Fig. 1 shows the manufacture method according to the actuator of first embodiment of the present invention ink jet-print head.With reference to the figure of the top of figure 1, the oscillating plate 20 that is integrally formed with chamber plate 10 provides fluid reservoir 11.
The monomer that can prepare mutual formation all-in-one-piece chamber plate 10 and oscillating plate 20.At this moment, fluid reservoir 11 is formed on subsequently corresponding in the body of chamber plate 10 that part of.In addition, can be individually formed chamber plate 10 and oscillating plate 20.Form after the fluid reservoir 11, the chamber plate 10 of gained is connected with the oscillating plate 20 that forms in chamber plate 10 separately.
The metal dust 40 of structure on being coated in chamber plate 10 and oscillating plate 20 that will comprise mutual all-in-one-piece chamber plate 10 and oscillating plate 20 then packed in the container in the heating furnace 30.
For metal dust 40, main aluminium (Al) or the chromium (Cr) that demonstrates anti-oxidation characteristics that uses.Nickel (Ni) or cobalt (Co) can add in aluminium or the chromium.
The activating agent and being used to that is used to provide the active coating of metal dust 40 can be prevented that metal dust 40 from flowing and the antiwelding agents that are sintered added in the stove 30 with Powdered the mixing with certain ratio with respect to metal dust 40 respectively.
Activating agent can comprise as sodium chloride (NaCl) or chlorination nitrogen (NH
4Cl) etc. halide.Antiwelding agent can comprise aluminium oxide (Al
2O
3) or zirconia (ZrO
2).
Heating furnace 30 under the high temperature in the atmosphere of needs then, the atmosphere that needs for example contains for example hydrogen (H
2) wait the reducing atmosphere of reducing gas or contain just like argon (Ar), helium (He) or nitrogen (N
2) wait the inert atmosphere of inert gas, and/or 10
-5Under the vacuum condition of 50Torr.
Preferably, the heating-up temperature of stove 30 is about more than 500 ℃.
Along with stove 30 is heated, metal dust 40 is melted, and is coated in thus on the exposed surface that is contained in interior chamber plate 10 of container and oscillating plate 20, forms anti-oxidation metal film 80 thus on the exposed surface of chamber plate 10 and oscillating plate 20.
The resulting structures that is coated with anti-oxidation metal film 80 is heat-treated under about 600 to 1,500 ℃ temperature in oxidizing atmosphere.By described heat treatment, oxidation is coated in the metal film 80 on chamber plate 10 and oscillating plate 20 exposed surfaces, forms oxidation-resistant film 50 thus on the exposed surface of these plates 10 and 20.
Oxidation-resistant film 50 is very fine and close, and very high interior grain density is promptly arranged, and can prevent oxidation in the metal thus.
Preferably, oxidation-resistant film 50 thickness of 0.03 to 5 μ m of having an appointment.Prescribe a time limit above last when the thickness of anti-oxidation metal film, the vibration performance of oscillating plate 20 significantly reduces.
After this, use silk-screen printing technique, deposited oxide piezoelectric element 60, sintering under about 900 to 1,100 ℃ high temperature then on the needs part of the oscillating plate 20 that is formed with oxidation-resistant film 50.At last, top electrode 70 is layered on the oxide piezoelectric element 60.Thus, make ink jet-print head.
On the surface owing to the exposure that is formed on chamber plate 10 and oscillating plate 20 according to above-mentioned method oxidation-resistant film 50, therefore can during the processing step of high temperature sintering oxide piezoelectric element 60, protect oscillating plate 20.Therefore, can prevent the physical property change or the distortion of oscillating plate 20.
Fig. 2 shows the manufacture method of the actuator of ink jet-print head according to a second embodiment of the present invention.In Fig. 2, represent by identical reference number corresponding to the element of Fig. 1.With reference to the last figure of figure 2, demonstrate and provide the oscillating plate 20 that the chamber plate 10 of fluid reservoir 11 is integrally formed.
This embodiment is characterised in that the vacuum deposition processes of using as sputter or evaporation technology etc., and anti-oxidation metal film 80 is deposited on the surface of exposure of mutual all-in-one-piece chamber plate 10 and oscillating plate 20.
