CN104741725B - Welding tool - Google Patents
Welding tool Download PDFInfo
- Publication number
- CN104741725B CN104741725B CN201310734031.5A CN201310734031A CN104741725B CN 104741725 B CN104741725 B CN 104741725B CN 201310734031 A CN201310734031 A CN 201310734031A CN 104741725 B CN104741725 B CN 104741725B
- Authority
- CN
- China
- Prior art keywords
- soldering appliance
- coating member
- solder
- top surface
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F15/00—Connecting wire to wire or other metallic material or objects; Connecting parts by means of wire
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention provides a welding tool. The welding tool is used for welding pins of an electronic component to a printed circuit board. The welding tool comprises a body and covering components, and a groove of the body is used for containing a welding flux; and the covering components cover at least the upper portion of the outer surface of the body, and are used for reducing or eliminating formation and accumulation of intermetallic compounds and/or metallic oxides, formed by the welding flux and/or the welding tool, on the outer surface of the body of the welding tool.
Description
Technical field
The present invention relates to a kind of soldering appliance, in particular to a kind of for the pin of electronic unit is welded to printing
The soldering appliance of circuit board.
Background technology
Fig. 1 shows and the pin of the electronic unit on electronic product is welded to printing using the soldering appliance of prior art
Easily occurs the schematic diagram that the Surface Mounted Device on electronic product drops or bridges when on circuit board.As shown in figure 1, one
As, first so that the Surface Mounted Device 4 of electronic product is welded on the printed circuit board (PCB) 1 of electronic product, subsequently so that electronics
The pin 9 of the electronic unit 3 of product is welded through welding hole 7 corresponding on the printed circuit board (PCB) 1 of electronic product is arranged on
Welded gasket is disposed with around hole 7（It is not shown）, the pin 9 of the electronic unit 3 of electronic product is carried out followed by soldering appliance 5
Welding.
When the soldering appliance 5 using prior art carries out batch welding to the electronic unit 3 of electronic product, soldering appliance
5 normal welds when starting, solder 6 along soldering appliance 5 outer surface toward dirty, but after welding certain amount product, weld
The outer surface of bonding tool 5 forms intermetallic compound（Ferrum in such as stannum in solder and soldering appliance reacts and is formed
FeSn2, etc.）And/or metal-oxide（The SnO that such as stannum in solder itself occurs oxidation and formed2, etc.）8, and gold
Between category, compound and/or metal-oxide 8 are elapsed over time and are thickened, and solder is by along the intermetallic compound piled up
And/or metal-oxide 8 is toward dirty, at this moment as electronic product is limited by its printed circuit board layout, electronic product
Surface Mounted Device 4 is less with the distance between welded gasket（E.g., less than 4mm）, so that solder meeting and Surface Mounted Device
4 contacts, in turn result in the secondary welding of Surface Mounted Device 4, and the degree of secondary welding is different, then can cause Surface Mounted Device
4 drop or bridge（Surface Mounted Device 4 itself is bridged）.
In order to ensure welding quality, the soldering appliance needs of prior art are clear with metallic brush and solder flux every such as 2 hours
Once to remove intermetallic compound and/or metal-oxide on its outer surface, this just destroys the appearance of soldering appliance to reason
Face, exacerbates the generating rate of intermetallic compound and/or metal-oxide, shortens the service life of soldering appliance.
EP 2131636A1 disclose a kind of soldering appliance, and the outer surface of the soldering appliance, inner surface and top surface are applied
The inert coatings not reacted with solder are covered with, to prevent intermetallic being formed on these surfaces of soldering appliance
Thing.However, as inert coatings cover the inner surface and top surface of soldering appliance and inert coatings are that solder is not infiltrated
, so that the solder in soldering appliance is unable to reach desired welding and assembling height, this greatly have impact on welding operation, or even
So that welding operation cannot be carried out.
It is therefore contemplated that provide a kind of new soldering appliance, its can both avoid or reduce intermetallic compound and/or
Formation and accumulation of the metal-oxide on the outer surface of soldering appliance, so as to preventing neighbouring Surface Mounted Device from dropping or
The life-span of soldering appliance is bridged and extended, and is able to ensure that accommodated solder reaches desired welding and assembling height.
The content of the invention
The goal of the invention of the present invention aims to solve the problem that the defect of prior art, and which is achieved by the following technical programs：
An embodiment provides a kind of soldering appliance, for the pin of electronic unit is welded to printing electricity
Road plate, soldering appliance include the body with outer surface, inner surface and top surface, and the inner surface of body is formed for accommodating solder
Groove, wherein soldering appliance also include coating member, coating member cover body outer surface at least upper part, cover
Part is used for reducing or eliminate the intermetallic compound that formed by solder and/or soldering appliance and/or metal-oxide and is welding
Formation and accumulation on the outer surface of the body of instrument.
The soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein solder be the alloy comprising stannum, by stannum and lead
The alloy of composition or the alloy being made up of SAC.
The body of the soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein soldering appliance is made of stainless steel.
The inner surface and top table of the body of the soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein soldering appliance
Face is coated with the material to wetting.
The soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein coating member are by the nonwettable inertia of solder
Material is made.
The soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein coating member are by made by titanium or zinc
Piece, coating member have base portion and from base portion extension towards the inclined rake of body, and coating member at least covers the outer of body
The upper part on surface is simultaneously concordant with the top surface of body, the corresponding edge of the rake of coating member against the top surface of body
Edge.
The rake of the soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein coating member is relative to covering part
The angle of inclination of the base portion of part is less than 30 degree more than 0 degree.
The soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein coating member are attached to weldering by fixed component
On the body of bonding tool.
The soldering appliance for providing according to the abovementioned embodiments of the present invention, wherein fixed component are screw.
The inner surface and top surface of the body of the soldering appliance of the present invention is coated with the material to wetting, so as to favourable
In welding, while the coating member on the outer surface of the body of soldering appliance is by making to the nonwettable inert material of solder, therefore
Intermetallic compound and/or metal-oxide formation and accumulation on the outer surface of soldering appliance is avoid or reduced, is entered
And prevent the Surface Mounted Device on electronic product from dropping or bridging, drastically increase the yield rate of electronic product and extend
Life-span of soldering appliance.
Description of the drawings
Discuss above and other aspect of the present invention below in conjunction with accompanying drawing in detail, in accompanying drawing：
Fig. 1 shows and the pin of the electronic unit on electronic product is welded to printing using the soldering appliance of prior art
Easily occurs the schematic diagram that the Surface Mounted Device on electronic product drops or bridges when on circuit board.
Fig. 2 shows the construction of soldering appliance according to an embodiment of the invention.
The partial enlarged view of the coating member that Fig. 3 is represented with circle A in showing Fig. 2.
Component names and label
| 1 | Printed circuit board (PCB) |
| 3 | Electronic unit |
| 4 | Surface Mounted Device |
| 5,50 | Soldering appliance |
| 6 | Solder |
| 7 | Welding hole |
| 8 | Intermetallic compound and/or metal-oxide |
| 9 | Pin |
| 100 | Body |
| 100a | Inner surface |
| 100b | Outer surface |
| 100c | Top surface |
| 102 | Coating member |
| 102a | Base portion |
| 102b | Rake |
| 103 | Screw |
.Specific embodiment
Fig. 1-3 and following description describe the present invention optional embodiment how to instruct those of ordinary skill in the art
Implement and reproduce the present invention.In order to instruct technical solution of the present invention, some conventional aspects are simplified or have eliminated.This area is common
Technical staff should be appreciated that from these embodiments modification or replacement will be within the scope of the present invention.This area is general
Logical technical staff should be appreciated that following characteristics can combine to form multiple modifications of the present invention in a variety of ways.Thus, this
It is bright to be not limited to following optional embodiments, and only limited by claim and their equivalent.
Herein, DIP is the abbreviation of the initial of english term " Dual In-line Package ", the Chinese of DIP
Entitled " dual-inline package technology ".Abbreviations of the PPM for the initial of english term " Parts per Million ", PPM
Chinese implication be " hundred a ten thousandths ".
Fig. 2 shows the construction of soldering appliance according to an embodiment of the invention.Fig. 3 uses circle A tables in showing Fig. 2
The partial enlarged view of the coating member for illustrating.The soldering appliance 50 of the present invention is used for the electronic product using DIP welding procedures
（It is unleaded or have lead electronic product）Electronic unit pin welding.As shown in Figures 2 and 3, soldering appliance 50 includes body
100 and coating member 102, body 100 includes inner surface 100a, outer surface 100b and top surface 100c, the interior table of body 100
Face 100a limits the groove for accommodating solder 6, and coating member 102 covers at least top portion of the outer surface 100b of body 100
Point, namely coating member 102 at least can cover outer surface 100b welding when with the neighbouring part of Surface Mounted Device 4.It is logical
At least upper part of the outer surface 100b for making coating member 102 cover body 100 is crossed, can be avoided or significant reduction metal
Between compound and/or metal-oxide formation and accumulation on the outer surface of soldering appliance.
In one embodiment, coating member 102 does not cover the top surface 100c and inner surface 100a of body 100.One
In individual embodiment, the top surface 100c and inner surface 100a of body 100 can be coated with the material to wetting.By making to cover
Cover 102 only covers outer surface 100b and does not cover top surface 100c and inner surface 100a, and makes top surface 100c and interior
Surface 100a is coated with the material to wetting, can either avoid or significant reduction intermetallic compound and/or metal oxygen
Compound is formed and is piled up on the outer surface, while the solder 6 also ensured in the groove formed by inner surface 100a can reach
Desired welding and assembling height.Desired welding and assembling height can aid in being smoothed out for welding operation.Arrow H in Fig. 2 shows
Solder 6 in groove reaches desired welding and assembling height.Be coated on top surface 100c and inner surface 100a to wetting
Material may, for example, be tin coating, or any other suitable material to wetting.
The solder for example, alloy comprising stannum is specifically the alloy that is made up of stannum and lead or is made up of SAC
Alloy.
In one embodiment, the body 100 of soldering appliance 50 is made of stainless steel.Certainly, those skilled in the art's energy
Enough to understand, the body 100 of soldering appliance 50 can also be made up of any other suitable material.
By making to the nonwettable inert material of solder, for example, coating member 102 is by made by titanium to coating member 102
Titanium sheet.As the inert material for forming coating member 102 is material nonwettable to solder so that when using the present invention's
When soldering appliance 50 is welded, the solder flowed out from the groove of soldering appliance 50 will be downward directed along coating member 102
Flow away, and will not be remained on soldering appliance 50 substantially.
Coating member 102 has base portion 102a and from base portion 102a extensions towards 100 inclined rake 102b of body, covers
Cover 102 covers at least upper part of the outer surface of body 100, rake 102b concordant with the top surface of body 100
Against the respective edges of the top surface 100c of body 100, to prevent solder from flowing in the gap between them.Coating member 102
Rake 102b be more than 0 degree and less than 30 degree relative to the angle of inclination of the base portion 102a of coating member.For example in this enforcement
In example, base portion 102a is generally vertical.
In an example of the present invention, coating member 102 is attached to the body 100 of soldering appliance 50 by fixed component
On（For example pass through screw 103）.Certainly titanium sheet can also be attached on soldering appliance body otherwise, and this also will be at this
In the protection domain of invention.Preferably, the thickness of titanium sheet is of about 0.5mm, and titanium sheet can also be other thickness, and this also will
It is within the scope of the present invention.
Additionally, coating member 102 can also be the piece by made by zinc etc., zinc is inert material nonwettable to solder.Cover
Cover 102 has base portion 102a and from base portion 102a extensions towards 100 inclined rake 102b of body, coating member 102
The upper part of outer surface of body 100 concordant with the top surface of body 100 is covered at least, rake 102b is against body
The respective edges of 100 top surface 100c, to prevent solder from flowing in the gap between them.
The inner surface and top surface of the body of the soldering appliance of the present invention is coated with the material to wetting, so as to favourable
In welding, while the coating member on the outer surface of the body of soldering appliance is by making to the nonwettable inert material of solder, therefore
Intermetallic compound and/or metal-oxide formation and accumulation on the outer surface of soldering appliance is avoid or reduced, is entered
And prevent the Surface Mounted Device on electronic product from dropping or bridging, drastically increase the yield rate of electronic product and extend
Life-span of soldering appliance.
Claims (10)
1. a kind of soldering appliance, for the pin of electronic unit is welded to printed circuit board (PCB), soldering appliance is included with appearance
The body of face, inner surface and top surface, the inner surface of body form the groove for accommodating solder, it is characterised in that Welder
Tool also includes coating member, and coating member covers at least upper part of the outer surface of body, and the coating member does not cover this
The inner surface of body, coating member are used for reducing or eliminating the intermetallic compound and/or gold formed by solder and/or soldering appliance
Category formation and accumulation of the oxide on the outer surface of the body of soldering appliance.
2. soldering appliance as claimed in claim 1, it is characterised in that solder is the alloy comprising stannum.
3. soldering appliance as claimed in claim 1, it is characterised in that solder is the alloy that is made up of stannum and lead or by SAC
The alloy of composition.
4. soldering appliance as claimed in claim 2 or claim 3, it is characterised in that the body of soldering appliance is made of stainless steel.
5. soldering appliance as claimed in claim 1, it is characterised in that the inner surface of the body of soldering appliance and top surface coating
There is the material to wetting.
6. soldering appliance as claimed in claim 1, it is characterised in that coating member is by the nonwettable inert material system of solder
Into.
7. soldering appliance as claimed in claim 6, it is characterised in that coating member is the piece by made by titanium or zinc, covers
Part has base portion and from base portion extension towards the inclined rake of body, and coating member at least covers the upper of the outer surface of body
Portion part is simultaneously concordant with the top surface of body, the respective edges of the rake of coating member against the top surface of body.
8. soldering appliance as claimed in claim 7, it is characterised in that base of the rake of coating member relative to coating member
The angle of inclination in portion is less than 30 degree more than 0 degree.
9. soldering appliance as claimed in claim 1, it is characterised in that coating member is attached to soldering appliance by fixed component
Body on.
10. soldering appliance as claimed in claim 9, it is characterised in that fixed component is screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310734031.5A CN104741725B (en) | 2013-12-27 | 2013-12-27 | Welding tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310734031.5A CN104741725B (en) | 2013-12-27 | 2013-12-27 | Welding tool |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104741725A CN104741725A (en) | 2015-07-01 |
| CN104741725B true CN104741725B (en) | 2017-03-22 |
Family
ID=53582292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310734031.5A Active CN104741725B (en) | 2013-12-27 | 2013-12-27 | Welding tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104741725B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3398873A (en) * | 1966-09-07 | 1968-08-27 | Hollis Engineering | Sumps and nozzles for soldering machines |
| CN1254493A (en) * | 1997-04-30 | 2000-05-24 | 摩托罗拉公司 | Method of attaching metallic objects to printed circuit board |
| CN1498066A (en) * | 2002-10-02 | 2004-05-19 | 阿尔卑斯电气株式会社 | Solder structure and soldering method of electronic assembly |
| CN101035643A (en) * | 2004-09-15 | 2007-09-12 | 白光株式会社 | Electrically-controlled soldering pot apparatus |
| EP2131636A1 (en) * | 2008-06-02 | 2009-12-09 | Robert Bosch GmbH | Crucible for a brazing device comprising a surface made from a neutral material in relation to a filling metal for brazing |
-
2013
- 2013-12-27 CN CN201310734031.5A patent/CN104741725B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3398873A (en) * | 1966-09-07 | 1968-08-27 | Hollis Engineering | Sumps and nozzles for soldering machines |
| CN1254493A (en) * | 1997-04-30 | 2000-05-24 | 摩托罗拉公司 | Method of attaching metallic objects to printed circuit board |
| CN1498066A (en) * | 2002-10-02 | 2004-05-19 | 阿尔卑斯电气株式会社 | Solder structure and soldering method of electronic assembly |
| CN101035643A (en) * | 2004-09-15 | 2007-09-12 | 白光株式会社 | Electrically-controlled soldering pot apparatus |
| EP2131636A1 (en) * | 2008-06-02 | 2009-12-09 | Robert Bosch GmbH | Crucible for a brazing device comprising a surface made from a neutral material in relation to a filling metal for brazing |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104741725A (en) | 2015-07-01 |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |