CN1249121A

CN1249121A - Circuit board for electrical apparatus with HF components, particularly for mobile radio communications equipment

Info

Publication number: CN1249121A
Application number: CN 97182034
Authority: CN
Inventors: G·布施
Original assignee: Siemens AG
Current assignee: Siemens AG
Priority date: 1997-03-12
Filing date: 1997-03-12
Publication date: 2000-03-29
Anticipated expiration: 2017-03-12
Also published as: CN1115081C

Abstract

The invention aims to riase the packing density of electronic circuits and printed conductor structures on circuit boards intended for a electrical apparatus having HF components, notably mobile radiocommunications equipment. To this end, a "micro via" layer is first applied to one or both sides of a circuit board substrate. Thereafter, especially HF circuits and HF printed conductor structures are placed onto at least part of the "micro via" layer. The HF circuits and HF printed conductor structures are protected in relation to an HF mass layer of the circuit board substrate by blocking zones arranged in a substrate layer of the circuit board layer situated directly below the "micro via" layer against interfering influences which affect the HF parameters to be adjusted of the HF circuits or HF printed conductor structures.

Description

Be used to have the HF components electric equipment, especially for the printed circuit board (PCB) of mobile radio communications equipment

The present invention relates to a kind of be used to have the HF components electric equipment, especially for the printed circuit board (PCB) of mobile radio communications equipment, total design as claimed in claim 1 is described.

Have HF components or high-frequency apparatus parts (HF-assembly, the HF parts) should be on the electric equipment with HF components and non-HF components (for example low frequency member) since influencing each other of between described member, occurring ((1): if the low frequency member is too near apart from HF components, then high-frequency signal will influence the low frequency characteristic of low frequency member; (2): owing to the low frequency member too closely will be affected HF components apart from HF components aspect the high-frequency parameter setting).An exemplary position of HF components (high-frequency circuit with the wiring of HF components and high frequency) and non-HF components (the non-high-frequency circuit with the wiring of non-HF components and non-high frequency) dense arrangement is exactly the flat electronic unit of printed circuit board (PCB) or electric equipment.In addition, in miniature electrical equipment, aggravated phase mutual interference between the various members with little printed circuit board (PCB).Demand to more and more littler compact electric equipment improves day by day on the other hand.This point appears under the situation that small-sized equipment can be portable especially, promptly can almost be carried to Anywhere (being any place) by the user.For example mobile radio communications equipment is exactly this small-sized portable electric equipment.

Be used for the Speech Communication of the communication of different purposes-for example from many kinds, optical data communication or pictorial data communication-(moving) wireless telecom gear in-DECT-telecommunication apparatus for example, the GSM-telecommunication apparatus, the PHS-telecommunication apparatus, " IS 95 "-telecommunication apparatus and other based on basic transmission method FDMA, TDMA, telecommunication apparatus single or combining transmission method among the CDMA (for example DS-CDMA-method or JD-CDMA-method)-, wherein above-mentioned problem will appear, promptly for example " require on the one hand miniaturization; and to avoid phase mutual interference between HF components and the low frequency member on the other hand ", and require the more and more cheap equipment of price (batch process), be that example is set forth the influence that produces therefrom as the representative of above-mentioned all telecommunication apparatus with the DECT mobile phone below.

