CN1260401C - Small plated body electroplating device - Google Patents
Small plated body electroplating device Download PDFInfo
- Publication number
- CN1260401C CN1260401C CNB021529035A CN02152903A CN1260401C CN 1260401 C CN1260401 C CN 1260401C CN B021529035 A CNB021529035 A CN B021529035A CN 02152903 A CN02152903 A CN 02152903A CN 1260401 C CN1260401 C CN 1260401C
- Authority
- CN
- China
- Prior art keywords
- small
- mentioned
- negative electrode
- plated body
- sized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
To solve a problem that electric field is concentrated to an edge of a cathode in electroplating for a small-sized material and a projecting part is formed in the deposited material on the cathode corresponding to the edge of the cathode and the projecting part disturbs the stirring of the material to make good and efficient plating impossible. The electric field is distributed over the whole by forming a plurality of grooves 11 on the surface of the cathode in contact with the small-sized material to center the electric field also in the vicinity of the grooves 11.
Description
Technical field
The present invention relates to the small-sized plated body of small electronic component one class is implemented galvanized electroplanting device, particularly the modifying device of cathode construction.
Technical background
For example, the outer electrode that sheet small electronic component outside surfaces such as laminated ceramic capacitor, tubular electrical condenser, stacked resistor, laminated inductor are formed is implemented to electroplate repeatedly.When utilizing plating to implement this plating, for example, can use the spy to open in the flat 5-70999 communique electroplanting device 1 as shown in Figure 6.
With reference to Fig. 6 as can be known, electroplanting device 1 has the plating tank 3 of storing electroplate liquid 2.To be immersed in the electroplate liquid 2 by negative electrode 4 and the anode 5 that each conductor forms.
Should be loaded in the part container 7 by galvanized several small-sized plated bodies 6 (schematically illustrating its aggregate), put into electroplate liquid 2 again with dotted line.Plated body 6 comprises several media 6b that answers galvanized several small electronic components 6a and formed by conductor.
Dispose above-mentioned electrode 4, make it form the part of above-mentioned part container 7 bottom surfaces.Therefore, small electronic component 6a and medium 6b form the state that is positioned on the negative electrode 4 in electroplate liquid 2.
In part container 7, be provided with Z-axis 8.Part container 7 wind by Z-axis 8 give with the vertical axis rotation, can stir electroplate liquid 2 thus, and small electronic component 6a and the medium 6b in the part container 7 are played stirring action, make each small electronic component 6a and each medium 6b and uniform and stable the contacting of negative electrode 4 formation.
In such electroplanting device 1, because energising between negative electrode 4 and anode 5, so, implement needed plating if, on the outer electrode (not shown) of small electronic component 6a, separate out electroplating film at these voltage that has applied regulation.
When stating electroplanting device 1 enforcement electroplating processes in the use, on the surface of negative electrode 4, more or less form inevitably and electroplate precipitate.Particularly small electronic component 6a gets over more frequent generation with the situation that medium 6b does not contact with negative electrode 4, and it is many more that the utmost point on negative electrode 4 goes out thing.
In electroplanting device 1, negative electrode 4 and contact surface small electronic component 6a and medium 6b have level and smooth plane, so do not hinder the stirring of these small electronic components 6a and medium 6b.
Therefore, when negative electrode 4 had level and smooth plane, in electroplating processes, electric field trended towards concentrating on the edge section of negative electrode 4, as shown in Figure 7, goes out thing 9 to the utmost point of negative electrode 4 and form projection 10 sometimes on the edge section of negative electrode 4.
Above-mentioned projection 10 can hinder the stirring of small electronic component 6a and medium 6b.In electroplating processes, precipitate 9 more is easy to generate and peels off.As a result, precipitate 9 as foreign material sometimes attached on the small-sized electronic part 6a.
Like this, the projection 10 that forms on precipitate 9 can hinder the stirring of small electronic component 6a and medium 6b, when stirring is subjected to hindering, the not contact condition of small electronic component 6a and medium 6b and negative electrode 4 more frequently takes place, if cause this situation, the precipitate 9 that forms is also many, and projection 10 is also just grown up easily, produces above-mentioned vicious cycle.
Summary of the invention
Therefore, the purpose of this invention is to provide and a kind ofly can be the electroplanting device of the small-sized plated body that addresses the above problem.
The present invention is the electroplanting device towards the small-sized plated body of following formation, promptly, have the plating tank of storing electroplate liquid and be immersed in negative electrode and the anode that forms by conductor in the electroplate liquid, in electroplate liquid, contact and between negative electrode and anode, switch on by several small-sized plated bodies that should plate with negative electrode, on small-sized plated body, separate out electroplating film, it is characterized in that for solving above-mentioned technical task, on negative electrode and face that small-sized plated body contacts, form recess, and the formation of described recess can not make plated body embedding size wherein.
Above-mentioned recess forms by form several ditches on negative electrode and face that small-sized plated body contacts, also can form by form several vesicles on this face, also can be formed chamfering by the peripheral part at this face and form recess.
When forming recess, ditch is intersected to form mutually with ditch.
The plating transposition of small-sized plated body of the present invention preferably also has the part container of several small-sized plated bodies of splendid attire in electroplate liquid, and the configuration negative electrode makes it form the part of this part container bottoms.
Above-mentioned part container preferably rotates around vertical axis.
The present invention is all applicable to various small-sized plated bodies, particularly can be applicable to electroplate small electronic component.
Description of drawings
Fig. 1 is the electroplanting device for explanation the present invention the 1st example, is the orthographic plan that the part container 7 that electroplanting device has is shown.
Fig. 2 is the enlarged diagram of configuration negative electrode 4a part in the part container 7 shown in Figure 1, (a) is orthographic plan, (b) is sectional view.
Fig. 3 is the figure that is equivalent to Fig. 2 (a) for the negative electrode 4b of explanation the present invention the 2nd example.
Fig. 4 is the figure that is equivalent to Fig. 2 for the negative electrode 4c of explanation the present invention the 3rd example.
Fig. 5 is the figure that is equivalent to Fig. 2 for the negative electrode 4d of explanation the present invention the 4th example.
Fig. 6 is the sectional view that diagram illustrates interested electroplanting device 1 according to the present invention.
Fig. 7 is for the fragmentary cross-sectional view that part container 7 is shown of problem to be solved by this invention is described.
The working of an invention form
With reference to above-mentioned Fig. 6, an example of the present invention is described.That is, in device shown in Figure 61, it is the structure of negative electrode 4 that feature of the present invention constitutes.
Fig. 1 is the orthographic plan for the part container 7 of explanation the present invention the 1st example.
Configuration negative electrode 4a, the part of formation part container 7 bottom surfaces.In this example, 4 negative electrode 4a spend arranged spaced round axle 8 with 90.
The enlarged view of the negative electrode 4a part that is located in the part container 7 has been shown among Fig. 2.Among Fig. 2, (a) being orthographic plan, (b) is sectional view.
As shown in Figure 2, on negative electrode 4a, that is, and with as on the small electronic component 6a of the plated body 6 that should plate and the face that medium 6b (with reference to Fig. 6) contacts, form several ditches 11, utilize these ditches 11, formation recess on negative electrode 4a.The width of these ditches 11 can prevent like this that less than the size of all small electronic component 6a that should plate and medium 6b these small electronic components 6a and medium 6b are embedded in the ditch 11.
In illustrated negative electrode 4a, can be parallel to each other to extend on 1 negative electrode 4a is provided with 3 ditches 11, and its number and spacing can change as required, also can arbitrarily change.
As shown in Figure 1, the bearing of trend of each self-forming ditch 11 on 4 negative electrode 4a, though roughly consistent with the radial direction of part container 7, also can change the bearing of trend of ditch 11 arbitrarily.
The section shape of ditch 11 shown in Fig. 2 (b), though form V word shape, also can form other shapes, as, U font, square etc.
Fig. 3 is the figure that is equivalent to Fig. 2 (a) for explanation the present invention the 2nd example.
On negative electrode 4b shown in Figure 3, being parallel to each other is formed extended at both sides several ditches 11, simultaneously, further intersects to form several ditches 11a with these ditches 11, for example, in this example, forms square crossing.
Fig. 4 is the figure that is equivalent to Fig. 2 for explanation the present invention the 3rd example.
On negative electrode 4c shown in Figure 4, form several vesicles 12, form recess by these vesicles 12.The size of vesicle 12 can prevent like this that less than the size of all small electronic component 6a that should plate and medium 6b this type electronic component 6a and medium 6b are embedded in the vesicle 12.
The quantity of above-mentioned vesicle 12 and distribution can arbitrarily change as required.
