CN1212072A - Surface mountable electrical device comprising PTC element - Google Patents
Surface mountable electrical device comprising PTC element Download PDFInfo
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- CN1212072A CN1212072A CN97192553A CN97192553A CN1212072A CN 1212072 A CN1212072 A CN 1212072A CN 97192553 A CN97192553 A CN 97192553A CN 97192553 A CN97192553 A CN 97192553A CN 1212072 A CN1212072 A CN 1212072A
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- conductive layer
- ptc
- tape
- insulating barrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/0411—Miniature fuses
- H01H2085/0414—Surface mounted fuses
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
- H01H85/048—Fuse resistors
- H01H2085/0483—Fuse resistors with temperature dependent resistor, e.g. thermistor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
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- Thermistors And Varistors (AREA)
Abstract
An electrical device 10 comprising a resistive element 20 having a first electrode 100 in electrical contact with a top surface 30 of the resistive element 20 and a second electrode 110 in electrical contact with a bottom surface 40 of the resistive element 20. An insulating layer 120 is formed on the first and second electrodes 100, 110. A portion of the insulating layer 120 is removed from the first and second electrodes 100, 110 to form first and second contact points 130, 140. A conductive layer 150 is formed on the insulating layer 120 and makes electrical contact with the first and second electrodes 100, 110 at the contact points 130, 140. The conductive layer 150 has portions removed to form first and second end terminations 155, 156 separated by electrically non-conductive gaps 160, 170. The wrap-around configuration of the device 10 allows for an electrical connection to be made to both electrodes 100, 110 from the same side of the electrical device 10.
Description
The present invention relates generally to surperficial fixable circuit protection device and the method for making this device.
As everyone knows, the resistivity of many electric conducting materials varies with temperature.Positive temperature coefficient (" PTC ") resistivity of material increases with material temperature.Many crystalline polymer of being made by dispersed electro-conductive filler conduction demonstrate this PTC effect.These polymer generally include and resemble polyethylene, polypropylene, the such polyolefin of ethylene/propene copolymer.Some doped ceramics as barium titanate so also demonstrates ptc characteristics.
When temperature is lower than a certain value, as critical or transformation temperature, ptc material shows low relatively, constant resistivity.Yet, along with increasing, the ptc material temperature surpasses this point, as long as temperature slightly increases, resistivity can sharply increase.
The polymer of electric device employing demonstration ptc characteristics and ceramic material are as the overcurrent protection in the circuit.Under the normal operating condition, load makes the electric current of the PTC device of flowing through relative less with the resistance of PTC device in circuit.Therefore, because I
2The unit temp that the R heating causes keeps below the critical or transformation temperature of PTC device.This device considered to be in poised state (promptly by I
2The heating rate that the R heating produces can equate to the heating rate that its periphery scatters and disappears with this device).
If load short circuit or circuit experience electric power impact, the electric current of the PTC device of flowing through increases and PTC unit temp (because I
2The R heating) sharply rises to critical temperature.This moment, a large amount of electric power is consumed on the PTC device, and that the PTC device becomes is unstable (i.e. the heating rate that produces of this device can scatter and disappear to its periphery greater than this device heating rate).Though the very short time (promptly one second branch several) only appears in this power consumption, owing to making the PTC unit temp rise to PTC device resistance, the power consumption of increase becomes very high value, to such an extent as to the electric current in the circuit is limited in a low relatively value.This new current value is enough kept the PTC device at new a, high-temperature/high resistance balance point, but will not damage circuit element.Therefore, when the PTC device was heated to its critical temperature range, the PTC device played the effect of fuse, reduced electric current to a safety of the short circuit load of flowing through, low relatively value.In case cut off electric current in the circuit, or removing and the relevant condition of short circuit (or electric power impact), the PTC device will be cooled to and get back to its normal running, low resistance state under its critical temperature.This effect be exactly can adjust again, circuit protection device.
Useful especially this device generally includes the PTC element that is clipped between a pair of laminated electrode.For this device is connected with other electric components, splicing ear is soldered to electrode usually.But welding process can have a negative impact to the resistance of the PTC element of polymer.And owing to common opposition side at the PTC element is electrically connected, this device takies more space usually on the PC plate.
We find now, are electrically connected to two important advantages that electrode produced from the same side of PTC device.The winding-structure of PTC device of the present invention makes an electrode that can be electrically connected on the PTC device opposition side.In addition, because electric device of the present invention is by being electrically connected around conductive layer around the PTC element roll, rather than places conductive layer by the hole in the PTC element and be electrically connected, this device has utilized whole PTC elements.And the necessary manufacturing step of electric device produced according to the invention allows to prepare simultaneously many tapes, and last tape finally is divided into a plurality of electric devices.Therefore, this method can reduce the resistance that volume also reduces electric device of the present invention thus.
On the one hand, the invention provides a kind of electric device, comprising:
Resistance element has the top and bottom face and first and second sides, and the every mask of top and bottom face has two end parts of being isolated by mid portion;
First electrode that electrically contacts with the resistance element end face and second electrode that electrically contacts with the resistance element bottom surface;
Contact the insulating barrier of first and second electrodes, insulating barrier has the part removed from first and second electroplaxs to form first and second contacts; And
The conductive layer that forms on insulating barrier and electrically contact in the contact with first and second electrodes, conductive layer has the part removed to form first and second terminals of being isolated by non-conductive gap.
In second aspect, the invention provides a kind of electric device, comprising:
By the laminated PTC element that polymers compositions and conductive filler component constitute, the PTC element has top and bottom face and first side and second side, and the every mask of top and bottom face has the pair of end part of being isolated by mid portion;
First electrode contact PTC component top surface, and second electrode contact PTC element bottom surface;
The insulating barrier that forms on first and second sides of first and second electrodes and PTC element, this insulating barrier have to remove with the part of determining first contact and from second electrode of the adjacent PTC element bottom end part of relative first contact from first electrode of adjacent PTC component top surface one end parts to be removed to determine the part of second contact;
On insulating barrier, form and contact first conductive layer of first and second electrodes in first and second contacts, this first conductive layer has from removing adjacent to the insulating barrier of PTC component top surface mid portion with the first that forms the first non-conductive gap and from removing adjacent to the insulating barrier of PTC element bottom surface mid portion forming the second portion in the second non-conductive gap, and
Second conductive layer that on first conductive layer, forms.
A third aspect of the present invention provides a kind of method of making electric device, comprises step:
Solid laminated PTC is provided sheet, has the top and bottom face, first electrode in that end face forms reaches second electrode that forms in the bottom surface;
In laminated PTC sheet, produce a plurality of tapes with regular pattern;
Apply the tape of laminated PTC sheet with insulating barrier;
In laminated PTC sheet, form a plurality of contacts with regular pattern on the top and bottom face of each tape;
With the tape in first conductive layer coating laminated PTC sheet, first conductive layer contacts with electrode in each contact;
In first conductive layer, form non-conductive gap with regular pattern on the top and bottom face of each tape in laminated PTC sheet; And
Each tape in the laminated PTC sheet is divided into a plurality of electric devices.
Last aspect of the present invention provides a kind of method of making electric device, comprises step:
The laminated resistance element is provided, has the top and bottom face and first and second sides, every mask of top and bottom face has the end parts of being isolated by mid portion;
On the PTC component top surface, form first electrode;
On PTC element bottom surface, form second electrode;
Apply first and second sides of first and second electrodes and PTC element with insulating barrier;
The first that removes insulating barrier is to form first contact;
The second portion of removing insulating barrier is to form second contact;
First conductive layer is applied to insulating barrier, first contact and second contact;
Remove first conductive layer part to form first and second terminals of isolating by non-conductive gap; And
Second conductive layer is applied to first conductive layer.
The present invention may be better understood with reference to following the detailed description and the accompanying drawings.The thickness of the various elements that show in the accompanying drawing and size are amplified greatly more to clearly illustrate electric device of the present invention.