Metal material by deposit oxidation on the surface of the exposure of chamber plate 10 and oscillating plate 20 can obtain anti-oxidation metal film 80.The metal material deposit anti-oxidation metal film 80 that also can contain in addition, anti-oxidation metal by deposit.
Though anti-oxidation metal film 80 has been in the state of oxidation, the chamber plate 10 and the oscillating plate 20 that are deposited with anti-oxidation metal film 80 are heat-treated under about 600 to 1,500 ℃ temperature.Thus, on the surface of the exposure of chamber plate 10 and oscillating plate 20, form very highdensity fine and close oxidation-resistant film 50.
With the same in the first embodiment of the present invention, the have an appointment thickness of 0.03 to 5 μ m of preferred oxidation-resistant film 50.
After this, deposited oxide piezoelectric element 60, sintering under about 900 to 1,100 ℃ high temperature then on the needs part of the oscillating plate 20 that is formed with oxidation-resistant film 50.At last, top electrode 70 is layered on the oxide piezoelectric element 60.Thus, make ink jet-print head.
According to a second embodiment of the present invention, advantage is not need to use the stove 30 that requires among first embodiment, be since simply on the surface of the exposure of chamber plate 10 and oscillating plate 20 deposit anti-oxidation metal film 80 just can form oxidation-resistant film 50.Yet compare the formation decrease in efficiency of oxidation-resistant film 50 this moment with first embodiment.
According to a second embodiment of the present invention, can during the processing step of high temperature sintering oxide piezoelectric element 60, protect oscillating plate 20, can prevent that thus the physical property of oscillating plate 20 from changing or distortion.
Fig. 3 shows the manufacture method of the actuator of a third embodiment in accordance with the invention ink jet-print head.In Fig. 3, represent by identical reference number corresponding to the element of Fig. 1 and 2.With reference to the last figure of figure 3, demonstrate and provide the fluid reservoir oscillating plate 20 that 11 Room plates 10 are integrally formed.
Chamber plate 10 and oscillating plate 20 have the material that contains anti-oxidation metal to make.
When heat-treating under about 600 to 1,500 ℃ temperature, its exposure surperficial oxidized forms oxidation-resistant film 50 thus thereon to the chamber plate 10 that contains anti-oxidation metal and oscillating plate 20.
The same with the last embodiment of the present invention, the have an appointment thickness of 0.03 to 5 μ m of preferred oxidation-resistant film 50.
After this, deposited oxide piezoelectric element 60, sintering under about 900 to 1,100 ℃ high temperature then on the needs part of the oscillating plate 20 that is formed with oxidation-resistant film 50.At last, top electrode 70 is layered on the oxide piezoelectric element 60.Thus, make ink jet-print head.
Fig. 4 shows the manufacture method of the actuator of a fourth embodiment in accordance with the invention ink jet-print head.In Fig. 4, represent by identical reference number corresponding to the element of Fig. 1.This embodiment be characterised in that oscillating plate 20 with not with slab integral ground, the chamber formation of fluid reservoir.According to this embodiment, be formed with the fluid reservoir that needs at last treatment step chamber plate 10.
When the chamber plate 10 of band fluid reservoir 11 used with first to the 3rd embodiment the samely, physical property can change during the oscillating plate 20 on covering fluid reservoir 11 tops was heat-treated under the high temperature in forming oxidation-resistant film 50, was because it is made up of thin plate.
When heat treatment oscillating plate under about 600 to 1,500 ℃ high temperature 20 forms oxidation-resistant film, its physical property changes, so the oscillating plate distortion.
For this reason, a fourth embodiment in accordance with the invention, oscillating plate 20 is connected to the chamber plate 10 that does not form fluid reservoir, so that prevent change in physical during the heat treatment of high temperature.
According to the 4th embodiment, the structure that will comprise mutual all-in-one-piece chamber plate 10 and oscillating plate 20 is then packed into the lip-deep metal dust 40 of the exposure that is coated in chamber plate 10 and oscillating plate 20 in the container in the heating furnace 30.
For metal dust 40, main aluminium or the chromium that demonstrates anti-oxidation characteristics that uses.Nickel or cobalt can add in aluminium or the chromium.
