CN1247057C

CN1247057C - Cases of electronic devices and mfg. methods

Info

Publication number: CN1247057C
Application number: CN 02100947
Authority: CN
Inventors: 粱渊程; 颜伟政; 徐志明; 吴佳惠
Original assignee: Quanta Computer Inc
Current assignee: Quanta Computer Inc
Priority date: 2002-01-09
Filing date: 2002-01-09
Publication date: 2006-03-22
Anticipated expiration: 2022-01-09
Also published as: CN1431861A

Abstract

The present invention provides a shell body of an electronic device and a manufacturing method, wherein the electronic device comprises at least one element, and the manufacturing method of the shell body comprises the following procedures: using a first metallic material to form a first structural component firstly, using a second metallic material to form a second structural component subsequently, ensuring at least one difference part formed on the second structural component, combining the first structural component and the second structural component into the shell body of the electronic device by using the mode that the second structural component is closer to elements and the section difference part corresponds to the elements. Not only the shell body can be caused to achieve the requirement of lightness, thinness and short characteristic, but also the structural strength can be well kept simultaneously by using the method in the present invention.

Description

The housing of electronic installation and manufacture method thereof

Technical field

The present invention relates to a kind of housing and manufacture method thereof of electronic installation, it is compact and can keep the housing and the manufacture method thereof of the electronic installation of structural strength particularly to relate to a kind of housing that not only can make.

Background technology

Electronic installations such as notebook computer, mobile phone or PDA the trend of its housing towards compactization that makes is arranged, yet many E-consumer products have often been ignored the problem of structure undercapacity for this compact requirement along with the progress in epoch.

Know clearly it, if will meet the demand that makes housing ultra-thin, existing housing may only constitute with a titanium alloy, and causes the structural strength deficiency; Relatively, if will supply structural strength the time, possibly by plastics reinforcement on ad-hoc location, yet if will pass through plastics reinforced structure intensity, plastic material must have enough thickness, and this just can't meet the requirement that makes housing lightening.

Summary of the invention

The object of the present invention is to provide a kind of housing and manufacture method thereof of electronic installation, it not only can make housing compact and can keep structural strength.

The object of the present invention is achieved like this, and a kind of manufacture method of housing of electronic installation promptly is provided, and at first, utilizes hard and thin metal material to form first member; Then, utilize and promptly to decide strength metal material and form second member; At last, with the housing of the synthetic electronic installation of first member and second component sets.

Again in the present invention, first member and second member glue together by viscose glue, and first metal material and second metal material can be respectively a sheet material.

Again in the present invention, it is identical or inequality that first metal material and second metal material can be, and wherein first metal material is hard and thin material, and second metal material is the material with a set intensity, and it can be by the punching out of sheet material alloying metal.

Again in the present invention, provide a kind of manufacture method of housing of electronic installation, wherein have at least one element in the electronic installation, and the manufacture method of housing comprises: at first, utilize hard and thin metal material to form first member; Then, utilization is promptly decided strength metal material and is formed second member, and forms at least one segment difference section on second member; At last, near element and its segment difference section mode corresponding, first member and second component sets are synthesized the housing of electronic installation with second member with element.

Again in the present invention, provide a kind of housing of electronic installation, wherein have at least one element in the electronic installation, and housing comprises: first member made from hard and thin metal material; Be arranged at second member on first member, it is made promptly to decide strength metal material, and wherein second member has at least one segment difference section, and near element, and its segment difference section is corresponding with element.

Again in the present invention, housing also comprises the gummed portion between first member and second member, and in order to glue together first member and second member, it is that a viscose glue is preferably.

Description of drawings

Fig. 1 is the schematic diagram of general electronic installation;

Fig. 2 a is the vertical view of the housing of electronic installation of the present invention;

Fig. 2 b is the cutaway view of the line B-B in Fig. 2 a;

Fig. 2 c is the cutaway view of the line C-C in Fig. 2 a;

Fig. 2 d is the cutaway view of the line D-D in Fig. 2 a;

Fig. 3 is the housing of electronic installation of the present invention and the flow chart of manufacture method thereof.

Embodiment

With reference to figure 1, general electronic installation 1, notebook computer for example, has the housing of forming by different piece 10, Fig. 2 a shows the part of housing 10, and by the section on housing 10, shown in Fig. 2 b, Fig. 2 c and Fig. 2 d, can learn: housing 10 of the present invention is to constitute by one first member 11 and one second member 12.