Illustrated vesicle 12 shown in Fig. 4 (a), though have circular planeform, also can be replaced with and has corneous planeform.The section shape of vesicle 12 shown in Fig. 4 (b), though form V word shape, also can form other shapes, for example, and U word shape, square shape etc.
Fig. 5 is the figure that is equivalent to Fig. 2 for explanation the present invention the 4th example.
Negative electrode 4d shown in Fig. 5, special shown in Fig. 5 (b), peripheral part in the above forms chamfered section 13, forms recess by these chamfered section 13.By separating 13 recesses that form, can prevent that like this these small electronic components 6a and medium 6b are embedded in the recess that is formed by chamfered section 13 less than all sizes of answering galvanized small electronic component 6a and medium 6b.
Illustrated chamfered section 13 shown in Fig. 5 (b), though form rounded surface, also can change and form plane inclined-plane.
According to the 1st of above explanation～the 4th example, in electroplating processes, the part that electric field is concentrated easily, not only ren is each edge section of negative electrode 4a～4d, and be present near the ditch 11, near ditch 11 and the 11a, near the vesicle 12, or near the chamfered section 13, so the electric field that can concentrate disperses.Therefore, very difficult generation phenomenon is as shown in Figure 7 promptly only generated by negative electrode 4 edge sections, and the result forms projection 10, therefore, also be difficult to produce the state of affairs that this projection 10 hinders small electronic component 6a and medium 6b to stir.
If according to the 1st～the 4th example, ditch 11, ditch 11 and 11a, vesicle 12 or chamfered section 13 as recess should form the small size that can not embed as the plated body 6 of small electronic component 6a and medium 6b one class, this is to hinder stirring because of preventing from that small-sized 6a and medium 6b from embedding recess, form to be detained.
In a single day in addition,,, also be easy to out, do not form and be detained and the obstruction stirring even embed recess if the size of recess is sufficiently more than small electronic component and medium.
Below, the experimental example of implementing is described for confirming effect of the present invention.
In this embodiment,, as shown in Figure 1, dispose 4 negative electrode 4a, in device shown in Figure 61, use the part container 7 of internal diameter 25cm as according to embodiments of the invention.
In this experimental example, as the negative electrode 4a that is located in the part container 7, use diameter 20mm and diameter 30mm respectively 2 kinds.
For the negative electrode 4a of above-mentioned diameter 20mm, form 3 ditches 11 with the 5mm spacing, the width of each ditch 11 is 0.3mm, the degree of depth is 0.2mm.
For the negative electrode 4a of diameter 30mm, form 5 ditches 11 with the 5mm spacing in addition, the width of each ditch 11 is 0.3mm, and the degree of depth is 0.2mm.
As plating small electronic component 6a, use cascade capacitor with 1.0mm * 0.5mm * 0.5mm size, the external electrode surface that forms on these cascade capacitor two ends is implemented to electroplate.
In addition, as a comparative example, use the negative electrode that does not form ditch, under the condition identical, implement to electroplate with embodiment.
The maximum ga(u)ge that forms precipitate in each embodiment and the comparative example on negative electrode has been shown in the following table 1.
Table 1
| The negative electrode diameter | Embodiment | Comparative example |
| 20mm | 3mm | 8mm |
| 30mm | 1.5mm | 5mm |
As known from Table 1, be that embodiment compares with comparative example under 20mm and any situation of 30mm at the negative electrode diameter, the maximum ga(u)ge of separating out portion is little.Can infer thus, this is to form projection on the precipitate because controlled among the embodiment.
Illustrated in the table 2 among the embodiment and comparative example when the negative electrode diameter is 20mm, have or not on the negative electrode precipitate peel off and the outer electrode of cascade capacitor on thickness of coating (on average).
Table 2
| Precipitate is peeled off | Thickness of coating (on average) | |
| Embodiment | Do not have | 4.9μm |
| Comparative example | Have | 3.4μm |
Known to table 2, at first, according to embodiment, the utmost point on the negative electrode goes out thing and can not produce and peel off.
When relatively electroplating bed thickness,, can obtain thicker electrolytic coating frequently according to embodiment.
If shown in the thickness results of plated film shown in the investigation table 2 and the above-mentioned table 1 to the maximum ga(u)ge of cathode deposition as a result the time, obtain to be thinner than the thickness of comparative example among the embodiment to the maximum ga(u)ge of cathode deposition, can suppress to hinder the generations such as projection of the cascade capacitor stirring that should plate thus, its result has improved the contact frequency of cascade capacitor and negative electrode, and supposition can obtain thicker plated film.