Fig. 1 is the schematic top view according to electric device of the present invention.
Fig. 2 is the sectional view of first embodiment a-a along the line of the electric device shown in Fig. 1.
Fig. 3 is the sectional view of second embodiment a-a along the line of the electric device shown in Fig. 1.
Fig. 4 is the perspective view with laminated PTC sheet of a plurality of bands that produce with regular pattern.
Fig. 4 A is the perspective view with the laminated PTC sheet shown in a plurality of Fig. 4 that produce a plurality of breakpoints on each band.
Fig. 5 has the perspective view of the part amplification of the laminated PTC sheet of a plurality of bands as shown in Figure 4.
Fig. 6 A-6H shows each step of the method for optimizing of making electric device of the present invention, as is applied to the cross section of the single band of the PTC sheet among Fig. 4 A.
Fig. 7 A-7D shows the step of second method for optimizing of making electric component of the present invention, originates in device shown among Fig. 6 E.
Fig. 8 is the sectional view of the preferred embodiment that installs among the Fig. 1 that is welded on the PC plate.
The present invention allows many multi-form embodiment, and accompanying drawing shows and below will describe the preferred embodiment of the present invention in detail, but this openly is interpreted as the example of the principle of the invention.For example, usually with reference to following description the present invention of polymer PTC device with the electrode that is formed on the top and bottom face.However, it should be understood that the present invention's consideration has ceramic PTC element or do not show the electric device of the resistance element of PTC feature.
Usually, resistance element of the present invention is become to be grouped into by the PTC that comprises polymers compositions and conductive filler component.Polymers compositions can be single polymer or two or more different mixture of polymers of planting.Polymers compositions can comprise the polyolefin with at least 40% degree of crystallinity.Suitable polymer blend comprises polyethylene, polypropylene, polybutadiene, polyethylene acrylate, ethylene acrylic acid co polymer, and ethylene propylene copolymer.In a preferred embodiment, polymers compositions comprises that (this polymer is made by E.I.Du Pont Company (Du Pont) and with trade (brand) name Fusabond for polyethylene and maleic anhydride
TMSell).The conductive filler component runs through the polymers compositions diffusion to guarantee that composition shows ptc characteristics with sufficient amount.Method as an alternative, conductive filler can be by grafting to polymer.Generally, the about 25-75wt% of conductive filler ingredients constitute that exists in the PTC composition.The suitable conductive filler that uses among the present invention comprises powder, sheet or the ball of following metal: nickel, silver, gold, copper, silver-plated copper or metal alloy.Conductive filler also can comprise carbon black, carbon plate or carbon ball, or graphite.In a preferred embodiment, the conductive filler of the present invention's use is that carbon black is (by Columbian Chemicals Co. (Columbian Chemicals) manufacturing and with trade (brand) name Raven
TMSell).
Useful especially PTC composition resistivity is lower than 10 ohmcms in the time of about 25 ℃, especially less than 5 ohmcms, and especially less than 3 ohmcms.Be used for suitable PTC composition of the present invention and be disclosed in U.S. Patent application series No.08/614,038 and United States Patent(USP) Nos. 4,237,441,4,304,987,4,849,133,4,880,577,4,910,389 and 5,190,697.
The PTC element has first electrode that electrically contacts end face and second electrode that electrically contacts the bottom surface.Electrode can contact with the top and bottom face direct physical of PTC element, but electric device of the present invention also can comprise the conductive adhesion composition between electrode and PTC element.
In a preferred embodiment, the PTC element is sandwiched between two foil electrode to form lamination.Method can be used traditional electrodeless plating or the electrolytic plating process top and bottom surface forming electrode at the PTC element as an alternative.First and second electrodes preferably include the metal of choosing from the group that is made of nickel, copper, silver, tin, gold and its alloy.
