CN1246411C - Adhesive for connection of circuit - Google Patents
Adhesive for connection of circuit Download PDFInfo
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- CN1246411C CN1246411C CN 01135050 CN01135050A CN1246411C CN 1246411 C CN1246411 C CN 1246411C CN 01135050 CN01135050 CN 01135050 CN 01135050 A CN01135050 A CN 01135050A CN 1246411 C CN1246411 C CN 1246411C
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- binding agent
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- circuit
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Abstract
The present invention provides adhesive for circuit connection. The adhesive is hot bonding adhesive which has the function that opposite circuit electrodes are heated and pressurized, which enables the electrodes in a pressurizing direction to realize electrical connection. The adhesive comprises dispersed rubber particles whose average grain size is below 10 mum and thermally solidified reactive resin. The heating start temperature of DSC (differential scanning thermal analysis) of the adhesive is higher than 60DEGC, and 80% of the end temperature of a solidification reaction is below 260DEGC.
Description
Technical field
The present invention relates to be used between the circuit substrate or electronic component such as IC chip with the adhesive for connection of circuit that connects between the circuit board.
Background technology
When carrying out circuit between the circuit substrate or between electronic component such as IC chip and the circuit substrate when connecting, use binding agent or the anisotropic conductive adhesive of conducting particles fractional.That is, can be between two electrodes of setting up relatively with these adhesive coated, through heating, pressurization make connect between the electrode after, realize being electrically connected by make it have electroconductibility at compression aspect again.For example, in open the flat 3-16147 of communique number of Japan's special permission, propose to use the scheme of Resins, epoxy as the adhesive for connection of circuit of main component.
Yet, with the binding agent of Resins, epoxy as main component, in the reliability test of tests such as heat shock resistance test and PCT etc.,, produce connection increase of impedance and peeling off of binding agent easily in the junction based on the internal stress that difference produced of the coefficient of thermal expansion that connects substrate.
In addition, when being directly connected to chip on the substrate by binding agent, as connecting substrate if use the printed base plate of FR4 body material etc., use flexible electric circuit board or the glass substrate of macromolecule membranes such as polyimide and polyester as body material, after the connection, come from the difference of the coefficient of thermal expansion of chip and the internal stress that produces is easy to generate the deflection of chip and substrate.Have, when chip is made under the binding agent mobile situation to the substrate crimping, many holes occur in linkage interface, have problems such as wet fastness reduction again.
Summary of the invention
The object of the present invention is to provide a kind of adhesive for connection of circuit, it can suppress because the internal stress that difference produced that comes from coefficient of thermal expansion increases the connection impedance of junction, binding agent peel off deflection with chip and substrate.
Adhesive for connection of circuit of the present invention is through heating, pressurization with relative circuit electrode, make in the heat adhesiveness binding agent of realizing being electrically connected between the electrode of compression aspect, above-mentioned binding agent has following feature, that is: it to contain the dispersive median size be the following rubber particles of 10 μ m and the reaction resin of thermofixation, it is more than 60 ℃ that the heating of the DSC of this binding agent (difference formula scanning calorimeter analyze) begins temperature, and 80% end temp of curing reaction is below 260 ℃.
In addition, binding agent of the present invention is in 80% temperature that finishes from heating beginning temperature to curing reaction, and the thermal value that records with DSC is preferably the 50-140 joule/gram.
Have, binding agent of the present invention is preferably in below 160 ℃ with 60% end temp of the curing reaction that DSC records again.
Have, reaction resin preferably contains Resins, epoxy and potentiality solidifying agent again.
Have, the potentiality solidifying agent is sulfonium salt preferably again.
In addition, binding agent of the present invention also can contain the conducting particles of the 0.1-30 volume % that exists with dispersion state.
Binding agent of the present invention is intended to comprise the binding agent and the adhesive paste of film like, but film like binding agent preferably.
Binding agent of the present invention being made under the situation of film like, can contain film forming polymer substance.
In addition, the spring rate of film of the present invention in the time of 25 ℃ is preferably 50-1000MPa, if use the present invention, can be absorbed in the internal stress that is produced in the reliability test of heat shock resistance test and PCT test etc., even after reliability test, also do not have the connection impedance increase of junction and the phenomenon that binding agent is peeled off, can obtain the binding agent that connection reliability improves.In addition, if use the present invention, the chip actual installation during at the LCD plate, can suppressed its detrimentally affect to display quality owing to reduced the deflection of substrate.That is, can suppress to produce the phenomenon of display dot owing to the variation in the gap of the display surface that brings of deflection.
Therefore, adhesive for connection of circuit of the present invention only is best suited for LCB plate and TAB, TAB and printed base plate, and LCD plate and IC chip, the IC chip is electrically connected with the compression aspect of printed base plate when being connected.
Embodiment
Binding agent of the present invention contains median size with dispersion state in binding agent be rubber particles below the 10 μ m.The purpose that contains rubber particles is the internal stress that produces in order to alleviate in the reliability test, prevents peeling off of binding agent, reduces the deflection of substrate.
The median size of rubber particles is 0.1-10 μ m preferably, and that especially good is 0.1-5 μ m.In addition, good especially is that rubber particles accounts for more than 80% of size distribution at the particle below the median size.
As rubber particles of the present invention so long as glass transition temperature the rubber particles below 25 ℃ all can, be not particularly limited, for example: can use divinyl rubber, polypropylene rubber, styrene-butadiene rubber(SBR), paracril, silicon rubber etc.
In above-mentioned rubber particles, preferably use the silicon rubber particle, because it is except solvent resistance is good, dispersiveness is also fine.The silicon rubber particle can use following method to make, that is: silane compound or methyl trialkoxysilane and/or its partial hydrolysis condenses are added to after alkaline matters such as using caustic soda or ammonia adjust to pH value in the aqueous ethanolic solution more than 9, make the method for its hydrolytie polycondensation again or make it and the method for organo-siloxane copolymerization.In addition, in order to improve the dispersiveness of reaction resin, preferably use in molecule end or intramolecularly side chain and contain hydroxy or epoxy group(ing), ketoimine, carboxyl, the silicon microparticle of functional groups such as sulfydryl.
Under situation about the rubber particles surface being handled, be more preferably the dispersiveness of raising to reaction resin with coupler.
The spring rate of rubber particles under room temperature (25 ℃) be 1-100Mpa preferably, and the stress at interface is more preferably 1-30Mpa when considering the dispersed of rubber particles or reducing connection.But, when selecting reaction resin, should consider the reactivity and the thermal value decision of binding agent.
It was the 10-100 weight part when rubber particles preferably was 100 weight parts with respect to adhesive composition with respect to the usage quantity of adhesive composition.
As reaction resin used in the present invention for example can be, the mixture of Resins, epoxy and potentiality solidifying agent, the mixture of free radical reaction resin and organo-peroxide.
Can use independent a kind of in the following example or be use mixing two or more as Resins, epoxy, but not be subjected to the restriction of these examples.For example: by chloromethyl Ethylene Oxide and dihydroxyphenyl propane, F or AD deutero-bisphenol-type epoxy resin; By chloromethyl Ethylene Oxide and linear novolac resin (Off ユ ノ Le ノ ボ ラ Star Network) or cresols-solubility novolac resin (Network レ ゾ one Le ノ ボ ラ Star Network) deutero-epoxy-Novolak resin, having the naphthalene that contains naphthalene ring is Resins, epoxy, and at the Racemic glycidol ammonia complex, glycidyl ether has the epoxy compounds of the glycidyl more than two in the molecule of biphenyl or ester ring type etc.
As these Resins, epoxy, preferably use foreign ion Na for example in order to prevent electronic migration
+, Cl
-Perhaps the concentration of water-disintegrable chlorine is reduced to the following high purity product of 300PPM.
Can be exemplified below as the potentiality solidifying agent, but not be subjected to the restriction of these object lessons.For example: imidazoles system, hydrazides system, the complex compound of boron trifluoride-acid amides, sulfonium salt, aminimide, the salt of polyamine and Dyhard RU 100 etc.
In these potentiality solidifying agent, the solidification value of sulfonium salt is more than 60 ℃ and its curing reaction is finished 60% temperature below 160 ℃, and good because of its low-temp reaction, useful life is long and the most suitable.As sulfonium salt, particularly suitable be with general expression (1) expression sulfonium salt
But, in formula (1), R
1Be the base of electron attractivity, for example: nitroso-group, carbonyl, carboxyl, cyano group, trialkyl ammonium, first is fluorine-based; R
2And R
3Be the base of electron donability, for example: amino, hydroxy, methyl; Y is the non-nuclearity negatively charged ion of asking, for example: hexafluoro arsenate, hexafluoro antimonate.
Sulfonium salt is with respect to the usage quantity of Resins, epoxy 2-20 weight part preferably.
In binding agent of the present invention, preferably sneak into the dispersed electro-conductive particle, its objective is make for the height error of the flange that remedies chip or electrode of substrate binding agent have anisotropic different electrically.
Reaction resin is the 20-100 weight part with respect to binding agent 100 weight parts preferably with respect to the usage quantity of binding agent.
Can use for example Au as conducting particles of the present invention, Ag, Cu, metallicss such as scolder, but be not subjected to the restriction of these examples.Best is on the surface of the contour molecular ball core of polystyrene material Ni to be set, Cu, and Au, conductive layers such as scolder in addition, on the surface of conducting particles, can also form Sn, upper layers such as Au scolder.The purpose that further forms upper layer is to improve electroconductibility for the combination by same bottom (conductive layer).The particle diameter of conducting particles must be also littler than the minimum interval of the electrode on the substrate.In addition, have at electrode under the situation of height error, the particle diameter of conducting particles cans be compared to height error most and wants big, and that concrete is 1-10 μ m.In addition, be dispersed in the conducting particles amount 0.1-30 volume % preferably in the binding agent, that especially good is 0.2-15 volume %.
In binding agent of the present invention, can sneak into the dispersion inorganic filling material.
Can be listed below material as spendable inorganic filling material among the present invention, but not be subjected to the restriction of these materials, for example: powder such as fused silicon-dioxide, crystalline silica, Calucium Silicate powder, aluminum oxide, lime carbonate.
The usage quantity of inorganic filling material is the 10-200 weight part with respect to adhesive composition 100 weight parts preferably.Especially good is the 20-90 weight part.In order to reduce thermal expansivity, the big more effect of the usage quantity of inorganic filling material is good more; Yet, consumption is excessive have produce that cohesiveness reduces or electrode between the bad tendency of conduction, consumption is too small the tendency that can not fully reduce thermal expansivity.
The median size of inorganic filling material is preferably in below the 3 μ m from preventing the junction bad viewpoint of conduction.In addition, from the viewpoint that prevents resin flow reduction when connecting with prevent from preferably to use ball filler as inorganic filling material to the viewpoint of the damage of the passive film of chip.Whether the inorganic filling material binding agent contains conducting particles all can be sneaked into, disperse.
For easier formation film, can also be with phenoxy resin, alkyd resin, thermoplastic resins such as polyamide resin (hereinafter referred to as film formation property polymer) join in the binding agent of the present invention.These films formation property polymer has the effect of the stress when alleviating reaction resin curing.Especially good is when having functional group such as hydroxy when it, and film forms the property polymer and helps improving cohesiveness.
Can adopt following method to carry out for binding agent of the present invention being made film shape, that is: will be at least by these reaction resins, the adhesive composition that the potentiality solidifying agent is formed dissolves or is dispersed in and makes its one-tenth liquid in the organic solvent, be coated in then on the body material that can peel off, below the active temperature of solidifying agent, get final product except that desolvating.At this moment the mixed solvent that used solvent preferably helps improving the aromatic series hydrocarbon system of material dissolves and contains oxygen system.
Adhesive film of the present invention can be by the adjustment reaction resin, rubber particles, and it is 50-1000MPa, preferably 70-500MPa that the usage quantity of film formation property macromolecular material etc. makes the spring rate (25 ℃) of film.The spring rate of adhesive film can not be with film applying to circuit card once surpassing 1000MPa, film width cut-out is in accordance with regulations being added the tendency that exists man-hour adhesive film to peel off on by the body material film.In addition, if the not enough 50MPa of spring rate, when the roll that is rolled into together with the body material film more than the 10M, exist adhesive film to stick on the back side of body material film and the tendency that is difficult to carry out adhesive film is pasted the operation on the circuit substrate.In addition, at this moment,, when crimping, there is the tendency that produces many holes because the content of low molecular reaction resin increases.Have again, the spring rate of adhesive film (storage elasticity rate: measure and to use film thickness: 10 μ m) can with the determination of viscoelasticity device (heat-up rate: 10 ℃/minute, frequency: 1Hz) try to achieve.
The reactivity of binding agent can use DSC (heat-up rate: 10 ℃/minute) to measure.It is more than 60 ℃ that binding agent of the present invention uses the heating of DSC to begin temperature, and 80% end temp of the curing reaction of binding agent is below 260 ℃.Make it reach these temperature by the reaction resin adjustment of selecting to add in the binding agent.Have, 60% end temp of curing reaction is preferably in below 160 ℃ again.
Thermal value based on the curing reaction of binding agent of the present invention also can be tried to achieve with DSC (heat-up rate: 10 ℃/minute).Thermal value is preferably the 50-140 joule/gram, and especially good is the 60-120 joule/gram, and good especially is the 60-100 joule/gram, by the change reaction resin, and rubber particles, the usage quantity of film formation property polymer etc. is adjusted.The thermal value of binding agent is if surpass 140 joule/gram, then because the factors such as increase of the cure shrinkage power of binding agent and spring rate increase internal stress, when connecting between the circuit, exist the circuit substrate deflection to cause the tendencies such as characteristic reduction of connection reliability reduction or electronic component.In addition, when thermal value less than 50 joule/gram, there is because the curing of binding agent is insufficient the tendency that causes cohesiveness and connection reliability to reduce.
DSC is that the zero-method of will supply with or remove heat makes that as measuring principle elimination constantly also can use commercially available determinator to measure with the temperature head of the standard test specimen that does not have heating, heat absorption in measuring temperature range.The reaction of binding agent is an exothermic reaction, if heat up with certain heat-up rate, specimen reaction just produces heat.This thermal value is outputed in the chart, baseline as benchmark, is tried to achieve the area that is enclosed by heating curve and baseline, with it as thermal value.To about 300 ℃, measure from room temperature (25 ℃) with 10 ℃/minute heat-up rates, try to achieve above-mentioned thermal value.These all fully automatically carry out, if use it to carry out at an easy rate.In addition, 80% of curing reaction end temp can be tried to achieve by the area of thermal value.
Embodiment one
(ユ ニ オ Application カ one バ イ De society system, PKHC) 50 grams are dissolved in vinyl acetic monomer 115 grams, obtain the phenoxy resin solution of 30 weight % with phenoxy resin.
As silicone, in being 12 aqueous ethanolic solution, 20 ℃ of pH values that methyltrimethoxy silane joined with 300 rev/mins of stirrings make its hydrolysis, condensation, and the storage elasticity rate that makes 25 ℃ is 8MPa, and median size is spherical particle of 2 μ m.
To contain phenoxy resin solution (with solid-state weight ratio phenoxy resin 45 grams) silicone micropartical 30 grams, liquid epoxies (the epoxy equivalent (weight) 185 of microcapsule-type potentiality solidifying agent, Asahi Chemical Industry Co., Ltd's system, ノ バ キ ユ ア HX--3941) 20 grams, bisphenol A type epoxy resin (epoxy equivalent (weight) 180) 50 grams mix, and (diameter: 5 μ m) thereby conducting particles of surface formation Au layer is dispersed in 6 volume % and wherein makes thin film coated solution will to examine core at polystyrene.Subsequently, with coating unit this solution being coated to thickness is that the single face of the film of 50 μ m carries out on surface-treated PET (polyethylene terephthalate, body material film, the separator) film, through 70 ℃ of warm air dryings 10 minutes, obtaining adhesive layer thickness was the film like binding agent of 45 μ m.About this binding agent, to the reaction time opening, the reaction concluding time, 60% and 80% end temp of curing reaction, the thermal value of the DSC that finishes up to 80% of curing reaction, and thermal value and the spring rate of the DSC that finishes fully up to curing reaction measure, it the results are shown in table 1.
Secondly, use the film like binding agent of gained will be with golden flange (area 80 * 80 μ m as shown below, interval 30 μ m, height 15 μ m, flange several 288) chip (10 * 10mm, thickness 500 μ m) is connected with having with the Cu circuit printing plate of the plating Ni/Au of the corresponding circuit electrode of electrode of chip.
With the film like binding agent (12 * 12mm) at 80 ℃, 1.0MPa (10 kgfs/centimetre
2) pressure under stick on the Cu circuit printing plate (electrode height 20mm, thickness 0.8mm) of plating Ni/Au, the peel separation device coincide the position of the Cu circuit printing plate (thickness 0.8mm) of the flange of chip and plating Ni/Au.Subsequently, at 180 ℃, 75 gram/each flange are heated, are pressurizeed by the chip top under 20 seconds the condition, thereby realize this connection.
The deflection of this connection back chip is 1 μ m (to the deflection of chip direction projection).In addition, the connection impedance after this connection, each flange is the highest 15M Ω, average out to 8M Ω, insulation impedance is 18
8More than the Ω.Even these values are carrying out-1000 circular treatment of heat shock resistance test of 55--125 ℃, and PCT test (121 ℃, 0.2MPa (2 normal atmosphere)) 200 hours, dipping did not change after 10 seconds yet during 260 ℃ of solderings were bathed, and showed the connection reliability that it is good.
Embodiment two
Except the conducting particles with 10 volume % was dispersed in the binding agent, all the other were identical with embodiment one, obtained thin film coated solution.
Subsequently, using coating unit that this solution is coated in thickness is that the single face of the film of 50 μ m carries out on the surface-treated PET film, and through 70 ℃ of warm air dryings 10 minutes, obtaining adhesive layer thickness was the film like binding agent a of 10 μ m.
Subsequently, apply with in the process of solution in above-mentioned making, except the conductive ion that will not form the Au layer is dispersed in the solution this point, use with last identical method and make thin film coated solution, using coating unit that this solution is coated in thickness is that the single face of the film of 50 μ m carries out on the surface-treated PET film, through 70 ℃ of warm air dryings 10 minutes, obtaining adhesive layer thickness was the film like binding agent b of 15 μ m.Again with resulting film like binding agent a and b 40 ℃ of heating on one side, on one side make the conductive film of each guide property of laminated two-layer structure with roll-type laminater.
About this binding agent, similarly to measure with embodiment one, it the results are shown in table 1.
Secondly, use prepared respectively to the Anisotropically conductive film, to be with golden flange (area: 50 * 50 μ m as shown below, at interval: 20 μ m, highly: 15 μ m, flange several 362) chip (1.7 * 17mm, thickness: 500 μ m) with the glass substrate (thickness: 1.1mm) connect of being with the ITO circuit.With anisotropic conducting film (2 * 20mm) at 80 ℃, 1MPa (10 kgfs/centimetre
2) pressure under paste on the glass substrate of band ITO circuit after, the peel separation device coincide the position of the glass substrate of the flange of chip and band ITO circuit.Subsequently, at 190 ℃, 40 gram/each flange are heated by the chip top under 10 seconds the condition, pressurization, thus realize this connection.The deflection of this connection back chip is 2.5 μ m.In addition, connect each flange of impedance and be the highest 80M Ω, average out to 30M Ω, insulation impedance is 10
8More than the Ω.Even these values are carrying out-1000 circular treatment of heat shock resistance test of 40--100 ℃, and high temperature does not change after high humidity (85 ℃, 85%RH, the 1000 hours) test yet, shows the connection reliability that it is good.
Embodiment three
(ユ ニ オ Application カ one バ イ De society system, PKHC) 50 grams are dissolved in vinyl acetic monomer 115 grams, make 30% solution with phenoxy resin.
Phenoxy resin 60 grams that will have solid-state weight ratio, the median size of 20 weight % is that the acrylic particles (the storage elasticity rate is 3MPa) of 0.2 μ m is dispersed in bisphenol A type epoxy resin (epoxy equivalent (weight) 180) 25 grams wherein, bisphenol A-type solid epoxy resin (epoxy equivalent (weight): 185) 5 grams, (the non-nuclearity negatively charged ion of asking: hexafluoro antimonate) 3 grams mix P-acetoxyphenyl group mesylate, and (diameter: surface 3 μ m) forms the conducting particles dispersing and mixing of 10 volume % of gold layer in wherein making thin film coated solution will to examine core at polystyrene again.
Subsequently, using coating unit to be coated in this solution with thickness is on the PET film after the single face of the film of 50 μ m carries out surface treatment, 70 ℃ through warm air drying 10 minutes, thereby the thickness that makes adhesive layer is the film like binding agent c of 10 μ m.
Subsequently, use in the process of solution in above-mentioned making thin film coated, except the conducting particles that will not form the Au layer is dispersed in the solution this point, all the other make thin film coated solution with the same identical method, using coating unit to be coated to this solution to thickness is on the PET film after the single face of the film of 50 μ m carries out surface treatment, 70 ℃ through warm air drying 10 minutes, thereby the thickness that makes adhesive layer is the film like binding agent d of 15 μ m.
With prepared film like binding agent c and d 40 ℃ of heating on one side, on one side be pressed into the anisotropic conducting film of two-layer structure with roll-type laminater making layer.Similarly measure with embodiment one about this adhesive film.It the results are shown in table 1.
Secondly, use prepared anisotropic conducting film, to be with golden flange (area: 50 * 50 μ m as shown below, at interval: 20 μ m, highly: 15 μ m, flange several 362) chip (1.7 * 17mm, thickness: 500 μ m) with the glass substrate (thickness: 1.1mm) connect of being with the ITO circuit.With anisotropic conducting film (2 * 20mm) at 80 ℃, with 1MPA (10 kgfs/centimetre
2) pressure paste on the glass substrate of band ITO circuit, the peel separation device coincide the position of the glass substrate of the flange of chip and band ITO circuit.Subsequently, at 150 ℃, 40 gram/each flange are heated, are pressurizeed by the chip top under 10 seconds the condition, thereby realize this connection.The deflection of this connection back chip is 1.5 μ m.In addition, connect each flange of impedance and be up to 50M Ω, average out to 20M Ω, full edge impedance is 10
8More than the Ω,, show good connection reliability even 1000 circular treatment of warp-40-100 ℃ of heat shock resistance test of these values do not change after high temperature, high humidity (85 ℃/85%RH, the 1000 hours) test yet.
Comparative example one
Use does not have the anisotropic conducting film FC-110A of mixed rubber particle, and (Hitachi Chemical Co., Ltd.'s system, thickness: 45 μ m) compare test with embodiment one, it the results are shown in table 1.
Secondly, use above-mentioned film like binding agent, as shown below, to be with golden flange (area: 80 * 80 μ m, at interval: 30 μ m, highly: 15 μ m, flange several 288) (10 * 10mm, thickness: 500 μ m) the Cu circuit printing plate with plating Ni/Au connects chip.(12 * 12mm) at 80 ℃, 1MPa (10 kilograms per centimeter with film adhesive
2) pressure under paste that (electrode height: 20 μ m, thickness: 0.8mm), behind the peel separation device, the flange that makes chip coincide with the position of the Cu circuit printing plate of plating Ni/Au on the Cu circuit printing plate of plating Ni/Au.Subsequently, at 190 ℃, 75 gram/each flange are heated by the chip top under 10 seconds the condition, pressurization, thus realize this connection.The deflection of this connection back chip is 7.2 μ m (to the deflections of chip direction projection).In addition, the connection impedance after this connection is up to 20M Ω for each flange, average out to 10M Ω, and insulation impedance is 10
8More than the Ω.Connect 1000 circular treatment of heat shock resistance test of warp-55--125 ℃ of impedance, dipping also produces some bad connections except increasing after 10 seconds situation is bathed in PCT test (121 ℃, 2MPA (2 normal atmosphere)) 200 hours, 260 ℃ soldering.
Comparative example two
Use will be anisotropic conducting film AC-8401 (the Hitachi Chemical Co., Ltd.'s system that does not contain rubber particles of the double-layer structure that constitutes of the thin film layer that contains conducting particles of 8 μ m and the thin film layer that does not contain conducting particles that thickness is 15 μ m by thickness, thickness: 23 μ m) embodiment two compares test relatively, and it the results are shown in table 1.
Secondly, use this anisotropic conducting film, will be with golden flange (area: 50 * 50 μ m as described below, interval 20 μ m, chip highly: 15 μ m, flange several 362) (1.7 * 17mm, thickness: 500 μ m) with the glass substrate (thickness: 1.1mm) be connected of being with the ITO circuit.With anisotropic conducting film (2 * 20mm) at 80 ℃, paste on the glass substrate of band ITO circuit with the pressure of 1MPa after, the peel separation device coincide the position of the glass substrate of the flange of chip and band ITO circuit.Subsequently, at 190 ℃, 40 gram/each flange are heated, are pressurizeed by the chip top under 10 seconds the condition, realize this connection.The deflection of the chip of this connection is 8.2 μ m, compares deflection with embodiment two and increases.
Table 1
| Project | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 |
| Reaction beginning temperature (℃) | 90 | 90 | 80 | 90 | 90 |
| The reaction end temp (℃) | 190 | 200 | 240 | 206 | 205 |
| 80% end temp of curing reaction (℃) | 160 | 160 | 230 | 180 | 180 |
| 60% end temp of curing reaction (℃) | 145 | 145 | 160 | 160 | 150 |
| The thermal value (joule/gram) of the DSC that finishes up to 80% of curing reaction | 75 | 70 | 120 | 180 | 160 |
| The thermal value (joule/gram) of the DSC that finishes up to curing reaction | 90 | 85 | 150 | 200 | 200 |
| Spring rate (25 ℃, MPa) | 600 | 600 | 200 | 2000 | 2000 |
Claims (8)
1. adhesive for connection of circuit, be through heating with relative circuit electrode, pressurization, make in the binding agent of realizing the heat adhesiveness that is electrically connected between the electrode of compression aspect, it is characterized in that: above-mentioned binding agent contains dispersive, median size is the following rubber particles of 10 μ m, the potentiality solidifying agent sulfonium salt of Resins, epoxy and following formula (I) expression, it is more than 60 ℃ that the heating of the DSC of this binding agent (difference formula scanning calorimeter is analyzed) begins temperature, and 80% end temp of curing reaction is below 260 ℃
In formula (1), R
1Be selected from nitroso-group, carbonyl, carboxyl, cyano group, trialkyl ammonium, first is fluorine-based; R
2And R
3Be selected from amino, hydroxy, methyl; Y is selected from hexafluoro arsenate, hexafluoro antimonate.
2. a kind of adhesive for connection of circuit according to claim 1 is characterized in that: above-mentioned binding agent begins temperature to 80% the end temp of curing reaction from above-mentioned heating, and the thermal value that records with DSC is 50～140 joule/gram.
3. a kind of adhesive for connection of circuit according to claim 1 is characterized in that: 60% end temp of the curing reaction that above-mentioned binding agent records with DSC is below 160 ℃.
4. a kind of adhesive for connection of circuit according to claim 1 is characterized in that: above-mentioned binding agent also contains the conducting particles of 0.1～30 volume % that exists with the dispersive state.
5. a kind of adhesive for connection of circuit according to claim 1 is characterized in that: also contain film formation property polymer.
6. a kind of adhesive for connection of circuit according to claim 1 is characterized in that: with respect to 100 parts by weight of epoxy resin, the use level of above-mentioned sulfonium salt is 2～20 weight parts.
7. make the circuit connection adhesive film of film shape according to the described any binding agent of claim 1～6.
8. a kind of circuit according to claim 7 connects uses adhesive film, and it is characterized in that: above-mentioned film is 50～1000MPa at 25 ℃ spring rate.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01135050 CN1246411C (en) | 2001-11-16 | 2001-11-16 | Adhesive for connection of circuit |
| CNB2004100309666A CN100513507C (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01135050 CN1246411C (en) | 2001-11-16 | 2001-11-16 | Adhesive for connection of circuit |
Related Child Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410030969 Division CN1532256B (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
| CNB2004100309632A Division CN100509981C (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
| CNB2004100309670A Division CN100509983C (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
| CNB2004100309651A Division CN100509982C (en) | 2001-11-16 | 2001-11-16 | Adhisive for circuit connection |
| CNB2004100309666A Division CN100513507C (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
| CNB2004100309685A Division CN100509984C (en) | 2001-11-16 | 2001-11-16 | Film-shaped adhesive for circuit connection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1420150A CN1420150A (en) | 2003-05-28 |
| CN1246411C true CN1246411C (en) | 2006-03-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01135050 Expired - Lifetime CN1246411C (en) | 2001-11-16 | 2001-11-16 | Adhesive for connection of circuit |
| CNB2004100309666A Expired - Fee Related CN100513507C (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100309666A Expired - Fee Related CN100513507C (en) | 2001-11-16 | 2001-11-16 | Adhesive for circuit connection |
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| CN (2) | CN1246411C (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102153957B (en) * | 2006-11-10 | 2013-12-04 | 日立化成株式会社 | Adhesive film, and connection structure and connecting method for circuit member |
| KR20120029485A (en) * | 2007-05-09 | 2012-03-26 | 히다치 가세고교 가부시끼가이샤 | Conductor connection member, connection structure, and solar cell module |
| EP2146404A1 (en) | 2007-05-09 | 2010-01-20 | Hitachi Chemical Company, Ltd. | Method for connecting conductor, member for connecting conductor, connecting structure and solar cell module |
| EP2694611B1 (en) * | 2011-04-05 | 2019-02-27 | Henkel IP & Holding GmbH | B-stageable and skip-curable wafer back side coating adhesives |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4556260B2 (en) * | 1999-10-27 | 2010-10-06 | 日立化成工業株式会社 | Additive insulation film for printed wiring boards |
-
2001
- 2001-11-16 CN CN 01135050 patent/CN1246411C/en not_active Expired - Lifetime
- 2001-11-16 CN CNB2004100309666A patent/CN100513507C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1420150A (en) | 2003-05-28 |
| CN1532253A (en) | 2004-09-29 |
| CN100513507C (en) | 2009-07-15 |
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