In above-mentioned experimental example, diameter 20mm negative electrode 4a as the embodiment employing, as depicted in figs. 1 and 2, though be to form 3 parallel ditches 11, but as shown in Figure 3, when use respectively forms the negative electrode 4b of 3 ditches 11 and 11a on vertical and horizontal, can confirm further to be reduced to 2mm to the maximum ga(u)ge of negative electrode 4b precipitate.
As mentioned above, according to the present invention, since negative electrode with by the face that contacts of the small-sized plated body of plating on form recess, so, in electroplating processes, the part that electric field is concentrated easily, be not only the edge section of negative electrode, and can near this recess, form and concentrate, so the precipitate of separating out on negative electrode only produces in that the cathode edge part is a large amount of, its result is difficult to be created in the phenomenon that forms projection on the precipitate.
Therefore, be difficult to produce this projection and hinder the small-sized state of affairs that should plate the thing stirring, thereby can improve the effect of electroplating processes.
On the precipitate on the negative electrode, be difficult to produce projection etc., simultaneously, by the fixed effect of recess to precipitate, so precipitate is difficult to strip down from negative electrode, thus, precipitate is difficult to produce attached to the state of affairs on the small-sized plated body as foreign material, and negative electrode self can not form very big problem yet.This has just further reduced the precipitate on the negative electrode unit surface, and can further improve the efficient of electroplating processes.
When particularly forming above-mentioned recess, be easy to distribute, also can more effectively disperse the electric field in the electroplating processes in whole upper recess of negative electrode by several ditches that on negative electrode and contact surface small-sized plated body, form.
When several ditches are intersected to form mutually, can bring into play above-mentioned effect more significantly.
The present invention is specially adapted to following electroplanting device, promptly has the part container of several small-sized plated bodies of splendid attire in electroplate liquid, and cathode arrangement is a part that forms this part container bottoms.That is, in such formation, the part container is when vertical axis rotates, small-sized plated body is played stirring action, under this situation, as previously mentioned, be difficult in and form projection etc. on the precipitate on the negative electrode, this is because stirring action more successfully feeds through to small-sized plated body.
Claims (8)
1. the electroplanting device of a small-sized plated body, be that following structure is arranged, be that above-mentioned electroplanting device has the plating tank of storing electroplate liquid and is immersed in the negative electrode and the anode that are formed by conductor of above-mentioned electroplate liquid, the small-sized plated body of several that should plate contacts with above-mentioned negative electrode in above-mentioned electroplate liquid, by between above-mentioned negative electrode and above-mentioned anode, switching on, plated film is separated out on small-sized plated body, it is characterized in that on above-mentioned negative electrode and face that small-sized plated body contacts, forming recess, and described recess forms and can not make plated body embed wherein size.
2. according to the electroplanting device of the small-sized plated body of claim 1 record, it is characterized in that forming above-mentioned recess by on above-mentioned of above-mentioned negative electrode, forming several ditches.
3. according to the electroplanting device of the small-sized plated body of claim 2 record, it is characterized in that above-mentioned ditch intersects to form mutually.
4. according to the electroplanting device of the small-sized plated body of claim 1 record, it is characterized in that forming above-mentioned recess by on above-mentioned of above-mentioned negative electrode, forming several vesicles.
5. according to the electroplanting device of the small-sized plated body of claim 1 record, it is characterized in that forming above-mentioned recess by on the face of above-mentioned negative electrode, forming chamfered section.
6. according to the electroplanting device of the small-sized plated body of each record in the claim 1～5, it is characterized in that also having the part container of several small-sized plated bodies of splendid attire in electroplate liquid, dispose above-mentioned negative electrode, make it form the part of above-mentioned part container bottoms.
7. according to the electroplanting device of the small-sized plated body of claim 6 record, it is characterized in that above-mentioned part container is rotated around vertical axis.
