1, electrode one, two, three, 4 11,12,13,14 is symmetrically printed on ceramic substrate 2.
As shown in Figure 11,3,4,5, first, second heating layer 31 ' is printed between electrode three, 4 13,14 ', 32 ' ',
First, the second heating layer 31 ' ', 32 ' ' is lamination and parallel form is connected between electrode three, 4 13,14.In first, second hair
Insulating barrier 4 is printed on thermosphere 31 ' ', 32 ' ', barrier layer one, 2 51,52 is printed respectively on electrode one, 2 11,12, is insulating
Print electrode layer 15 on layer 4.
As shown in Figure 6,7, between electrode layer 15 and barrier layer one, 2 51,52 print solder paste welding alloy formed it is leading
Electrical circuit 6, fluxing rosin 7 is added on alloy.To protect interiors of products, lid 8 is bonded on ceramic substrate 2.
Such as, it is assumed that keep the total resistance of heating layer（5Ω）In the case of constant, two resistive layer resistances can be 8 Ω and 6
Ω, in the case where the voltage at the techniques such as the thickness material of resistive layer with loading both ends is constant, under resistive layer hot face temperature
10-15% drops.
Embodiment 4
Other are same as Example 1 for the present embodiment, simply if the heating layers of Figure 12 first, second are to be respectively provided at ceramic substrate and upper
Cover.
As shown in figure 1, respectively symmetrically print electrode one, two, three, 4 11,12 on four sides of rectangle on ceramic substrate 2,
13,14.
As shown in Figure 12,3,4,5, the first heating layer 31 ' is printed between electrode three, 4 13,14 ' ', in the first heating layer
31 ' ' the first insulating barrier 41 is printed on ', barrier layer one, 2 51,52 is printed respectively on electrode one, 2 11,12, in insulating barrier 4
On print electrode layer 15.
As shown in Figure 6,7, between electrode layer 15 and barrier layer one, 2 51,52 print solder paste welding alloy formed it is leading
Electrical circuit 6, fluxing rosin 7 is added on alloy.
As Fig. 8 connects the second heating layer in face of title six, the seven and Fig. 9 that prints electrode on upper lid between electrode six, seven, and
It is covered with the second heating layer shown in insulating barrier, symmetrically prints electrode six, 7 16,17 on upper lid 8, on electrode six, seven
Print the second heating layer 32 ' ' ', the second insulating barrier 42 is printed on the second heating layer, finally bonds and covers on ceramic substrate 2
8, effectively to protect interiors of products structure.
Claims (9)
1. it is a kind of can be resistant to high pressure from control type protector, including ceramic substrate, electrode, insulating barrier and main conductive circuit,
It is characterized in that：Described ceramic substrate for rectangle, be arranged with electrode one, two, three on four sides of the ceramic substrate
With four, the relative electrode of one pair of which is at least connected with a heating layer, and insulating barrier is provided with the heating layer, is covered on the insulating layer
There is electrode layer；Barrier layer is provided with least on another pair electrode, by welding or printing and burn between electrode layer and barrier layer
The mode of knot connects main conductive circuit, and upper lid is bonded in into described ceramic substrate after coating fluxing agent on the main conductive circuit
Top.
2. it is according to claim 1 can be resistant to high pressure from control type protector, it is characterised in that described ceramic base
Plate thickness is not more than 0.5mm.
3. it is according to claim 1 or 2 can be resistant to high pressure from control type protector, it is characterised in that described pottery
Porcelain substrate be provided with two either more than two heating layers with parallel form or, the parallel form of two resistive layers side by side,
Either two or more resistive layers cascade side by side or two or more resistance layer laminate are in parallel
Form is connected to on a pair of comparative electrodes.
4. according to described in claim 1 or 2 can be resistant to high pressure from control type protector, it is characterised in that described ceramics
Substrate sets the first heating layer, and the second heating layer is set on described upper lid, is provided with a pair of electrodes on the opposite side covered on described, and second
Heating layer is connected to this and is bonded in on electrode, being then covered with after the second insulating barrier above described ceramic substrate.
A kind of 5. preparation method from control type protector that can be resistant to high pressure according to claims 1 to 3, according to following
Step：
1）The surface of ceramic substrate symmetrical printed conductor slurry along four sides, the and of electrode one, two, three is formed after high temperature sintering
Four；
2）The printed resistor slurry between electrode three and four, forms heating layer after high temperature sintering；
3）The printed medium slurry above heating layer, insulating barrier is formed by high temperature sintering；
4）Square printed conductor slurry on the insulating layer, electrode layer is formed by high temperature sintering；
5）Either sputtering or sprays insulating material are printed on electrode one and two, high temperature sintering is used according to insulating materials species
Or low-temperature setting forms barrier layer one, two；
6）Main conductive circuit is connected by way of welding or printing and sinter between electrode layer and barrier layer one, two, in master
Fluxing agent is added above galvanic circle or does not add fluxing agent；
7）Bond and cover above ceramic substrate.
6. the preparation method from control type protector according to claim 5 that high pressure can be resistant to, it is characterised in that：Step
Rapid 2）In two parallel resistance slurry bars are printed between electrode three and four, first, the of parallel connection is formed after high temperature sintering
Two heating layers, insulating barrier is covered on first, second heating layer.
7. the preparation method from control type protector according to claim 5 that high pressure can be resistant to, it is characterised in that：Step
Rapid 2）In the resistance slurry bars of two side-by-side series is printed between electrode three and four, the of series connection is formed after high temperature sintering
First, the second heating layer, insulating barrier is covered on first, second heating layer.
8. the preparation method from control type protector according to claim 5 that high pressure can be resistant to, it is characterised in that：Step
Rapid 2）In the two laminations resistance slurry bar of parallel form side by side is printed between electrode three and four, formed after high temperature sintering
First, second heating layer of series connection, insulating barrier is covered on first, second heating layer.
A kind of 9. preparation method from control type protector according to claim 4 that can be resistant to high pressure, according to following steps
Suddenly：
1）The surface of ceramic substrate symmetrical printed conductor slurry along four sides, the and of electrode one, two, three is formed after high temperature sintering
Four；
2）One layer of resistance slurry is printed between electrode three and four, the first heating layer is formed after high temperature sintering；
3）The printed medium slurry above heating layer, the first insulating barrier is formed by high temperature sintering；
4）Square printed conductor slurry on the insulating layer, electrode layer is formed by high temperature sintering；
5）Either sputtering or sprays insulating material are printed on electrode one and two, high temperature sintering is used according to insulating materials species
Or low-temperature setting forms barrier layer one, two；
6）Main conductive circuit is connected by way of welding or printing and sinter between electrode layer and barrier layer one, two, in master
Fluxing agent is added above galvanic circle or does not add fluxing agent；
7）Upper cap-shaped shape is corresponding with ceramic substrate, in the symmetrical printed conductor slurry of two relative edges of upper lid, after high temperature sintering
Form electrode five and six；
8）One layer of resistance slurry is printed between electrode five and six, the second heating layer is formed after high temperature sintering；
9）The second insulating barrier is printed on the second heating layer, upper lid is inwardly bonded on ceramic substrate by the second last heating layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710800772.7A CN107393784A (en) | 2017-09-07 | 2017-09-07 | It is a kind of can be resistant to high pressure from control type protector and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710800772.7A CN107393784A (en) | 2017-09-07 | 2017-09-07 | It is a kind of can be resistant to high pressure from control type protector and preparation method thereof |
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| CN107393784A true CN107393784A (en) | 2017-11-24 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022095279A1 (en) * | 2020-11-03 | 2022-05-12 | 上海维安电子有限公司 | Self-fusing unit and protective element applying same |
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Address after: 200083 806, floor 8, No. 125, Liuying Road, Hongkou District, Shanghai Applicant after: Shanghai Wei'an Electronic Co.,Ltd. Address before: Seven road 201202 Shanghai Pudong New Area Shiwan No. 1001 Applicant before: Shanghai Changyuan Wayon Circuit Protection Co.,Ltd. |
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Address after: Room 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant after: Shanghai Weian Electronics Co.,Ltd. Address before: 806, 8th floor, 125 Liuying Road, Hongkou District, Shanghai 200083 Applicant before: Shanghai Wei'an Electronic Co.,Ltd. |
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Application publication date: 20171124 |