With reference to figure 2b-Fig. 2 d, electronic installation 1 has a plurality of elements 20 (only demonstrating in the drawings), and second member 12 is arranged on first member 11, and second member 12 has the segment difference section 121 corresponding with element 20, and second member, 12 to the first members 11 it should be noted the be provided with number of the formation number of segment difference section 121 corresponding to element 20 more near element 20.

Again, also comprise gummed portion 13 in the housing 10, it is between first member 11 and second member 12, and in order to glue together first member 11 and second member 12, it can be a viscose glue is preferably.

With reference to figure 3 and Fig. 2 b-Fig. 2 d, the manufacture method of case of electronic device of the present invention is described, at first, utilize the first sheet metal material to form first member 11, step S1; Then, utilize the second sheet metal material to form second member 12, and on second member 12, form segment difference section 121, step S2; At last, near the corresponding mode of element 20 and its segment difference section 121 and element 20, first member 11 and second member 12 are combined into the housing 20 of electronic installation, step S3 by viscose glue with second member 12.

Again, it is identical or inequality that the first sheet metal material and the second sheet metal material can be, and wherein the first sheet metal material is that hard and thin metal material are preferably, and it can make the top layer application comparatively simple and easy; And the second sheet metal material is that the alloy metal material with a set intensity is preferably, and it can be by punching out as structure, and the limit for height that can get out of the way inner member; Can reach the requirement of structural strength and appearance tactile impression thus simultaneously, meet really that the E-consumer product is compact, the requirement of practicality.

The present invention does compound application by the sheet material alloying metal, to improve the simplification of structure and assembling; And utilize the design of top layer outward appearance and endothecium structure mode, the sheet material alloying metal is closed as inside and outside mat compound, with body frame as electric consumers.

The compound mode of certain first member and second member is not restricted to viscose glue, as long as can make both combinations really.

Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to qualification the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention; can do a little change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined.

Claims

1. the manufacture method of the housing of an electronic installation comprises:

(a) utilize a hard and thin metal material to form one first member;

(b) utilize the metal material of a set intensity to form one second member; And

(c) with the housing of this first member with synthetic this electronic installation of this second component sets.

2. the manufacture method of the housing of electronic installation as claimed in claim 1, wherein this first member and this second member glue together by a viscose glue.

3. the manufacture method of the housing of electronic installation as claimed in claim 2, wherein this hard and thin metal material and the metal material of this set intensity are respectively a sheet material.

4. the manufacture method of the housing of electronic installation as claimed in claim 3, wherein this second member is by the punching out of sheet material alloying metal.

5. the manufacture method of the housing of an electronic installation wherein have at least one element in this electronic installation, and the manufacture method of above-mentioned housing comprises:

(a) utilize a hard and thin metal material to form one first member;

(b) utilize the metal material of a set intensity to form one second member, and on this second member, form at least one segment difference section; And

(c) this first member and this second component sets are synthesized the housing of this electronic installation with this second member near this element and its segment difference section mode corresponding with this element.

6. the manufacture method of the housing of electronic installation as claimed in claim 5, wherein this first member and this second member glue together by a viscose glue.

7. the manufacture method of the housing of electronic installation as claimed in claim 6, wherein this hard and thin metal material and the metal material of this set intensity are respectively a sheet material.

8. the manufacture method of the housing of electronic installation as claimed in claim 7, wherein this second member is by the punching out of sheet material alloying metal.

9. the housing of an electronic installation wherein have at least one element in this electronic installation, and above-mentioned housing comprises:

One first member is made with a hard and thin metal material; And

One second member is arranged on this first member, and makes with the metal material of a set intensity, and wherein this second member has at least one segment difference section, and this second member is near this element, and this segment difference section is corresponding with this element.

10. the housing of electronic installation as claimed in claim 9 also comprises:

One gummed portion is between this first member and this second member, in order to glue together this first member and this second member.

11. the housing of electronic installation as claimed in claim 10 should gummed portion be a viscose glue wherein.

12. the housing of electronic installation as claimed in claim 9, wherein the metal material of this hard and thin metal material and this set intensity is respectively a sheet material.

13. the housing of electronic installation as claimed in claim 12, wherein this second member is by the punching out of sheet material alloying metal.