CN1219091C - Cu-base electric contact material coated by diamond coated by oxide and its preparing process - Google Patents
Cu-base electric contact material coated by diamond coated by oxide and its preparing process Download PDFInfo
- Publication number
- CN1219091C CN1219091C CN 01127933 CN01127933A CN1219091C CN 1219091 C CN1219091 C CN 1219091C CN 01127933 CN01127933 CN 01127933 CN 01127933 A CN01127933 A CN 01127933A CN 1219091 C CN1219091 C CN 1219091C
- Authority
- CN
- China
- Prior art keywords
- copper
- coated
- tindioxide
- content
- weisspiessglanz
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims abstract description 16
- 239000010432 diamond Substances 0.000 title claims abstract description 9
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 8
- 238000000034 method Methods 0.000 title claims description 4
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims abstract description 50
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 25
- 239000010949 copper Substances 0.000 claims abstract description 25
- 239000002245 particle Substances 0.000 claims abstract description 20
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 10
- 229910000410 antimony oxide Inorganic materials 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 4
- 230000003647 oxidation Effects 0.000 claims abstract description 3
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 claims description 14
- 239000003595 mist Substances 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Inorganic materials O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 claims description 5
- YEAUATLBSVJFOY-UHFFFAOYSA-N tetraantimony hexaoxide Chemical compound O1[Sb](O2)O[Sb]3O[Sb]1O[Sb]2O3 YEAUATLBSVJFOY-UHFFFAOYSA-N 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 4
- 239000002113 nanodiamond Substances 0.000 claims description 4
- 238000005245 sintering Methods 0.000 claims description 4
- 238000007772 electroless plating Methods 0.000 claims description 3
- 238000001192 hot extrusion Methods 0.000 claims description 3
- 239000011159 matrix material Substances 0.000 claims description 3
- 238000005056 compaction Methods 0.000 claims description 2
- 239000008187 granular material Substances 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 238000004663 powder metallurgy Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 6
- 230000003064 anti-oxidating effect Effects 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000004927 fusion Effects 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 238000002844 melting Methods 0.000 description 5
- 239000000956 alloy Substances 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 231100000357 carcinogen Toxicity 0.000 description 1
- 239000003183 carcinogenic agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Abstract
The present invention discloses a copper-base low-voltage electric contact material coated by diamonds and oxides and a production method thereof, which is characterized in that a copper alloy is used as a basal material; accordingly, an electrical contact has high electric conductivity, high thermal conductivity and favorable anti-oxidation performance; the electrical contact for low-voltage electric appliances has the advantages of strong breaking capacity, high resistance capability of arc burning and fusion welding and high electrical durability. The copper-base low-voltage electric contact material is prepared by that diamond micropowder of which the particle size is from 5 nm to 200 nm and nanometer-grade micropowder of stannic oxide and antimony oxide are added into a basal body of the oxidation-resistant copper alloy, the content of the diamond micropowder is from 0.1 to 5 wt%, the content of the stannic oxide is from 0.1 to 10 wt%, the content of the antimony oxide is from 0.1 to 10 wt%, and the rest is copper power.
Description
The invention belongs to a kind of copper base alloy, the contact alloy material of a kind of special applications in low-voltage apparatus.
The copper-based electrical contact alloy material discloses a plurality of technical schemes in Chinese patent, the novel electrician's contact of this copper-based non-silver is the novel novel material that is applied in the low-voltage apparatus.Its feature is to have stronger breaking capacity, anti-electrical arc erosion ability and anti-melting welding ability.But when copper-based non-silver electric contact was applied on the low-voltage apparatuses such as alternating current contactor, electric life was lower than traditional silver alloys electrical contact.
The present invention seeks to disclose a kind of copper base coated by diamond coated by oxide is the low-voltage electrical contact material, discloses its production method simultaneously.The novel copper-based non-silver electric contact material of the present invention, its copper alloy is a body material, can make electrical contact have very high electric conductivity thermal conductivity and good oxidization resistance energy.The electrical contact that is used for low-voltage apparatus except that having stronger breaking capacity, outside anti-electrical arc erosion ability and the anti-melting welding ability, also has very high electric life.
The present invention is a kind of powder metallurgy of copper, its composition is to add particle size at 5-200nm diadust and nano level tindioxide, weisspiessglanz micro mist in the matrix of resistance to oxidation copper alloy, the content of diadust is at 0.1-5% (wt), the content of tindioxide the content of 0.1-10% (wt), weisspiessglanz at 0.1-10% (wt), all the other are copper powder.