8. according to the electroplanting device of the small-sized plated body of claim 1 record, it is characterized in that small-sized plated body comprises small electronic component.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001352892A JP4235980B2 (en) | 2001-11-19 | 2001-11-19 | Small plating object plating equipment |
| JP2001352892 | 2001-11-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1420212A CN1420212A (en) | 2003-05-28 |
| CN1260401C true CN1260401C (en) | 2006-06-21 |
Family
ID=19165010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021529035A Expired - Fee Related CN1260401C (en) | 2001-11-19 | 2002-11-11 | Small plated body electroplating device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20030094373A1 (en) |
| JP (1) | JP4235980B2 (en) |
| CN (1) | CN1260401C (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5435355B2 (en) * | 2009-09-04 | 2014-03-05 | 日立金属株式会社 | Plating equipment |
| CN102677118B (en) * | 2012-05-03 | 2014-12-31 | 武汉威蒙环保科技有限公司 | Multipole type electro-deposition method for electrode of platy metal oxide |
| CN102677088B (en) * | 2012-05-03 | 2015-04-01 | 武汉威蒙环保科技有限公司 | Stress relief method for complex pole type plate-like metal oxide electrode |
| CN107287645B (en) * | 2016-05-12 | 2019-03-01 | 郑灵月 | A kind of anti-oxidation material section electrolytic plating apparatus |
| CN108085734B (en) * | 2017-12-26 | 2019-11-05 | 石家庄铁道大学 | Test small-sized Tumble-plating device |
| CN110373702B (en) * | 2019-08-13 | 2021-02-26 | 创隆实业(深圳)有限公司 | Electroplating system with feeding and stirring functions |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3833482A (en) * | 1973-03-26 | 1974-09-03 | Buckbee Mears Co | Matrix for forming mesh |
| US4341613A (en) * | 1981-02-03 | 1982-07-27 | Rca Corporation | Apparatus for electroforming |
| US5603815A (en) * | 1994-10-04 | 1997-02-18 | Lashmore; David S. | Electrochemical fluidized bed coating of powders |
| US5656140A (en) * | 1995-06-28 | 1997-08-12 | Chamberlain Ltd., Inc. | Electrochemical reclamation of heavy metals from natural materials such as soil |
| US5698081A (en) * | 1995-12-07 | 1997-12-16 | Materials Innovation, Inc. | Coating particles in a centrifugal bed |
| US6736952B2 (en) * | 2001-02-12 | 2004-05-18 | Speedfam-Ipec Corporation | Method and apparatus for electrochemical planarization of a workpiece |
-
2001
- 2001-11-19 JP JP2001352892A patent/JP4235980B2/en not_active Expired - Fee Related
-
2002
- 2002-11-02 US US10/286,172 patent/US20030094373A1/en not_active Abandoned
- 2002-11-11 CN CNB021529035A patent/CN1260401C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1420212A (en) | 2003-05-28 |
| US20030094373A1 (en) | 2003-05-22 |
| JP4235980B2 (en) | 2009-03-11 |
| JP2003155600A (en) | 2003-05-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1260401C (en) | Small plated body electroplating device | |
| CN1137497C (en) | Inductor device and process of production thereof | |
| CN101066004A (en) | Method for producing substrate having through hole filled with conductive material | |
| CN1506502A (en) | Method and equipment for controlling local electric current to obtain uniform electroplating thickness | |
| CN101030479A (en) | Multilayer capacitor and method of manufacturing same | |
| CN1591719A (en) | Multilayer capacitor | |
| CN1862727A (en) | Solid electrolytic capacitor which can easily be lowered in esl | |
| CN1255712A (en) | Flat shape electronic component and its mfg. method | |
| CN1921735A (en) | Production method of suspension board with circuit | |
| CN1758392A (en) | Solid electrolytic capacitor | |
| CN1576400A (en) | Electroplating apparatus and method for electronic parts,and the same electronic parts | |
| CN101034622A (en) | Laminated ceramic capacitor | |
| KR101506910B1 (en) | Method for anisotropic plating and thin- film coil | |
| CN1667879A (en) | Electronic connector terminal, a method for plating, and a terminal stack | |
| JP2002054000A (en) | Electroplating method for substrate | |
| CN1815643A (en) | Laminated electronic component | |
| CN1754236A (en) | Solid electrolytic capacitor | |
| TW574437B (en) | Electrodeposition device and electrodeposition system for coating structures which have already been made conductive | |
| CN1163919C (en) | Coil assembly | |
| CN1201348C (en) | Electronic device and manufacture thereof | |
| CN105593412B (en) | Drum type electrode, the method for producing drum type electrode, electroplanting device, the method for producing resin-formed body and the method for producing metal porous body | |
| US5817220A (en) | Electroplating apparatus | |
| CN1405806A (en) | Chip type electronic part | |
| CN1110056C (en) | Variable capacitor | |
| CN1183667C (en) | Surface mounted electronic parts and its mfg. method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060621 Termination date: 20211111 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |