CN1218809C - High-strength silver-base brazing alloy and use thereof - Google Patents

High-strength silver-base brazing alloy and use thereof Download PDF

Info

Publication number
CN1218809C
CN1218809C CN 03142642 CN03142642A CN1218809C CN 1218809 C CN1218809 C CN 1218809C CN 03142642 CN03142642 CN 03142642 CN 03142642 A CN03142642 A CN 03142642A CN 1218809 C CN1218809 C CN 1218809C
Authority
CN
China
Prior art keywords
solder
silver
polycrystalline diamond
base
strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 03142642
Other languages
Chinese (zh)
Other versions
CN1456415A (en
Inventor
李贤珍
李嘉珍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 03142642 priority Critical patent/CN1218809C/en
Publication of CN1456415A publication Critical patent/CN1456415A/en
Application granted granted Critical
Publication of CN1218809C publication Critical patent/CN1218809C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Earth Drilling (AREA)

Abstract

The utility model provides high-strength silver-base solder and an application thereof which belong to the technical field of soldering connection. The silver-base solder solves the technical problem of the nonideal combination property of joints of polycrystalline diamond bodies and steel soldered by the present solder. The solder has the components, in weight percentages, 46 to 54% of Ag, 24 to 32 % of Cu, 17 to 25 % of Zn, 0.5 to 5 % of Mn, 0.1 to 1.5 % Ni and 0.01 to 1 % of B. The solder is mainly suitable for soldering the polycrystalline diamond bodies with high loads or the hard alloys with the steel.

