CN1254493A - Method of attaching metallic objects to printed circuit board - Google Patents
Method of attaching metallic objects to printed circuit board Download PDFInfo
- Publication number
- CN1254493A CN1254493A CN98804692A CN98804692A CN1254493A CN 1254493 A CN1254493 A CN 1254493A CN 98804692 A CN98804692 A CN 98804692A CN 98804692 A CN98804692 A CN 98804692A CN 1254493 A CN1254493 A CN 1254493A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- soldering paste
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/042—Remote solder depot on the PCB, the solder flowing to the connections from this depot
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A single-step heating application for soldering a metallic flange (202) and other components (309) to a printed circuit board (201) is disclosed. Printed circuit board (201) includes one or more through apertures (203) where a solder paste (305) is dispensed, and is heated with metallic flange (202) and other components (309). The apertures (203) holding solder paste (305) have walls of non-metallic surfaces where solder is repelled during the heating process such that the solder flows to an area where the surfaces of metallic flange (202) and printed circuit board (201) are being soldered.
Description
The present invention relates to welding assembly, more specifically, relate to metal parts is welded welding assembly on the printed circuit board (PCB).
Metal parts is such as metal rim, owing to some reasons are soldered on the printed circuit board (PCB) (PCB).One of reason is for power amplifier is fixed on the metal rim, and then this metal rim can be made the radiator of this power amplifier, and provides circuit ground for power amplifier.Therefore, flange must be to provide circuit ground and the heat of power amplifier the two not damaged mode that sheds be welded on the printed circuit board (PCB).
For metal rim is welded on the printed circuit board (PCB), the welding process of existing technology has two problems at least, and first problem is to produce hole between the connection surface of flange and printed circuit board (PCB).Second problem is for metal rim and other element are welded on the printed circuit board (PCB) suitably, to need at least to heat in two steps.
Add in the first step and to pine for, have only flange to be soldered on the printed circuit board (PCB).Add and pine in second step, other is welded on the printed circuit board (PCB) than small components with low-melting scolder.This low melting point of scolder in second step is allowed printed circuit board (PCB) is heated again and is unlikely to make solder reflow in the first step.Yet the scolder protective layer on the printed circuit board (PCB) top layer has been burnt in the heating first time at high temperature to printed circuit board (PCB).If like this, second step was not only unnecessary step, and was poor efficiency and/or invalid.
The welding process of existing technology can be with reference to figure 1, and comprising the following step: place skim scolder 101 between flange 102 and printed circuit board (PCB) 103, this scolder is made according to the true form and the size of flange.Then, to 103 heating of flange 102 and printed circuit board (PCB) up to adding scolder 101 between printed circuit board (PCB) 103 and flange 102, melt.But when adopting this welding method, can produce hole between printed circuit board (PCB) 103 and the flange 102.The generation of hole is because can be converted into gas before the solder alloy fusing of the flux component in the scolder in scolder 101.The air accumulation that is produced is between the surface of printed circuit board (PCB) 103 and flange and generate hole.Final result is to obtain uniform welding, the heat dispersion that this can damage the circuit ground performance greatly and be affixed to the power amplifier on flange.
Therefore, need seek a kind of metal rim and other element to be welded to method on the printed circuit board (PCB), to overcome the shortcoming in the existing method.
Fig. 1 briefly illustrates the welding method of existing technology.
Fig. 2 briefly illustrates fixedlying connected according to the flange of embodiment of the present invention and printed circuit board (PCB) with holes.
Fig. 3 briefly illustrates the hole of having filled up soldering paste according to the heating process of embodiment of the present invention before.
Fig. 4 briefly illustrates according to this hole shown in Figure 3 after the heating process of embodiment of the present invention.
Generally speaking, the invention discloses and a kind of metal rim and other element are welded to single step heating means on the printed circuit board (PCB).This printed circuit board (PCB) comprises one or more through holes that split soldering paste, and this hole and metal rim and other element are heated simultaneously.This hole that soldering paste is housed has the wall of nonmetallic surface, repels scolder in heating process, so that scolder flow into the zone that ledge surface and printed circuit board (PCB) are welded together.
More particularly, a kind of printed circuit board (PCB), this printed circuit board (PCB) has first, second, at least one fills the hole of soldering paste, and metal rim, this flange is combined in by soldering paste on above-mentioned second of printed circuit board (PCB), to printed circuit board (PCB) and flange heating the time this soldering paste can tap hole outside.Hole on the above-mentioned printed circuit board (PCB) is covered by nonmetallic surface, and nonmetallic surface flows out solder paste in heating process.The edge that has wound hole on first of printed circuit board (PCB), this edge comprise near a kind of bonding nonmetallic materials of element of soldering paste and this edge that stop.In preferred version, printed circuit board (PCB) has a plurality of circular ports, and this hole can have substantially the same diameter also can have different basically diameters.
A kind of metal rim is welded to method on the printed circuit board (PCB), comprising the following steps: soldering paste is placed in is arranged in hole on the printed circuit board (PCB), and this printed circuit board (PCB) has first and second; Then, flange is fixed on second of printed circuit board (PCB), and printed circuit board (PCB) is heated with flange, makes soldering paste fusion and deliquescing (wicked) between second of printed circuit board (PCB) and metal rim in the hole.This method also comprises, before the heating steps with soldering paste with first the step of combination of elements to the printed circuit board (PCB), thereby make that after heating steps these elements also are fixed on the printed circuit board (PCB).
A kind of device, adopt the following step manufacturing: soldering paste is placed in is arranged in hole on the printed circuit board (PCB), and this printed circuit board (PCB) has first and second; Then, this flange is incorporated on second of printed circuit board (PCB), and printed circuit board (PCB) and combined flange be heated, thereby makes soldering paste fusion and deliquescing between printed circuit board (PCB) and metal rim in the hole.
Fig. 2 briefly shows metal rim 202 according to the present invention and contains fixedlying connected of porose 203 printed circuit board (PCB).As shown in Figure 2, printed circuit board (PCB) 201 has several holes 203 in the zone of holding flange.In preferred version, hole 203 all has identical diameter basically for circular and each hole.One skilled in the art will recognize that this hole also can have different basically diameters or also can be all specific shapes.Hole 203 they the edge and their cavity wall on all do not have the metal surface, and be to pass printed circuit board (PCB) 201 from first 204 to obtain to second boring of fixing metal flange.203 the edge in the hole applies the scolder protective layer, and scolder just can not contact with other element on edge or peripheral region or side, hole in heating process like this.
With the technology that metal rim 202 is fixedlyed connected with printed circuit board (PCB) 201, at first from flange 202 is combined with printed circuit board (PCB) 201, this combination can be passed through the whole bag of tricks, for example, and anchor clamps, interference fit or use chemical bonding such as glue.Then, referring to Fig. 3, the soldering paste 305 of packing in the hole 203.Soldering paste 305 can be inserted earlier in the hole 203, and the multiple mode that printed circuit board (PCB) 201 and metal rim 202 usefulness can be selected combines then.Soldering paste 305 comprises the solder flux that melts before solder alloy and the solder alloy in soldering paste basically.Heating makes soldering paste 305 fusing deliquescing enter slit between printed circuit board (PCB) 201 and the metal rim 202 then.As shown in Figure 4, soldering paste 305 flows into from hole 203 basically.According to the present invention, utilize these holes, the soldering paste 305 in the hole that is placed in melts, and flow to the slit between flange and the printed circuit board (PCB) downwards along the hole.The gas that produces from solder flux is overflowed by each face of printed circuit board (PCB) 201 or first 204 of printed circuit board (PCB) 201.Like this, the gas in the solder flux can not stagnate poly-, and is shown in Figure 4 as the present invention, forms welding uniformly between printed circuit board (PCB) 201 and flange 202.
As shown in Figure 3, the scolder protective layer 304 on 201 first of printed circuit board (PCB)s places the edge in hole 203, and hole 203 self covers by a kind of nonmetallic surface, and the tolerable soldering paste flows out in heating process like this.Splitting at normal temperatures of soldering paste 305 carried out, and do not want excessive heat when soldering paste 305 fusings, too is higher than the fusing point of soldering paste 305 to prevent temperature.Therefore, according to single stage of the present invention heating, can be by element 309 usefulness soldering pastes 305 first with printed circuit board (PCB) 201 be combined such as other element of element 309, and heating element 309, printed circuit board (PCB) 201 and metal rim and be fixed up.
Though in conjunction with specific embodiments the present invention is described in detail, should be appreciated that for those skilled in the art, do not deviating from the present invention spirit and do not breaking away under its scope prerequisite, can be in form, make many variations on the details.The wide variety of method steps and the function element of the structure in following claims, material, effect and equivalence should comprise all structures, material that combines with the above-mentioned element that other indicates or the method for carrying out this function.
Claims (9)
1. device comprises:
At least one hole that printed circuit board (PCB), this printed circuit board (PCB) have first and second and be used to hold soldering paste; And
By the metal rim that described soldering paste combines with second face of described printed circuit board (PCB), this soldering paste goes out from described orifice flow to printed circuit board (PCB) and flange heating the time.
2. device as claimed in claim 1, wherein: the described hole on the described printed circuit board (PCB) is coated with a kind of nonmetallic surface that described soldering paste is flowed out when heating.
3. device as claimed in claim 1, wherein: described first bread of described printed circuit board (PCB) contains the edge around described hole, comprises near the mutually bonding nonmetallic materials of element that prevent that described soldering paste is with the edge in the described edge.
4. device as claimed in claim 1, wherein: described printed circuit board (PCB) has a plurality of described holes.
5. device as claimed in claim 4, wherein: described a plurality of holes are the essentially identical circle of diameter.
6. device as claimed in claim 4, wherein: described a plurality of holes are the different substantially circle of diameter.
7. one kind is fixed to method on the printed circuit board (PCB) with metal rim, and this method comprises the following steps:
Soldering paste is placed in the hole on the described printed circuit board (PCB), and this printed circuit board (PCB) has first and second;
Described second face of described flange and described printed circuit board (PCB) is combined; And
Heat described printed circuit board (PCB) and the described flange that is fixed, so that the fusion and softening between second of described printed circuit board (PCB) and described metal rim of the described scolder in the described hole.
8. method as claimed in claim 7, before heating steps, further comprise, with soldering paste element is combined with described first face of described printed circuit board (PCB), thus the step that described element also is fixed together with described printed circuit board (PCB) behind heating steps.
9. device that makes with the following step:
Soldering paste is placed in the hole on the printed circuit board (PCB), and this printed circuit board (PCB) has first and second;
Flange is combined on described second of described printed circuit board (PCB), and
Heat described printed circuit board (PCB) and the described flange that is fixed, thereby make the described soldering paste fusion and softening between described second and the described metal rim of described printed circuit board (PCB) in the described hole, to make described device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US84636197A | 1997-04-30 | 1997-04-30 | |
| US08/846,361 | 1997-04-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1254493A true CN1254493A (en) | 2000-05-24 |
Family
ID=25297695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN98804692A Pending CN1254493A (en) | 1997-04-30 | 1998-03-02 | Method of attaching metallic objects to printed circuit board |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2001522532A (en) |
| CN (1) | CN1254493A (en) |
| BR (1) | BR9807963A (en) |
| WO (1) | WO1998049875A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100534268C (en) * | 2001-06-01 | 2009-08-26 | 恩德莱斯和豪瑟尔两合公司 | Circuit board with at least one electronic component |
| CN104741725A (en) * | 2013-12-27 | 2015-07-01 | 博世汽车部件(苏州)有限公司 | Welding tool |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6842341B1 (en) * | 2003-10-02 | 2005-01-11 | Motorola, Inc. | Electrical circuit apparatus and method for assembling same |
| NL1027632C2 (en) * | 2004-12-01 | 2006-06-02 | Electrische App Nfabriek Capax | Support for electrical components with insulated heat sink. |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3032253B2 (en) * | 1990-08-06 | 2000-04-10 | 株式会社フジクラ | Pre-soldered flat cable and manufacturing method thereof |
| JPH06152092A (en) * | 1992-11-10 | 1994-05-31 | Murata Mfg Co Ltd | Surface-mount type printed circuit board assembly |
-
1998
- 1998-03-02 WO PCT/US1998/004013 patent/WO1998049875A1/en active Search and Examination
- 1998-03-02 JP JP54695498A patent/JP2001522532A/en active Pending
- 1998-03-02 CN CN98804692A patent/CN1254493A/en active Pending
- 1998-03-02 BR BR9807963-8A patent/BR9807963A/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100534268C (en) * | 2001-06-01 | 2009-08-26 | 恩德莱斯和豪瑟尔两合公司 | Circuit board with at least one electronic component |
| CN104741725A (en) * | 2013-12-27 | 2015-07-01 | 博世汽车部件(苏州)有限公司 | Welding tool |
| CN104741725B (en) * | 2013-12-27 | 2017-03-22 | 博世汽车部件(苏州)有限公司 | Welding tool |
Also Published As
| Publication number | Publication date |
|---|---|
| BR9807963A (en) | 2000-03-08 |
| WO1998049875A1 (en) | 1998-11-05 |
| JP2001522532A (en) | 2001-11-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |