CN1257533C - Wet etching apparatus - Google Patents
Wet etching apparatus Download PDFInfo
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- CN1257533C CN1257533C CN 03145140 CN03145140A CN1257533C CN 1257533 C CN1257533 C CN 1257533C CN 03145140 CN03145140 CN 03145140 CN 03145140 A CN03145140 A CN 03145140A CN 1257533 C CN1257533 C CN 1257533C
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- filter
- liquid
- wet etching
- accumulator tank
- valve
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Abstract
The present invention discloses a wet etching device which at least comprises a first storage groove, a filter, a second storage groove, a reaction chamber, a liquid discharge assembly, a first pump and a second pump, wherein the first storage groove is used for storing first liquid which is used as a chemical substance for a wet etching reaction, the filter comprises at least one filter core which is connected with the first storage groove and used for filtering impurities in the first liquid, the second storage groove which has a parallel connection state with the first storage groove is connected with the filter and is used for storing second liquid, the reaction chamber is connected with the filter and the wet etching reaction is carried out in the reaction chamber. The liquid discharge assembly is connected with the filter and has the parallel connection state with the reaction chamber. The first pump is used for conveying the first liquid to the reaction chamber through the filter, and the second pump is used for conveying the second liquid to the liquid discharge assembly through the filter and discharging the second liquid from the wet etching device.
Description
Technical field
The present invention relates to a kind of wet etching device, particularly relate to a kind of wet etching device with automatic cleaning filter core function.
Background technology
Please refer to Fig. 1, it shows in the existing semiconductor fabrication process, particularly in the thin-film transistor manufacture craft of TFT-LCD, is used for a glass substrate is carried out the etch module of the wet etching device 100 of etching process.Wherein capacity is the accumulator tank 102 of about 150L, store etching solution 10 in 104, and by an etching solution pipe-line system, supply reative cell 122 needed etching solutions 10, via a recovery system (not being illustrated in drawing) etching solution 10 is recycled to accumulator tank 102 again, 104 recycle, and the etching solution pipe-line system of above-mentioned supply reative cell 122 needed etching solutions 10 also comprises: the pump (pump) 162 of supply etching solution 10 required drive when above-mentioned etching solution pipe-line system flows, control etching solution 10 flows out the valve (valve) 131 and 132 of accumulator tank 102 and 104 respectively, the valve 133 of control etching solution 10 efflux pumps 162, include one or more filter core 117 and be used for the filter 111 and 112 of impurity in the filtered etch liquid 10, control etching solution 10 flows to the valve 134 and 135 of filter 111 and 112 respectively, and control etching solution 10 is flowed to the valve 137 and 136 of reative cell 122 by filter 111 and 112 respectively; In addition, capacity stores etching solution 10 in the accumulator tank 106,108 of about 270L, and by one with above-mentioned etching solution pipe-line system with similar structures, therefore supply reative cell 124,126 needed etching solutions 10 respectively or jointly, the above-mentioned difference or the structure of supplying the etching solution pipe-line system of reative cell 124,126 needed etching solutions 10 jointly just no longer indicate and describe in detail.And in above-mentioned etching solution pipe-line system, also can only use one group or two groups of above filters.And in the etching solution pipe-line system of above-mentioned wet etching device 100, use the benefit of two set filters 111,112 to be: when filter 111 is done maintenance or is safeguarded; the switch of may command valve 134,135,136,137; and use filter 112 to come filtered etch liquid 10; vice versa, makes wet etching device 100 not need to shut down and just can do maintenance or maintenance in the running simultaneously.
To the SiO on the glass substrate
x/ SiN
yWhen layer carried out wet etching, employed etching solution 10 for example was BHF (HF+NH
4The F+ interfacial agent) etc. the etching solution that contains interfacial agent, and when 122,124,126 pairs of above-mentioned glass substrates of reative cell carry out etching, add the SiO that the mode of soaking etching solution 10 makes etching solution 10 and above-mentioned glass substrate again to spray
x/ SiN
yChemical reaction takes place in layer, and meeting produces some reactants and bubble in above-mentioned chemical reaction process, and in the process that etching solution 10 recycles, above-mentioned reactant and bubble can be attached on the filter cores 117, after making production 80～200 sheet glass substrates, the reactant and the bubble that continue accumulation can make filter core 117 block.
The reactant of above-mentioned obstruction filter core 117 is soluble but is insoluble in the material of water that bubble then can dribble with the passing of time.Therefore traditionally after producing 80～200 sheet glass substrates, constantly water is introduced filter 111 or 112, washed filter core 117 by the circulation of water in manual mode.
Yet above-mentioned manually operated mode is operating mistake when controlled valve easily, and water is introduced in reative cell 112,124 or 126, causes the lowering of concentration of the etching solution 10 that is reacting, and makes SiO on the glass substrate carrying out etching reaction
x/ SiN
yLayer rate of etch is unusual, makes the glass substrate produced to scrap, and to the qualification rate of glass substrate, production cost, with the delivery time-histories etc., harmful effect is arranged all; In addition, above-mentioned manually operated mode need dispose manpower and deal with, and the human cost during also to production has harmful effect; Moreover, when using above-mentioned traditional wet etching device operation, sometimes can make etching solution 10 can't enter reative cell 122 and when sending the unusual caution cresset and the sound at filter core 117 total blockage, just know and to clean filter core 117, yet filter core 117 this moment total blockage, mode with above-mentioned flushing is difficult to allow water enter the effect that reaches cleaning in the filter core 117, and the filter core 117 that must more renew, and aspect required time and consumptive material, more production cost and output (throughput) there is harmful effect at renew cartridge more.
Summary of the invention
Main purpose of the present invention is to provide a kind of wet etching device, compare with traditional wet etching device, wet etching device of the present invention also provides the assembly that can wash filter, can use a programmable logic controller (PLC) (programmable logic controller; PLC) control the above-mentioned assembly that can wash filter, and can be after certain production cycle, the filter of wet etching device of the present invention is carried out the step of washing automatically, avoiding operating mistake, thus can improve product the production qualification rate, reduce production costs, with shorten the delivery time-histories.
Another object of the present invention is to provide a kind of wet etching device, compare with traditional wet etching device, wet etching device of the present invention also provides the assembly that can wash filter, can reduce the configuration of the manpower of wet etching board, save more required time and the consumptive material of renew cartridge, thereby reduce manpower and material cost and can be further helpful the reduction of production cost.
For reaching above-mentioned purpose of the present invention, the invention provides a kind of wet etching device, comprise at least: one first accumulator tank, in order to store first liquid of a chemical substance of using as wet etching reaction; One filter comprises at least one filter core, connects above-mentioned first accumulator tank, in order to filter the impurity in above-mentioned first liquid; One second accumulator tank connects above-mentioned filter and is state in parallel with above-mentioned first accumulator tank, and in order to store one second liquid, wherein this second liquid is cleaning solution; One reative cell connects above-mentioned filter, carries out wet etching reaction in above-mentioned reative cell; One discharge opeing assembly connects above-mentioned filter, is state in parallel with above-mentioned reative cell, and one first pump via above-mentioned filter, is transported to above-mentioned reative cell with above-mentioned first liquid; And one second pump, this second liquid via this filter, is transported to this discharge opeing assembly, this second liquid is discharged this wet etching device; One first valve is between this first accumulator tank and this filter; One second valve is between this filter and this reative cell; One the 3rd valve is between this second accumulator tank and this filter; One the 4th valve, between this filter and this discharge opeing assembly, wherein this first pump be device between this first valve and this first accumulator tank,, this second pump is that device is between the 3rd valve and this second accumulator tank; And a programmable logic controller (PLC), to control the switch of above-mentioned each valve.To reach the function of automatic cleaning strainer.
Description of drawings
Fig. 1 is a schematic diagram, and it shows the etch module of traditional wet etching device;
Fig. 2 is a schematic diagram, and it shows the etch module of wet etching device of the present invention;
Fig. 3 is a schematic diagram, and it shows being connected of etch module of a PLC and wet etching device of the present invention.