Description

A kind of high strength silver-base solder and uses thereof
Technical field
A kind of high strength silver-base solder that the present invention proposes and uses thereof belongs to soldering interconnection technique field, specially refers to polycrystalline diamond or carbide alloy and is connected with the soldering of metal.
Background technology
In recent years, more and more come extensively with the application of polycrystalline diamond (PCD), become the preferred material of high-grade machining tool, geology and oil exploration, building, traffic, wood working tool, the contour wear resistant tools of non-ferrous metal cutting element as cutter with cutting edge.Mainly in lithotome processing, highway construction and concrete works, the polycrystalline diamond saw blade has become the principal element that influences project speed and cost.
Polycrystalline diamond all adopts existing silver-base solder to be connected with method for welding with the metal cutter hub at present.The year consumption of silver-base solder reaches tens of tons.
The brazing temperature of polycrystalline diamond can not surpass 800 ℃, because the polycrystalline diamond sheet oxidation and graphitization will take place when surpassing 800 ℃ in air, has a strong impact on the quality of polycrystalline diamond sheet.For the cutting tool under the speed of running up (as saw blade etc.), because they are to work under high speed, vibration, higher temperature, the cutter load is big, and the bonding strength of cutter head is required height.At present, used silver solder mainly contains during both at home and abroad to the soldering of high capacity polycrystalline diamond sheet: (1) BAg50CuZnCd, i.e. 50Ag-16Cu-16Zn-18Ca, fusing point 620-635 ℃; (2) BAg50CuZnCdNi, i.e. 50Ag-15.5Cu-15.5Zn-16Cd-3Ni, fusing point 632-688 ℃; (3) BAg45CuZn, i.e. 45Ag-30Cu-25Zn, fusing point 675-745 ℃; (4) BAg49CuMnNi, i.e. 49Ag-16Cu-23Zn-7.5Mn-45Ni, fusing point 625-705 ℃; The elevated temperature strength that has in these solders is not enough, as BAg50CuZnCd; What have contains poisonous Elements C d, as BAg50CuZnCd, BAg50CuZnCdNi etc., very big to human health damage; The strength of joint that has is not enough, as BAg45CuZn; The processing and manufacturing difficulty that has, yield rate is low, as BAg49CuMnNi.Therefore, these solders all can not satisfy the requirement of polycrystalline diamond sheet soldering under the high load condition safely.
Summary of the invention
The objective of the invention is to,, propose a kind of high strength silver-base solder of novel nontoxic, high comprehensive performance in order to overcome deficiency above-mentioned in the background technology.
Finish the purpose of the invention described above by following technical scheme.
1, a kind of high strength silver-base solder is characterized in that, the percentage by weight of this high strength silver-base solder consists of Ag46-54%, Cu24-32%, Zn17-25%, Mn0.5-5%, Ni0.1-1.5%, B0.01-1%.
2, a kind of above-mentioned high strength silver-base solder mainly is applicable to the brazing filler metal of polycrystalline diamond body or the carbide alloy and the steel of high capacity.
Solder of the present invention is a kind of silver-base alloy, and its proportioning is a Main Ingredients and Appearance with silver, copper and zinc, 680 ℃ of solidus, 710 ℃ of liquidus curves, 750 ℃ of brazing temperatures.For satisfying the requirement of soldering polycrystalline diamond body, on the weight percent content basis of original corresponding solder, adjust the proportioning of its silver, copper, zinc, so that improve brazing temperature; In pricker spare, add an amount of manganese, in order that improve solder intensity and to the wetability of polycrystalline diamond; In order to improve the high-temperature behavior of solder, in solder, add minor amount of nickel again; Boron in the solder plays the crystal grain thinning effect, and especially when boron, nickel acting in conjunction, the grain refinement effect is more obvious, thereby has improved the mechanics and the processing characteristics of solder.
The solder of mentioning in solder of the present invention and the background technology is compared and is had the following advantages:
(1), do not conform to harmful element Cd in the solder, this solder is a kind of nontoxic green solder;
(2), the good processability of solder, easily make the 0.2mm thin slice;
(3), solder is to polycrystalline diamond body, carbide alloy, 65 manganese steel, T8 steel, No. 45 steel etc. all have good wetability.
(4), the soldered fitting intensity height that adopts this solder to obtain, for example, improve more than 40% than the shearing strength of the soldered fitting of original solder (as the BAg45CuZn solder).
Because solder of the present invention has the brazing temperature that is lower than generation oxidation of polycrystalline diamond body and graphitization temperature, therefore advantages such as the soldered fitting intensity height, the soldering processes performance that obtain of solder be good thus are specially adapted to the brazing filler metal of polycrystalline diamond body or the carbide alloy and the steel of high capacity.
The specific embodiment
1, a kind of solder of the present invention, the percentage by weight of this solder consists of:
Ag47.58%、Cu28%、Zn21%、Mn3%、Ni0.4%、B0.02%。This solder is through operations such as batching, smelting, ingot casting, peeling, roughing, annealing, pickling, finish rolling, finally make the thick thin slice of 0.2mm, this solder thin slice is used for polycrystalline diamond sheet cutter and No. 65 drill rods connect, 750 ℃ of brazing temperatures, after the brazing filler metal, the shearing strength of soldered fitting can reach 300-350MPa.
2, another solder of the present invention, the percentage by weight of this solder consists of: Ag49.87%, Cu27%, Zn20%, Mn2.5%, Ni0.6%, B0.03%.This solder is through finally making the thin slice of 0.2mm with 1 same technological process, and this solder thin slice is used for hard alloy cutter and No. 45 drill rods connect, 750 ℃ of brazing temperatures, and after the brazing filler metal, the shearing strength of soldered fitting can reach 300-350MPa.

Claims (2)

1, a kind of high strength silver-base solder is characterized in that, the percentage by weight of this high strength silver-base solder consists of: Ag 46-54%, Cu 24-32%, Zn 17-25%, Mn 0.5-5%, Ni 0.1-1.5%, B 0.01-1%.
According to the purposes of the described a kind of high strength silver-base solder of claim 1, it is characterized in that 2, this silver-base solder is applicable to the brazing filler metal of polycrystalline diamond body or the carbide alloy and the steel of high capacity.
CN 03142642 2003-06-10 2003-06-10 High-strength silver-base brazing alloy and use thereof Expired - Fee Related CN1218809C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 03142642 CN1218809C (en) 2003-06-10 2003-06-10 High-strength silver-base brazing alloy and use thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 03142642 CN1218809C (en) 2003-06-10 2003-06-10 High-strength silver-base brazing alloy and use thereof

Publications (2)

Publication Number Publication Date
CN1456415A CN1456415A (en) 2003-11-19
CN1218809C true CN1218809C (en) 2005-09-14

Family

ID=29411835

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 03142642 Expired - Fee Related CN1218809C (en) 2003-06-10 2003-06-10 High-strength silver-base brazing alloy and use thereof

Country Status (1)

Country Link
CN (1) CN1218809C (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101554686B (en) * 2009-05-15 2011-11-16 西安理工大学 High-entropy alloy solder used for welding hard alloy and steel and preparation method thereof
CN101985193B (en) * 2010-11-18 2012-09-05 常熟市华银焊料有限公司 Cadmium-free silver solder and preparation method thereof
CN103358048B (en) * 2013-07-25 2016-08-17 杭州华光焊接新材料股份有限公司 A kind of silver-bearing copper phosphorus system vacuum brazing material
CN104801805B (en) * 2015-04-27 2017-08-25 河南理工大学 High-temp soldering method between multi-disc hard alloy and strip stainless steel knife rest
CN106378510B (en) * 2016-10-14 2018-08-10 马鞍山市威马机械设备有限责任公司 A kind of silver soldering processing method of four swords tungsten steel blade
CN111347356A (en) * 2018-12-20 2020-06-30 江苏友美工具有限公司 Preparation process of multifunctional grinding-cutting diamond grinding wheel
CN110355495A (en) * 2019-04-30 2019-10-22 北京安达泰克科技有限公司 Solder product and preparation method thereof and welding method

Also Published As

Publication number Publication date
CN1456415A (en) 2003-11-19

Similar Documents

Publication Publication Date Title
CN101693325B (en) High-toughness cadmium-free silver solder and preparation method thereof
EP3042971B1 (en) Lead-free high-sulphur easy-cutting alloy containing manganese and copper and preparation method therefor
CN102069355B (en) Production method for pick-like bit
CN101342626B (en) Welding method and silver based metal for hard-alloy heavy type cutting tools
CN103695725A (en) Compound aluminum alloy strip material for long-life car heat exchanger and manufacturing method of compound aluminum alloy strip material
CN104384743A (en) Low-silver cadmium-free solder and preparation method thereof
CN1218809C (en) High-strength silver-base brazing alloy and use thereof
CN111889917B (en) Composite brazing filler metal for brazing hard alloy cutter and preparation method thereof
CN106736015A (en) Without silver yellow copper brazing filler metal alloy
CN109128577A (en) A kind of solder and preparation method thereof of Mn-Cu alloy and the soldering of Fe-Cr based alloy
CN101716705B (en) Multi-alloy cadmium-free phosphor-free copper-based solder
CN103537821B (en) A kind of high temperature brazing iron nickel-based solder
CN109909642B (en) Brazing filler metal for brazing pick-shaped cutting tooth and brazing method for pick-shaped cutting tooth
CN1139457C (en) Multi-element Cu-base solder for soldering low-alloy chilled cast iron
CN101158000A (en) Leadless easy-cutting aluminum alloy
CN1428222A (en) Welding method of hard alloy cutting tool
CN102719701B (en) Free-cutting titanium alloy and preparation method thereof
CN101805841A (en) Rare earth oxide unleaded free-cutting brass and preparation method thereof
CN101709406B (en) Manganese dioxide unleaded cutting brass and preparation method thereof
CN101363086A (en) Leadless free-cutting brass alloy
CN103203561B (en) Silver-free brazing filler metal for brazing hard alloy
CN101363087A (en) Low lead or leadless free-cutting brass alloy
CN109676283B (en) Active brazing filler metal for diamond saw blade
CN103567662B (en) A kind of iron-based solder obtaining high tenacity soldered fitting
CN107052614A (en) Without silver yellow spelter solder

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee