CN1223378A - Socket for tester of semiconductor chip property - Google Patents

Abstract

The present invention relates to a semiconductor chip performance tester socket. It is characterized by that said tester socket is assembled by using elastic contacts, circuit-connected diagram portion formed on the printed circuit base board on which the elastic contacts are assembled and outer shell into which the above-mentioned elastic contacts and the printed circuit base board are vertically inserted. Said invented semiconductor chip performance tester socket has no need of welding process, and is easy to change, and can prevent the short-circuit and electrical leakage due to welding, and has no need of plug hole so as to be able to eliminate the problem which can be produced by plug hole. Besides, its surface assembly can shorten signalling wire, and is favourable for high-speed action testing of semiconductor.

Description

Socket for tester of semiconductor chip property

The present invention relates to a kind of socket that is used for tester of semiconductor chip property that semi-conductor chip is made a service test, in particular for the contact and be formed at the socket that figure is implemented surface-mounted tester of semiconductor chip property that is connected of printed circuit (PCB) substrate surface.

Generally, the semi-conductor chip of manufacturing is wanted in advance the quality of its performance to be tested before use, makes the disqualification rate of finished product be kept to bottom line with this.

In order to judge the quality of this semi-conductor chip, generally be socket for tester of semiconductor chip property to be contained in be used for after semi-conductor chip is installed on described socket, on described PCB substrate, applying signal on the PCB substrate of performance test.That is to say, the exerciser socket is installed in the situation on the PCB substrate that is used for performance test, to be loaded on the described socket its semi-conductor chip of implementing the performance judgement, by described PCB substrate is applied signal, look it and whether can export desired signal, judge the quality of described semi-conductor chip.

For realizing such function, existing socket for tester of semiconductor chip property (100) is made into contacted contact, inside (102) structure that has the lead and the shell (101) of semi-conductor chip as shown in Figures 1 and 2.

At this moment, as shown in Figure 1, go up formation described contact (102), contact with test unit with the through hole that is electrically connected (111) at the PCB of the semi-conductor chip that makes a service test substrate (110), fix by pad (120), thus the performance of judgement semi-conductor chip.

That is to say, the contact (102) of socket (100) inside is welded mutually with the PCB substrate and fixes, the semi-conductor chip of the performance test of described socket (100) is carried out in setting, if the lead of described semi-conductor chip is linked to each other with the contact, then apply signal, thereby judge the quality of described semi-conductor chip by test unit.

And, as shown in Figure 2, utilize consent (130), described contact (102) are formed on the PCB substrate of implementing the semi-conductor chip performance test, thereby make test unit be electrically connected be connected figure (112) and through hole (111) contacts.

That is to say, by lower end the consent (130) that is formed by the silicon pin is set in described contact (102), described contact (102) can be contacted with the described figure (112) that is connected, simultaneously described consent (130) is inserted and be fixed in through hole (111), in this state, can implement to judge to the performance of semi-conductor chip.

Like this, under the situation of using consent (130), though directly do not weld with described contact (102), identical with the situation of Fig. 1, the bottom of described consent (130) still must be fixing to weld.

So the existing socket for tester of semiconductor chip property that constitutes is to utilize welding and PCB substrate to fix, and therefore when socket wearing and tearing etc. need to change socket, owing to be difficult to remove welding portion, often produces the problem that is difficult to change socket.

That is to say, in a plurality of sockets on being formed at the PCB substrate, when only intending wherein specific several sockets are changed because of reliability decrease, owing to must remove weld part, and this is difficult, so whole sometimes PCB substrate can not re-use.

And existing socket for tester of semiconductor chip property when when inserting tens to hundred sockets on the PCB substrate, must be implemented weld job separately, so when contact separation is narrow, short circuit that can occur causing or electric leakage problem by welding.

In addition, the recent semiconductor of producing, the conductor spacing of its encapsulation is very narrow, so the interval of contact also narrows down, therefore, the socket of existing tester of semiconductor chip property, when carrying out the PCB substrate manufacture, it is difficult that its perforation processing becomes, thereby the elongated problem of PCB wiring circuit occurs.

In addition, in existing socket for tester of semiconductor chip property because other needs device that socket is welded, when after the operation when welding fixing socket and wash, the surface of contact site is polluted, and the function problem of forfeiture test unit occurs.

In addition, in existing socket for tester of semiconductor chip property, be handwork because of inserting consent, be difficult so regulate height, thereby the problem that the flatness of socket is difficult to regulate occurs.That is to say, when inserting consent, have the flatness deterioration problem of socket, this will influence the reliability of the contact device portion contact on socket top.

For improving the problem of above-mentioned existence, the purpose of this invention is to provide a kind of for not using welding, and use with the PCB substrate on have be connected the socket that figure carries out contact contact and fixing tester of semiconductor chip property.

For achieving the above object, the invention provides a kind of socket of tester of semiconductor chip property, it has following feature; In order to carry out the performance test of semi-conductor chip, will with surface-mounted on the connection figure that is located at substrate, vertical aspect has elasticity and insert in the shell contact that forms.

Below accompanying drawing is done simple declaration.

Fig. 1 and Fig. 2 are existing performance test device socket structural map.

Fig. 3 is a performance test device socket structural map of the present invention.

Fig. 4 is other embodiment structural maps of the contact of presentation graphs 3.

Fig. 5 is the installment state synoptic diagram for the shell of Fig. 3.

Fig. 6 is the detail structure synoptic diagram of the sticking department of Fig. 5.

Fig. 7 is the detail structure synoptic diagram of the sticking department of Fig. 5.

Fig. 8 is a performance test device socket guide plate structural map of the present invention.

The symbol relevant with the accompanying drawing major part below is described.

The 201-shell, the 202-contact, 203,204,205, the 206-contact jaw, 207,209, the 223-teat, the 210-substrate, 211-connects figure, 212-through hole, 215-pilot hole, 300-socket guide plate, 302-guide hole, 310-built-up member.

Following with reference to accompanying drawing, describe embodiments of the invention in detail.

As shown in Figure 3, in order to carry out the performance test of semi-conductor chip, socket for tester of semiconductor chip property of the present invention be with surface-mountedly gone up at the connection figure (211) that is formed at substrate (210), vertical direction has elasticity and shell (201) is inserted in the contact (202) that forms and make.

Here, shown in Fig. 3 a, described contact (202) contact with the described figure (211) that is connected in order to be easy to, and its contact jaw (203) is the coign shape and forms.

Also have, shown in Fig. 3 b, described contact (202) contact with the described figure (211) that is connected in order to be easy to, and its contiguous bottom (204) is hook-type, and promptly " fourth " word shape forms.

Also have, shown in Fig. 3 c, described contact (202) contact with the described figure (211) that is connected in order to be easy to, and its contact jaw (205) forms with arrow shaped.At this moment, on the substrate that is provided with described connection figure (211), form through hole (212), can make described sagittate contact (205) be easy to contact and insertion in the porch of described through hole (212).

In addition, shown in Fig. 3 d, in order to be easy to and the described contact that is connected figure (211), its contact jaw (206) forms with tabular surface described contact (202).

Also have, as shown in Figure 4, described contact (202) are in order to be easy to and the described contact that is connected figure (211), establish teat (207,209,223) at its contact jaw, inside in shell (201) forms the rubber-like flexing, is easy to install so that implement the semiconductor of performance test.

That is to say that shown in Fig. 4 a, described contact (202) constitute with " fourth " word shape,, form teat (207), make to be easy to contact with the described figure (211) that is connected at contact jaw keeping above-below direction to have elasticity simultaneously.

In addition, shown in Fig. 4 b, described contact (202) form with " L " word shape, keeping the above-below direction rubber-like simultaneously, form teat (209) at contact jaw, are easy to contact with the described figure (211) that is connected thereby make.

In addition, shown in Fig. 4 C, described contact (202) are " S " word shape and form, and keeping the above-below direction rubber-like simultaneously, form teat (223) at contact jaw, make to be easy to contact with the described figure (211) that is connected.

Like this, so that contact (202) be located at described substrate (210) on be connected on figure (211) face to become surface-mounted and form, described contact (202) need not be welded mutually or use other consent etc. with described substrate, described contact (202) is contacted with the figure (211) that is connected of described substrate (210).

Like this, the contact jaw of the bottom of described contact (202) contacts with the figure (211) that is connected of substrate, the semi-conductor chip of implementing performance test is installed on the shell, if lead is contacted with the upper end of described contact, then will apply signal, thereby can judge the quality of described semi-conductor chip by test unit.

On the other hand, as shown in Figure 5, on (201), form sticking department (213) for enabling to insert the mounting hole of being located on the described substrate outside described, described touching is fixed in described connection figure.That is to say that in order to be fixed on surface-mounted contact (202) on the connection figure of described substrate, described shell (201) should be fixed in described substrate, and the formation sticking department is set for this reason.

That is to say, as shown in Figure 6, described sticking department (213) is to tear shape (214) formation open resilient the bending of upper and lower mask, insertion is located in the mounting hole (215) on the described substrate (210), need not weld or be similar under other installing component situations of rivet, and substrate is being fixed in described contact and shell, therefore, after this, with described substrate to separate and remove to be easy.

Have again, as shown in Figure 7, in order to be easy to insert, described sticking department (213) constitutes with the hook (216) that is formed by slit (217) on longitudinal direction, be inserted into the mounting hole (215) that is located on the described substrate (210), do not having welding or rivet like this under the situation of other installing component, and described contact and shell are being fixed on the substrate, later on the separating and remove and become easy of described substrate.

Here, described sticking department (213) as described in Figure 7, also can utilize other built-up member (218).

On the other hand, for described shell is fixed on the substrate, as shown in Figure 8, use socket guide plate (300).That is to say, outer setting socket guide plate (300) at described shell (201), go up formation guide hole (302) at described socket guide plate (300) and substrate (210), in the guide hole (302) of described socket guide plate (300) and substrate (210), use installing component (310), such as rivet etc., make it to be connected and fixed.

As described above, semiconductor chip performance test device socket of the present invention has following effect.

The first, owing to do not use welding, the replacing of socket is easy, and can prevent because of welding And the short circuit that causes and electric leakage.

The second, no longer need to use consent, not only thoroughly solve the problem that produces by using consent, and especially can reduce the length of the distribution of hole processing generation.

The 3rd, because the contact can be carried out surface-mountedly, signal transmission line shortens, and helps the test of semiconductor high speed motion.

Claims (11)

1. socket that is used for tester of semiconductor chip property, it is characterized in that, in order to carry out the performance test of semi-conductor chip, with surface-mounted in the connection figure (211) that is located at substrate go up, vertical direction has elasticity and insert in the shell (201) contact (202) that forms.

2. the socket that is used for tester of semiconductor chip property according to claim 1 is characterized in that, described contact (202) are in order can be easily to be connected figure (211) contact and to make contact jaw (203) outstanding with described.

3. the socket that is used for tester of semiconductor chip property according to claim 1 is characterized in that, described contact (202) are connected the hook-shaped of figure (211) contact and form with described being easy to.

4. the socket that is used for tester of semiconductor chip property according to claim 3 is characterized in that, described contact (202) are provided with teat in order to be easy to and the described contact that is connected figure (211) at contact jaw.

5. the socket that is used for tester of semiconductor chip property according to claim 1 is characterized in that, described contact (202) form with arrow shaped in order to be easy to and the described contact that is connected figure (211).

6. the socket that is used for tester of semiconductor chip property according to claim 5, it is characterized in that, on the substrate that is provided with described connection figure, have through hole (212), and make and describedly have sagittate contact (202) and be easy to contact with the inlet of described through hole.

7. the socket that is used for tester of semiconductor chip property according to claim 1 is characterized in that, described contact (202) have tabular surface in order to be easy to and the described contact that is connected figure (211).

8. the socket that is used for tester of semiconductor chip property according to claim 1 is characterized in that, in order to insert the pilot hole (215) that is formed on the described substrate, described shell is formed with sticking department, makes described contact be fixed in described connection figure.

9. the socket that is used for tester of semiconductor chip property according to claim 8 is characterized in that, described sticking department is torn shape formation for having elasticity open to bend.

10. the socket that is used for tester of semiconductor chip property according to claim 8 is characterized in that, described sticking department inserts for being easy to, by hook-shapedly constituting of forming with slit.

11. the socket that is used for tester of semiconductor chip property according to claim 1 is characterized in that, for described shell is fixed on the substrate, at the outer setting socket guide plate (300) of described shell.

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