The activating agent and being used to that is used to provide the active coating of metal dust 40 can be prevented that metal dust 40 from flowing or the antiwelding agent that is sintered to add in the stove 30 with the form of the powder of certain ratio with respect to metal dust 40 respectively.
Activating agent can comprise as sodium chloride (NaCl) or chlorination nitrogen (NH
4Cl) etc. halide.Antiwelding agent can comprise aluminium oxide (Al
2O
3) or zirconia (ZrO
2).
Heating furnace 30 under the high temperature in the atmosphere of needs then, the atmosphere that needs for example contains for example hydrogen (H
2) wait the reducing atmosphere of reducing gas or contain just like argon (Ar), helium (He) or nitrogen (N
2) wait the inert atmosphere of inert gas, and/or 10
-5Under the vacuum condition of 50Torr.Along with stove 30 is heated, metal dust 40 is melted, and is coated in thus on the exposed surface that is contained in interior chamber plate 10 of container and oscillating plate 20, forms anti-oxidation metal film 80 thus on the exposed surface of chamber plate 10 and oscillating plate 20.
Preferably, the heating-up temperature of stove 30 is about more than 500 ℃.
The resulting structures that is coated with anti-oxidation metal film 80 is heat-treated under about 600 to 1,500 ℃ temperature in oxidizing atmosphere.By described heat treatment, oxidation is coated in the metal film 80 on chamber plate 10 and oscillating plate 20 exposed surfaces, forms oxidation-resistant film 50 thus on the exposed surface of these plates 10 and 20.
Oxidation-resistant film 50 is very fine and close, and very high interior grain density is promptly arranged, and can prevent oxidation in the metal thus.
Preferably, oxidation-resistant film 50 thickness of 0.03 to 5 μ m of having an appointment.Prescribe a time limit above last when the thickness of anti-oxidation metal film, the vibration performance of oscillating plate 20 significantly reduces.
After this, use silk-screen printing technique, deposited oxide piezoelectric element 60, sintering under about 900 to 1,100 ℃ high temperature then on the needs part of the oscillating plate 20 that is formed with oxidation-resistant film 50.Then, top electrode 70 is layered on the oxide piezoelectric element 60.
At last, fluid reservoir 11 is formed on the lower surface of chamber plate 10.
In order to form fluid reservoir 11, at first photoresist film 90 is coated on the lower surface of chamber plate 10, use suitably composition of mask according to exposure, development and developing technique then.That is, remove photoresist film 90 partly and stay the figure that is less than or equal to fluid reservoir 11 areas that will form.Make with photoresist figure make mask, the corroding chamber plate 10 then, form fluid reservoir 11 thus.
Thus, prepare the ink jet-print head that needs.
Fig. 6 shows the manufacture method of the actuator of a fourth embodiment in accordance with the invention ink jet-print head.In Fig. 6, the element that corresponds respectively to Figure 4 and 5 is represented by identical reference number.This embodiment is similar to the 4th embodiment and is the same with the 4th embodiment, and oscillating plate 20 integrally forms with the chamber plate 10 with fluid reservoir not.
According to this embodiment, use vacuum deposition processes as sputter or evaporation technology etc., anti-oxidation metal film 80 is deposited on the surface of exposure of mutual all-in-one-piece chamber plate 10 and oscillating plate 20.
Metal material by deposit oxidation on the surface of the exposure of chamber plate 10 and oscillating plate 20 can obtain anti-oxidation metal film 80.The metal material deposit anti-oxidation metal film 80 that also can contain in addition, anti-oxidation metal by deposit.
Though anti-oxidation metal film 80 has been in the state of oxidation, the chamber plate 10 and the oscillating plate 20 that are deposited with anti-oxidation metal film 80 are heat-treated under about 600 to 1,500 ℃ temperature.Thus, on the surface of the exposure of chamber plate 10 and oscillating plate 20, form very highdensity fine and close oxidation-resistant film 50.
With the same in the first embodiment of the present invention, the have an appointment thickness of 0.03 to 5 μ m of preferred oxidation-resistant film 50.
After this, deposited oxide piezoelectric element 60, sintering under about 900 to 1,100 ℃ high temperature then on the needs part of the oscillating plate 20 that is formed with oxidation-resistant film 50.Then, top electrode 70 is layered on the oxide piezoelectric element 60.
At last, fluid reservoir 11 is formed on the lower surface of chamber plate 10.
In order to form fluid reservoir 11, at first photoresist film 90 is coated on the lower surface of chamber plate 10, use suitably composition of mask according to exposure, development and developing technique then.That is, remove photoresist film 90 partly and stay the figure that is less than or equal to fluid reservoir 11 areas that will form.Make with photoresist figure make mask, the corroding chamber plate 10 then, form fluid reservoir 11 thus.
Thus, prepare the ink jet-print head that needs.
Fig. 7 shows the manufacture method of the actuator of ink jet-print head according to a sixth embodiment of the invention.In Fig. 7, correspond respectively to Fig. 4 and represent by identical reference number with 6 element.Except oscillating plate 20 and the chamber plate 10 with fluid reservoir not integrally form, this embodiment is similar to the 3rd embodiment.According to of the present invention the 6th, the same with the 3rd embodiment, chamber plate 10 and oscillating plate 20 are made by the material that contains anti-oxidation metal.
When the chamber plate 10 and the oscillating plate 20 that contain anti-oxidation metal are heat-treated under about 600 to 1,500 ℃ temperature, the surface of its exposure of oxidation forms very highdensity fine and close oxidation-resistant film 50 thus thereon.
The have an appointment thickness of 0.03 to 5 μ m of preferred oxidation-resistant film 50.
After this, deposited oxide piezoelectric element 60, sintering under about 900 to 1,100 ℃ high temperature then on the needs part of the oscillating plate 20 that is formed with oxidation-resistant film 50.Then, top electrode 70 is layered on the oxide piezoelectric element 60.
At last, fluid reservoir 11 is formed on the lower surface of chamber plate 10.
In order to form fluid reservoir 11, at first photoresist film 90 is coated on the lower surface of chamber plate 10, use suitably composition of mask according to exposure, development and developing technique then.That is, remove photoresist film 90 partly and stay the figure that is less than or equal to fluid reservoir 11 areas that will form.Make with photoresist figure make mask, the corroding chamber plate 10 then, form fluid reservoir 11 thus.
Thus, prepare the ink jet-print head that needs.
Fig. 8 shows the manufacture method of the actuator of ink jet-print head according to a seventh embodiment of the invention.In Fig. 8, the element that corresponds respectively to Fig. 1 is represented by identical reference number.According to this embodiment, the same with first embodiment, oscillating plate 20 integrally forms with the chamber plate 10 of band fluid reservoir.The structure that will comprise mutual all-in-one-piece chamber plate 10 and oscillating plate 20 is then packed into the lip-deep metal dust 40 of the exposure that is coated in chamber plate 10 and oscillating plate 20 in the container in the heating furnace 30.
For metal dust 40, main aluminium or the chromium that demonstrates anti-oxidation characteristics that uses.Nickel or cobalt can add in aluminium or the chromium.
The activating agent and being used to that is used to provide the active coating of metal dust 40 can be prevented that metal dust 40 from flowing or the antiwelding agent that is sintered to add in the stove 30 with the form of the powder of certain ratio with respect to metal dust 40 respectively.
Activating agent can comprise as sodium chloride (NaCl) or chlorination nitrogen (NH
4Cl) etc. halide.Antiwelding agent can comprise aluminium oxide (Al
2O
3) or zirconia (ZrO
2).
Heating furnace 30 under the high temperature in the atmosphere of needs then, the atmosphere that needs for example contains for example hydrogen (H
2) wait the reducing atmosphere of reducing gas or contain just like argon (Ar), helium (He) or nitrogen (N
2) wait the inert atmosphere of inert gas, and/or 10
-5Under the vacuum condition of 50Torr.
Preferably, the heating-up temperature of stove 30 is about more than 500 ℃.
Along with stove 30 is heated, metal dust 40 is melted, and is coated in thus on the exposed surface that is contained in interior chamber plate 10 of container and oscillating plate 20, forms anti-oxidation metal film 80 thus on the exposed surface of chamber plate 10 and oscillating plate 20.