Fig. 1 show a kind of that use in Siemens Company's mobile phone " GIGASET 1000 S, C ", owing to the 1st printed circuit board (PCB) LP1 of the preferential single face mounting structure of the reason of manufacturing technology aspect.This printed circuit board (PCB) LP1 shown in Fig. 2 sectional view, have a multilayer, by 4 layer printed circuit board LPL1 ... the thickness that LPL4 forms is about the 1st printed circuit board base board LPT1 of 1350 μ m, and this substrate is preferentially made of mixing Ma Silamu (Masslam) method that people know.Printed circuit board base board LPT1 comprises the 1st a core K1 that about 360 μ m are thick, this core have one core K1 downside configuration, that preferentially do by copper, as the 1st high frequency earthing layer MS1 _HF, the 1st metal level M1 _K1(the 3rd layer printed circuit board LPL3) and the 2nd a metal level M2 who preferentially does by copper in the configuration of core K1 upside _K1(the 2nd layer printed circuit board LPL2).At metal level M1 _K1, M2 _K1On respectively have a thickness to be about the 1st " complex fiber material " the layer P1 of 360 μ m.The epoxy resin layer that " complex fiber material " layer is glass fiber-reinforced.At metal level M1 _K1" complex fiber material " layer P1 of last configuration is at metal level M1 _K1Opposite one side has preferential the 3rd a metal level M1 by copper production _P1(the 4th layer printed circuit board LPL4) and at metal level M2 _K1Opposite one side has preferential the 4th a metal level M2 by copper production _P1(the 1st layer printed circuit board LPL1).On the 1st layer printed circuit board LPL1, for example disposed the 1st strict high frequency conduction band structure LBS1 _HF, and on the 2nd layer printed circuit board LPL2, for example made the 1st non-high frequency conduction band structure LBS1 _NHFAnd/or the 1st non-high-frequency circuit wiring SVD1 _NHFIn order to protect and high frequency earthing layer MS on the 3rd layer printed circuit board LPL3 _HFRelevant high frequency conduction band structure LBS1 _HFAvoid non-high frequency conduction band structure LBS1 _NHFAnd/or the 1st non-high-frequency circuit wiring SVD1 _NHFInfluence, on the 2nd layer printed circuit board LPL2, made a cut-off region SB1 who surrounds high-frequency signal part 1 field line FL1 on a large scale.In addition, between the 1st layer printed circuit board LPL1 and the 4th layer printed circuit board LPL4, be used for high frequency and connect the part 1 through hole DB1 be connected with non-high frequency having on the printed circuit board (PCB) base plate LPT1 _LPT1And be used for the part 2 through hole DB2 that is connected with external component (for example insert earphone or microphone etc.) _LPT1

Fig. 3 be illustrated in the zone that with dashed lines marks among Fig. 2 amplification 3-D view.

Fig. 4 show one that go up to use at the DECT-of Siemens Company mobile phone " GIGASET2000 S.C ", owing to the reason on the manufacturing technology still preferentially at the 2nd printed circuit board (PCB) LP2 of side configuration element.As shown in the sectional view among Fig. 5, printed circuit board (PCB) LP2 has a multilayer, remain by 4 layer printed circuit board LPL1 ... LPL4 constitutes, thickness is about the 2nd printed circuit board base board LPT2 of 1350 μ m, and this substrate still preferentially adopts and mixes the making of Ma Silamu (Masslam) method.This printed circuit board base board LPT2 comprises that a thickness is about the 2nd core K2 of 360 μ m, and this core has one at the 5th metal level M1 by the copper production configuration of core K2 downside, preferential _K2(the 3rd layer printed circuit board LPL3) and one the configuration of core K2 upside, that preferentially do by copper, as the 2nd high frequency earthing layer MS2 _HFThe 6th metal level M2 _K2(the 2nd layer printed circuit board LPL2).At metal level M1 _K2, M2 _K2On respectively disposed the 2nd " complex fiber material " the layer P2 that a thickness is about 360 μ m.At metal level M1 _K2" complex fiber material " layer P2 of last configuration is at metal level M1 _K2Opposite one side has the 7th a metal level M1 who is preferentially done by copper _P2(the 4th layer printed circuit board LPL4) and at metal level M2 _K2Opposite one side has the 8th a metal level M2 who is preferentially done by copper _P2(the 1st layer printed circuit board LPL1).At layer printed circuit board LPL2 ... three plate structures (Tri-Plate-Struktur) that people know have been disposed on the LPL4.This structure is by the 2nd high frequency conduction band structure LBS2 of the strictness on the 3rd layer printed circuit board LPL3 _HF, the high frequency earthing layer MS2 on the 2nd layer printed circuit board LPL2 _HFWith the 3rd high frequency earthing layer MS3 that is used for high-frequency signal part 2 field line FL2 on a large scale on the 4th layer printed circuit board LPL4 _HFConstitute.In addition, between the 1st layer printed circuit board LPL1 and the 4th layer printed circuit board LPL4, still be useful on the part 1 through hole DB1 that the high frequency connection is connected with non-high frequency on the printed circuit board base board LPT2 _LPT2And be used for the part 2 through hole DB2 that is connected with external component (for example insert earphone, microphone etc.) _LPT2

In order to reduce the physical dimension of printed circuit board (PCB) LP1, LP2, thereby, can adopt method as everybody knows at printed circuit board (PCB) two sides configuration element as mentioned above so that make compact DECT-mobile phone parts.But this method will spend bigger expense aspect manufacturing technology.

Aspect the printed circuit board (PCB) of the electric equipment of making no HF components, as everybody knows, " little path " (" Mikro Via ") technology (being MV technology) that adopts people to know usually for the miniaturization that realizes above-mentioned electric equipment.This MV technology is the modification that same known mechanical deep hole through type contacts.MV technology is to be used for cheap a kind of technology that is connected of making the printed circuit board (PCB) of no high-frequency circuit and high frequency conduction band structure.Economizing on the use of funds is achieved in that promptly except mechanical deep hole, and charging and discharging and the burr technology of removing the limit, hole have all been omitted.Disclose some kinds at present already and made for example method of large tracts of land " little path " layer.These methods are " assembling according to the order of sequence " (" Sequential Built Up ") methods (being the SBU method), and " silver-colored flange " (" Silver Bump ") method (being the SB method) method for etching plasma adopts CO ₂Laser carries out the method for laser drill and adopts the YAG laser to carry out the method for laser drill.For production in enormous quantities, generally believe at present from the angle of cost viewpoint (economy) and may have only preceding two kinds of technology manufacture methods to be worthy of consideration." little path " (through-hole type contact) of making of this kind technology for example its diameter be 50 to 150 μ m and the diameter range that requires welded eye 0.12 and 0.35mm between.The diameter of " little path " is relevant and should be diameter/interlamellar spacing＞1 to the following spacing between one deck with " little path " layer again.With the conduction band width is that the fine wire manufacturing process of 50 μ m combines and can reach the highest wiring density.

The size of printed circuit board (PCB) (for example deep hole through-hole type contact) in the standard technology of alternative technology is determined by through-hole type contact desired position and at the conduction band structure of printed circuit board component one side.Because in MV technology, exist the possibility of direct immersion (abtauchen), so the locational requirement of through-hole type contact and conduction band structure has just only accounted for little ratio towards " pad " (" Pad ") of the member of the 1st internal layer.So long as there is not the caused problem of high frequency, then member can very compact arrangement, so long as the words that manufacturing technology allows.The size of printed circuit board (PCB) almost completely is to be determined by the element that is adopted (member) quantity and moulding under above-mentioned prerequisite in MV technology.

Task of the present invention is to improve the packing density of electronic circuit and conduction band structure on the printed circuit board (PCB) of electric equipment, particularly mobile radio communications equipment being used to have HF components and therefore reduces the physical dimension of printed circuit board (PCB).

This task is set out by the defined printed circuit board (PCB) of claim 1 preamble, and the feature given by the characteristic of claim 1 solved.

Basic design of the present invention is; promptly make " little path " layer at single or double on the printed circuit board base board; the device-specific circuit (for example being used for having high-frequency circuit wiring and high-frequency component and high frequency conduction band structure or having non-high-frequency component and the non-high-frequency circuit and the non-high frequency conduction band structure of the wiring of non-high frequency of the telecommunication apparatus that provides in claim 9 to 12) that will have wiring and element and conduction band structure on this " little path " layer is produced on local area at least; and with high-frequency circuit and high frequency conduction band structure high frequency earthing layer with printed circuit board base board; by the cut-off region that directly in the basic unit of the printed circuit board base board under " little path " layer, disposes; it is so-called window; protected, disturbed (for example preventing it is the interference that the non-high frequency conduction band structure that directly disposes and/or non-high-frequency circuit connect up equally in the basic unit of " little path " layer printed circuit board base board down) to prevent from the parameter of the high-frequency circuit that respectively should set and high frequency conduction band structure produced.

The implementation method of the top making printed circuit board (PCB) of introducing, when with above-mentioned implementation method not simultaneously, promptly one side is configured in the high frequency wiring and the high frequency conduction band structure of high-frequency circuit in the basic unit that is located immediately at the printed circuit board base board under " little path " layer, and on the other hand with the high-frequency component of cut-off region and high-frequency circuit, non-high frequency conduction band structure and/or have wiring and the non-high-frequency circuit of element is also set up when being configured on " little path " layer promptly also can be used.In addition, also these two kinds of implementation methods can be combined.

When using " little path " technology and window technique, installing space for circuit given on printed circuit board (PCB) and conduction band structure should count, and adopts " little path " technology and window technique to increase than the printed circuit board (PCB) number of plies that other technology was directed at.But, the quantity of layer printed circuit board is compared with window technique with a kind of technology of nothing " little path " technology, have only when opposite, thereby and reduce just can remain unchanged when packing density also can not realize the desired miniaturization of electric equipment with problem to be solved by this invention.

If configuring high-frequency member, printed circuit board (PCB) especially for the electric equipment of mobile radio communications equipment is made according to the method for being advised, then the erection unit special circuit is compared and will be reduced effectively with common printed circuit board (PCB) with the required installation site of conduction band structure on this printed circuit board (PCB).

According to described another implementation method of claim 2, its advantage is, " if little path " layer and be located immediately between the basic unit of printed circuit board base board below " little path " layer spacing with make " little path " layer required spacing economically at the same order of magnitude according to " assembling according to the order of sequence " (" Sequential Built up ") method (being the SBU method), then except less printed circuit board arrangement, because higher packing density also can make the manufacturing cost of printed circuit board (PCB) significantly reduce.

Also has approximate effect (advantage) according to claim 3 and 4 described implementation methods.

According to claim 5 described of the present invention for example further develop can " " little path " aperture and at " little path " layer and be located immediately at the ratio of the spacing between the basic unit of the printed circuit board base board below " little path " layer " greater than 1, and typical aperture is between 50 μ m and 150 μ m, and the diameter of welded eye is realized under the condition between 0.12mm and the 0.35mm.

By described of the present invention the further developing of claim 6, compare with the theory of claim 1, might further reduce the structure of printed circuit board (PCB), because can also further improve packing density by the additional high-frequency circuit that is produced on " little path " layer that covers first hole (" standard vias ").

Can affirm according to described of the present invention the further developing of claim 7, during first hole on covering " little path " layer, owing to exhaust (blast) phenomenon can not take place in these holes by covering the micro climate that is produced.

Elaboration has been done in further developing that the present invention is preferential in the dependent claims.

One embodiment of the present of invention are illustrated by means of accompanying drawing 6 to 10.

Fig. 6 illustrates one and has made improved the 3rd printed circuit board (PCB) LP3 with respect to printed circuit board (PCB) LP1, LP2 by adopting MV technology and combining with its adaptive window technique, this printed circuit board (PCB) is because manufacturing technology preferentially still adopts the method manufacturing of single face assembling element.But the two sides assembling element also is fine.Like this, the physical dimension of printed circuit board (PCB) LP3 is further reduced.Printed circuit board (PCB) LP3 shown in Fig. 6 sectional view, have a multilayer by-different-6 layer printed circuit board LPL1 with printed circuit board (PCB) LP1, LP2 ... the 3rd printed circuit board base board LPT3 that LPL6 constitutes, its thickness is about 1400 μ m, the layer printed circuit board LPL2 of this printed circuit board base board ... the mixing Ma Silamu method that LPL5 still preferentially adopts people to know is made, and layer printed circuit board LPL1, LPL6 then adopt MV technology to make.Like this, this printed circuit board base board LPT3 comprises one the 3rd core layer K3, and this core layer thickness is about 360 μ m and has one at the 9th metal level M1 configuration of core layer K3 downside, that preferentially done by copper _K3(the 4th layer printed circuit board LPL4) and one the configuration of core layer K3 upside, that preferentially do with copper, as the 4th high frequency earthing layer MS4 _HFThe 10th metal level M2 _K3(the 3rd layer printed circuit board LPL3).At metal level M1 _K3, M2 _K3On respectively have a thickness be about 360 μ m " complex fiber material " layer P3.Be configured in metal level M1 _K3On " complex fiber material " layer P3 at metal level M1 _K3There is the 11st a metal level M1 who is preferentially done by copper on the opposite _P3(the 5th layer printed circuit board LPL5) and at metal level M2 _K3There is the 12nd a metal level M2 who is preferentially done by copper on the opposite _P3(the 2nd layer printed circuit board LPL2).At metal level M1 _P3, M2 _P3On respectively have one the 1st " little path " layer M1, its thickness is about 50 μ m.At metal level M1 _P3Last configuration " " layer M1 is at metal level M1 for little path _P3There is the 13rd a metal level M1 who is preferentially done by copper on the opposite _M1(the 6th layer printed circuit board LPL6), and at metal level M2 _P3The opposite has the 14th a metal level M2 who is preferentially done by copper _M1(the 1st layer printed circuit board LPL1).On the 1st layer printed circuit board LPL1, for example disposed the 2nd high frequency conduction band structure LBS2 of a strictness _HF, and one the 2nd non-high frequency conduction band structure LBS2 for example is set on the 2nd layer printed circuit board LPL2 _NHFAnd/or one the 2nd non-high-frequency circuit wiring SVD2 _NHFIn order to prevent non-high frequency conduction band structure LBS2 _NHFAnd/or non-high-frequency circuit wiring SVD2 _NHFTo on the 3rd layer printed circuit board LPL3 with high frequency earthing layer MS4 _HFRelevant high frequency conduction band structure LBS2 _HFInfluence, on the 2nd layer printed circuit board LPL2, made the 3rd a cut-off region SB3 who surrounds high-frequency signal the 3rd field line FL3 on a large scale.

High frequency conduction band structure LBS2 _HFAlso can be alternatively or additionally be formulated on the 2nd layer printed circuit board LPL2, the 5th layer printed circuit board LPL5 and/or the 6th layer printed circuit board LPL6.As if under in the end a kind of situation, cut-off region should be positioned at the 5th layer printed circuit board LPL5 logically.Cut-off region may be positioned at the 1st layer printed circuit board LPL1 and the 6th layer printed circuit board LPL6 under preceding two kinds of situations.

In addition, be used between the 1st layer printed circuit board LPL1 and the 6th layer printed circuit board LPL6, carrying out high frequency and connect the 1st crowd of through hole DB1 that is connected with non-high frequency having made on the printed circuit board base board LPT3 _LPT3And be used for the 2nd crowd of through hole DB2 being connected with external component (for example insert earphone, microphone etc.) _LPT3If through hole DB1 especially _LPT3Opening wide like that as shown in the figure is then by sewing the high-frequency ray (this is undesirable effect) that is produced by high-frequency circuit on printed circuit board (PCB) and high frequency conduction band structure in these holes.

Fig. 7 illustrates the three-dimensional enlarged drawing of dashed region shown in Figure 6.

Fig. 8 shows one with respect to improved a little the 4th printed circuit board (PCB) LP4 of printed circuit board (PCB) LP3 shown in Figure 6, and this printed circuit board (PCB) is owing to the still preferential single face configuration of the reason element of making aspect.Here, two-sided configuration element also is fine.According to sectional view shown in Figure 8, printed circuit board (PCB) LP4 has a multilayer, still by 6 layer printed circuit board LPL1 ... the 4th printed circuit board base board LPT4 that LPL6 constitutes, its thickness is about 1400 μ m, its layer printed circuit board LPL2 ... LPL5 is still made by known mixing Ma Silamu method, layer printed circuit board LPL1, LPL6 then make of MV technology, this printed circuit board base board LPT4 comprises one the 4th core layer K4 according to this, its thickness is about 360 μ m, and this core layer has one and is configured in the 15th metal level M1 layer K4 downside, that preferentially be made of copper _K4That (the 4th layer printed circuit board LPL4) and one are configured in is core layer K4 upside, that preferentially do with copper, as the 5th high frequency earthing layer MS5 _HFThe 16th metal level M2 _K4(the 3rd layer printed circuit board LPL3).At metal level M1 _K4, M2 _K4On disposed respectively one the 4th " complex fiber material " layer P4, its thickness is about 360 μ m.At metal level M1 _K4" complex fiber material " layer P4 of last configuration is at metal level M1 _K4The opposite has the 17th a metal level M1 who preferentially does with copper _P4(the 5th layer printed circuit board LPL5), and at metal level M2 _K4The opposite has the 18th a metal level M2 who preferentially does with copper _P4(the 2nd layer printed circuit board LPL2).At metal level M1 _P4, M2 _P4On respectively dispose one the 2nd " little path " layer M2, its thickness is about 50 μ m.At metal level M1 _P4" little path " layer M2 of last configuration is at metal level M1 _P4The opposite has the 19th a metal level M1 who preferentially does with copper _M2(the 6th layer printed circuit board LPL6), and at metal level M2 _P4The opposite has the 14th a metal level M2 who preferentially does with copper _M2(the 1st layer printed circuit board LPL1).On the 1st layer printed circuit board LPL1, for example disposed the 3rd high frequency conduction band structure LBS3 of a strictness _HF, and on the 2nd layer printed circuit board LPL2, for example disposed one the 3rd non-high frequency conduction band structure LBS3 _NHFAnd/or the 3rd non-high-frequency circuit wiring SVD3 _NHFIn order to prevent non-high frequency conduction band structure LBS3 _NHFAnd/or non-high-frequency circuit wiring SVD3 _NHFFor the high frequency earthing layer MS5 on the 3rd layer printed circuit board LPL3 _HFRelevant high frequency conduction band structure LBS3 _HFInfluence, on the 2nd layer printed circuit board LPL2, made the 4th a cut-off region SB4 who surrounds the 4th field line FL4 of high-frequency signal on a large scale.

High frequency conduction band structure LBS3 _HFStill also can be alternatively or additionally be produced on the 2nd layer printed circuit board LPL2, on the 5th layer printed circuit board LPL5 and/or the 6th layer printed circuit board LPL6.As if logically cut-off region should be positioned at the 5th layer printed circuit board LPL5 under in the end a kind of situation.Cut-off region should be located in the 1st layer printed circuit board LPL1 and the 6th layer printed circuit board LPL6 under preceding two kinds of situations.

In addition, in printed circuit board base board LPT4, made the 1st crowd of through hole DB1 that is connected with non-high frequency that is used between the 1st layer printed circuit board LPL1 and the 6th layer printed circuit board LPL6, carrying out the high frequency connection _LPT4And be used for the 2nd crowd of through hole DB2 being connected with external component (for example insert earphone, microphone etc.) _LPT4That different with situation shown in Figure 6 is these through holes DB1 _LPT4-as shown in the figure-be by having metal level M1 _M2And metal level M2 _M2" little path " layer M2 surround.At metal level M2 _M2Go up by this measure and can provide additional position (further improving packing density) for high-frequency circuit or high frequency conduction band structure, and at the metal level M1 as the through type ground plane _M2Upward make the hole to " radioshielding " (" HF ... dicht "), promptly from this part perforate, can not sew the high-frequency ray that causes by high-frequency circuit on printed circuit board (PCB) and high frequency conduction band structure again by this measure.Because in other perforate, lay high-frequency circuit or high frequency conduction band structure, so the high frequency radiation of therefrom sewing influence is very little.

In order to make the hole DB that covers in this way _LPT4Can exhaust when covering by the micro climate that in the hole, forms, so this hole is preferential with a kind of packing material filling.

The figure of the printed circuit board (PCB) LP4 that Fig. 9 shows in this way to be realized.

Figure 10 provides another kind of execution mode, and different with execution mode shown in Figure 8 with Fig. 6 is that printed circuit board base board is not considered two " little path " layer but is made of a unique basic unit here.When making printed circuit board base board, can reduce manufacturing expense like this.

Claims

1. be used to have the HF components electric equipment,, wherein on printed circuit board (PCB), disposing high-frequency circuit, non-high-frequency circuit, high frequency conduction band structure and non-high frequency conduction band structure, it is characterized in that especially for the printed circuit board (PCB) of mobile radio communications equipment,

A) has substrate (LPT1, a LPT2; Fig. 2 and Fig. 5), this substrate has one the 1st skin (LPL2; Fig. 6 and Fig. 8) and one the 2nd skin (LPL5; Fig. 6 and Fig. 8) and many these outer field hole (DB1 that passes _LPT3,4, DB2 _LPT3,4Fig. 6 and Fig. 8),

B) have one " little path " layer (LPL1, LPL2; Fig. 6 and Fig. 8), this layer is produced on two outer field skins at least in part at least,

C) have some cut-off region (SB3, SB4 that are used for non-high-frequency circuit and non-high frequency conduction band structure; Fig. 6 and Fig. 8), with on the protective substrate with high frequency earthing layer (LPL3, Fig. 6 and Fig. 8) the relevant high-frequency circuit and the high frequency characteristics of high frequency conduction band structure, they are produced on " little path " layer and/or on the skin by the corresponding covering of " little path " layer,

D) have circuit element, they are configured on " little path " layer,

E) have wiring, they are to be configured on " little path " layer and/or on the skin by the corresponding covering of " little path " layer at least,

F) have conduction band structure, they are to be configured on " little path " layer and/or on the skin by the corresponding covering of " little path " layer at least.

2. according to the described printed circuit board (PCB) of claim 1, it is characterized in that, spacing between outer and " little path " layer is to determine like this, and promptly this " little path " layer is to make of " assembling according to the order of sequence " (" Sequential Built Up ") method (being the SBU method).

3. according to the described printed circuit board (PCB) of claim 1, it is characterized in that the spacing between outer and " little path " layer is to determine like this, promptly this " little path " layer is by adopting CO ₂Laser carries out the laser drilling method making.

4. according to the described printed circuit board (PCB) of claim 1, it is characterized in that the spacing between outer and " little path " layer is to determine like this, promptly " little path " layer is to make of " silver-colored flange " (" Silver Bump ") method (being the SB method).

5. according to claim 2,3 or 4 described printed circuit board (PCB)s, it is characterized in that the spacing between outer and " little path " layer is 50 μ m.

6. according to one of them described printed circuit board (PCB) of claim 1 to 5, it is characterized in that the 1st crowd of hole (DB1 _LPT3,4, Fig. 6 and Fig. 8) covered and configuring high-frequency circuit and/or be used for a metal level of radioshielding on " little path " layer in the 1st batch of hole of covering by " little path " of no cut-off region layer.

7. according to the described printed circuit board (PCB) of claim 6, it is characterized in that the 1st batch of hole filled with packing material.

8. according to one of them described printed circuit board (PCB) of claim 1 to 7, it is characterized in that substrate is a multilager base plate.

9. described according to Claim 8 printed circuit board (PCB) is characterized in that, this multilayer board substrate is made of mixing Ma Silamu (Masslam) method.

According to one of them described printed circuit board applications of claim 1 to 9 on a kind of DECT telecommunication apparatus.

11. according to one of them described printed circuit board applications of claim 1 to 9 on a kind of GSM telecommunication apparatus.

12. according to one of them described printed circuit board applications of claim 1 to 9 on a kind of PHS telecommunication apparatus.

13. according to one of them described printed circuit board applications of claim 1 to 9 on a kind of " IS-95 " type telecommunication apparatus.

14. according to one of them described printed circuit board applications of claim 1 to 9 on a kind of wireless telecom gear of a kind of single or combining transmission method based on basic transmission method FDMA, TDMA, CDMA.