CN1231764A - Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same - Google Patents
Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same Download PDFInfo
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- CN1231764A CN1231764A CN 97198319 CN97198319A CN1231764A CN 1231764 A CN1231764 A CN 1231764A CN 97198319 CN97198319 CN 97198319 CN 97198319 A CN97198319 A CN 97198319A CN 1231764 A CN1231764 A CN 1231764A
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Abstract
An epoxy resin sealing material used for molding a semiconductor chip by means of a transfer molding machine. This material is composed of an epoxy resin,a curing agent, an inorganic filler, and a mold release agent. This material is granulated and =99 wt.% of the material is composed of particles having particle sizes of 0.1-5.0 mm, with the remaining wt.% being fine particles of <0.1mm in particle size. This material has an angle of repose of 20 to 40 and exhibits such excellent fluidity that the material does not cause clogging in the transferring route to the mold cavity of the transfer molding machine and an excellent sealing performance. This material is manufactured in such a way that a B-stage half-cured material is first obtained by kneading a sealing composition containing the above-mentioned components and half-curing the kneaded product. Then the half-cured product is crushed into particles of mm in dimaeter. The particles contain particles having particle sizes of 0.1-5.0 mm and fine particles having particle sizes of <0.1mm and the fine particles arecaught in the melt phase of the resin component by melting the resin component of the epoxy sealing composition on the surfaces of the particles by unceasingly moving the particles. Then the above-mentioned granular epoxy resin sealing material coated with resin layers containing the fine particles is obtained by drying the melt phase. Therefore, the resin layers are formed on the surfaces of particles having particle sizes of 0.1-5.0 mm and fine particles having particle sizes <0.1mm are contained in the resin layers.
Description
Background technology
Invention field
The invention relates to a kind of epoxy resin enclosed material and manufacture method thereof of packaged semiconductor.
The narration of technology in the past
Sealing of semiconductor chip used what is called by a kind of epoxy resin, and the sheet grain of the encapsulation compositions that a kind of curing agent and a kind of inorganic filler are formed is made by the transfer molding method.The manufacturing step of this grain is: mediate encapsulation compositions and be processed into sheet or the semi-solid preparation body of strip, solid is ground into particle then is compacted into cylindric.Such sheet grain is imported in a kind of groove of transfer molding device and is pushed into a die cavity, and they are molded around chip there.Recently there is the transfer molding device that proposes with a kind of multiple-grooved to improve and seals quality, wherein, have the compound groove that has shortened towards the runner of die cavity and can once seal a plurality of semiconductor chips.When the groove number increased, the size of sheet grain certainly will will be dwindled so that the sheet grain of enough numbers is all arranged in each groove.At this on the one hand, the pulverized particles with encapsulation compositions has been subjected to attention before being compacted grain in blocks.
Yet the particle after the semi-solid preparation epoxy composite is pulverized must contain some particulate, and they stop up probably to seal and expect to supply with the passage of transfer molding device metering section and their are supplied with the passage of groove.Thereby give die cavity under feeding and cause seal bad.These particulates have the tendency that sticks on the bulky grain, and they are difficult to be sized, and with particle input slot and/or die cavity the time, but easily fall down owing to loosening from particle.Moreover under vibration, the corner of particle easily breaks up how new particulate again.
Even use the sheet grain, when input slot and/or die cavity, loosening particulate will be fallen down from the sheet grain, cause the undesirable passage that leads to die cavity to stop up.
In view of the above problems, have and to provide the graininess epoxy that successfully to avoid material in transfer molding device passage, to stop up to seal material.
Summary of the invention
The present invention has solved the problems referred to above, and it provides a kind of epoxy resin enclosed material and manufacture method thereof of improved packaged semiconductor.Composition according to epoxy resin enclosed material of the present invention is a kind of epoxy resin, a kind of curing agent, a kind of inorganic filler and a kind of release agent and form less than the particulate of 0.1mm at the particle and the diameter below the 1 weight % of 0.1 to 5.0mm scope by the diameter more than the 99 weight %.The feature of this epoxy resin enclosed material is to show one 20 ° to 40 ° slide angle, and this represents that its flowability is good, can not stop up the passage that leads to die cavity, thus the improvement that quality is sealed in assurance.When the particle that is higher than 1 weight % or diameter 0.1 to 5.0mm less than the fraction of particle of 0.1mm when diameter was less than 99 weight %, this material just may blocking channel.Equally, use slide angle greater than 40 ° material, also may blocking channel.Though the preparation slide angle is less than 20 ° seal also to do and obtain, this preparation needs long time, does not gear to actual circumstances from economic angle.
This epoxy resin enclosed material is like this preparation: at first will have the encapsulation compositions of mentioned component to be kneaded into the semi-solid preparation attitude on a kind of B-rank; This semi-solid preparation body is ground into the following particle of diameter 5.0mm subsequently, and this particle is made up of less than the particulate of 0.1mm the particle and the diameter of diameter 0.1 to 5.0mm; Then do not stop transport down moving, heating make particle surface the resinous principle fusing of sealing material and with those micro particle catchings to the resin of fusion mutually in; Last fusion is solidified mutually and is obtained a kind of epoxy resin enclosed pellet that is being coated with the resin bed that contains particulate.In this case, form diameter 0.1 to 5.0mm and in resinous coat, captured the particle of diameter less than the particulate of 0.1mm.The epoxy resin enclosed material of particulate be can successfully can not prepare with this method, above distribution of sizes and slide angle requirement satisfied.
In a preferred embodiment, particle under agitation is heated so that melt in the encapsulation compositions resinous principle on whole particle surfaces effectively and prevent to form unsuitable bulk, thereby helps the uniform epoxy resin enclosed material of preparation size.
Also have, make before resin is coated in particle surface in heating, preferably add water in crushed material do preliminary treatment so that particle surface by water-wet.This preliminary treatment has been arranged, and particulate was bonded on the particle surface before resinous principle is fused into fusion mutually easily, became trapped in the fusion mutually and went thereby help next step.
When impelling their agglomeration, a collection of particle of stirring can add a kind of solvent or wetting agent.Solvent be selected from a kind of can the dissolved particles surface in the encapsulation compositions resinous principle go adsorbent particles with wetting surface, wetting agent be too for wetting particle surface with adsorbent particles thereon and comprise at least a in following one group: a kind of epoxy resin, a kind of curing agent, a kind of release agent and a kind of surfactant, each in them can be identical with the composition in the epoxy encapsulation compositions or inequality.With release agent as wetting agent by preferably, because favourable to encapsulating operation.
These and other purposes of the present invention and favorable characteristics can and obtain in conjunction with the accompanying drawings more clearly understanding from following detailed description of the present invention and embodiment.
The summary of accompanying drawing
Fig. 1. be used to prepare the schematic diagram of the blender of epoxy resin enclosed material according to the present invention;
Fig. 2. be used to prepare the schematic diagram of the fluidizer of epoxy resin enclosed material according to the present invention.
Realize optimal mode of the present invention
Epoxy resin enclosed material of the present invention is graininess, is used for by the transfer molding packaged semiconductor. This encapsulating material is to comprise a kind of epoxy resin by one, a kind of curing agent, the encapsulation compositions preparation of a kind of releasing agent and a kind of inorganic filler. In addition, this composition can also comprise a kind of curing accelerator if necessary, a kind of surfactant, a kind of silane coupling agent, a kind of colouring agent, a kind of stress relaxation agent and a kind of flame retardance.
Epoxy resin comprises o-cresol-novolac epoxy resin, bisphenol-A type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, open chain aliphatic epoxy resin, alicyclic type epoxy resin and heterocyclic-type epoxy resin. Indivedual epoxy resin can be separately with or share.
Curing agent comprises phenol-linear phenol-aldehyde resin and its derivative, cresols-linear phenol-aldehyde resin and its derivative, monohydroxy or dihydroxy naphthlene-phenolic resins and derivative thereof, the condensation product of paraxylene and phenol or naphthols, phenol-ing fixed agent is such as the copolymer of dicyclopentadiene and phenol, amine hardener or acid anhydrides. Indivedual curing agent can be separately with or share. Phenol-linear phenol-aldehyde resin is preferred because reducing the hygroscopicity quilt that solidifies rear resin. The blending amount of curing agent is 0.1 to 10 times with respect to the epoxy resin equivalent.
Releasing agent comprises aliphatic acid, such as stearic acid, and montanic acid, palmitic acid, oleic acid, flaxseed acid; The salt of aliphatic acid such as calcium salt, magnesium salts, aluminium salt and zinc salt; The acid amides of aliphatic acid; Phosphate, polyethylene, bisamide, carboxylic polyolefin and natural CARNAUBA WAX. Contain that releasing agent enables to use to semiconductor chip and/or lead frame (lead frame) but resin that the very strong epoxy resin of viscous force has guaranteed to solidify can take out from the mould of metastasis model device and/or stamping.
Inorganic filler comprises the silica of crystallization, fused silica, aluminium oxide, magnesia, titanium oxide, calcium carbonate, magnesium carbonate, silicon nitride, talcum and calcium nitrate. Inorganic filler can be separately with or share. Use crystallization or fused silica to be conducive to the linear expansion coefficient of the epoxy resin after solidifying is reduced near semiconductor chip. The preferred content of inorganic filler is that in per 100 parts of total amounts 60 to the 95 parts heat that apply during with the semiconductor chip that reduces hygroscopicity and guarantee welding is sealed have remarkable heat resistance. Inorganic filler selects to have average diameter 0.5 to 50 μ m.
Curing accelerator comprises 1,8 diazonium-dicyclo (5,4,0) hendecene-7, the tertiary amine compound is such as triethylenediamine and benzyl dimethylamine, and imidazolium compounds is such as glyoxal ethyline, 2-ethyl-4-methylimidazole, 2-phenylimidazole and 2-phenyl-4-methylimidazole, organic phosphorus compound is such as triphenylphosphine and tributylphosphine.
Silane coupling agent comprises that epoxy silane such as γ-glycidol oxygen propyl trimethoxy silicane and amino silane are such as N-phenyl-γ-An Bingjisanjiayangjiguiwan.
Surfactant comprises cithrol, the glycerine-acid esters of sorbitan fatty acid ester and aliphatic acid.
Colouring agent comprises carbon black and titanium oxide.
Stress relaxation agent comprises silicon gel, silicon rubber and silicone oil.
Flame retardance comprises titanium dioxide two antimony, halide and phosphide.
Each curing accelerator, silane coupling agent, release agent, colouring agent, stress relaxation agent, surfactant and flame retardance can use one or more specialty chemical product or compound.
In order to prepare this epoxy resin enclosed material, above-mentioned resinous principle and inorganic filler are placed on a kind of blender, for example mix in the Henschel blender, and the softening back of resinous principle is mediated, be extruded into strip, tabular or other similar semi-solid preparation solids then in heating.Mediate and extrude for example a kind of pressure roller of use, twin-screw is mediated or extruder.Mediating the time that continues is to make resinous principle abundant and inorganic filler mixing and don't undue curing.Subsequently, Gu the shape body is crushed to diameter 5.0mm or littler.Sieve and remove the big grain of diameter greater than 5.0mm.Pulverize and use a kind of rotocycle, mill or hammer mill roll.Therefore pulverized material package is drawn together diameter and is not less than the particle of 0.1mm and the diameter particulate less than 0.1mm.
The particle of pulverizing is agglomerated into the epoxy resin enclosed pellet that final having is captured in particulate in the corresponding resinous coat.Heating and stirring make it agglomeration and trap particles in conjunction with the particle that puts on a pile pulverizing.That is heating the particle that is stirred, the resin on the particle surface is fused into fusion phase and trap particles.Agglomeration technique A
As one of method of above-mentioned particle agglomeration is with blender shown in Figure 1, comprises that 10, one in an open-topped container mixes lodicule 11, rotates in container with motor 12 drivings.Because lodicule 11 rotation relatively at a high speed, the pulverized particles G that is full of container 10 is fiercely stirred, and bump produces frictional heat and makes the resinous principle fusing that fusing point is minimum on the encapsulation compositions particle surface mutually.Can regulate temperature or fricative heat by selecting motor rotary speed in order to melt the minimum resinous principle of fusing point.Cause the surface to have the particle of resin fusion phase to collide agglomeration each other thus by the interface of fusion phase.Grow up to a certain degree when the particle of agglomeration, the lodicule shear force that is rotated is again smashed.Carry out agglomeration so repeatedly and smash, make particle present suitable size eventually and simultaneously make particulate have an opportunity to be swallowed up mutually again by the fusion of particle.Reduce the rotating speed of mixed pulp then, make the resin fusion phase cooled and solidified of particle surface and obtain particulate to be fixed on the interior particle of its surface resin coating.By this stirring means, the pellet slide angle that obtains is in 20 ° to 40 ° scope.In this method, when the mixed pulp reduction of speed, preferably append some release agents, so that particle surface has the coating of individual release agent or the combination coating of release agent and resin, the particle with such coating helps encapsulating operation.The useful blender of this method is comprised the Henschel blender, omnipotent blender, helical blade or blender and super blender.Agglomeration technique B
Another kind of agglomeration technique is that heater is used in combination with above-mentioned blender.Heater is mounted in the wall of Fig. 1 container 10, goes up the minimum resinous principle melting temperature of fusing point in order to the particle that heating is pulverized to its surface.In heating process lodicule 11 continue to stir so that the fusion boundary agglomeration of particle mat resin again the mat rotation lodicule shear force and prevent excessive.In agglomeration process, particulate is trapped in the fusion mutually.After this, stop heating but continue to stir, the mixing speed deficiency makes the resinous principle fusing, thereby fusion is solidified mutually and obtained particulate and be fixed on particle in its resinous coat.In stirring, lean on the shear force of lodicule to make agglomerated particle size homogenizing.The slide angle of the pellet that obtains with this paddling process is in 20 ° to 40 ° scope.In this method, preferably also add extra release agent so that particle surface has the combination coating of one deck release agent or release agent and resin.Agglomeration technique C
Another kind of agglomeration technique uses fluidized bed plant shown in Figure 2, comprises a container 20, air blown producer 21 and heater 22.The particle G that pulverizes is placed on the screen cloth 23 of container 20, and is blown by the air by air blast 21 inputs and to rise suspension and get up to form a fluid bed.A Lu device 24 is established to collect the particle that rises with gas in adjacent row gas port position.At first heater is activated the particle that is being suspended by air stream to heat, and makes the resinous principle fusing that fusing point is minimum on the particle surface in the encapsulation compositions.Particle with the fusion phase that is caused clashes into mutually in fluid bed, and agglomerates into suitable size by the interface of fusion, and particulate is trapped in the fusion mutually in this process.Because particle is constantly motion in fluid bed, unlikelyly so agglomerated particle constantly breaks again looks too big, reaches an appropriate size at last.Heter temperature is lowered subsequently, makes particle in the fluid bed become size evenly and captured the pellet of particulate in its resinous coat.Be not melted when the particulate of catching mutually overflows with air-flow and be trapped in the filter 24.By this paddling process, its slide angle of the pellet that obtains is in 20 ° to 40 ° scope.
In this method, too, be preferably in heater when cooling, add release agent, so that the gained particle surface scribbles the coating that one deck release agent or release agent combine with resin.
The fluidized bed plant that is used for the method comprises the device of centrifugal air stream and spiral air flow.Agglomeration technique D
Also having a kind of agglomeration method with Fig. 1 blender, is to add solvent in the pulverized particles that is being stirred in blender, along with the adding of solvent, and the dissolved and wetting surface of the resin of particle surface in the encapsulation compositions.One side adsorbent particles agglomeration mutually on the one hand in the stirring.Grow up to a certain degree when agglomeration, the mixing lodicule of rotation is broken into reduced size with them again, and above-mentioned agglomeration and shearing makes particle size moderate and increase the chance that particulate is adsorbed to the particle wetted surface simultaneously repeatedly.Thereafter, one cold or hot air stream is blown into the agglomerated particle that continues stirring and makes its dry tack free.So just obtained the particle that superficial layer has captured particulate.By this paddling process, the pellet that obtains has 20 ° to 40 ° slide angle.In the particle that is stirring, add solvent, can once add or repeatedly add.Solvent comprises acetone, methyl alcohol, dimethylbenzene, toluene, hexane, methylethylketone, ethyl acetate, cyclohexane, isopropyl alcohol, phenylmethylacetone and absolute ethyl alcohol.Specific solvent can be separately with or share.Agglomeration technique E
Also having a kind of agglomeration technique with Fig. 1 blender, is to add a kind of wetting agent when pulverized particles when being stirred.Wetting agent is from epoxy resin, and curing agent is select in release agent and the surfactant.They each can be identical with the composition in the epoxy encapsulation compositions or inequality, wetting agent is deployed on the surface of the particle that is stirring with liquid state, make particulate absorption and particle agglomeration, continuing stir simultaneously thereafter, be blown into one cold or hot air the wetting agent that covers particle surface is solidified, and thereby obtain having captured on the surface particle of particulate.By the pellet that this method obtains, has 20 ° to 40 ° slide angle.When stirring particles, wetting agent can add by one or many.At room temperature be the wetting agent of solid, want first heat fused to become liquid before adding, with being the wetting agent of solid under this room temperature, needn't force cooling get final product the pellet of expecting, help sealing as wetting agent with release agent, be welcome.Be balance agglomeration performance and drying property, add 0.1 to 5.0 weight portion in the preferred 100 parts of pulverized particles of the addition of wetting agent.Agglomeration technique F
The method that also has a kind of agglomeration, be to remove to mediate the epoxy encapsulation compositions and will be extruded into the ribbon of a softness through the composition of kneading by an extrusion with a kind of kneading-extruder, pelletizing then, the particle of round as a ball one-tenth diameter 0.5 to 5.0mm in cooling procedure.
According to agglomeration technique A to E with the particle agglomeration of pulverizing before, preferably give preliminary treatment, to promote micro particle catching and to be limited in the efficient of particle surface.Below handle to be found and help this purpose.The pre-treatment of agglomeration
Water is added to and goes in the pulverized particles that is stirring both to have helped particle aggregation and also be beneficial to adsorbent particles with wetting particle surface.The particle of Xing Chenging is dry because the water ease is gone in continuing stirring like this.Through this processing, particulate sticks to particle surface.This gathering can be carried out in above-mentioned blender or fluidized bed plant.Particle through handling like this carries out agglomeration with one of said method A to E then.Also can replace water, as long as it does not make the resinous principle fusing in the encapsulation compositions with another kind of liquid.These liquid comprise epoxy resin, curing agent, and release agent and surfactant, they can be identical with the composition in the epoxy encapsulation compositions, also can be inequality.
Following examples are to be used for illustrating the present invention rather than for to claim restriction to be set.Embodiment 1
This embodiment is in order to prepare epoxy resin enclosed material according to agglomeration technique A.
A kind of epoxy resin enclosed composition is blended into according to listed ratio by following ingredients: epoxy resin:
3 weight portion orthoresol-novolac epoxy resins [Japanese Sumitomo ChemicalCo.Ltd sells with trade name ESCN195XL];
3 weight portion biphenyl type epoxy resins [Japanese Yuka Shell Epoxy Inc. sells with trade name YX4000H]; Curing agent:
5 weight portion phenolic resins [Japanese Arakawa Chemical Industry Ltd. sells with trade name Tamanol 752]; Inorganic filler:
The fused silica of 80 weight portions [Japanese Tatsumori Ltd. sells with trade name R08]; Release agent:
0.3 weight portion stearic acid [Japanese Dainich Chemical Industry Co., Ltd. sell with trade name W02];
0.3 the natural babassu of weight portion cured [Japanese DAINICHI chemical industry Co., Ltd. sell] with trade name F-1-100.Coupling agent:
1 weight portion γ-glycidol oxygen-propyl trimethoxy silicane [Japanese Toray DowCorning Silicone Inc. sells with trade name SH6040]; Curing accelerator:
The 2-phenylimidazole of 1 weight portion; Colouring agent:
0.2 weight portion carbon black flame retardance:
5-weight portion antimony trioxide
Twin-screw kneader of epoxy resin enclosed composition input that such blending is got up was mediated 5 minutes at 85 ℃, made this composition cools fixed and be ground into the pulverized particles that diameter is not more than 5.0mm and has 63 ℃ of fusing points then with a shredding machine.This pulverized particles is made up of less than the particulate of 0.1mm the diameter of the particle of the diameter 0.1mm to 5.0mm of 90 weight % and 10 weight %.
The 50kg pulverized particles is put into the Henschel blender by above-mentioned agglomeration technique A agglomeration.Mixed pulp 11 stirred 10 minutes with the 1500rpm rotating speed, and the resinous principle of particle surface is melted by the frictional heat that stirs, with and with micro particle catching in its fusion mutually.Rotating speed drops to 400rpm then, make not produce frictional heat basically, thereby in follow-up 20 minutes stirred, fusion is cooled off mutually and become solid phase, thereby is formed in the epoxy resin enclosed pellet that has captured particulate in its surface resin coating.Embodiment 2
This embodiment uses according to the agglomeration technique A with pre-treatment to prepare epoxy resin enclosed material.
The pulverized particles of preparation is placed into a Henschel blender [MitsuiMining Co., Ltd. makes] and sprays into the 2kg pure water under mixed pulp 11 stirs with the 400rpm rotating speed among 50kg such as the embodiment 1.Then mixed pulp continues to keep stirring 20 minutes, makes wetting of particulates and particulate is adsorbed on the wet surface.Then the mixed pulp rotating speed is brought up to 1500rpm and was stirred 10 minutes, with the frictional heat that produces make the resinous principle fusing of particle surface and micro particle catching in fusion mutually.Again the rotating speed of mixed pulp dropped to 400rpm and continue to stir 20 minutes, blast air so that particle drying to blender during this period, thereby obtain in its surface resin layer, having captured the epoxy resin enclosed pellet of particulate thereafter.Embodiment 3
This embodiment is intended to prepare epoxy resin enclosed material by above-mentioned agglomeration technique C.
The pulverized particles of preparation is placed into a fluidized bed plant [Japanese Okawara MFG Co.Ltd. makes] as shown in Figure 2 among 50kg such as the embodiment 1, air in the room temperature of this one rising upwards is blown into the fluid bed that causes a particle continuously from the bottom, so add 0.5kg toluene in fluid bed and allow particle keep the fluidisation attitude.Like this, the resinous principle of the particle surface of composition epoxy resin will be fused into the fusion phase.The temperature that will be blown into air is subsequently brought up to 40 ℃ and kept 60 minutes, makes fusion dry mutually, thereby obtains having captured in the surface resin coating the epoxy resin enclosed pellet of particulate.Embodiment 4
This embodiment prepares epoxy resin enclosed material with above-mentioned agglomeration technique E.
The pulverized particles for preparing among 50kg such as the embodiment 1 is packed in the helical blade blender.Identical 0.5kg stearic acid has been added under 70 ℃ and 200rpm rotating speed stir in the epoxy encapsulation compositions therewith, and keeps and stirred 15 minutes.During this period, stearic acid has wet particle surface, agglomerated particle, and, obtained the surperficial epoxy resin enclosed pellet that has captured particulate after the cooling micro particle catching.Embodiment 5
This embodiment prepares epoxy resin enclosed material with above-mentioned agglomeration technique F.
Epoxy resin enclosed composition is placed into a kneading-extruder, mediated therein and the extrusion of the 1.5mm diameter by a heating is extruded into the bar of a softness, being cut into a sheet subsequently also rolls down along an inclined-plane, roll down change circle and cooling in the process, thereby obtain epoxy resin enclosed pellet.Comparative example 1
The pulverized particles of epoxy resin enclosed composition is pressed embodiment 1 preparation.Comparative example 2
The pulverized particles of the epoxy resin enclosed composition that obtains according to embodiment 1 is sieved again, and size 0.3mm and following fraction are sized, and stays part 2 samples as a comparative example on the compass screen surface.Comparative example 3
The pulverized particles of the epoxy resin enclosed composition that obtains according to embodiment 1 is pressed into diameter 7.4mm with 92% compression ratio, the cylindrical grain of heavy 1.2g.Comparative example 4
In omnipotent blender, pulverized 10 minutes again according to the particle that embodiment 1 obtains with the rolling of 400rpm rotating speed.
The assessment of each embodiment and comparative example
The particle of the pellet of embodiment 1-5 and comparative example 1-4 or sheet grain are assessed by table 1 and 2 Listed Items features.