With reference now to Fig. 1-3,, electric device 10 of the present invention comprises having end face 30, the resistance element 20 of bottom surface 40, the first sides 50 and second side 60.Two top and bottom faces 30,40 have by mid portion 90,90 ' two end parts 70,80 and 70 ', 80 ' of separating.First electrode 100 forms on the end face 30 of resistance element 20, and second electrode 110 forms on the bottom surface 40 of resistance element 20.As mentioned above, preferably resistance element 20 is become to be grouped into by polymer PTC.
Insulating barrier 120 forms on first side 50 of electrode 100,110 and resistance element 20 and second side 60.Insulating barrier 120 can be by photoresist, insulating material, and ceramic material, solder mask, or any non-conducting material is formed.Insulating barrier 120 have the part of removing from first electrode 100 so as to determine first contact 130 and the part removed from second electroplax 110 to determine second contact 140.In the preferred embodiment shown in Fig. 2-3, first contact 130 is contiguous with the end parts 70 of the end face 30 of resistance element 20, and the end parts 80 ' vicinity of the bottom surface 40 of second contact 140 and resistance element 20 (promptly, first and second contacts 130,140 are positioned at the opposition side and the end opposite of electric device 10).Though preferred this structure, the present invention has covered has the electric device that is positioned at along the contact Anywhere of first and second electrodes, as long as can be electrically connected to two electrodes from the homonymy of electric device.
First conductive layer 150 is formed on the insulating barrier 120 and in first and second contacts 130,140 and first and second electrodes 100,110 and contacts.Conductive layer 150 can be made up of any electric conducting material, but preferably includes the metal of choosing from the group that is made of copper, tin, silver, nickel, gold and its alloy.The first conductive layer coiling electric device side is extremely important.This winding-structure allows to be electrically connected to two electrodes from the homonymy of electric device.
First conductive layer 150 has the part of removing from insulating barrier 120 to form terminal 155,156.Each terminal comprises a contact.Terminal 155,156 is separated by non-conductive gap 160,170.Fig. 2-3 has shown an electric device 10, the mid portion 90,90 ' of the top and bottom face 30,40 of wherein contiguous resistance element 20 and form non-conductive gap 160,170.But, can think to need only non-conductive gap isolation terminal 155,156, each terminal comprises a contact, so non-conductive gap 160,170 can form any position in first conductive layer 150.This structure prevents that electric current is around electric device circulation.On the contrary, electric current can flow to first contact through a terminal around arbitrary end parts of electric device, and flows to second contact that forms by resistance element on the electric device opposition side.
Non-conductive gap 160,170 can form by traditional etch process.Among Fig. 2-3, non-conductive gap 160,170 stays blank, exposes insulating barrier 120 thus.Method as an alternative, non-conductive gap 160,170 can be by any non-conducting material filling.
With particular reference to Fig. 3, in a preferred embodiment of the invention, second conductive layer 180 forms on first conductive layer 150.Second conductive layer should not crossed over non-conductive gap 160,170 or any non-conducting material that can fill non-conductive gap 160,170.Second conductive layer 180 preferably allows device 10 easily to be connected to the solder compositions of the conducting terminal of PC plate.By applying first conductive layer 150 fully with second conductive layer 180, the electric device 10 of this preferred embodiment is symmetrical.Therefore, be installed on the PC plate or before being connected to other electric component, installing 10 and need not with the ad hoc fashion adjustment.But, can think that the present invention has covered a kind of electric device 10, wherein second conductive layer 180 only contacts the part of first conductive layer 150, or only contacts with first conductive layer 150 in a side of electric device, i.e. asymmetric unit.
Electric device of the present invention in the time of about 25 ℃ resistance less than 1 ohm, preferably less than 0.5 ohm, especially less than 0.2 ohm.
Electric device of the present invention can be made in every way.But, as shown in Figure 4, provide method for optimizing so that on sizable thin plate 185, carry out treatment step, thin plate 185 comprises a plurality of tapes 186,186 ', 186 " etc.Final treatment step comprises tape is divided into a plurality of electric devices.Thus, can economic mode make and have low-resistance minimum electric device.
In a preferred method, electrode forms on the top and bottom face of suitably big or small solid laminated PTC sheet.As mentioned above, preferably the PTC sheet is clipped between two foil electrode.Method is utilized traditional metallide or electrodeless plating technology as an alternative, but the electrode Direct Electroplating is on PTC sheet top and bottom face.With reference to Fig. 4, the laminated PTC sheet of qualification dug carve or punching press to produce a plurality of tapes 186,186 ', 186 " etc.Tape produces with regular pattern, and is preferably width W, is about the hope length of last electric device.For example, 6 inches of laminated PTC agreements that contracts a film or TV play to an actor or actress are wide, and 8 inches are long, and 0.015 inch is thick, can dig to carve or punching press produces a plurality of tapes 186,186 ', 186 " etc., about 7 inches long of tape, wide be about the 0.160-0.180 inch or below.The top and bottom face of each tape is made up of first and second electrodes 100,110.Carve or punching course owing to dig, the side of each tape is made up of PTC element 20.
After the PTC sheet of laminated is dug quarter, cross over each tape (Fig. 4 A) level and produce a plurality of breakpoints 187,187 ', 187 " ..., 187a, 187a ', 187a " ..., 187b, 187b ', 187b " ... etc.By apply minimum power on each breakpoint, breakpoint makes final tape be divided into a plurality of electric devices.Therefore, by blocking disconnected or grinding tape from the edge simply, last tape can be divided into a plurality of electric devices effectively.Laboratory test shows there is not breakpoint, and conductive layer when with traditional cutting and pruning technique tape being divided into electric device (following detailed description) is easily smeared.The conductive layer of smearing produces defective electric device and increases the short circuit possibility.
Usually, the part of the electrode of the top and bottom face by removing each tape on both produces breakpoint.This can be by finishing with stacked PTC sheet quarter, that limit that digs as shown in Figure 4 of wafer photoresist.Mask material is placed on the part of the photoresist that will develop or solidify, and stays the not masked area that a plurality of about 5 mil thick are crossed over each tape horizontal stretching.Best, masked area is not being dug quarter, forms with the direction identical with the direction of PTC composition elongation on the laminated PTC sheet of qualification.Because polymer chain is elongated in the direction of elongation in the PTC composition, the brittleness of PTC sheet is anisotropic.That is, to be parallel to prolonging direction in a direction (promptly perpendicular to prolonging direction) firm for the PTC sheet.Therefore, produce breakpoint by being parallel to prolonging direction, last tape can easily be divided into a plurality of electric devices.
Should produce not masked area with stay a plurality of have approximate last electric device and wanted width, as the mask part of 0.100-0.150 inch or smaller szie.Tape is exposed on ultraviolet ray down then, makes the not masked area degraded of photoresist thus.The photoresist of degraded is rinsed, with the exposed electrode surface part.The part of electrodes exposed is removed (for example, electrode surface exposed being placed ferric chloride solution) with traditional etching process then, therefore, produces a plurality of breakpoints.At last, by the PTC sheet being immersed in the wafer photoresist that develops or solidify as chemical scavenging in the potassium hydroxide solvent.
The cross-sectional view of the several tapes of laminated PTC sheet that amplify Fig. 5 display part.Though breakpoint will be carried out various treatment steps after the PTC sheet that digs quarter forms, for the sake of clarity, various treatment steps (shown in Fig. 6 A-6H and 7A-7D) are discussed with reference to the cross section of single tape.
Breakpoint produces back (Fig. 6 A) on each tape that digs laminated PTC sheet quarter, that limit, the tape of laminated PTC sheet applies with insulating barrier 120 (Fig. 6 B).With any of following conventional art: brush, lamination, immersion, screen printing or spraying can provide insulating barrier 120.Insulating barrier 120 can comprise any non-conducting material, and still, preferred material comprises photoresist, ceramic material, insulating material, or solder mask.
A plurality of contacts 130,140 form (Fig. 6 C-6D) with regular pattern on the top and bottom face of each tape.Can think, present invention includes certain methods, wherein insulating barrier 120 is applied to stay into producing contact 130,140 tape of initial exposed electrodes 100,110 parts.In addition, the present invention has covered the method that insulating barrier 120 is applied to all surfaces of each tape at first.Form contact 130,140 by the part of removing insulating barrier 120 then.For example, with reference to Fig. 6 B-6D, the photoresist of just working is as insulating barrier 120.With reference to the alphabetical M among Fig. 6 C, mask is applied to the photoresist part, this photoresist will develop on the surface of each tape or solidify, and stays to form the not photoresist part (the cross-hauling part of the insulating barrier as shown in Fig. 6 C) of the contact 130,140 of mask.Tape is exposed to ultraviolet ray down then, the not mask part of the photoresist of degrading thus.The photoresist of degraded is rinsed with exposed electrode surface (Fig. 6 D), therefore, forms a plurality of contacts on the top and bottom face of each tape.Use negative photoresist can put upside down this process (that is, be exposed to develop under the ultraviolet ray or solidify not mask material).
After a plurality of contacts 130,140 formed, first conductive layer 150 was added to (Fig. 6 E) on the tape.Can apply conductive layer 150 by traditional electroplating technology (as electrodeless plating).Method also can apply conductive layer to tape immersion, spraying or brush electric conducting material by liquid form as an alternative.In a preferred embodiment, first conductive layer 150 comprises the metal of choosing from the group that is made of nickel, copper, tin, silver, gold and alloy thereof.First conductive layer 150 must electrically contact with the electrode 100,110 at each place, contact that forms on tape.
Shown in Fig. 2-3 and 6E, the end parts of first conductive layer, 150 coiling electric devices 10.This winding-structure can make can be from electric device the same side two electrodes of electric contact.
In next step, a plurality of non-conductive gaps 160,170 are forming (Fig. 6 F-6G) with regular pattern on the top and bottom face of each tape in first conductive layer 150.Provide first conductive layer 150 at first by mode, can form non-conductive gap 160,170 with the insulating barrier 120 that stays exposure.But the present invention has also covered certain methods, and wherein each tape is coated fully by first conductive layer 150, and produces non-conductive gap 160,170 by the part of removing first conductive layer 150 with regular pattern on the top and bottom face of each tape.Arbitrary process causes forming a plurality of first and second terminals 155,156 of being isolated by non-conductive gap 160,170 on each tape.
For example, with reference to figure 6E-6G, the protection mask among Fig. 6 F shown in the reference letter M is added on the conductive layer 150, stays the predetermined portions (expose portion is partly represented by the cross-hauling of the conductive layer among Fig. 6 F 150) of exposure.Use traditional etch process then,, remove expose portion as expose portion is placed ferric chloride solution.
Method as an alternative, non-conductive gap 160,170 and terminal 155,156 can form in the following method.First conductive layer 150 is added to each tape, is coated with insulating layer coating 120 and contact 130,140 (Fig. 6 E).With reference now to Fig. 7 A-7D,, photoresist 190 is added on the conductive layer 150.If photoresist is used to form insulating barrier 120, second photoresist 190 that is used for this step so necessarily has opposite reaction (promptly to ultraviolet ray, if negative work photoresist is used to form insulating barrier, the photoresist of so just working must be used for forming non-conductive gap at conductive layer, and vice versa).Mask material shown in the reference letter M among Fig. 7 B is applied to outer photoresist layer 190, stays a plurality of parts of the top and bottom face of the layer 190 that exposes with regular pattern.Tape places ultraviolet ray down then, and the not mask of outer photoresist layer 190 is partly degraded.Rinse the degraded part of photoresist 190, stay the part (Fig. 7 C) of a plurality of first conductive layers 150 that on the top and bottom face of each tape, expose with regular pattern.Expose portion (the cross-hauling part of the conductive layer as shown in Fig. 7 C) by removing conductive layer 150 in the etching solution that tape is immersed in standard then.As a result, the part of insulating barrier 120 is exposed.Photoresist 190 outside (Fig. 7 D) removes under ultraviolet ray by further exposure tape then.Because during this step, the part of insulating barrier 120 is exposed, importantly, use photoresist 190, photoresist 190 is compared with the photoresist that may be used to form insulating barrier 120, and ultraviolet ray is had opposite reaction.
