CN1266732C

CN1266732C - Field emission display device

Info

Publication number: CN1266732C
Application number: CNB021474877A
Authority: CN
Inventors: 陈杰良
Original assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Current assignee: Hongfujin Precision Industry Shenzhen Co Ltd; Hon Hai Precision Industry Co Ltd
Priority date: 2002-07-12
Filing date: 2002-11-05
Publication date: 2006-07-26
Anticipated expiration: 2022-11-05
Also published as: US20040007966A1; US6750617B2; TW200401324A; TWI229365B; CN1467785A

Abstract

A field emission display device includes a cathode plate, a resistive buffer in contact with the cathode plate, a plurality of electron emitters formed on the buffer, and an anode plate spaced from the electron emitters. Each electron emitter includes a rod-shaped first part and a conical second part. The buffer and first parts are made from silicon oxide. The combined buffer and first parts has a gradient distribution of electrical resistivity such that highest electrical resistivity is nearest the cathode plate and lowest electrical resistivity is nearest the anode plate. The second parts are made from niobium. When emitting voltage is applied between the cathode and anode plates, electrons emitted from the electron emitters traverse an interspace region and are received by the anode plate. Because of the gradient distribution of electrical resistivity, only a very low emitting voltage is needed.

Description

Field emission display

[technical field]

The present invention relates to a kind of field emission display, refer in particular to a kind of field emission display that comprises the electron emission unit of nanoscale.

[background technology]

In recent years, the flat-panel screens development has been widely used in fields such as personal computer, consumption electronic products rapidly.Using the most general flat-panel screens at present is to have high-resolution active matrix liquid crystal display, hereinafter to be referred as LCD, it can provide higher resolution, thereby uses wider, yet the intrinsic limitation of LCD itself causes it to be not suitable for some application.For example, there are many shortcomings in LCD in manufacture view, and the speed that is included on the face glass the unformed silicon of deposition is slow, yield is lower.And LCD needs the backlight of higher-energy, and still, the wide part that backlight produces is all absorbed by panel of LCD or loses, thereby causes energy dissipation.In addition, the display image of LCD is subject to the restriction at ambient brightness and visual angle, promptly reaches at bright environment and is difficult to see its image at the visual angle of broad.In addition, the response time of LCD is depended on the response time of liquid crystal to applied field, so the response speed of LCD is corresponding slower.The response time of exemplary lcd is generally 25ms to 75ms.Above-mentioned drawbacks limit LCD application in many aspects, as high definition TV, giant display etc.The another kind of better display device of type is a plasma display, and it is suitable for, and high definition shows and large scale shows that still, the plasma display consumed power is more, and self is easy to generate more heat, is its weak point.

Developed other flat-panel screens in recent years outside LCD and plasma display again, Field Emission Display is exactly wherein a kind of, and it has overcome some shortcomings of LCD and plasma display, and has some important advantages.For example, Field Emission Display is compared with conventional thin film transistor LCD and plasma display, has higher contrast, wider visual angle, higher brightness, lower energy loss, shorter response time and wideer operating temperature range.

Maximum difference between Field Emission Display and the LCD is that Field Emission Display is to utilize the color phosphor self-luminous, and does not need to adopt complexity and the backlight and the filter of power consumption, and nearly all light can both be seen by the user.And Field Emission Display does not need to use thin film transistor (TFT) array to drive.So it has overcome active matrix liquid crystal display need be equipped with expensive backlight and the lower problem of thin film transistor (TFT) array process rate.

Field Emission Display is to utilize the point discharge principle, and by the tip is applied voltage, electronics sends from the tip of negative electrode, and bombardment is deposited on the fluorescent material on the transparency carrier back side and produces image then.The image brightness of emission current and generation depends on the work function of the emissive material of field emitting electronic source on the negative electrode to a great extent.So desire obtains Field Emission Display efficiently, just must adopt suitable field emmision material.

See also Fig. 3, be a kind of generalized section of existing field emission display 11, this field emission display 11 deposits a resistive layer 12 on glass substrate 14, and this resistive layer 12 mainly is the film substrate that contains amorphous silicon, insulating barrier 16 is made up of insulating material, as silicon dioxide.Gate electrode metal layer 18 is deposited on this insulating barrier 16, by etching this gate electrode metal layer 18 and insulating barrier 16, produce a plurality of micropores (not indicating), the little awl 21 of metal is respectively formed in this micropore, negative electrode 22 is covered by resistive layer 12, wherein resistive layer 12 shows slightly conductive capability, this point is extremely important, when if metal little most advanced and sophisticated 21 is lower than this gate electrode metal 18, this resistive layer 12 can be used as effective resistance and flows into little most advanced and sophisticated 21 to prevent excessive electric current, but the resistance value that should control this resistive layer 12 makes it unlikely insulation fully, thereby guarantees little awl 21 operate as normal of metal.

But typical field emission display needs a high voltage is provided between negative electrode and anode, and this voltage makes that usually above 1000 volts the power consumption of device is very big.

Therefore, provide a kind of field emission display of above shortcoming that improves in fact for necessary.

[summary of the invention]

The object of the present invention is to provide the field emission display of a kind of low-voltage, low power consumption.