Table 1
| Distribution of sizes (%) | Slide angle (°) | Dust amount (mg/m 3) | Secondary dust is than (%) | |||
| ?＜0.1mm | ???0.1-5.0mm | After 30 minutes | After 60 minutes | |||
| Embodiment 1 embodiment 2 embodiment 3 embodiment 4 embodiment 5 comparative examples 1 comparative example 2 comparative examples 3 comparative examples 4 | ????0.05 ?????0 ????0.01 ????0.09 ????0.09 ?????10 ????0.1 ?????- ?????5 | ?????99.95 ??????100 ?????99.99 ?????99.91 ?????99.91 ??????90 ??????99.9 ???????- ???????95 | ????26 ????20 ????21 ????31 ????39 ????51 ????41 ?????- ????35 | ?????0.03 ?????0.01 ?????0.02 ?????0.04 ?????0.04 ?????0.31 ?????0.12 ?????0.12 ?????0.12 | ????0.1 ????0.1 ????0.1 ????0.1 ????0.1 ????1.0 ????2.0 ????2.0 ????2.0 | ????0.2 ????0.2 ????0.2 ????0.2 ????0.2 ????2.0 ????4.0 ????4.0 ????2.0 |
Table 2
| Error in dipping (g) with the 5cc container | Error in dipping (g) with the 10cc container | |
| Embodiment 1 embodiment 2 embodiment 3 embodiment 4 embodiment 5 comparative examples 1 comparative example 2 comparative examples 3 comparative examples 4 | ?????????????0.15 ?????????????0.05 ?????????????0.10 ?????????????0.2 ?????????????0.2 ?????????????2.0 ?????????????0.5 ??????????????- ?????????????0.5 | ????????????0.15 ????????????0.05 ????????????0.10 ????????????0.2 ????????????0.3 ????????????3.0 ????????????1.0 ?????????????- ????????????1.0 |
Distribution of sizes is to tie up to a sieve on the low frequency vibrator with one group to measure.The 200g sample is by vibrosieve 30 minutes, the weight that stays on each sieve of weighing then, the weight that weighs up by classification before example weight calculate percentage, and be distinguished into 0.1mm to 5.0mm and the following two parts of 0.1mm.
The mensuration of slide angle is with the long glass conical hopper of the 50mm of a upper opening diameter 50mm, the bottom meets a diameter 7mm, the conduit of long 7mm, this funnel vertically is contained in the top, center of the glass plate of a thick 30mm of diameter 100mm, its end-to-end distance glass plate center of circle 100mm, by the sampling method of stipulating among the JIS K6911, the 300g granular by by funnel gently let-down on glass plate, thereby form a slope that piles by particle.If funnel is blocked up by particle, smash with the copper rod of a diameter 2mm logical, from the height (h) on slope by following formula:
Can calculate slide angle.Slide angle is measured and will be done 7 times every sample, removes minimum and maximum value, and remaining 5 medians are taken the mean and are used for assessment.
Dust amount measure one clean, concentration of dust is lower than 0.1mg/m
3The room in measure the concentration of dust that occurs with a piezoelectricity-balance dust monitor.The 200g sample freely falls from 0.5m, sees the concentration of dust that instrument reflects.
The mensuration of the ratio of secondary dust is the plastic bottle with one 2 liter capacity, ties up on the low frequency vibrator.The 500g sample is put into bottle, vibrate 30 minutes respectively and 60 minutes, measure the weight ratio (%) of the following particulate dust of diameter 0.1mm weight sample total weight before vibrating.
The error of calculation is the stability of metering or weighs the particle index that opposing is stopped up in leading to the approach of metastasis model machine.Two kinds of measuring vessels of 5cc and 10cc are used for measuring particle.Error in dipping is that particle is passed in and out container repeatedly by transfer molding machine path 10 00 time, with the maximum weight of the particle that takes out in each container and the gap between the minimum weight value.The results are shown in the table 2.
Can know and find out that the some embodiments of the present invention diameter is extremely low and show slide angle (θ) error in dipping all little (high quantification stability) less than the content of 0.1mm particulate from above-mentioned two tables.This shows to have and prevents to stop up the good fluidity of leading to molding apparatus die cavity passage.In other words, the error in dipping of the pellet of embodiment 1-5 is to every kind of container, between 0.05 to 0.2, than 0.5 to 2.0 much lower (high quantification stability) of comparative example 1,2 and 4.Therefore the sample of these embodiment stick to container, that is the degree on the transfer molding device passage is very low.
Moreover dust amount and secondary dust amount are lowered to minimum, diffuse out particulate so the vibration that suffers in the process of going in being input to die cavity is also unlikely, thereby have both prevented blocking channel and operational environment is kept clean.
Claims (6)
1. be used for the epoxy resin enclosed material of packaged semiconductor, comprise:
Some compositions that said epoxy resin enclosed material has: a kind of epoxy resin, a kind of curing agent, a kind of inorganic filler and a kind of release agent, and form by the particle of 99 weight % or more diameter 0.1mm to 5.0mm and 1 weight % or the particulate below the diameter 0.1mm still less; And
The slide angle that said epoxy resin enclosed material shows is in 20 ° to 40 ° scope.
2. epoxy resin enclosed material as claimed in claim 1, wherein said particle are to have formed more corresponding coatings and captured the particulate of said diameter less than 0.1mm in coating.
3. method for preparing the epoxy resin enclosed material that claim 1 limits, said method may further comprise the steps:
Kneading is by a kind of epoxy resin, a kind of curing agent, and the composition that a kind of inorganic filler and a kind of release agent are formed is to prepare a kind of semi-solid preparation body of the B-of being in scalariform attitude;
Pulverize said semi-solid preparation body to the particle below the diameter 5.0mm, said particle is made up of less than the particulate of 0.1mm the particle and the diameter of diameter 0.1 to 5.0mm;
With the resinous principle in the said encapsulation compositions the fusing of said particle surface and move said particle in case with micro particle catching in the fusion mutually of said resin composition.
Solidify said fusion to obtain the said epoxy resin enclosed pellet of grain shape.
4. method for making as claimed in claim 3, wherein said pulverized particles be under agitation be heated so that in the said encapsulation compositions said resinous principle melt at said particle surface.
5. method for making as claimed in claim 4, wherein a kind of liquid are added into goes in the said pulverized particles with wetting particle surface, and said particulate was adsorbed on the said particle surface before said resinous principle fusing.
6. method for making as claimed in claim 5, wherein said liquid is to be selected from water, a group of forming of epoxy resin, curing agent, release agent and surfactant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB971983194A CN1147929C (en) | 1997-08-07 | 1997-08-07 | Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB971983194A CN1147929C (en) | 1997-08-07 | 1997-08-07 | Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1231764A true CN1231764A (en) | 1999-10-13 |
| CN1147929C CN1147929C (en) | 2004-04-28 |
Family
ID=5179789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB971983194A Expired - Lifetime CN1147929C (en) | 1997-08-07 | 1997-08-07 | Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1147929C (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365783C (en) * | 2005-01-24 | 2008-01-30 | 西安交通大学 | Designing method for improving breakdown potential of electronic element with epoxy powder pack |
| CN104531027A (en) * | 2015-01-21 | 2015-04-22 | 广州聚合电子材料有限公司 | Epoxy resin encapsulating material as well as preparation method and application thereof |
| CN106715579A (en) * | 2014-09-22 | 2017-05-24 | 赫克塞尔合成有限公司 | Fast curing compositions |
| CN108734155A (en) * | 2018-07-27 | 2018-11-02 | 星科金朋半导体（江阴）有限公司 | A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip |
-
1997
- 1997-08-07 CN CNB971983194A patent/CN1147929C/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365783C (en) * | 2005-01-24 | 2008-01-30 | 西安交通大学 | Designing method for improving breakdown potential of electronic element with epoxy powder pack |
| CN106715579A (en) * | 2014-09-22 | 2017-05-24 | 赫克塞尔合成有限公司 | Fast curing compositions |
| CN104531027A (en) * | 2015-01-21 | 2015-04-22 | 广州聚合电子材料有限公司 | Epoxy resin encapsulating material as well as preparation method and application thereof |
| CN108734155A (en) * | 2018-07-27 | 2018-11-02 | 星科金朋半导体（江阴）有限公司 | A kind of packaging method and its encapsulating structure of ultra-thin fingerprint recognition chip |
| CN108734155B (en) * | 2018-07-27 | 2023-08-15 | 星科金朋半导体（江阴）有限公司 | Packaging method and packaging structure of ultrathin fingerprint identification chip |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1147929C (en) | 2004-04-28 |
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