Embodiment
Please refer to Fig. 2, the etch module that it shows wet etching device 200 of the present invention comprises: etching solution pipe-line system and cleaning solution pipe-line system.Wherein capacity is the accumulator tank 202 of about 150L, store etching solution 10 in 204, and by above-mentioned etching solution pipe-line system supply reative cell 222 needed etching solutions 10, via a recovery system (not being illustrated in drawing) etching solution 10 is recycled to accumulator tank 202 again, 204 recycle, and the etching solution pipe-line system of above-mentioned supply reative cell 222 needed etching solutions 10 also comprises: the pump (pump) 262 of supply etching solution 10 required drive when above-mentioned etching solution pipe-line system flows, control etching solution 10 flows out the valve (valve) 231 and 232 of accumulator tank 202 and 204 respectively, the valve 233 of control etching solution 10 efflux pumps 262, include one or more filter core 217 and be used for the filter 211 and 212 of impurity in the filtered etch liquid 10, control etching solution 10 flows to the valve 234 and 235 of filter 211 and 212 respectively, and control etching solution 10 is flowed to the valve 237 and 236 of reative cell 222 by filter 211 and 212 respectively; In addition, capacity stores etching solution 10 in the accumulator tank 206,208 of about 270L, and by one with above-mentioned etching solution pipe-line system with similar structures, therefore supply reative cell 224,226 needed etching solutions 10 respectively or jointly, the above-mentioned difference or the structure of supplying the etching solution pipe-line system of reative cell 224,226 needed etching solutions 10 jointly just no longer indicate and describe in detail.And aspect the cleaning solution pipe-line system, cleaning filter core 217 needed cleaning solutions 20, be preferably deionized water (D.I.water), the capacity that is stored in is in the accumulator tank 203 of about 50L, when needs cleaning filter core 217, by above-mentioned cleaning solution pipe-line system supply cleaning filter core 217 needed cleaning solutions 20, and the cleaning solution pipe-line system of above-mentioned supply cleaning filter core 217 needed cleaning solutions 20 also comprises: the pump 263 of supply cleaning solution 20 required drive when above-mentioned cleaning solution pipe-line system flows, dispensing cleaning solution 20 is to the pipeline 271 of each filter, control cleaning 20 flows to the valve 272 and 273 of filter 211 and 212 respectively, and control cleaning solution 20 flows to a valve 275 and 274 in order to the pipeline 276 that reclaims cleaning solution 20 by filter 211 and 212 respectively.In addition, in preferred embodiment of the present invention, when the filter core in the etching solution pipe-line system of supply reative cell 224,226 needed etching solutions 10 218,219 is made cleaning, also supply respectively and recovery cleaning solution 20, also can connect independently cleaning solution accumulator tank, dispensing pipeline and reclaim line in addition by accumulator tank 203, pipeline 271, pipeline 276; And above-mentioned when the filter core in the etching solution pipe-line system of supply reative cell 224,226 needed etching solutions 10 218,219 is made cleaning the structure of needed cleaning solution pipe-line system also as the cleaning solution pipe-line system of above-mentioned supply cleaning filter core 217 needed cleaning solutions 20, just repeated description no longer.
Please refer to Fig. 3, aspect the action of above-mentioned etching solution pipe-line system of control and cleaning solution pipe-line system, can in PLC 290, write suitable control and make the technology preface, reach the purpose of automated cleaning filter core.For example: in the thin-film transistor manufacture craft of wet etching device 200 of the present invention at TFT-LCD of application drawing 2, be used for to the SiO on the glass substrate
x/ SiN
yWhen layer carries out etching process, in the process of running, earlier filter the required etching solution 10 of supply reative cell 222 with filter 212, and switching to when filtering the required etching solution 10 of supply reative cell 222 with filter 211, PLC 290 controls with Fig. 3: earlier with valve 234,275 open and make valve 237,272 close, do not make cleaning solution 20 inflow filters 211, and during with the previous filter rinsed 211 of etching solution 10 displacement in filter core 217 residual cleaning solution 20, next valve 237 is closed and opened to valve 275, and valve-off 235,236 and make etching solution 10 arrive reative cell 222 and do not enter filter 212 via filter 211, open valve 273 simultaneously, 274 and cleaning solution 20 is introduced filters 212 clean filter core 217; Because behind aforementioned production 80～200 sheet glass substrates, the filter core 117 that the reactant of lasting accumulation and bubble can make traditional wet etching device 100 blocks; When being applied in wet etching device 200 of the present invention, can set switch to filter 211 back and produce 70 sheet glass substrates after, with similar above-mentioned changeover program, change again by filter 212 and come filtered etch liquid 10 and filter rinsed 211, avoid the filter core 217 of filter 211,212 can't carry out the problem generation that on-line cleaning must be changed because of total blockage.Therefore, wet etching device of the present invention, after certain production cycle, the filter of wet etching device of the present invention is carried out the step of washing automatically and is reached: can avoid operating mistake, thereby the production qualification rate of lifting glass substrate, reduce production costs, with shorten the delivery time-histories; Also can reduce the configuration of the manpower of wet etching board, save more required time and the consumptive material of renew cartridge, thereby reduce manpower and material cost and can be further helpful the reduction of production cost.
And in above-mentioned etching solution pipe-line system, also can only use one group or two groups of above filters.And in the etching solution pipe-line system of above-mentioned wet etching device 200, use the benefit of two set filters 211,212 to be: when filter 211 is made cleaning, keeps in repair or is safeguarded; the switch of may command valve 234,235,236,237; and use filter 212 to come filtered etch liquid 10; vice versa, makes wet etching device 200 not need to shut down and just can do cleaning, maintenance or maintenance in the running simultaneously.
Though disclosed the present invention in conjunction with an above preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art can do some change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined without departing from the spirit and scope of the present invention.
Claims (4)
1. wet etching device comprises at least:
One first accumulator tank is in order to store first liquid of a chemical substance of using as wet etching reaction;
One filter comprises at least one filter core, connects this first accumulator tank, in order to filter the impurity in this first liquid;
One second accumulator tank connects this filter and is state in parallel with this first accumulator tank, and in order to store one second liquid, wherein this second liquid is cleaning solution;
One reative cell connects this filter, carries out wet etching reaction in this reative cell;
One discharge opeing assembly connects this filter, is state in parallel with this reative cell,
One first pump via this filter, is transported to this reative cell with this first liquid; And
One second pump via this filter, is transported to this discharge opeing assembly with this second liquid, and this second liquid is discharged this wet etching device;
One first valve is between this first accumulator tank and this filter;
One second valve is between this filter and this reative cell;
One the 3rd valve is between this second accumulator tank and this filter;
One the 4th valve, between this filter and this discharge opeing assembly, wherein this first pump be device between this first valve and this first accumulator tank,, this second pump is that device is between the 3rd valve and this second accumulator tank; And
One programmable logic controller (PLC) is to control the switch of above-mentioned each valve.
2. wet etching device as claimed in claim 1, wherein this cleaning solution is a deionized water.
3. wet etching device as claimed in claim 1, wherein this first liquid contains an interfacial agent.
4. wet etching device as claimed in claim 1, wherein this first accumulator tank is an etching solution accumulator tank, this first liquid is one to contain the etching solution of interfacial agent,
This second accumulator tank is a cleaning solution accumulator tank, in order to store this cleaning solution.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03145140 CN1257533C (en) | 2003-06-23 | 2003-06-23 | Wet etching apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03145140 CN1257533C (en) | 2003-06-23 | 2003-06-23 | Wet etching apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1567094A CN1567094A (en) | 2005-01-19 |
| CN1257533C true CN1257533C (en) | 2006-05-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03145140 Expired - Lifetime CN1257533C (en) | 2003-06-23 | 2003-06-23 | Wet etching apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1257533C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100466192C (en) * | 2005-06-20 | 2009-03-04 | 台湾积体电路制造股份有限公司 | Liquid flow control system for wet processing tank, and wet processing system |
-
2003
- 2003-06-23 CN CN 03145140 patent/CN1257533C/en not_active Expired - Lifetime
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| Publication number | Publication date |
|---|---|
| CN1567094A (en) | 2005-01-19 |
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