CN1219305C - Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band - Google Patents

Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band Download PDF

Info

Publication number
CN1219305C
CN1219305C CN 01134998 CN01134998A CN1219305C CN 1219305 C CN1219305 C CN 1219305C CN 01134998 CN01134998 CN 01134998 CN 01134998 A CN01134998 A CN 01134998A CN 1219305 C CN1219305 C CN 1219305C
Authority
CN
China
Prior art keywords
connection point
shaped composite
electric contacting
composite connection
contacting layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 01134998
Other languages
Chinese (zh)
Other versions
CN1423292A (en
Inventor
江轩
吕保国
范金铎
张晓辉
何毅
李宏
刘凤龙
刘力
余前春
闫琳
李勇军
孔峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YOUYAN YIJIN NEW MATERIAL CO Ltd
Original Assignee
YOUYAN YIJIN NEW MATERIAL CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YOUYAN YIJIN NEW MATERIAL CO Ltd filed Critical YOUYAN YIJIN NEW MATERIAL CO Ltd
Priority to CN 01134998 priority Critical patent/CN1219305C/en
Publication of CN1423292A publication Critical patent/CN1423292A/en
Application granted granted Critical
Publication of CN1219305C publication Critical patent/CN1219305C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Contacts (AREA)
  • Manufacture Of Switches (AREA)

Abstract

The present invention discloses a method for preparing an ultrathin electric contact layer of a micro heterotypic composite contact band. The method comprises the steps that a band material with surface purification is wound on a cylinder in different modes to cause the band material to be in helical close arrangement, overlapping or gap arrangement, and then the cylinder is arranged in a vacuum chamber of a magnetron sputtering device and is rotated; the surface of the band material is deposited by a magnetron sputtering technology to form an electric contact layer with stable thickness and uniform component, and places without the need of deposition can be shielded by the helical close arrangement or the overlapping of the band material. The present invention has the advantages that the electric contact layer of a micro heterotypic composite contact band can cover all outer surfaces except for bottom surfaces and can cover parts of outer surfaces except for bottom surfaces so as to largely save noble metal; moreover, the electric contact layer has the advantages of high purity, uniform component, uniform thickness and good surface mass, ensures the mass stability of the electric contact layer and can obtain an alloy electric contact layer; the electric contact layer is firmly combined with an intermediate layer.

Description

The super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip
Technical field
The present invention relates to a kind of super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip.
Background technology
Tiny special-shaped composite connection point strip is to develop to miniaturization and, Highgrade integration direction with relay and switch, and the special-shaped light current contactor material that a kind of novel multi-layer is compound, the cross section is small that occurs, it is the product that new technology and high precision apparatus combine, it is the critical material of making electric contacts in instrument and meter, telecommunication and the electronics, being widely used in the high occasions of reliability requirement such as miniature relay, button, microswitch, digital switch, circuit-breaker, controller and connector, is the core of communication electronic device.Its cross-sectional area is mostly less than 1 square millimeter, and cross section is irregular.It is to constitute by multilayer material is compound, generally comprises base layer, intermediate layer and electric contacting layer etc., and purpose is in order to make full use of the combination property of various materials.Wherein electric contacting layer is one deck the most key in the tiny special-shaped composite connection point strip, is made up of precious metal material, and electric contacting layer thickness mostly is the 0.5-10 micron, and super thin electric contacting layer is meant that electric contacting layer thickness is below 3 microns.
Realize that the compound main technique of tiny special-shaped composite connection point strip has: electroplate, methods such as rolling, roll welding and vapour deposition.
Galvanoplastic mainly are to adopt the continuum selective electroplating, noble metal are covered on the part surface of matrix, make electrodeposited coating thickness reach micron order.Shortcoming is: 1. there is hole in coating, and is not fine and close, influences electrical contact performance when using for a long time; 2. coating and high base strength can not show a candle to roll welding, other method such as rolling; 3. there is problem of environmental pollution; 4. selectable coated metal kind is restricted.
When adopting milling method, primary working modulus generally is not less than 50%, require milling train to have quite high rolling power, so equipment investment is bigger.In addition, if when the thickness difference in the electric contacting layer of tiny special-shaped composite connection point strip and intermediate layer is very big, the technology of compound and following process is complexity.Though the hot rolling method does not have special requirement to the rolling power of milling train, inevitably brings the transition thermal diffusion, and is totally unfavorable to the electric contacting layer performance.
Roll welding is the higher combination process of a kind of efficient, can the compound band that goes out to grow.
Rolling and roll welding complex method can only be used for the compound of routine, can not satisfy the manufacturing of thickness at the electric contacting layer below 3 microns.
CVD (Chemical Vapor Deposition) method mainly contains vacuum evaporation, sputter and ion plating etc.Magnetically controlled sputter method is fit to the part of preparation except that the bottom surface or the preparation of the micro-special-shaped contact band of all surfaces depositing ultrathin thickness electric contacting layer.Be characterized in: 1. electric contacting layer is purer; 2. electric contacting layer thickness is even; 3. electric contacting layer combines more firm with the intermediate layer; 4. the optional wide ranges of electric contacting layer composition.
Summary of the invention
The super thin electric contacting layer preparation method who the purpose of this invention is to provide a kind of tiny special-shaped composite connection point strip, this electric contacting layer can cover all outer surfaces except that the bottom surface, also can cover the part outer surface except that the bottom surface, saved noble metal greatly, and the electric contacting layer composition is even, thickness is even, has guaranteed the quality stability of electric contacting layer.
To achieve these goals, the present invention takes following design:
The super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip, its step is as follows:
1, at first will carry out compoundly as the band of base layer and band with the method for hot rolling or roll welding, form the two-layer composite band in base layer and intermediate layer as the intermediate layer;
2, with composite strip orthopedic to the moulding size, in conjunction with intermediate annealing, after orthopedic the finishing, carry out hardness adjustment annealing in the orthopedic process, annealing is carried out in protective atmosphere;
3, will be through the composite strip after the hardness adjustment annealing, after ultrasonic cleaning, on the cylinder of magnetron sputtering apparatus, making it in the shape of a spiral, shape solid matter, overlap joint cover or gap arrangement differently;
4, the cylinder of wrapping wire is put into the vacuum chamber of magnetron sputtering apparatus, the electric contacting layer for preparing tiny special-shaped composite connection point strip with magnetron sputtering apparatus, electric contacting layer can cover all other outer surface or a part of outer surface except that the bottom surface, cleans the intermediate layer outer surface with the backwash device before the deposition;
5, the electric contacting layer of magnetron sputtering method preparation can reduce internal stress by heat treatment, improves itself and the combining of intermediate layer;
6, for thicker electric contacting layer, can be by the repeatedly method preparation of deposition, inter process is in conjunction with heat treatment, to eliminate stress;
7, will deposit good composite strip and be rolled into tiny special-shaped composite connection point strip with finishing rolling mill with definite shape.
The intermediate layer number of described tiny special-shaped composite connection point strip is 0-3.
The electric contacting layer material of described tiny special-shaped composite connection point strip is a kind of material in gold, billon, platinum, platinum alloy, palladium, the palldium alloy.
The intermediate layer of described tiny special-shaped composite connection point strip is a kind of band in silver-colored nickel, silver oxide, nickel, silver and the silver alloy.
The base layer of described tiny special-shaped composite connection point strip is copper or copper alloy.
Described tiny special-shaped composite connection point strip electric contacting layer thickness is below 3 microns, and width is the 0.3-4 millimeter, and length is not less than 100 meters.
The intermediate layer thickness of described tiny special-shaped composite connection point strip is the 0.1-2 millimeter, and width is the 0.3-4 millimeter, and length is not less than 100 meters.
The matrix ligament thickness of described tiny special-shaped composite connection point strip is the 0.1-2 millimeter, and width is the 0.3-4 millimeter, and length is not less than 100 meters.
Advantage of the present invention is: the electric contacting layer of tiny special-shaped composite connection point strip can cover all outer surfaces except that the bottom surface, also can cover the part outer surface except that the bottom surface, has saved noble metal greatly; Electric contacting layer purity height, composition is even, thickness is even, and surface quality is good, has guaranteed the quality stability of electric contacting layer; Can obtain the alloy electric contacting layer; Electric contacting layer combines firmly with the intermediate layer.
Description of drawings
Fig. 1 is the magnetron sputtering apparatus schematic diagram.
Fig. 2 is typical three layers of tiny special-shaped composite connection point strip cross sectional representation.
Fig. 3 is for only there being the composite strip cross sectional representation of sedimentary deposit at upper surface.
Fig. 4 is except that the bottom surface, and all there is the composite strip cross sectional representation of sedimentary deposit on other surface.
Fig. 5 is for only there being the composite strip cross sectional representation of sedimentary deposit in the upper surface part.
Fig. 6 is a kind of finished product cross sectional representation of tiny special-shaped composite connection point strip.
Fig. 7 is the another kind of finished product cross sectional representation of tiny special-shaped composite connection point strip.
Embodiment
Embodiment, with roll welding compound or hot rolling compounding method, prepare wide be 0.70mm, thickly be the Ag/CuNi20 composite strip of 0.49mm.Wherein, the thickness of Ag is 0.21 millimeter, and the thickness of CuNi20 is 0.28 millimeter.With the Ag/CuNi20 composite strip orthopedic to the moulding size.In conjunction with intermediate annealing, after orthopedic the finishing, carry out hardness adjustment annealing in the orthopedic process, annealing should be carried out in protective atmosphere.Will be through the Ag/CuNi20 composite strip after the hardness adjustment annealing, after ultrasonic cleaning, on cylinder 5, the cylinder 5 of wrapping wire is put into the vacuum chamber 4 (see Fig. 1,9 is that firing equipment, 6 is that pedestal, 10 is that molecular pump, 12 is the Ar source of the gas) of magnetron sputtering apparatus differently.In when deposition, make the cylinder rotation, on the surface of band 7, form thickness evenly, the electric contacting layer of ingredient stability.When adopting distinct methods to twine, can form cross section such as Fig. 3, Fig. 4, sedimentary deposit shown in Figure 5.Because the bottom surface of band contacts with cylinder, can not form sedimentary deposit in the bottom surface, can not influence the welding performance of tiny special-shaped composite connection point strip and reed.
Before the Ag of Ag/CuNi20 composite strip surface deposition electric contacting layer material, carry out reverse sputtering and clean, remove the surface inertness rete, form the reactive metal face.Target 8 is the AuAg10 material, according to waiting to deposit electric contacting layer thickness, the decision deposition parameter.If electric contacting layer is too thick, need carry out the centre stress relief annealing in the deposition process.The AuAg10/Ag/CuNi20 composite strip finishing rolling mill roll forming that deposition is good, cross section such as Fig. 6, shown in Figure 7.
The electric contacting layer composition of the tiny special-shaped composite connection point strip of the present invention's preparation can obtain by selecting different targets for use, thereby can prepare the tiny special-shaped composite connection point strip of gold or billon, platinum or platinum alloy, palladium or palldium alloy composition electric contacting layer.

Claims (8)

1, a kind of super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip, its step is as follows:
(1) at first will carry out compoundly as the band of base layer and band with the method for hot rolling or roll welding, form the two-layer composite band in base layer and intermediate layer as the intermediate layer;
(2) with composite strip orthopedic to the moulding size, in conjunction with intermediate annealing, after orthopedic the finishing, carry out hardness adjustment annealing in the orthopedic process, annealing is carried out in protective atmosphere;
(3) will be through the composite strip after the hardness adjustment annealing, after ultrasonic cleaning, on the cylinder of magnetron sputtering apparatus, making it in the shape of a spiral, shape solid matter, overlap joint cover or gap arrangement differently;
(4) cylinder of wrapping wire is put into the vacuum chamber of magnetron sputtering apparatus, the electric contacting layer for preparing tiny special-shaped composite connection point strip with magnetron sputtering apparatus, electric contacting layer can cover all other outer surface or a part of outer surface except that the bottom surface, cleans the intermediate layer outer surface with the backwash device before the deposition;
(5) electric contacting layer of magnetron sputtering method preparation can reduce internal stress by heat treatment, improves itself and the combining of intermediate layer;
(6) for thicker electric contacting layer, can be by the repeatedly method preparation of deposition, inter process is in conjunction with heat treatment, to eliminate stress;
(7) will deposit good composite strip and be rolled into tiny special-shaped composite connection point strip with finishing rolling mill with definite shape.
2, ask the super thin electric contacting layer preparation method of 1 described tiny special-shaped composite connection point strip according to right, it is characterized in that: the intermediate layer number of described tiny special-shaped composite connection point strip is 0-3.
3, according to the super thin electric contacting layer preparation method of claim 1 described tiny special-shaped composite connection point strip, it is characterized in that: the electric contacting layer material of described tiny special-shaped composite connection point strip is gold and billon, platinum and platinum alloy, palladium and palldium alloy.
4, the super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip according to claim 1 is characterized in that: the intermediate layer of described tiny special-shaped composite connection point strip is silver-colored nickel, silver oxide, nickel, silver and silver alloy.
5, the super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip according to claim 1 is characterized in that: the base layer of described tiny special-shaped composite connection point strip is copper and copper alloy.
6, the super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip according to claim 1 is characterized in that: described tiny special-shaped composite connection point strip electric contacting layer thickness is below 3 microns, and width is the 0.3-4 millimeter, and length is not less than 100 meters.
7, the super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip according to claim 1 is characterized in that: the intermediate layer thickness of described tiny special-shaped composite connection point strip is the 0.1-2 millimeter, and width is the 0.3-4 millimeter, and length is not less than 100 meters.
8, the super thin electric contacting layer preparation method of tiny special-shaped composite connection point strip according to claim 1 is characterized in that: the matrix ligament thickness of described tiny special-shaped composite connection point strip is the 0.1-2 millimeter, and width is the 0.3-4 millimeter, and length is not less than 100 meters.
CN 01134998 2001-12-03 2001-12-03 Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band Expired - Lifetime CN1219305C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 01134998 CN1219305C (en) 2001-12-03 2001-12-03 Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 01134998 CN1219305C (en) 2001-12-03 2001-12-03 Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band

Publications (2)

Publication Number Publication Date
CN1423292A CN1423292A (en) 2003-06-11
CN1219305C true CN1219305C (en) 2005-09-14

Family

ID=4672878

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 01134998 Expired - Lifetime CN1219305C (en) 2001-12-03 2001-12-03 Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band

Country Status (1)

Country Link
CN (1) CN1219305C (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104384186B (en) * 2014-09-23 2017-06-06 重庆川仪自动化股份有限公司 Containing golden three layers of preparation method of micro-special-shaped contact material
CN112916878B (en) * 2021-01-22 2022-10-21 西安国宏天易智能科技有限公司 Additive manufacturing ring-shaped part shape righting method

Also Published As

Publication number Publication date
CN1423292A (en) 2003-06-11

Similar Documents

Publication Publication Date Title
US7341639B2 (en) Electroceramic component comprising a plurality of contact surfaces
KR100975757B1 (en) Laminated electronic component and method for manufacturing same
US8094432B2 (en) Multilayer ceramic electronic component and method for manufacturing the same
JP2001035740A (en) Electronic component equipped with external terminal electrode and manufacture thereof
EP2275590B1 (en) Slide member fabrication method, slide member, and slide member base material
EP3007533B1 (en) Metal foil for electromagnetic shielding, electromagnetic shielding member, and shielded cable
EP3018986A1 (en) Electromagnetic wave shield-use metal foil, electromagnetic wave shield material and shield cable
EP1465201A3 (en) Producing conductive layers
US9111690B2 (en) Multilayer electronic component
TWI246095B (en) Multilayer ceramic electronic component and method of manufacturing thereof
US20040038072A1 (en) Terminal with ruthenium layer and part having the same
US11417469B2 (en) Multilayer ceramic electronic component
KR20110030548A (en) Electrical contact with anti tarnish oxide coating
KR101141573B1 (en) A method of producing a spring element
AT14576U1 (en) Metallization for a thin film device, method of making the same and sputtering target
CN1219305C (en) Method for preparing ultrathin electric contact layer of micro neterotypic composite contact band
EP0690035B1 (en) Metallization of ferrites comprising surface reduction
JP2010242117A (en) Electrical contact and method for manufacturing the same
CN1209953C (en) Preparing method for surface electromagnetic screening membrane layer in plastic mobile shell
JPH0329307A (en) Manufacture of laminated ceramic chip capacitor
CN209357574U (en) A kind of multi sphere bottoming metallization magnetic core and chip inductor
JP2004107693A (en) Ceramic electronic component manufacturing method
CN112233833B (en) Flexible transparent electrode and preparation method thereof
JP2000077253A (en) Electronic component, electronic component chip, and component manufacturing method
KR20000000707A (en) Different sort metal material bound having cube structure and manufacturing method thereof

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20050914