CN1241488A - Manufacture of metal sheet coated with polymer film specially for soft printed circuit - Google Patents
Manufacture of metal sheet coated with polymer film specially for soft printed circuit Download PDFInfo
- Publication number
- CN1241488A CN1241488A CN 99116606 CN99116606A CN1241488A CN 1241488 A CN1241488 A CN 1241488A CN 99116606 CN99116606 CN 99116606 CN 99116606 A CN99116606 A CN 99116606A CN 1241488 A CN1241488 A CN 1241488A
- Authority
- CN
- China
- Prior art keywords
- metal
- plate
- plastic film
- clad
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 65
- 239000002184 metal Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 229920006254 polymer film Polymers 0.000 title 1
- 239000002131 composite material Substances 0.000 claims abstract description 40
- 239000002985 plastic film Substances 0.000 claims abstract description 34
- 229920006255 plastic film Polymers 0.000 claims abstract description 34
- 239000000853 adhesive Substances 0.000 claims abstract description 22
- 230000001070 adhesive effect Effects 0.000 claims abstract description 22
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 229920002521 macromolecule Polymers 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 12
- 238000009413 insulation Methods 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000004945 silicone rubber Substances 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 238000005056 compaction Methods 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000003139 buffering effect Effects 0.000 abstract 1
- 239000002655 kraft paper Substances 0.000 abstract 1
- 239000004033 plastic Substances 0.000 abstract 1
- 229920000260 silastic Polymers 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 10
- 150000001875 compounds Chemical class 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000005030 aluminium foil Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical class C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000002650 laminated plastic Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN99116606A CN1081128C (en) | 1999-08-18 | 1999-08-18 | Manufacture of metal sheet coated with polymer film specially for soft printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN99116606A CN1081128C (en) | 1999-08-18 | 1999-08-18 | Manufacture of metal sheet coated with polymer film specially for soft printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1241488A true CN1241488A (en) | 2000-01-19 |
CN1081128C CN1081128C (en) | 2002-03-20 |
Family
ID=5279401
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99116606A Expired - Lifetime CN1081128C (en) | 1999-08-18 | 1999-08-18 | Manufacture of metal sheet coated with polymer film specially for soft printed circuit |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1081128C (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091822C (en) * | 1999-09-09 | 2002-10-02 | 沈阳防锈包装材料公司 | Thermal resistance gasket paper for stainless steel sheet and its prodn. method |
CN101374383B (en) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | Insulated basilar membrane, circuit board substrate and circuit board |
CN103722793A (en) * | 2012-10-12 | 2014-04-16 | 昆山雅森电子材料科技有限公司 | Silicon steel foil used for printed circuit board stitching, and stitching method using silicon steel foil |
CN104202927A (en) * | 2014-09-12 | 2014-12-10 | 高德(无锡)电子有限公司 | Production process of semi-finished rigid-flexible printed circuit boards |
CN109322888A (en) * | 2018-11-02 | 2019-02-12 | 广州凯立达电子有限公司 | The bottom cover of watch of deep water overpressure resistant and the stickup curing method of piezoelectric ceramic piece |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
MY105514A (en) * | 1989-05-05 | 1994-10-31 | Gould Electronic Inc | Protected conductive foil and procedure for protecting an electrodeposited metallic foil during further processing. |
IT1271941B (en) * | 1993-02-10 | 1997-06-10 | Cedal Srl | PROCEDURE FOR THE PRODUCTION OF PLASTIC LAMINATES WITH METALLIC LAMINS IN SPECIES FOR PRINTER CIRCUITS, WITH ENDOTHERMAL HEATING. |
RU2118322C1 (en) * | 1993-07-05 | 1998-08-27 | Дюфар Интернэшнл Рисерч Б.В. | 2,3-dihydro-1,4-benzodioxine-5-yl-pyrerazine derivatives and salts thereof |
US5362534A (en) * | 1993-08-23 | 1994-11-08 | Parlex Corporation | Multiple layer printed circuit boards and method of manufacture |
TW324737B (en) * | 1994-03-30 | 1998-01-11 | Gould Wlectronics Inc | Epoxy adhesive composition and copper foil and laminate using the same |
JP3319650B2 (en) * | 1994-03-30 | 2002-09-03 | 三井金属鉱業株式会社 | Copper foil for copper clad laminates |
JP2649899B2 (en) * | 1994-09-21 | 1997-09-03 | ヤマウチ株式会社 | Cushion material for forming press |
JP3400186B2 (en) * | 1995-05-01 | 2003-04-28 | 三井金属鉱業株式会社 | Multilayer printed wiring board and method of manufacturing the same |
-
1999
- 1999-08-18 CN CN99116606A patent/CN1081128C/en not_active Expired - Lifetime
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1091822C (en) * | 1999-09-09 | 2002-10-02 | 沈阳防锈包装材料公司 | Thermal resistance gasket paper for stainless steel sheet and its prodn. method |
CN101374383B (en) * | 2007-08-24 | 2010-06-09 | 富葵精密组件(深圳)有限公司 | Insulated basilar membrane, circuit board substrate and circuit board |
CN103722793A (en) * | 2012-10-12 | 2014-04-16 | 昆山雅森电子材料科技有限公司 | Silicon steel foil used for printed circuit board stitching, and stitching method using silicon steel foil |
CN103722793B (en) * | 2012-10-12 | 2016-07-06 | 昆山雅森电子材料科技有限公司 | For the silicon steel paper tinsel of printed circuit board (PCB) pressing and use the compression method of this silicon steel paper tinsel |
CN104202927A (en) * | 2014-09-12 | 2014-12-10 | 高德(无锡)电子有限公司 | Production process of semi-finished rigid-flexible printed circuit boards |
CN109322888A (en) * | 2018-11-02 | 2019-02-12 | 广州凯立达电子有限公司 | The bottom cover of watch of deep water overpressure resistant and the stickup curing method of piezoelectric ceramic piece |
Also Published As
Publication number | Publication date |
---|---|
CN1081128C (en) | 2002-03-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: HUASHUO SCIENCE CO., LTD. Free format text: FORMER NAME: HUBEI PROV. CHEMICAL RESEARCH INST. |
|
CP01 | Change in the name or title of a patent holder |
Address after: No. 30 Guan Shan Road, Hongshan District, Hubei, Wuhan Patentee after: Huashuo Technology Co., Ltd. Address before: No. 30 Guan Shan Road, Hongshan District, Hubei, Wuhan Patentee before: Hubei Research Institute of Chemistry |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Manufacture of metal sheet coated with polymer film specially for soft printed circuit Effective date of registration: 20100907 Granted publication date: 20020320 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20151106 Granted publication date: 20020320 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Huashuo Technology Co., Ltd. Registration number: 2010990000869 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PM01 | Change of the registration of the contract for pledge of patent right |
Change date: 20151106 Registration number: 2010990000869 Pledgee after: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgee before: Bank of Hankou, Limited by Share Ltd, Optics Valley branch |
|
CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20020320 |