CN1218809C - High-strength silver-base brazing alloy and use thereof - Google Patents
High-strength silver-base brazing alloy and use thereof Download PDFInfo
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- CN1218809C CN1218809C CN 03142642 CN03142642A CN1218809C CN 1218809 C CN1218809 C CN 1218809C CN 03142642 CN03142642 CN 03142642 CN 03142642 A CN03142642 A CN 03142642A CN 1218809 C CN1218809 C CN 1218809C
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Abstract
The utility model provides high-strength silver-base solder and an application thereof which belong to the technical field of soldering connection. The silver-base solder solves the technical problem of the nonideal combination property of joints of polycrystalline diamond bodies and steel soldered by the present solder. The solder has the components, in weight percentages, 46 to 54% of Ag, 24 to 32 % of Cu, 17 to 25 % of Zn, 0.5 to 5 % of Mn, 0.1 to 1.5 % Ni and 0.01 to 1 % of B. The solder is mainly suitable for soldering the polycrystalline diamond bodies with high loads or the hard alloys with the steel.
Description
Technical field
A kind of high strength silver-base solder that the present invention proposes and uses thereof belongs to soldering interconnection technique field, specially refers to polycrystalline diamond or carbide alloy and is connected with the soldering of metal.
Background technology
In recent years, more and more come extensively with the application of polycrystalline diamond (PCD), become the preferred material of high-grade machining tool, geology and oil exploration, building, traffic, wood working tool, the contour wear resistant tools of non-ferrous metal cutting element as cutter with cutting edge.Mainly in lithotome processing, highway construction and concrete works, the polycrystalline diamond saw blade has become the principal element that influences project speed and cost.
Polycrystalline diamond all adopts existing silver-base solder to be connected with method for welding with the metal cutter hub at present.The year consumption of silver-base solder reaches tens of tons.
The brazing temperature of polycrystalline diamond can not surpass 800 ℃, because the polycrystalline diamond sheet oxidation and graphitization will take place when surpassing 800 ℃ in air, has a strong impact on the quality of polycrystalline diamond sheet.For the cutting tool under the speed of running up (as saw blade etc.), because they are to work under high speed, vibration, higher temperature, the cutter load is big, and the bonding strength of cutter head is required height.At present, used silver solder mainly contains during both at home and abroad to the soldering of high capacity polycrystalline diamond sheet: (1) BAg50CuZnCd, i.e. 50Ag-16Cu-16Zn-18Ca, fusing point 620-635 ℃; (2) BAg50CuZnCdNi, i.e. 50Ag-15.5Cu-15.5Zn-16Cd-3Ni, fusing point 632-688 ℃; (3) BAg45CuZn, i.e. 45Ag-30Cu-25Zn, fusing point 675-745 ℃; (4) BAg49CuMnNi, i.e. 49Ag-16Cu-23Zn-7.5Mn-45Ni, fusing point 625-705 ℃; The elevated temperature strength that has in these solders is not enough, as BAg50CuZnCd; What have contains poisonous Elements C d, as BAg50CuZnCd, BAg50CuZnCdNi etc., very big to human health damage; The strength of joint that has is not enough, as BAg45CuZn; The processing and manufacturing difficulty that has, yield rate is low, as BAg49CuMnNi.Therefore, these solders all can not satisfy the requirement of polycrystalline diamond sheet soldering under the high load condition safely.
Summary of the invention
The objective of the invention is to,, propose a kind of high strength silver-base solder of novel nontoxic, high comprehensive performance in order to overcome deficiency above-mentioned in the background technology.
Finish the purpose of the invention described above by following technical scheme.
1, a kind of high strength silver-base solder is characterized in that, the percentage by weight of this high strength silver-base solder consists of Ag46-54%, Cu24-32%, Zn17-25%, Mn0.5-5%, Ni0.1-1.5%, B0.01-1%.
2, a kind of above-mentioned high strength silver-base solder mainly is applicable to the brazing filler metal of polycrystalline diamond body or the carbide alloy and the steel of high capacity.
Solder of the present invention is a kind of silver-base alloy, and its proportioning is a Main Ingredients and Appearance with silver, copper and zinc, 680 ℃ of solidus, 710 ℃ of liquidus curves, 750 ℃ of brazing temperatures.For satisfying the requirement of soldering polycrystalline diamond body, on the weight percent content basis of original corresponding solder, adjust the proportioning of its silver, copper, zinc, so that improve brazing temperature; In pricker spare, add an amount of manganese, in order that improve solder intensity and to the wetability of polycrystalline diamond; In order to improve the high-temperature behavior of solder, in solder, add minor amount of nickel again; Boron in the solder plays the crystal grain thinning effect, and especially when boron, nickel acting in conjunction, the grain refinement effect is more obvious, thereby has improved the mechanics and the processing characteristics of solder.
The solder of mentioning in solder of the present invention and the background technology is compared and is had the following advantages:
(1), do not conform to harmful element Cd in the solder, this solder is a kind of nontoxic green solder;
(2), the good processability of solder, easily make the 0.2mm thin slice;
(3), solder is to polycrystalline diamond body, carbide alloy, 65 manganese steel, T8 steel, No. 45 steel etc. all have good wetability.
(4), the soldered fitting intensity height that adopts this solder to obtain, for example, improve more than 40% than the shearing strength of the soldered fitting of original solder (as the BAg45CuZn solder).
Because solder of the present invention has the brazing temperature that is lower than generation oxidation of polycrystalline diamond body and graphitization temperature, therefore advantages such as the soldered fitting intensity height, the soldering processes performance that obtain of solder be good thus are specially adapted to the brazing filler metal of polycrystalline diamond body or the carbide alloy and the steel of high capacity.
The specific embodiment
1, a kind of solder of the present invention, the percentage by weight of this solder consists of:
Ag47.58%、Cu28%、Zn21%、Mn3%、Ni0.4%、B0.02%。This solder is through operations such as batching, smelting, ingot casting, peeling, roughing, annealing, pickling, finish rolling, finally make the thick thin slice of 0.2mm, this solder thin slice is used for polycrystalline diamond sheet cutter and No. 65 drill rods connect, 750 ℃ of brazing temperatures, after the brazing filler metal, the shearing strength of soldered fitting can reach 300-350MPa.
2, another solder of the present invention, the percentage by weight of this solder consists of: Ag49.87%, Cu27%, Zn20%, Mn2.5%, Ni0.6%, B0.03%.This solder is through finally making the thin slice of 0.2mm with 1 same technological process, and this solder thin slice is used for hard alloy cutter and No. 45 drill rods connect, 750 ℃ of brazing temperatures, and after the brazing filler metal, the shearing strength of soldered fitting can reach 300-350MPa.
Claims (2)
1, a kind of high strength silver-base solder is characterized in that, the percentage by weight of this high strength silver-base solder consists of: Ag 46-54%, Cu 24-32%, Zn 17-25%, Mn 0.5-5%, Ni 0.1-1.5%, B 0.01-1%.
According to the purposes of the described a kind of high strength silver-base solder of claim 1, it is characterized in that 2, this silver-base solder is applicable to the brazing filler metal of polycrystalline diamond body or the carbide alloy and the steel of high capacity.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN 03142642 CN1218809C (en) | 2003-06-10 | 2003-06-10 | High-strength silver-base brazing alloy and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 03142642 CN1218809C (en) | 2003-06-10 | 2003-06-10 | High-strength silver-base brazing alloy and use thereof |
Publications (2)
Publication Number | Publication Date |
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CN1456415A CN1456415A (en) | 2003-11-19 |
CN1218809C true CN1218809C (en) | 2005-09-14 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 03142642 Expired - Fee Related CN1218809C (en) | 2003-06-10 | 2003-06-10 | High-strength silver-base brazing alloy and use thereof |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101554686B (en) * | 2009-05-15 | 2011-11-16 | 西安理工大学 | High-entropy alloy solder used for welding hard alloy and steel and preparation method thereof |
CN101985193B (en) * | 2010-11-18 | 2012-09-05 | 常熟市华银焊料有限公司 | Cadmium-free silver solder and preparation method thereof |
CN103358048B (en) * | 2013-07-25 | 2016-08-17 | 杭州华光焊接新材料股份有限公司 | A kind of silver-bearing copper phosphorus system vacuum brazing material |
CN104801805B (en) * | 2015-04-27 | 2017-08-25 | 河南理工大学 | High-temp soldering method between multi-disc hard alloy and strip stainless steel knife rest |
CN106378510B (en) * | 2016-10-14 | 2018-08-10 | 马鞍山市威马机械设备有限责任公司 | A kind of silver soldering processing method of four swords tungsten steel blade |
CN111347356A (en) * | 2018-12-20 | 2020-06-30 | 江苏友美工具有限公司 | Preparation process of multifunctional grinding-cutting diamond grinding wheel |
CN110355495A (en) * | 2019-04-30 | 2019-10-22 | 北京安达泰克科技有限公司 | Solder product and preparation method thereof and welding method |
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2003
- 2003-06-10 CN CN 03142642 patent/CN1218809C/en not_active Expired - Fee Related
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