CN1237585C - Process for preparing silicon chip and silicon chip thereof - Google Patents
Process for preparing silicon chip and silicon chip thereof Download PDFInfo
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- CN1237585C CN1237585C CNB011424249A CN01142424A CN1237585C CN 1237585 C CN1237585 C CN 1237585C CN B011424249 A CNB011424249 A CN B011424249A CN 01142424 A CN01142424 A CN 01142424A CN 1237585 C CN1237585 C CN 1237585C
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
- H01L21/3225—Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering
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Abstract
Silicon wafer W is thermal-annealed in atmosphere G to form new vacancies therein in a thermal annealing step and atmosphere G in the thermal annealing step contains a nitride gas having a lower decomposition temperature than a decomposable temperature of N2 so that the thermal annealing is carried out at a lower temperature or for a short time to suppress generation of slip and to provide satisfactory surface roughness.
Description
Invention field
The present invention relates to silicon chip heat treatment in atmosphere gas, portion forms the room within it, the step of going forward side by side carry out heat treatment form on the top layer zero defect (DZ (Denuded Zone)) layer silicon chip manufacture method and with the silicon chip of this method manufacturing.
Background technology
The silicon chip that processing is made of the silicon single crystal of CZ (cutting the krousky crystal-pulling) method pulling growth contains a large amount of oxygen impurities, and this oxygen impurities becomes the oxygen precipitate (bulky micro defect) (BMD:Bulk Micro Defect) that dislocation and defective etc. are produced.This oxygen precipitate is present in when forming device surperficial, becomes to cause leakage current to increase and reason such as the withstand voltage reduction of oxide-film, causes very big influence to semiconductor device characteristic.
For this reason, the method of Cai Yonging was in the past: silicon chip surface is implemented the heat treatment (RTA:Rapid Thermal Annealing) of the Fast Heating chilling of short time in the atmosphere gas that sets under the high temperature more than 1250 ℃, portion forms the thermally equilibrated atom vacancy (Vacancy: following is called the room) of high concentration within it, when freezing owing to chilling, thereby by in heat treatment after this, making the room be formed uniformly the method (for example, the world discloses the technology that communique WO 98/38675 is put down in writing) of DZ layer (zero defect layer) to outdiffusion on the surface.And, adopt following operation: promptly, after above-mentioned DZ layer forms, implement heat treatment being lower than under the temperature of said temperature, form as the defect layer of inside and make oxygen separate out the operation that karyomorphism becomes stable and has bulky micro defect (BMD) layer of absorbing effect.
Again,, at first under oxygen atmosphere, heat-treat, then under non-oxidizing atmosphere, heat-treat, make at superficial layer formation DZ with at inside formation BMD as other prior art (for example, the technology that international open communique WO 98/45507 is put down in writing).
Moreover, in for the heat treatment that forms the room, mainly used N as atmosphere gas in the past
2(nitrogen).That is, by decomposing N at high temperature
2, form Si at silicon chip surface
xN
y(nitride film), thus the room injected.
, in the heat treatment technics of above-mentioned silicon chip, leave over following problem:
In the past, for example when the heat treatment of implementing to make the room to form, with the oxide-film covering surfaces, with N
2Be to heat-treat in the atmosphere gas of leading, but, also need to carry out more than 1250 ℃ and the heat treatment more than the 10sec at this moment in order to obtain sufficient thermal effectiveness.Thus, the disadvantage that silicon chip has is: because the heat treatment of high temperature causes producing slippage from the part that contacts with receptor or fulcrum etc., become reasons such as crackle.
Again, the silicon chip surface before the heat treatment is formed natural oxide film by severe oxidation, but owing to implement above-mentioned heat treatment, so lip-deep natural oxide film at high temperature distils, disadvantageously makes surperficial roughening.
Brief summary of the invention
The present invention finishes in view of above-mentioned problem, its objective is and seeks heat treated low temperatureization or short timeization, provides the generation that can either suppress slippage can obtain the manufacture method and the silicon chip of the silicon chip of surface of good roughness again.
The present invention has adopted following formation in order to solve above-mentioned problem.That is, the manufacture method of silicon chip of the present invention has heat treatment silicon chip in atmosphere gas, and portion newly forms the heat treatment step in room within it, and the above-mentioned atmosphere gas of this heat treatment step is characterised in that: it contains and compares N
2The nitriding gas of the decomposition temperature that the temperature that may decompose is also low.
In the manufacture method of this silicon chip,, the atmosphere gas of heat treatment step compares N because containing
2The nitriding gas of the decomposition temperature that the temperature that may decompose is also low, for example NH
3, NO, N
2O, N
2O
2, hydrazine or dimethyl hydrazine etc., so, even compare N
2Also low heat treatment temperature of situation or short heat treatment time, also can the decompose nitrogen oxidizing gases, with silicon chip surface nitrogenize (formation nitride film), can be to its inner room of injecting, and the slippage when suppressing heat treatment produces.
Again, the manufacture method of silicon chip of the present invention, its above-mentioned nitriding gas contains NH
3(ammonia) is advisable.That is, in the manufacture method of this silicon chip, contain NH owing to use
3Nitriding gas, NH
3Decompose the cleaning performance that the H (hydrogen) that produces has the natural oxide film of removing silicon chip surface, so more promote the nitrogenize on surface and the injection in room.Simultaneously, NH
3Have the effect that makes the oxide-film nitrogenize, can promote the injection in room.Moreover, above-mentioned NH
3The cleaning performance that brings is because hydrogen has reproducibility, and it is different with the evaporation (distillation) that natural oxide film only has when the high temperature.
Again, the manufacture method of silicon chip of the present invention adopts the above-mentioned NH that makes in the above-mentioned nitriding gas
3Concentration be more than 0.5%, perhaps make NH
3The technology of flow more than 10sccm.That is, in the manufacture method of this silicon chip, owing to the NH that makes in the nitriding gas
3Concentration be more than 0.5% or make NH
3Flow more than 10sccm, so nitridation reaction is a reaction rate under this gas condition,, be identical then at the formed nitride film thickness of wafer surface if contain the nitriding gas of this condition, uniformly the room is injected and is become possibility in wafer face.
Again, the manufacture method of silicon chip of the present invention, its above-mentioned nitriding gas is advisable by plasma.That is, in the manufacture method of this silicon chip, nitriding gas further promotes the nitrogenize on surface and the injection in room by become the nitriding gas of activation by plasma.
Again, the manufacture method of silicon chip of the present invention, its above-mentioned heat treated temperature is for being to be advisable below the 60sec (second) from 900 ℃ to 1200 ℃ temperature, above-mentioned heat treatment period.That is, in the manufacture method of this silicon chip, owing to be the heat treatment temperature and the heat treatment time of above-mentioned scope, thereby when suppressing the slippage generation, can also inject the room fully, and obtain an amount of BMD layer.Again, as the back was narrated, owing to be in the heat-treated below 1200 ℃, so formed gap Si is few in crystallization, room and gap Si that the nitride film by the surface is injected into can not offset in pairs, can improve injection efficiency.
Again, the manufacture method of silicon chip of the present invention has the oxide-film removal of above-mentioned silicon chip surface or the oxide-film removal operation of filming is advisable before above-mentioned heat treatment step.Promptly, the manufacture method of this silicon chip is owing to have before heat treatment step the oxide-film removal of silicon chip surface or the oxide-film removal operation of filming, so the oxide-films such as natural oxide film of wafer surface remove fully or largely removed state under carry out RTA and handle, can prevent that oxide-film from hindering the nitrogenize and the room injection of the wafer surface of being brought by nitriding gas, effective room is injected becomes possibility.
Moreover the manufacture method of silicon chip of the present invention is removed in the operation at above-mentioned oxide-film, contains NH at above-mentioned atmosphere gas
3The time, be removed to thickness to the above-mentioned oxide-film of major general and be advisable less than 2nm.Discoveries such as the inventor: as the back is narrated, when the oxide-film more than the surface forms 2nm, then (heat treated temperature is the temperature from 900 ℃ to 1200 ℃ in above-mentioned heat-treat condition, heat treatment period is the following time of 60sec (second)) in, can not fully oxide-film be removed or the oxynitriding membranization fully, can not obtain the room injection effect that above-mentioned nitriding gas brings fully.That is, in the manufacture method of this silicon chip,, contain NH at above-mentioned atmosphere gas owing to remove in the operation at oxide-film
3The time, be removed to thickness less than 2nm to major general's oxide-film, so as the back is narrated, can obtain injecting the effect in room fully fully with residual oxide-film oxynitriding membranization.
Again, the manufacture method of silicon chip of the present invention is in above-mentioned heat treatment step, above-mentioned silicon chip is disposed in the above-mentioned heat treated reative cell of enforcement, after the purified treatment of carrying out oxygen contained in the atmosphere gas in this reative cell is removed, the atmosphere gas that will contain above-mentioned nitriding gas is supplied with in reative cell and is advisable.Promptly, in the manufacture method of this silicon chip, because after the purified treatment of carrying out oxygen contained in the atmosphere gas in the reative cell is removed, the atmosphere gas that will contain nitriding gas is supplied with in reative cell, so the atmosphere gas oxygen-free in the heat treatment can prevent to inject effect owing to surface oxidation suppresses the room.
The manufacture method of silicon chip of the present invention is characterised in that: it has behind above-mentioned heat treatment step, the above-mentioned silicon chip of heat treatment under than the also low temperature of this heat treatment step, when the top layer forms the zero defect layer, in the room of inside, make the treatment process of separating out that oxygen separates out.
Promptly, in the manufacture method of this silicon chip, behind heat treatment step, owing to have heat treatment silicon chip under than the also low temperature of this heat treatment step, when the top layer forms the zero defect layer, make the treatment process of separating out that oxygen separates out in the room of inside, both have the DZ layer that suitable device forms on the top layer so can make, portion has the high-performance silicon chip that has near the high bmd density zone of absorbing effect within it again.
Silicon chip of the present invention is characterised in that: it is the silicon chip that newly forms the room by heat treatment in inside, is to make according to the manufacture method of the silicon chip of the invention described above.Promptly, for this silicon chip, because it is to make according to the manufacture method of the silicon chip of the invention described above, taken place so can both suppress slippage, the heat treatment by thereafter has sufficient DZ layer and has the high-quality wafer of the high bmd density of appropriateness in inside on the top layer again.
Silicon chip of the present invention is characterised in that: it is the silicon chip that newly forms the room by heat treatment in inside, has on the surface to make surfaces nitrided silicon oxynitride film when above-mentioned heat treatment.Promptly, for this silicon chip, owing to have and when heat treatment, make surfaces nitrided silicon oxynitride film, promptly when heat treatment, do not make the silicon oxynitride film that makes its nitrogenize, formation under the situation of the silicon oxide layer such as natural oxide film on surface and oxygen evaporation, so since surfaces nitrided and when the room is injected fully in its inside, the shaggy surface of good roughness of inhibition had.So,, have the wafer of the good DZ layer of surface roughness simultaneously on the top layer if the heat treatment that further enforcement is separated out oxygen to this silicon chip then can access the BMD layer that has high bmd density in inside.