After this, deposited oxide piezoelectric element 60 on the needs part of the oscillating plate 20 that is formed with anti-oxidation metal film 80 carries out sintering by heat treatment then in oxidizing atmosphere.By described heat treatment, the metal film 80 that is coated on the exposed surface of chamber plate 10 and oscillating plate 20 is also oxidized, forms oxidation-resistant film 50 on these plates 10 and 20 the exposed surface thus.
Compare with first embodiment, described the 7th embodiment is characterised in that the oxide piezoelectric element 60 that is stacked on the oscillating plate 20 by sinter layer forms oxidation-resistant film 50.In first embodiment, before stacked oxide piezoelectric element 60, form oxidation-resistant film 50.
At last, top electrode 70 is layered on the oxide piezoelectric element 60.Thus, make ink jet-print head.
Fig. 9 shows the manufacture method according to the actuator of eighth embodiment of the present invention ink jet-print head.In Fig. 9, the element that corresponds respectively to Fig. 8 is represented by identical reference number.This embodiment different with the 7th embodiment and with the similar part of the 4th embodiment be oscillating plate 20 with not with slab integral ground, the chamber formation of fluid reservoir.According to this embodiment, be formed with the fluid reservoir that needs at last treatment step chamber plate 10.
According to the 8th embodiment, the structure that will comprise mutual all-in-one-piece chamber plate 10 and oscillating plate 20 is then packed into the lip-deep metal dust 40 of the exposure that is coated in chamber plate 10 and oscillating plate 20 in the container in the heating furnace 30.
For metal dust 40, main aluminium or the chromium that demonstrates anti-oxidation characteristics that uses.Nickel or cobalt can add in aluminium or the chromium.
The activating agent and being used to that is used to provide the active coating of metal dust 40 can be prevented that metal dust 40 from flowing or the antiwelding agent that is sintered to add in the stove 30 with the form of the powder of certain ratio with respect to metal dust 40 respectively.
Activating agent can comprise as sodium chloride (NaCl) or chlorination nitrogen (NH
4Cl) etc. halide.Antiwelding agent can comprise aluminium oxide (Al
2O
3) or zirconia (ZrO
2).
Heating furnace 30 under the high temperature in the atmosphere of needs then, the atmosphere that needs for example contains for example hydrogen (H
2) wait the reducing atmosphere of reducing gas or contain just like argon (Ar), helium (He) or nitrogen (N
2) wait the inert atmosphere of inert gas, and/or 10
-5Under the vacuum condition of 50Torr.
Preferably, the heating-up temperature of stove 30 is about more than 500 ℃.
Along with stove 30 is heated, metal dust 40 is melted, and is coated in thus on the exposed surface that is contained in interior chamber plate 10 of container and oscillating plate 20, forms anti-oxidation metal film 80 thus on the exposed surface of chamber plate 10 and oscillating plate 20.
After this, deposited oxide piezoelectric element 60 on the needs part of the oscillating plate 20 that is formed with anti-oxidation metal film 80 carries out sintering by heat treatment then in oxidizing atmosphere.By described heat treatment, the metal film 80 that is coated on the exposed surface of chamber plate 10 and oscillating plate 20 is also oxidized, forms oxidation-resistant film 50 on these plates 10 and 20 the exposed surface thus.
Sintering temperature is about 600 to 1,500 ℃.
Top electrode 70 is layered on the oxide piezoelectric element 60 then.Subsequently, photoresist film 90 is coated on the lower surface of chamber plate 10, uses suitably composition of mask according to exposure, development and developing technique then.That is, remove photoresist film 90 partly and stay the figure that is less than or equal to fluid reservoir 11 areas that will form.Make with photoresist figure make mask, the corroding chamber plate 10 then, form fluid reservoir 11 thus.
Thus, prepare the ink jet-print head that needs.
In above-mentioned embodiment, the oxidation-resistant film 50 that is coated on the exposed surface of chamber plate 10 and oscillating plate 20 is made up of chrome green film or di-aluminium trioxide film.In order to form this oxidation-resistant film 50, need in oxidizing atmosphere, carry out about heat treatment more than one hour.
Very stable by this oxidation-resistant film 50 that chrome green film or di-aluminium trioxide film are formed, be because it is highdensity dense oxidation film.Because through no longer carrying out further oxidation after certain section oxidization time, oxidation-resistant film 50 thickness of formation are constant.
