CN101963647B - Chip testing board and system - Google Patents
Chip testing board and system Download PDFInfo
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- CN101963647B CN101963647B CN 200910055379 CN200910055379A CN101963647B CN 101963647 B CN101963647 B CN 101963647B CN 200910055379 CN200910055379 CN 200910055379 CN 200910055379 A CN200910055379 A CN 200910055379A CN 101963647 B CN101963647 B CN 101963647B
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Abstract
The invention discloses a chip testing board and system. The chip testing board comprises a circuit board, wherein the circuit board is provided with a plurality of jack arrays which are uniformly arranged; substrates are arranged on the jack arrays and comprise frames formed by connecting at least first, second, third and fourth side walls in turn, feed mechanisms and elastic elements respectively arranged at the two sides of corresponding jacks; and the elastic elements are used for extruding pins plugged into the jacks to ensure the jacks and the pins to be electrically connected. Pushed by the feed mechanisms, the elastic elements extrude the pins plugged into the jacks to ensure the jacks and the pins to be electrically connected, the socket can be plugged, pulled and changed at will, and when a chip is tested or burnt, the socket is only taken out, without affecting continuous testing of other sockets in the same line or row, thus overcoming the defects caused by welding and greatly saving the cost.
Description
Technical field
The present invention relates to a kind of measurement mechanism and system, specifically, relate to a kind of chip testing plate and chip test system.
Background technology
Wafer after forming chip and encapsulation and finishing, also needs extremely strict various tests such as burn-in test etc. after complicated technology manufacture processes such as overexposure, etching, ion injection, deposition, growth, until qualified, could it be consigned to the client.
In order to improve burn-in test efficient; Traditional method is: in order to test a chip, supplier is according to the type and the quantity demand of this Chip Packaging to be tested of client, and burn-in testing plate (burn in board) is provided with some groups of array of receptacles; The stitch (pin) that special-purpose chip carrier socket (socket) will be installed then inserts in the corresponding array of receptacles; And weld, consigning to the client after the completion, the client can carry out burn-in test after chip is installed into socket.
Various and the technological quick progress of As market, the chip of various packing forms and type are also increasing, and time to market (TTM) also shortens day by day, and the defective of this traditional die test board is more and more obvious:
One: the chip testing plate is connected through welding manner with socket on it; When certain socket is burnt out or is damaged; Be difficult to change, clear up socket; Also can influence the work of other socket of colleague or same column, also delay the plenty of time, influence testing progress and reformulate the chip testing plate.
Two: each chip testing plate can only be applied to a kind of test of chip, when there are tens kinds of chip types even more for a long time in a factory, then need order the chip testing plate of respective number to supplier, has increased cost undoubtedly.
Three: the socket fixed number on every chip block test board, in the process that reality is used, part socket does not use, the waste resource.
Summary of the invention
Technical matters to be solved by this invention provides a kind of chip testing plate and chip test system, arbitrarily plugs and change socket, reduces cost, and is suitable for various types of chip testings.
For solving above technical matters; A kind of chip testing plate provided by the invention comprises circuit board, has some evenly distributed array of receptacles on the said circuit board; Array of receptacles is provided with pedestal; Said pedestal comprises framework, propulsive mechanism that is connected in sequence by first, second, third and fourth sidewall at least and the flexible member that is provided with respectively in the said jack of correspondence both sides, and said flexible member electrically connects said jack and stitch in order to the stitch of the said jack of extruding insertion.
Further, said flexible member is circular arc sheet, and its direction that arches upward is towards said jack, and flexible member one end of both sides is separately fixed on second, the four sidewall inwalls, and the other end connects corresponding said propulsive mechanism respectively.
Further, be respectively arranged with threaded hole at said the first side wall near end positions.
Further, said propulsive mechanism comprises handle and push rod, and said push rod one end is connected with said handle, and the other end passes corresponding said threaded hole and connects with the other end of corresponding said flexible member.
Further, said the first side wall and the 3rd parallel sidewalls, said first and third inside sidewalls is respectively equipped with guide rail.
Further, also be provided with two baffle plates on the said pedestal, the two ends of said baffle plate are connected on the guide rail of first and third sidewall, and on said guide rail, slide.
Further, the position of the corresponding jack of said baffle plate is provided with the recessed sidewall of respective numbers.
Further, said pedestal is connected through removably with said circuit board.
Further, said pedestal is connected through thread connecting mode with said chip testing plate.
Use a kind of chip test system of said chip test board, comprise signal generation unit, processing unit, display unit, said chip test system also comprises aforesaid chip testing plate and is positioned at the chip to be measured on the chip testing plate, wherein,
Said signal generation unit produces pumping signal and gives said chip operation;
Said processing unit is used for the chip running status is monitored or analyzed, and sends the state of monitoring or the result who analyzes to said display unit;
Said display unit is used for the state or the result of display chip operation.
Compared with prior art, chip testing plate and chip test system that the present invention proposes are provided with flexible member and propulsive mechanism through said chip testing plate; Under the promotion of propulsive mechanism, the stitch of said jack is inserted in the flexible member extruding, and said jack and stitch are electrically connected; Can arbitrarily plug and change socket; When the test of certain chips finishes or burnt, only need to take out this socket and get final product, other socket that do not have influence on same column or colleague continue to test; Overcome the defective that welding brings, and practiced thrift cost greatly.
Description of drawings
Fig. 1 is the chip testing plate synoptic diagram of the embodiment of the invention;
Fig. 2 is the pedestal enlarged diagram of the embodiment of the invention;
Fig. 3 is an embodiment of the invention chip test system synoptic diagram.
Embodiment
For making technical characterictic of the present invention more obviously understandable,, the present invention is done further description below in conjunction with accompanying drawing and embodiment.
See also Fig. 1, Fig. 1 is the chip testing plate synoptic diagram of the embodiment of the invention.Embodiment of the invention chips test board; Comprise circuit board 1; Have some evenly distributed array of receptacles 10 on the said circuit board 1; Each array of receptacles 10 is arranged in every way by some jacks 100 and is formed, when practical design, and the design that is complementary in conjunction with stitch quantity and the arrangement mode of socket.Said array of receptacles 10 is provided with a pedestal 2, and said pedestal 2 and said circuit board 1 are connected through removably, such as being threaded, perhaps hold through catch mechanism is set, and in the present embodiment, connect through thread connecting mode.For easy to be understandable, as shown in Figure 1, the part array of receptacles has not indicated pedestal 2, and part is provided with pedestal 2.
See also Fig. 2, Fig. 2 is the pedestal enlarged diagram of the embodiment of the invention.Said pedestal 2 comprises the framework that the head and the tail by first, second, third and fourth sidewall (21,22,23,24) are connected in sequence; Certainly; The present invention is not limited to the framework that four sidewalls are formed, and can as required said Frame Design be become to be made up of a plurality of sidewalls.Said pedestal 2 also comprises propulsive mechanism 20 and the flexible member 25 that is provided with respectively in the said jack of correspondence 100 both sides, and the stitch (indicating) in order to the said jack 100 of extruding insertion electrically connects said jack 100 and stitch.
Said flexible member 25 is circular arc sheet, and its direction that arches upward is towards said jack 100, and an end of the flexible member 25 of both sides is separately fixed on second, four sidewalls (22, the 24) inwall.
Said propulsive mechanism 20 includes handle 200 and push rod 201, and push rod 201 1 ends are connected on the said handle 200, and the other end can be connected with the other end of said flexible member 25 through the threaded hole 211 that is provided with respectively near end positions at the first side wall 21.
Said the first side wall 21 is parallel with the 3rd sidewall 23, and both its inboards are respectively equipped with guide rail 210 and guide rail 230.On guide rail 210 and guide rail 230, be placed with two baffle plates 26, the two ends of said baffle plate 26 are placed on respectively on the guide rail of first and third sidewall (21,23), thereby can on said guide rail 210 and guide rail 230, be free to slide.
During use,, adopt the mode that is threaded that said pedestal 2 is fixed on the said circuit board 1 through being arranged on the screw 27 at first, second, third and fourth sidewall (21,22,23,24) two ends; Then, chip is installed in the socket, inserts the stitch of socket in the corresponding jack 100; Rotating handles 200, push rod 201 promote flexible member 25 under the drive of handle 200 rotations; Because the direction that arches upward of flexible member 25 is towards said jack 100, under the promotion of push rod 201, flexible member 25 promotes baffle plate 26 and in guide rail 210 and guide rail 230, slides; Thereby make baffle plate 26 withstand the stitch of socket, stitch is tightly touched said jack 100.
When the test process of reality; Jack 100 on the said circuit board 1 is generally circular hole; The stitch (not indicating) that inserts said jack 100 is column, and in order to improve the reliability of electric connection, the position of said baffle plate 26 corresponding jacks 100 is provided with the recessed sidewall 260 of respective numbers.
When test finishes or this socket when can't use, only need opposite spin handle 200, push rod 201 is toward pedestals 2 outer returning; Unclamp flexible member 25, can take out socket, thereby realize pluggable electric connection; Overcome the defective that welding brings, its advantage is following:
One: when the test of certain chips finishes or burnt, only need to take out this socket and get final product, other socket that do not have influence on same column or colleague continue to test.
Two: go for the test of different chips, when different chips is tested, only need select for use the socket of corresponding specification to install and to insert, thereby make same chip testing plate go for different chips, significantly reduced the cost of making.
Three: because the cost of socket is the chief component of chip testing plate cost; When entrusting supplier designs chip testing plate; Only need the design circuit plate to get final product, need not special-purpose socket be installed in advance on this chip testing plate, in use; Buy according to actual needs, reduce cost greatly; For chip with direct plugging-in pin, like the chip of dual inline type encapsulated types such as (DIP:Dual In-line Package), even can socket can directly insert in the jack 100 and just can test, further save cost.
See also Fig. 3, use the present invention to implement the chip test system of chip testing plate, comprise signal generation unit 3, processing unit 4, display unit 5, chip testing plate 1 and be positioned at the chip to be measured (not indicating) on the chip testing plate.
During use; Be installed in chip in the socket, and socket is fixed on the pedestal 2 of relevant position, said signal generation unit 3 produces pumping signal and gives said chip operation; Said processing unit 4 is monitored or is analyzed the running status of chip in real time simultaneously; When monitoring, can in real time the state that detects be shown through said display unit 5, be convenient to monitor personnel's Direct observation; When analyzing, can the result of operation be analyzed, and the result that will analyze shows through display unit 5.
Certainly, the pumping signals that the present invention implements in the signal generation unit 3 in the chip test system of chip testing plate not only comprise the generation feeble signal, can also press such as heavy current or forceful electric power by strong signal, and said chip is carried out burn-in test or load test.
More than show and described ultimate principle of the present invention, principal character and advantage of the present invention.The technician of the industry should understand; That describes in the foregoing description and the instructions just explains principle of the present invention; The present invention also has various changes and modifications under the prerequisite that does not break away from spirit and scope of the invention, and these variations and improvement all fall in the scope of the invention that requires protection.
Claims (8)
1. chip testing plate; Comprise circuit board; Have some evenly distributed array of receptacles on the said circuit board, it is characterized in that: array of receptacles is provided with pedestal, and said pedestal comprises framework, propulsive mechanism that is connected in sequence by first, second, third and fourth sidewall at least and the flexible member that is provided with respectively in the said jack of correspondence both sides; Said flexible member inserts the stitch of said jack in order to extruding; Said jack and stitch are electrically connected, be respectively arranged with threaded hole at said the first side wall near end positions, said propulsive mechanism comprises handle and push rod; Said push rod one end is connected with said handle, and the other end passes corresponding said threaded hole and connects with the other end of corresponding said flexible member.
2. chip testing plate as claimed in claim 1; It is characterized in that: said flexible member is circular arc sheet; Its direction that arches upward is towards said jack, and flexible member one end of both sides is separately fixed on second, the four sidewall inwalls, and the other end connects corresponding said propulsive mechanism respectively.
3. chip testing plate as claimed in claim 1 is characterized in that: said the first side wall and the 3rd parallel sidewalls, said first and third inside sidewalls is respectively equipped with guide rail.
4. chip testing plate as claimed in claim 3 is characterized in that: also be provided with two baffle plates on the said pedestal, the two ends of said baffle plate are connected on the guide rail of first and third sidewall, and on said guide rail, slide.
5. chip testing plate as claimed in claim 4 is characterized in that: the position of the corresponding jack of said baffle plate is provided with the recessed sidewall of respective numbers.
6. chip testing plate as claimed in claim 1 is characterized in that: said pedestal is connected through removably with said circuit board.
7. chip testing plate as claimed in claim 6 is characterized in that: said pedestal is connected through thread connecting mode with said chip testing plate.
8. a chip test system comprises signal generation unit, processing unit, display unit, it is characterized in that: said chip test system also comprises chip testing plate as claimed in claim 1 and is positioned at the chip to be measured on the chip testing plate, wherein,
Said signal generation unit produces pumping signal and gives said chip operation;
Said processing unit is used for the chip running status is monitored or analyzed, and sends the state of monitoring or the result who analyzes to said display unit;
Said display unit is used for the state or the result of display chip operation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910055379 CN101963647B (en) | 2009-07-24 | 2009-07-24 | Chip testing board and system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200910055379 CN101963647B (en) | 2009-07-24 | 2009-07-24 | Chip testing board and system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101963647A CN101963647A (en) | 2011-02-02 |
| CN101963647B true CN101963647B (en) | 2012-12-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200910055379 Active CN101963647B (en) | 2009-07-24 | 2009-07-24 | Chip testing board and system |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014111995B4 (en) | 2014-08-21 | 2022-10-13 | Infineon Technologies Ag | METHODS OF GRASPING, MOVING AND ELECTRICAL TESTING OF A SEMICONDUCTOR MODULE |
| CN104316731B (en) * | 2014-10-29 | 2017-09-29 | 上海华岭集成电路技术股份有限公司 | Chip testing plate and chip test system |
| CN109633406A (en) * | 2018-11-27 | 2019-04-16 | 珠海欧比特宇航科技股份有限公司 | A kind of chip life-span test system and its chip detecting method |
| CN112904180B (en) * | 2021-01-22 | 2022-04-19 | 长鑫存储技术有限公司 | Chip test board and chip test method |
| CN113568800A (en) * | 2021-08-02 | 2021-10-29 | 深圳市睿识科技有限公司 | Tool and method for testing software version of FLASH chip of camera |
| CN118150988B (en) * | 2024-05-11 | 2024-08-02 | 福建时代星云科技有限公司 | Circuit board detection equipment and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1112683A (en) * | 1994-03-07 | 1995-11-29 | 日立化成工业株式会社 | Clamp for detecting characteristic of semiconductor and manufacture and application of same |
| CN1223378A (en) * | 1998-01-12 | 1999-07-21 | 株式会社三湖工程 | Socket for tester of semiconductor chip property |
| US6262581B1 (en) * | 1998-04-20 | 2001-07-17 | Samsung Electronics Co., Ltd. | Test carrier for unpackaged semiconducter chip |
| CN2648629Y (en) * | 2003-09-23 | 2004-10-13 | 佶鸿电子股份有限公司 | Socket type connector |
-
2009
- 2009-07-24 CN CN 200910055379 patent/CN101963647B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1112683A (en) * | 1994-03-07 | 1995-11-29 | 日立化成工业株式会社 | Clamp for detecting characteristic of semiconductor and manufacture and application of same |
| CN1223378A (en) * | 1998-01-12 | 1999-07-21 | 株式会社三湖工程 | Socket for tester of semiconductor chip property |
| US6262581B1 (en) * | 1998-04-20 | 2001-07-17 | Samsung Electronics Co., Ltd. | Test carrier for unpackaged semiconducter chip |
| CN2648629Y (en) * | 2003-09-23 | 2004-10-13 | 佶鸿电子股份有限公司 | Socket type connector |
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| Publication number | Publication date |
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| CN101963647A (en) | 2011-02-02 |
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