Production method of the present invention is:
(1), make copper/silver evenly be coated on the surface of diadust with Nano diamond micro mist electroless plating.The diadust particle size is at 5-200nm, and coating bed thickness is 5nm-1 μ m;
(2) with nano level tindioxide (SnO2) and weisspiessglanz (Sb2O3) micro mist electroless copper/silver, copper/silver evenly is coated on the surface of tindioxide and antimony oxide particle.Tindioxide (SnO2) and weisspiessglanz (Sb2O3) micro powder granule size are at 5-200nm, and coating bed thickness is 5nm-1 μ m;
(3) Nano diamond micro mist and tindioxide weisspiessglanz micro mist and the prealloy copper powder uniform mixing after will coating.
(4) cold isostatic compaction under the pressure of 200Mpa-250Mpa.
(5) blank after the moulding is under the vacuum less than 10Mpa, at 850--950 ℃ of following sintering 1-1.5 hour.
(6) blank behind the sintering is at 700--750 ℃ of following hot extrusion molding.
(7) section bar after the hot extrusion is cut into the shape that contact requires.
The present invention has very high electric life.Add diadust in copper alloy matrix, diamond particles coats copper or silver with electroless plating method.In electrical contact material, play anti-electrical arc erosion and anti-melting welding effect.Tindioxide and antimony oxide particle play the effect of arc extinguishing and anti-melting welding in electrical contact.Arc extinguishing and anti-melting welding do not contain the oxide compound carcinogens of cadmium metal commonly used and cadmium, satisfy in the low-voltage apparatus the every technical requirements to electrical contact fully.Its method is to be suitable for industrialization technology.
Embodiment (1)
Diadust content: 0.5% (wt), average degree 20nm.
Copper facing thickness: 10nm.
Tindioxide content: 1% (wt), SnO2 mean particle size 20nm.
Copper facing thickness: 10nm.
Weisspiessglanz content: 1% (wt), Sb2O3 mean particle size 20nm.
Copper facing thickness: 10nm/
The copper alloy surplus.
The contact material performance:
Density: 8.7g/cm3.
Resistivity: 1.97 μ Ω .cm..
Hardness: 450Mpa.
Embodiment 2
Diadust content: 1% (wt), mean particle size 50nm.
Copper facing thickness: 1m.
Tindioxide content: 3% (wt), SnO2 mean particle size 50nm.
Copper facing thickness: 1
Weisspiessglanz content: 1.5% (wt), b03 mean particle size 50nm.
Copper facing thickness: 1
The copper alloy surplus.
The contact material performance:
Density: 8.6g/cm3.
Resistivity: 2.2 μ Ω .cm
Hardness: 370Mpa..
Embodiment (3)
Diadust content: 2% (wt), mean particle size 100nm.
Silver-plated thickness: 100nm.
Tindioxide content: 5% (wt), mean particle size 10nm.
Silver-plated thickness: 20nm.
Weisspiessglanz content: 1% (wt), mean particle size 10nm..
Silver-plated thickness: 20nm.
The copper alloy surplus.
The contact material performance:
Density: 8.4g/cm3.
Resistivity: 2.37 μ Ω .cm.
Hardness: 320Mpa..
Embodiment (3)
Diadust content: 3% (wt), mean particle size 10nm.
Silver-plated thickness: 0.5 μ m.
Tindioxide content: 8% (wt), mean particle size 100nm.
Silver-plated thickness: 0.5 μ m.
Weisspiessglanz content: 8% (wt), mean particle size 100nm.
Silver-plated thickness: 0.5 μ m.
The copper alloy surplus.
The contact material performance:
Density: 8.2g/cm3.
Resistivity: 3.0 μ Ω m.cm.
Hardness: 300Mpa..
Claims (2)
1. a copper base coated by diamond coated by oxide is the low-voltage electrical contact material, it is a kind of powder metallurgy of copper, its composition is to add particle size at 5-200nm diadust and nano level tindioxide, weisspiessglanz micro mist in the matrix of resistance to oxidation copper alloy, the content of diadust is at 0.1-5% (wt), the content of tindioxide the content of 0.1-10% (wt), weisspiessglanz at 0.1-10% (wt), all the other are copper powder.
2. copper base coated by diamond coated by oxide is the production method of low-voltage electrical contact material according to claim 1, and its technological process is:
(1) with Nano diamond micro mist electroless plating, make copper/silver evenly be coated on the surface of diadust, the diadust particle size is at 5-200nm, and coating bed thickness is 5nm-1 μ m;
(2) with nano level tindioxide (SnO2) and weisspiessglanz (Sb2O3) micro mist electroless copper/silver, copper/silver evenly is coated on the surface of tindioxide and antimony oxide particle, tindioxide (SnO2) and weisspiessglanz (Sb2O3) micro powder granule size are at 5-200nm, and coating bed thickness is 5nm-1 μ m;
(3) Nano diamond micro mist and tindioxide weisspiessglanz micro mist and the prealloy copper powder uniform mixing after will coating;
(4) cold isostatic compaction under the pressure of 200Mpa-250Mpa;
(5) blank after the moulding is under the vacuum less than 10Mpa, at 850--950 ℃ of following sintering 1-1.5 hour;
(6) blank behind the sintering is at 700--750 ℃ of following hot extrusion molding;
(7) section bar after the hot P extruding is cut into the shape that contact requires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01127933 CN1219091C (en) | 2001-07-12 | 2001-07-12 | Cu-base electric contact material coated by diamond coated by oxide and its preparing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01127933 CN1219091C (en) | 2001-07-12 | 2001-07-12 | Cu-base electric contact material coated by diamond coated by oxide and its preparing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1397656A CN1397656A (en) | 2003-02-19 |
| CN1219091C true CN1219091C (en) | 2005-09-14 |
Family
ID=4667838
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01127933 Expired - Lifetime CN1219091C (en) | 2001-07-12 | 2001-07-12 | Cu-base electric contact material coated by diamond coated by oxide and its preparing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1219091C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105719854A (en) * | 2016-04-16 | 2016-06-29 | 苏州思创源博电子科技有限公司 | Preparation method for copper-based electric contact material with graphene |
-
2001
- 2001-07-12 CN CN 01127933 patent/CN1219091C/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1397656A (en) | 2003-02-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6126066B2 (en) | Electrical contact material and manufacturing method thereof | |
| CN101054654A (en) | High-strength high-conductivity oxidation-resisting low-silver copper-base alloy and preparation thereof | |
| CN101343700A (en) | Ag/Ti3SiC2 electric contact material and manufacturing process | |
| CN101608272A (en) | AgNi electrical contact material and preparation method thereof | |
| CN1555074A (en) | Electric contact material for low voltage electric appliance | |
| CN1830599A (en) | Silver composite tin oxide contact material and its preparation technology | |
| CN1037725C (en) | Contact material for vacuum current breaker | |
| CN106086495B (en) | Cupric oxide doped siller tin oxide composite and preparation method thereof | |
| CN1498287A (en) | Inert electrode material in nanocrystalline powder form | |
| CN1219091C (en) | Cu-base electric contact material coated by diamond coated by oxide and its preparing process | |
| CN1046599C (en) | Copper-plated carbon fibre metal graphite composite electric brush and making method | |
| CN101656160B (en) | Preparing method of silver-base metal acid-salt electrical-contact composite material | |
| CN1725561A (en) | Nano carbon tube composited contact material | |
| CN1057633C (en) | Electrode material | |
| CN101075501A (en) | Silver-economizing low-voltage electrical-appliance contact materials | |
| CN104404461B (en) | Electrical contact Ag-TiC nano-composite coating based on magnetron sputtering codeposition technique | |
| CN1290623C (en) | Electrode nozzle of electric arc spraying coater in supersonic speed and manufacturing method | |
| JP2017179579A (en) | Ag-Ni-METAL OXIDE-BASED ELECTRICAL CONTACT MATERIAL, MANUFACTURING METHOD THEREFOR, CIRCUIT BREAKER AND ELECTROMAGNETIC CONTACT DEVICE | |
| JPH11269579A (en) | Silver-tungsten/wc base sintered type electric contact material and its production | |
| CN1265409C (en) | Copper/rare-earth oxide/carbon contact and method for producing same | |
| CN1124353C (en) | Copper-tungsten carbide contact material | |
| CN104867622B (en) | A kind of AgSnO2the preparation method of Multicore composite material | |
| CN1539744A (en) | Composite powder of stannic oxide Nano crystal with silver being covered | |
| CN1293237C (en) | Production method for electrical contact material | |
| CN1232994C (en) | Copper base composite electric contact material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HARBIN DONGDA HIGH NEW MATERIAL CO., LTD. Free format text: FORMER OWNER: DONGDA ELECTROTECHNOLOGY CO LTD, HARBIN Effective date: 20071109 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20071109 Address after: 150001, 240 Hongqi Avenue, Nangang District, Heilongjiang, Harbin Patentee after: Harbin Dongdagao New Material Co.,Ltd. Address before: 150060 Bohai three road, cottage Economic Development Zone, Heilongjiang, Harbin Patentee before: Dongda Electrotechnology Co., Ltd., Harbin |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Cu-base electric contact material coated by diamond coated by oxide and its preparing process Effective date of registration: 20121108 Granted publication date: 20050914 Pledgee: Heilongjiang Xin Xin Investment Guarantee Group Co., Ltd. Pledgor: Harbin Dongdagao New Material Co.,Ltd. Registration number: 2012230000019 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20131120 Granted publication date: 20050914 Pledgee: Heilongjiang Xin Xin Investment Guarantee Group Co., Ltd. Pledgor: Harbin Dongdagao New Material Co.,Ltd. Registration number: 2012230000019 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| CX01 | Expiry of patent term |
Granted publication date: 20050914 |
|
| CX01 | Expiry of patent term |