For realizing purpose of the present invention, the invention provides a kind of field emission display, it comprises a minus plate, one resistance resilient coating, this resistance resilient coating links to each other with minus plate, a plurality of electron emission unit, these a plurality of electron emission unit are formed on this resistance resilient coating, each electron emission unit constitutes by the first of this resistance resilient coating of connection and the second portion that this first joins, one positive plate, form a space between this positive plate and this resistance resilient coating, wherein, this resistance resilient coating and this first are by silicon nitride (SiN _x) make, the stoichiometric proportion that X can be as required and controlling wherein, the resistivity distribution that thereby the resistivity that makes the first of this resistance resilient coating and electron emission unit has at least a part to have successively decreases, make the resistivity of the most close minus plate the highest, and the resistivity of close positive plate is minimum.The second portion of electron emission unit is made up of molybdenum.When apply an emission voltage between minus plate and positive plate, electronics spontaneous emission unit is launched, and passes this spatial separation and be that positive plate receives.

Compared with prior art, the resistivity of the resistance resilient coating of field emission display of the present invention and the first of this electron emission unit is graded profile, thereby required emission voltage is lower, most advanced and sophisticated less because of the electron emission unit of field emission display of the present invention again, be beneficial to point discharge, thereby can reduce emission voltage and improve launch accuracy.

[description of drawings]

Fig. 1 is the generalized section of field emission display of the present invention;

Fig. 2 is the stereogram of the electron emission unit of field emission display of the present invention;

Fig. 3 is the generalized section of prior art field emission display.

[embodiment]

See also Fig. 1, field emission display 1 of the present invention comprise one first substrate 10, one by electric conducting material make and be formed on minus plate 20, a resistance resilient coating 30 that links to each other with minus plate 20 on first substrate 10, be formed on a plurality of electron emission unit 40 on the resistance resilient coating 30, one and these a plurality of electron emission unit 40 positive plate 50 and one second substrate 60 of certain space spacings at interval.

This first substrate 10 comprises a substrate of glass 101 and a silicon membrane layer 102, and this silicon membrane layer 102 is formed on the substrate of glass 101, and these silicon membrane layer 102 tool bonding characteristics can provide minus plate 20 to be connected with the effective of substrate of glass 101.

Please cooperate and consult Fig. 2, each electron emission unit 40 constitutes with the contacted column of resistance resilient coating 30 first 401 and a coniform second portion 402 away from resistance resilient coating 30 by one, and first 401 contacts with resistance resilient coating 30 and by silicon nitride (SiN _x) make, the stoichiometric proportion that X can be as required and being controlled wherein, in better embodiment, control X value can be guaranteed the resistivity distribution that the resistivity of resistance resilient coating 30 and first 401 has at least a part to have to successively decrease, make the resistivity of the most close minus plate the highest, and the resistivity of close positive plate is minimum.This coniform second portion 402 is formed in the first 401, is made by molybdenum.

In better embodiment, the diameter of each column first 401 is 5～50 nanometers, and length is 0.2～2 micron, and the bottom diameter of second portion 402 is 5～50 nanometers, and is consistent with the diameter of first 401, and tip diameter then is 0.3～2 nanometer.

In another embodiment of the present invention, resistance resilient coating 30 is not limited to a graded profile with the resistivity of first 401, also can be a plurality of graded profile or gradual change and constant and is alternately distributed.

Positive plate 50 is formed on second substrate 60, comprises the transparency electrode 502 that is coated with phosphor powder layer 501.This transparency electrode 502 allows light to pass through.This transparency electrode 502 can comprise indium tin oxide class transparent material.When second portion 402 electrons emitted of electron emission unit 40 were clashed into this phosphor powder layer 501, phosphor powder layer 501 was luminous.Second substrate 60 is that light transmissive material is made, as glass.

During field emission display 1 work, apply an emission voltage at

minus plate

20 and 502 of transparency electrodes, electronics will emit from the second portion 402 of electron emission unit 40, and pass through an area of space and arrive positive plate 50, absorb and luminous through phosphor powder layer 501, issued light see through transparency electrode 502 with second substrate 60 the generation image.

Because the resistivity of resistance resilient coating 30 and first 401 is graded profile, and the tip size of second portion 402 is very little, thereby 502 of minus plate 20 and transparency electrodes only need a lower emission voltage, electronics just can emit from second portion 402, thereby the reduction consumption of electric, the while is emitting electrons accurately and reliably.

Claims

1. field emission display, it comprises a minus plate, the one resistance resilient coating that links to each other with minus plate, a plurality of electron emission unit that are formed on the resistance resilient coating, each electron emission unit connects the first of this resistance resilient coating and the second portion formation of joining with this first by one, one with should be a plurality of the positive plate of electron emission unit interval certain space spacing, it is characterized in that: this resistance resilient coating and this first are made by silicon nitride, the resistivity of this resistance resilient coating and this first has a part at least from the distribution of successively decreasing of resistance resilient coating to this first, and this second portion is made by metal molybdenum.

2. field emission display as claimed in claim 1 it is characterized in that this first is a column structure, and its diameter is 5～50 nanometers.

3. field emission display as claimed in claim 2 is characterized in that this first's length is 0.2～2 micron.

4. field emission display as claimed in claim 1 it is characterized in that this second portion is a cone-shaped structure, and its top end diameter is 0.3～2 nanometer.

5. field emission display as claimed in claim 1 is characterized in that this positive plate is made of a transparency electrode that applies phosphor powder layer.

6. field emission display as claimed in claim 5 is characterized in that this transparency electrode comprises indium tin oxide.

7. field emission display as claimed in claim 1 is characterized in that this minus plate is formed on one first substrate, and this positive plate is formed on one second substrate, and this first substrate and second substrate are glass.

8. field emission display as claimed in claim 7 is characterized in that being provided with silicon thin film between this minus plate and first substrate.