For example, the same with the of the present invention the first, the 4th with the 8th embodiment, in the time of when mainly be deposited on these chamber plates 10 in the stove 30 and oscillating plate 20 by chamber plate of making for the nickel of anti-oxidation metal and chromium 10 and oscillating plate 20 on, resulting structures demonstrates the proportion of composing between the nickel and chromium in the state that Figure 10 A is shown in deposit chromium.With reference to figure 10A, can find substrate be form certain thickness on the surface of nickel substrate be the chromium layer of anti-oxidation metal.When under about 600 to 1,500 ℃ temperature during this structure of heat treatment, the border between nickel substrate and chromium layer goes out the component ratio marked change between nickel and the chromium, shown in Figure 10 B.When heat-treating in oxidizing atmosphere, that part of chromium layer that boundary exists between nickel substrate and chromium layer becomes the chrome green film for oxidation-resistant film.At this moment, that part of nickel substrate that boundary exists between nickel substrate and chromium layer becomes increases degree of depth place at the nickel substrate and contains and reduce the chrome-nickel film of nickel of the chromium of composition and increase composition.
That is, because oxidation gradually becomes the chrome green film from the surperficial chromium floor of chamber plate 10 and oscillating plate 20.Thus, highdensity fine and close oxidation-resistant film is formed on the surface of chamber plate 10 and oscillating plate 20 and is inner.Oxidation-resistant film demonstrates in the increase degree of depth place of chamber plate 10 and oscillating plate 20 density and descends.The nickel substrate still maintains certain degree of depth of chamber plate 10 and oscillating plate 20.
The oxidation-resistant film that is formed on after the oxidation on chamber plate 10 and the oscillating plate 20 works to prevent oxygen penetration in chamber plate 10 and oscillating plate 20, prevents that thus chamber plate 10 and oscillating plate 20 are by oxidation further.Oxidation-resistant film also demonstrates high temperature resistant.Therefore, chamber plate 10 and oscillating plate 20 remain in the stable status.
Particularly, when sintered oxide piezoelectric element 60 forms oxidation-resistant film 50 before or simultaneously on oscillating plate 20, the temperatures involved of using in the sintering of the not oxidated thing piezoelectric element 60 of oscillating plate 20.Therefore, can prevent the physical property or the alteration of form of oscillating plate 20.
When oxidation-resistant film 50 also is formed on the inner surface of the fluid reservoir 11 that is limited in the chamber plate 10, can prevent to limit that part of chamber plate 10 of fluid reservoir 11 and ink corrosion that oscillating plate 20 is touched them.
Because oxidation-resistant film 50 demonstrates insulating property (properties) usually, therefore before oxide piezoelectric element 60 is deposited on oscillating plate 20, use as the thick film of silk-screen printing technique etc. forms technology formation bottom electrode.Electric wire also can be formed on the oxidation-resistant film 50, so that provide stable voltage to oxide piezoelectric element 60.
When in oxidizing atmosphere when being layered in anti-oxidation metal film 80 on chamber plate 10 and the oscillating plate 20 and heat-treating, anti-oxidation metal film 80 is oxidized and become oxidation-resistant film 50.Between the described heat of oxidation, the Volume Changes in chamber plate 10 and the oscillating plate 20 is very big.
For this reason, when oxidation-resistant film 50 only is formed on the oscillating plate 20, can not obtain the connection between chamber plate 10 and the oscillating plate 20 fully.Therefore, carry out the formation of oxidation-resistant film 50 after preferred chamber plate 10 and oscillating plate 20 integrally link together.
When printing the preparation of head in mode above-mentioned, even oscillating plate 20 slight deformation are also no problem.This is because the distortion of oscillating plate 20 and the distortion of chamber plate 10 take place simultaneously.Therefore, favourable advantage is and can be subjected to ectocine by the above printhead of mentioning preparation reliably.
Though, those skilled in the art will appreciate that, can make and variously change shape, additional and replace, and can not deviate from the scope and spirit essence of the present invention that appended claims is put down in writing for the purpose of showing discloses the preferred embodiment of the present invention.