Again, silicon chip employing of the present invention when the top layer forms the zero defect layer, is separated out the technology of oxygen at least in the above-mentioned room of inside.That is, for this silicon chip, because at least when the top layer forms the zero defect layer, in the room of inside, separate out oxygen, so when having the DZ layer that is suitable as nmosfet formation region, have the BMD zone of sufficient bmd density in inside, can access near the effect of absorbing.
Then can reach following effect according to the present invention:
According to the manufacture method and the silicon chip of silicon chip of the present invention,, the atmosphere gas of heat treatment step compares N because containing
2The nitriding gas of the decomposition temperature that the temperature that may decompose is also low is so even compare N
2Also low heat treatment temperature of situation or short heat treatment time, nitriding gas also decomposes and with the silicon chip surface nitrogenize, can inject the room to inside, and the slippage when suppressing heat treatment takes place, simultaneously, in heat treatment thereafter, can access the high-quality wafer that has sufficient DZ layer and have the high bmd density of appropriateness in inside.Be more effective on the wafer of 300mm particularly at the diameter also bigger than 200mm.
Again,, when heat treatment, make surfaces nitrided silicon oxynitride film, so when the room is injected fully in inside, have the shaggy surface of good roughness of inhibition owing to have according to silicon chip of the present invention.So,, have the wafer of the good DZ layer of surface roughness again on the top layer if the heat treatment that further enforcement is separated out oxygen to this silicon chip then can access the BMD layer that both has high bmd density in inside.
The simple declaration of accompanying drawing
Fig. 1 is the general section view that is illustrated in the summary of the heat-treatment furnace in the example of the manufacture method of the silicon chip relevant with the present invention and silicon chip.
Fig. 2 A be illustrated in heat treatment temperature in the example of the manufacture method of the silicon chip relevant and silicon chip and gas flow (slm) with the present invention the time interocclusal record figure.
Fig. 2 B be illustrated in heat treatment temperature in the example of the manufacture method of the silicon chip relevant and silicon chip and gas flow (slm) with the present invention the time interocclusal record figure.
Fig. 3 A is the enlarged cross section figure that is illustrated in the wafer after RTA in the example of the manufacture method of the silicon chip relevant with the present invention and silicon chip handles the back and makes the heat treatment that oxygen separates out thereafter.
Fig. 3 B is the enlarged cross section figure that is illustrated in the wafer after RTA in the example of the manufacture method of the silicon chip relevant with the present invention and silicon chip handles the back and makes the heat treatment that oxygen separates out thereafter.
Fig. 4 A is illustrated in the example of the manufacture method of the silicon chip relevant with the present invention and silicon chip, before and after the RTA when forming silicon oxynitride film on the surface handles and make the enlarged cross section figure of the wafer after the heat treatment that oxygen separates out thereafter.
Fig. 4 B is illustrated in the example of the manufacture method of the silicon chip relevant with the present invention and silicon chip, before and after the RTA when forming silicon oxynitride film on the surface handles and make the enlarged cross section figure of the wafer after the heat treatment that oxygen separates out thereafter.
Fig. 4 C is illustrated in the example of the manufacture method of the silicon chip relevant with the present invention and silicon chip, before and after the RTA when forming silicon oxynitride film on the surface handles and make the enlarged cross section figure of the wafer after the heat treatment that oxygen separates out thereafter.
Fig. 5 is a blank of representing to form than when critical point is above based on the theoretical V/G of the bright koff of ripple (ボ ロ Application コ Off) rich room, and V/G forms the blank of rich gap silicon than when critical point is following, and ideal zone is the 1st critical ratio ((V/G)
1) above, the 2nd critical ratio ((V/G)
2) following figure.
Fig. 6 is the figure that is illustrated in the relation of heat treatment temperature among the embodiment of the manufacture method of the silicon chip relevant with the present invention and silicon chip and bmd density.
Fig. 7 is the figure that is illustrated in the relation of heat treatment temperature among the embodiment of the manufacture method of the silicon chip relevant with the present invention and silicon chip and DZ width.
Fig. 8 is the figure of the relation of heat treatment temperature when to be illustrated in heat treatment temperature among the embodiment of the manufacture method of the silicon chip relevant with the present invention and silicon chip be 1100 ℃ and 1150 ℃ and bmd density.
Fig. 9 is the figure of the slip length among the embodiment when being illustrated in the example always of the manufacture method of the silicon chip relevant with the present invention and silicon chip and changing heat treatment temperature.
Figure 10 A is among the embodiment when being illustrated in the example always of the manufacture method of the silicon chip relevant with the present invention and silicon chip and forming silicon oxynitride film, by from the surface to the analysis result figure of the element measure of spread gained of depth direction.
Figure 10 B is among the embodiment when being illustrated in the example always of the manufacture method of the silicon chip relevant with the present invention and silicon chip and forming silicon oxynitride film, by from the surface to the figure of the analysis result of the element measure of spread gained of depth direction.
Detailed description of the invention
Following one side is referring to Fig. 1 to Fig. 5, on one side the manufacturing side of the explanation silicon chip relevant with the present invention An example of method and silicon chip.
Fig. 1 is the heat treatment that is expressed as the one chip of the manufacture method of implementing silicon chip of the present invention Stove. This heat-treatment furnace has the circular receptor 1 that can place silicon chip W as shown in Figure 1 With the reative cell 2 that this receptor 1 is contained in inside. Again, the exterior arrangement at reative cell 2 adds The kerosene lamp of hot silicon chip W (diagram slightly).
Designed the supply port 2a that supplies with atmosphere gas G to the surface of silicon chip W at reative cell 2 Outlet 2b with the atmosphere gas G discharge that will supply with.
Again, supply port 2a is connected with the supply source (diagram slightly) of atmosphere gas G.
Atmosphere gas G compares N2The temperature that may decompose is the nitriding gas of low decomposition temperature also, for example NH3、NO、N
2O、N
2O
2, hydrazine, dimethyl hydrazine etc. and mist or their nitriding gas and Ar (argon), N2(nitrogen), O2(oxygen), H2The mixing of (hydrogen) etc. Gas. Moreover, in this example, use with NH3Be main atmosphere gas G.
Below process (heat to using this heat-treatment furnace in atmosphere gas, silicon chip W to be carried out RTA Process), newly form the method in room in inside, further be implemented in the top layer shape of this wafer W Become the DZ layer, the heat-treating methods that forms simultaneously the BMD layer in inside is illustrated.
At first, before the RTA that injects the room processes, in advance will be on the surface of silicon chip W The natural oxide film that forms and because oxide-film removal or the filming that other processing etc. cause Be advisable. That is, with the silicon chip W before the clean heat treatments such as fluoric acid, remove in advance the oxide-film on surface. At this moment, remove at least oxide-film to the not enough 2nm of thickness. Moreover natural oxide film is not enough 2nm Thickness the time, as the back is narrated, can not carry out especially the oxide-film Transformatin.
Process (anxious in order to utilize this heat-treatment furnace that silicon chip W is implemented heat treatment, particularly RTA Heat and the heat treatment of chilling), behind receptor 1 placement silicon chip W, from supply port 2a Under the state that above-mentioned atmosphere gas G is supplied with to the surface of silicon chip W, with from 900 ℃ to 1200 ℃ the heat treatment temperature of scope, and the following heat treatment time of 60sec carries out the short time The heat treatment of Fast Heating, chilling (for example 50 ℃/second intensification or cooling). Moreover, should Heat treatment is included in the peak value annealing of above-mentioned lower short time of heat treatment temperature (not enough 1sec).
So long as in the scope of this heat treatment temperature and heat treatment time, then suppress reliably sliding When moving generation, the 2 step heat treatments thereafter according to narrating later can access fully DZ layer and bmd density. Moreover, in this example, be more suitable for suppressing the slippage generation Condition, from 900 ℃ to 1180 ℃ heat treatment temperature and the heat treatment time below the 30sec Under carry out RTA and process.
Moreover, in above-mentioned heat treatment, for example shown in Fig. 2 A and Fig. 2 B, at first proceed to Before 800 ℃ the intensification, only supply with Ar as atmosphere gas with high flow, to replace the heat place Manage the atmosphere gas in the stove, remove the purified treatment of oxygen. Remove in the stove fully at oxygen Under the state, Yi Bian and then only supply with Ar as atmosphere gas to set flow, Yi Bian rise Temperature is to 800 ℃.
Secondly, with the flow that sets with NH3Import heat-treatment furnace, on one side supply with Ar and NH as atmosphere gas3Mist, Yi Bian carry out from 800 ℃ to fixed heat treatment temperature (example Such as 1180 ℃) Fast Heating heat up, in the constant situation of this heat treatment temperature, carry out institute The heat treatment of the time of setting, and then be quenched to 800 ℃.
Then, in 800 ℃ of constant situations, improve flow as atmosphere gas and only supply with Ar until discharge NH fully3, after discharge is over, again in the atmosphere gas that Ar is only arranged, lower the temperature. Like this, midway, above-mentioned as the atmosphere gas supply during midway lower the temperature to chilling when heating up The nitriding gas of low decomposition temperature. Moreover, make to import NH3The time heat treatment temperature be and heat place The identical temperature (800 ℃) of temperature during the reason after-purification is the burden for alleviator.
Moreover, after the above-mentioned heat treatment, carry out chilling but by taking out wafer W from heat-treatment furnace. Chilling effect when the heat treatment when at this moment, utilizing above-mentioned purification (800 ℃) and taking-up can Eliminate inner oxygen alms giver.
Adopt above-mentioned heat treatment, even under the heat treatment temperature lower than the past, at silicon chip W The surface on nitriding gas also decompose fully and with surfaces nitrided, namely form nitride film, such as figure Shown in the 3A, can inject fully room (Vacancy) V to inside.
Further, after above-mentioned heat treatment (RTA processing), implement heat treatment (for example, 800 ℃ of lower heat treatment of 4 hours, N being lower than under this heat treated temperature with heat-treatment furnace etc.2/O
2Atmosphere), so that oxygen separates out to room V, shown in Fig. 3 B, owing to follow the room on the top layer Form to external diffusion and oxide-film, the injection of gap Si causes room and gap Si to support in pairs Disappear, thus when the top layer forms DZ layer DZ, separate out the stable of nuclear for seeking oxygen, by Further implement long heat treatment (for example carrying out 1000 ℃ of lower heat treatments of 16 hours), Carry out the growth of precipitate, form the BMD layer BMD of high bmd density in inside.
Moreover, do not make especially this heat treatment that above-mentioned DZ layer forms or oxygen is separated out, can Follow element manufacturing operation thereafter, in the heat treatment of carrying out, carry out.
Like this, in this example, because atmosphere gas G compares N2The temperature that may decompose is the NH of low decomposition temperature also3Deng nitriding gas, so can seek heat in RTA processes The low temperature for the treatment of temperature, the slippage in the time of can suppressing heat treatment takes place.
Again, owing to use with NH
3Be main atmosphere gas G, NH
3The H that decompose to produce has the cleaning performance of the natural oxide film of removing silicon chip W surface etc., so, more promote the nitrogenize on surface and the injection of room V.Again, NH
3Have the effect that makes the oxide-film nitrogenize, can promote the injection of room V.
Further, in this example, in 900 ℃ to 1200 ℃ temperature range, heat-treating, this heat treatment time is 60 seconds (sec) following time, so when suppressing the slippage generation, can inject room V fully, can access an amount of BMD layer.
Again, as the past, in surpassing 1200 ℃ high-temperature heat treatment, being called as Fu Lunkeer in crystallization takes place simultaneously to the room (Vacancy) and the gap Si of (Off レ Application ケ Le ペ ア), handle the room and the gap Si that are injected by RTA and offset in pairs, be actually the density of separating out the room of contributing and reduce.In contrast, in this example, because at Fu Lunkeer few low temperature being taken place (Off レ Application ケ Le ペ ア) promptly heat-treats below 1200 ℃, so the gap Si that forms in crystallization is few, room V and gap Si that nitride film by the surface injects can not offset in pairs, when can improving injection efficiency, can deeper inject than the past to inside.
Again, before RTA handles, because the oxide-film on silicon chip W surface is removed or filming, so the oxide-films such as natural oxide film on wafer W surface remove fully or largely removed state under carry out RTA and handle, the nitrogenize and the room that can prevent the wafer W surface that oxide-film obstruction nitriding gas brings are injected, and effective room is injected becomes possibility.Moreover, owing to be removed to the not enough 2nm of thickness to major general's oxide-film, so can utilize NH
3Cleaning performance or nitriding result remaining oxide-film is removed or the oxynitriding membranization, can access the effect of abundant injection room V.
Further after RTA heat treatment, be lower than under this heat treated temperature, with silicon chip W heat treatment, when the top layer forms DZ layer DZ, oxygen is separated out to the room of inside V, form BMD layer BMD, so, can be manufactured on the top layer and have the DZ layer DZ that is suitable for device formation, have the high function silicon chip that has near the BMD layer BMD of the high bmd density of absorbing effect simultaneously in inside.
Moreover technical scope of the present invention is not limited to the form of above-mentioned enforcement, and various changes is possible in addition in the scope that does not break away from aim of the present invention.
For example, in above-mentioned example, reduced heat treatment temperature than past, even but with used atmosphere gas N of past
2The same high heat treatment temperature also can be formulated and compare N
2The also short heat treatment time of situation, at this moment also the same with the situation that reduces heat treatment temperature, can alleviate slippage significantly.
Again, the above-mentioned nitriding gas of plasma is also passable as atmosphere gas.At this moment, because above-mentioned nitriding gas is by plasma, activation, so can promote the nitrogenize on surface and the injection in room more.
Again, when atmosphere gas is a mist more than three kinds, as long as wherein more than one are NH
3Just can Deng nitriding gas.
Again, when atmosphere gas is a mist more than two kinds, contained nitriding gas more than 0.5% or more than the 10sccm and the amount of getting the few side of absolute magnitude for well.That is, be reaction rate at the nitridation reaction of this scope, if contain the gas of the above nitriability of this minimum, be identical then at the formed nitride film thickness of wafer surface, the atom vacancy concentration that is consequently imported is identical, and the amount of separating out is identical.Moreover when in 0.05% above less than 0.5% or above 1sccm and the scope below 10sccm, if same temperature and time, then the nitrogenize thickness changes the nitrogenize amount according to the dividing potential drop of nitrogen.So this zone is a diffusion rate, can control the amount of separating out according to the nitrogen amount.
Again, the pressure of above-mentioned atmosphere gas can be arbitrary state of decompression, normal pressure or pressurization.
Be with Si according to above-mentioned example at the formed nitride film of wafer surface, oxynitride film (silicon oxynitride film) again,
3N
4Si for representative
XN
yDuring with the oxide-film nitrogenize, form with Si again,
2N
2O is the Si of representative
2N
xO
41.5xPromptly form silicon oxynitride film.This silicon oxynitride film is the product that makes natural oxide film, chemical oxide film or heat oxide film nitrogenize.
Again, these nitride films also can contain hydrogen in film.
Moreover in above-mentioned example, the silicon chip surface before the heat treatment forms natural oxide film sometimes, but if the oxide-film of natural oxide film degree then as above-mentioned, utilizes NH
3Nitrogenize Deng cleaning performance and oxide-film can access sufficient room injection effect.
, when utilizing NH
3Before the heat treatment etc. above-mentioned nitriding gas, adopt oxygen containing atmosphere gas etc. to heat-treat, when silicon chip surface forms, just can not fully obtain NH than the also thick oxide-film of natural oxide film
3Inject effect etc. the room that surfaces nitrided effect brings.Its reason is: because the thickness of oxidation film on surface, so even adopt NH
3Heat-treat Deng atmosphere gas, the nitride film (containing oxynitride film) that may have good room injection effect can not form on the Si surface.
So, in this example, utilize NH
3Before the heat treatment etc. above-mentioned nitriding gas, on silicon chip, form oxide-film energetically, or it is bad to resemble the treatment process of heat-treating in oxygen containing atmosphere gas before this heat treatment than autoxidation thickness.Again, in this example, with NH
3, before supplying with, reative cell carries out the purified treatment operation that oxygen contained in the atmosphere gas is removed is advisable etc. above-mentioned nitriding gas.
Moreover, below illustrated utilizing above-mentioned RTA to handle the situation that forms above-mentioned silicon oxynitride film referring to Fig. 4 A～4C.
Silicon chip W before the heat treatment forms natural oxide film (silicon oxide layer) SO on the surface shown in Fig. 4 A, do not implement oxide-film especially and remove processing.Under this state, carry out above-mentioned RTA and handle, natural oxide film SO and silicon when the surface utilize NH
3And during nitrogenize, then shown in Fig. 4 B, when the room is injected in inside, form silicon oxynitride film SNO on the surface.
In this silicon chip, owing to have and when heat treatment, make its surfaces nitrided oxynitride film, the silicon oxynitride film SNO that promptly when heat treatment, makes the natural oxide film SO nitrogenize on surface and form, so fully inject room V by the nitrogenize on surface to inside, have the shaggy surface of good roughness of inhibition simultaneously.Therefore,, then shown in Fig. 4 C, can access the BMD layer BMD that has high bmd density in inside, have the wafer of the good DZ layer DZ of surface roughness simultaneously on the top layer if this silicon chip is further applied the heat treatment that oxygen is separated out.
Again, in above-mentioned example, use the silicon chip that cuts from the blank that adopts common CZ method pulling growth, but adopt the silicon chip of blank of the CZ method pulling growth of taking from other also passable.For example, as above-mentioned silicon chip, the zone that will exist on the silicon type point defect mastery ground, gap in the silicon single crystal blank is as [I], the zone that room type point defect mastery ground is existed is as [V], with the non-existent ideal zone of agglutination body of the agglutination body of gap silicon type point defect and room type point defect during, use the silicon chip of the agglutination body that does not have point defect that cuts from the blank that constitutes by ideal zone [P] also passable as [P].Moreover room type point defect is the defective that a silicon atom causes from normal one room that break away to form in silicon crystal lattice, and again, the gap silicon point defect is meant the defective when atom is positioned at position (intermediate space point) beyond the lattice-site of silicon wafer.
Promptly, the silicon chip that is made of this ideal zone [P] for example opens as the spy that flat 1-1393 communique proposed, utilize the CZ method with based on the melted silicon drawing blank of the theoretical draw rate scope of the bright koff of ripple (Voronkov) in the hot-zone, this blank cutting is made.This blank is designated as V (mm/ branch) with draw rate, the temperature gradient of the blank vertical direction of the melted silicon that will be in crucible and the near interface of blank be designated as G (℃/mm) time, determine V/G (mm
2/ minute ℃) value after make so that when carrying out thermal oxidation, produce OSF (the Oxidation Induced Stacking Fault of ring-type; Oxidation induced fault defective) disappears in center wafer portion.
In the bright koff of above-mentioned ripple (ボ ロ Application コ Off) theory, as shown in Figure 5, getting V/G is transverse axis, gets room type point defect concentration and gap silicon type defect density is the same longitudinal axis, the relation of diagram performance V/G and point defect concentration, the border of this explanation null region and gap silicon area determines according to V/G.In more detail,, form the dominant blank of room type point defect concentration, on the contrary,, form the dominant blank of gap silicon type point defect concentration when V/G compares when critical point is above when V/G compares when critical point is above.In Fig. 5, [I] expression gap silicon type point defect is zone ((V/G) overriding, that gap silicon type point defect exists
1Below), the room type point defect that [V] is illustrated in the blank is the zone ((V/G) that agglutination body overriding, room type point defect exists
2Below), the agglutination body of [P] expression room type point defect and the non-existent ideal zone of agglutination body ((V/G) of gap silicon type point defect
1～(V/G)
2).With the zone [V] of zone [P] adjacency in exist to form the zone [OSF] ((V/G) that OSF examines
2～(V/G)
3).
So, the draw rate scope dictates of blank that offers silicon chip is as follows: promptly, when the melted silicon of blank in the hot-zone draws, with respect to the ratio (V/G) of the draw rate of temperature gradient the 1st critical ratio (V/G) in the generation of the agglutination body that prevents gap silicon type point defect
1More than, maintain regional the 2nd critical ratio ((V/G) that the agglutination body of room type point defect is limited to the room type point defect mastery ground existence of the central authorities that are positioned at blank
2) below.
The scope of this draw rate is determined based on the bright koff of above-mentioned ripple is theoretical by experiment type standard blank is cut and simulation at direction of principal axis.
Like this, the silicon chip of making in ideal zone [P] is the flawless wafer that does not have OSF, COP etc., but conversely, the IG effect is low, so, if implement the heat treatment of above-mentioned example, then can form highdensity BMD layer fully, can possess near the effect of absorbing in inside.
Moreover the agglutination body of point defects such as COP shows the detection sensitivity sometimes, detects the different value of lower limit according to the difference of detection method.Therefore, in this manual, the meaning of " agglutination body of point defect does not exist " is meant: with the silicon single crystal of mirror finish apply do not have the Seco of stirring corrosion after, when utilizing light microscope that viewing area and etch pit long-pending observed as detection volume, each agglutination body that defective stream (vacancy-like defects) and dislocation are gathered (gap silicon type point defect) is with respect to 1 * 10
-3Cm
3The inspection volume, the situation that detects 1 defective is decided to be and detects lower limit (1 * 10
3Individual/cm
3) time, the number of the agglutination body of point defect is below above-mentioned detection lower limit.
Embodiment
Specifically describe the manufacture method and the silicon chip of the silicon chip relevant with the present invention below in conjunction with embodiment.
Based on above-mentioned example, Fig. 6 illustrates as the actual respectively NH of making of atmosphere gas
3/ Ar:2SLM/2SLM, NH
3The heat treatment temperature (annealing temperature) of the situation that/N2:2SLM/2SLM flows and the relation of bmd density.In addition, similarly, Fig. 7 illustrates as the actual respectively NH of making of atmosphere gas
3/ Ar:2SLM/2SLM, NH
3The heat treatment temperature of the situation that/N2:2SLM/2SLM flows and the relation of DZ width.Moreover, same with the past as a comparison, make N as atmosphere gas
2: the situation that 4SLM flows is also illustrated.By Fig. 6 and Fig. 7 as can be known, containing NH as atmosphere gas
3Heat treatment of the present invention in, even under low heat treatment temperature, also can obtain the bmd density higher, simultaneously can obtain sufficient DZ width with practical value than the past.
Again, Fig. 8 illustrates as atmosphere gas at NH
3Under the condition of/N2:2SLM/2SLM, the heat treatment time (annealing time) when heat treatment temperature is 1100 ℃ and 1150 ℃ and the relation of bmd density.As shown in Figure 8, in identical heat treatment time, 1150 ℃ the situation of situation than 1100 ℃ of high temperature can also obtain high bmd density.Again, the short heat treatment time of the difference of its effect is remarkable more.
Moreover, utilize other various conditions to experimentize, the result as can be known: even under the temperature lower, also can obtain sufficient bmd density, simultaneously than the past according to the present invention, even change the flow-rate ratio of above-mentioned nitriding gas in atmosphere gas in the present invention, bmd density also less changes.Further distinguish: in the present invention, when improving cooling rate, then separate out more and increase.
Again as can be known: for slip length, heat treated aspect at low temperatures is short, and simultaneously, the aspect that cooling rate is high is short.Again, as the situation of the atmosphere gas that contains ammonia, its slip length weak point of aspect that ammonia is fewer.Can think: this is owing to when ammonia decomposes, the few cause of thermal conductivity ratio higher H (hydrogen).Therefore, under lower temperature and use the atmosphere gas contain the few ammonia of flow-rate ratio to heat-treat, if with higher cooling rate cooling, then slippage is more suppressed, and can access sufficient bmd density.
Fig. 9 is and past method (N
2/ Ar, 1220 ℃) compare, at the present invention (NH
3/ reduce heat treatment temperature in Ar), in order to clearly illustrate the effect of slippage, and the figure of the slip length of measuring by the fulcrum vestige when on quartzy fulcrum, keeping wafer.Slip length is to obtain by the largest interval that the Seco corrosion measurement forms the dislocation pit behind the 13 μ m off.Can know: in the method, be the slippage of elongation 3mm, but be below the 0.4mm in the present invention in the past.In time below 1130 ℃ is 0, and slippage can reduce significantly.
Again, for implementing with N
2/ Ar is as the situation of the RTA processing in the past of atmosphere gas use with based on the situation of above-mentioned example at surface formation silicon oxynitride film, and Figure 10 A and 10B illustrate the result of the composition of the analytic approach actual analysis surface reaction film that utilizes XPS and sputter combination.By this analysis result as can be known, always Li situation is not almost measured oxygen on the surface shown in Figure 10 A, only measured silicon and nitrogen, on the contrary, for embodiment based on this example, shown in Figure 10 B, be detected under same level at surperficial oxygen and nitrogen, form silicon oxynitride film.
Claims (8)
1. the manufacture method of a silicon chip, it is characterized in that: have heat treatment silicon chip in atmosphere gas, newly form the heat treatment step in room in inside, the above-mentioned atmosphere gas of above-mentioned heat treatment step contains nitriding gas, and described nitriding gas is NH
3, NO, N
2O, N
2O
2, hydrazine or dimethyl hydrazine, before above-mentioned heat treatment step, have and the oxide-film of above-mentioned silicon chip surface removed or the oxide-film of filming is removed operation.
2. the manufacture method of the silicon chip of putting down in writing according to claim 1, it is characterized in that: in the manufacture method of this silicon chip, above-mentioned nitriding gas contains NH
3
3. the manufacture method of the silicon chip of putting down in writing according to claim 2 is characterized in that: in the manufacture method of this silicon chip, make the NH of above-mentioned nitriding gas
3Flow more than 10sccm.
4. the manufacture method of the silicon chip of putting down in writing according to claim 1, it is characterized in that: in the manufacture method of this silicon chip, above-mentioned nitriding gas is by plasma.
5. the manufacture method of the silicon chip of putting down in writing according to claim 1, it is characterized in that: in the manufacture method of this silicon chip, above-mentioned heat treated temperature is the temperature from 900 ℃ to 1200 ℃, and above-mentioned heat treatment period is below the 60sec.
6. the manufacture method of the silicon chip of putting down in writing according to claim 1, it is characterized in that: in the manufacture method of this silicon chip, above-mentioned oxide-film is removed operation and contain NH in above-mentioned atmosphere gas
3The time, be removed to the not enough 2nm of oxide-film thickness to the above-mentioned oxide-film of major general.
7. the manufacture method of the silicon chip of putting down in writing according to claim 1, it is characterized in that: in the manufacture method of this silicon chip, above-mentioned heat treatment step is disposed at above-mentioned silicon chip and implements in the above-mentioned heat treated reative cell, after the purified treatment of carrying out oxygen contained in the atmosphere gas in this reative cell is removed, the atmosphere gas that will contain above-mentioned nitriding gas is supplied with in reative cell.
8. the manufacture method of the silicon chip of putting down in writing according to claim 1, it is characterized in that: in the manufacture method of this silicon chip, behind above-mentioned heat treatment step, have under above-mentioned wafer heat than the also low temperature of this heat treatment step, when the top layer forms the zero defect layer, in the room of inside, make the treatment process of separating out that oxygen separates out.
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| JP2000360913 | 2000-11-28 | ||
| JP360913/00 | 2000-11-28 | ||
| JP2001139216 | 2001-05-09 | ||
| JP139216/01 | 2001-05-09 | ||
| JP2001291145A JP4720058B2 (en) | 2000-11-28 | 2001-09-25 | Silicon wafer manufacturing method |
| JP291145/01 | 2001-09-25 |
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| Publication Number | Publication Date |
|---|---|
| CN1356720A CN1356720A (en) | 2002-07-03 |
| CN1237585C true CN1237585C (en) | 2006-01-18 |
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| CNB011424249A Expired - Fee Related CN1237585C (en) | 2000-11-28 | 2001-11-28 | Process for preparing silicon chip and silicon chip thereof |
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|---|---|
| US (2) | US7521381B2 (en) |
| EP (1) | EP1345262B1 (en) |
| JP (1) | JP4720058B2 (en) |
| KR (1) | KR100707728B1 (en) |
| CN (1) | CN1237585C (en) |
| TW (1) | TW546741B (en) |
| WO (1) | WO2002045149A1 (en) |
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| TWI311781B (en) * | 2004-02-16 | 2009-07-01 | Sharp Kabushiki Kaish | Thin film transistor and method for manufacturing same, display device, method for modifying oxidized film, method for forming oxidized film, semiconductor device and method for manufacturing same, and apparatus for manufacturing semiconductor device |
| JP4617751B2 (en) * | 2004-07-22 | 2011-01-26 | 株式会社Ｓｕｍｃｏ | Silicon wafer and manufacturing method thereof |
| JP4711167B2 (en) * | 2004-08-25 | 2011-06-29 | 信越半導体株式会社 | Manufacturing method of silicon epitaxial wafer |
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| JP4743010B2 (en) * | 2005-08-26 | 2011-08-10 | 株式会社Ｓｕｍｃｏ | Silicon wafer surface defect evaluation method |
| JP2007194232A (en) * | 2006-01-17 | 2007-08-02 | Shin Etsu Handotai Co Ltd | Process for producing silicon single crystal wafer |
| JP4853027B2 (en) * | 2006-01-17 | 2012-01-11 | 信越半導体株式会社 | Method for producing silicon single crystal wafer |
| JP2008053521A (en) | 2006-08-25 | 2008-03-06 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Heat treatment method of silicon wafer |
| JP2008294245A (en) * | 2007-05-25 | 2008-12-04 | Shin Etsu Handotai Co Ltd | Method of manufacturing epitaxial wafer, and epitaxial wafer |
| JP2010028065A (en) * | 2008-07-24 | 2010-02-04 | Sumco Corp | Method for manufacturing silicon wafer |
| JP2010109100A (en) * | 2008-10-29 | 2010-05-13 | Shin Etsu Handotai Co Ltd | Method of manufacturing silicon wafer |
| KR101565794B1 (en) * | 2008-12-16 | 2015-11-05 | 삼성전자주식회사 | Silicon substrate capable of improving gettering effect and silicon wafer thereof method of heating silicon wafer |
| JP5434239B2 (en) * | 2009-04-30 | 2014-03-05 | 株式会社Ｓｕｍｃｏ | Silicon wafer manufacturing method |
| KR20120023056A (en) * | 2009-05-15 | 2012-03-12 | 가부시키가이샤 사무코 | Silicon wafer and method for producing the same |
| JP5583070B2 (en) * | 2011-04-27 | 2014-09-03 | グローバルウェーハズ・ジャパン株式会社 | Heat treatment method for silicon wafer |
| US9945048B2 (en) * | 2012-06-15 | 2018-04-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor structure and method |
| DE102014208815B4 (en) * | 2014-05-09 | 2018-06-21 | Siltronic Ag | Process for producing a semiconductor wafer made of silicon |
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-
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- 2001-09-25 JP JP2001291145A patent/JP4720058B2/en not_active Expired - Lifetime
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| KR20020041754A (en) | 2002-06-03 |
| KR100707728B1 (en) | 2007-04-16 |
| US7670965B2 (en) | 2010-03-02 |
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| EP1345262A4 (en) | 2007-09-05 |
| JP2003031582A (en) | 2003-01-31 |
| US7521381B2 (en) | 2009-04-21 |
| CN1356720A (en) | 2002-07-03 |
| JP4720058B2 (en) | 2011-07-13 |
| EP1345262B1 (en) | 2016-04-20 |
| TW546741B (en) | 2003-08-11 |
| US20050130452A1 (en) | 2005-06-16 |
| US20040053516A1 (en) | 2004-03-18 |
| EP1345262A1 (en) | 2003-09-17 |
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