As the result of arbitrary process, promptly (1) is applied to the full surface of tape with conductive layer and removes the part of conductive layer then, or (2) beginning uses conductive layer in the mode of the insulating barrier part that stays exposure, forms first and second terminals 155,156.
In the preferred embodiment shown in Fig. 3 and the 6H, second conductive layer 180 is added to first conductive layer 150.Second conductive layer 180 preferably is made up of solder compositions and available any traditional handicraft applies, and comprises that metallide or scolder soak.Solder layer makes electric device 10 of the present invention easily connect the conducting terminal of PC plate.
In the step in the end, at each breakpoint place, tape is divided into a plurality of electric devices, and each device has a contact point and a non-conductive gap in the both sides (that is top and bottom) of device like this.As mentioned above, by applying minimum pressure simply at each breakpoint, tape can be divided into a plurality of electric devices.
With reference to figure 8, arrow is represented the flow through direction of device of electric current.Terminal allows electric current to flow to first electrode of first contact from PC plate conducting end winding apparatus outer rim (through the first terminal).Electric current flows to second electrode through the PTC element then.Electric current is through the contact of second terminal bleeder and continue to flow through the remainder of circuit.
Claims (42)
1, a kind of electric device comprises:
Resistance element has the top and bottom face and first and second sides, and the every mask of top and bottom face has two end parts of being isolated by mid portion;
First electrode that electrically contacts with the resistance element end face and second electrode that electrically contacts with the resistance element bottom surface;
Contact the insulating barrier of first and second electrodes, insulating barrier has the part removed from first and second electrodes to form first and second contacts; And
The conductive layer that forms on insulating barrier and electrically contact in the contact with first and second electrodes, conductive layer has the part removed to form first and second terminals of being isolated by non-conductive gap.
2,, it is characterized in that resistance element presents ptc characteristics according to the electric device of claim 1.
3,, it is characterized in that resistance element comprises conducting polymer according to the electric device of claim 2.
4,, it is characterized in that second conductive layer forms on first and second terminals according to the electric device of claim 1.
5,, it is characterized in that the top end branch of first contact, and second contact is adjacent to the resistance element bottom end part of relative first contact adjacent to resistance element according to the electric device of claim 1.
6,, it is characterized in that the first current interruptions gap adjacent to resistance element end face mid portion, and the second current interruptions gap is adjacent to resistance element bottom surface mid portion according to the electric device of claim 1.
7,, it is characterized in that first conductive layer comprises the metal of choosing from the group that is made of tin, silver, copper, nickel, gold and alloy thereof according to the electric device of claim 1.
8,, it is characterized in that second conductive layer comprises scolder according to the electric device of claim 4.
9,, it is characterized in that insulating barrier is from by photoresistance, insulate the material of choosing in the group that pottery and solder mask are formed according to the electric device of claim 1.
10, a kind of electric device comprises:
By the laminated PTC element that polymers compositions and conductive filler component constitute, the PTC element has top and bottom face and first side and second side, and the every mask of top and bottom face has the pair of end part of being isolated by mid portion;
First electrode contact PTC component top surface, and second electrode contact PTC element bottom surface;
The insulating barrier that forms on first and second sides of first and second electrodes and PTC element, this insulating barrier have to remove with the part of determining first contact and from second electrode of adjacent PTC element bottom surface one end parts of relative first contact from first electrode of adjacent PTC component top surface one end parts to be removed to determine the part of second contact;
On insulating barrier, form and contact first conductive layer of first and second electrodes in first and second contacts, this first conductive layer has from removing adjacent to the insulating barrier of PTC component top surface mid portion with the first that forms the first non-conductive gap and from removing adjacent to the insulating barrier of PTC element bottom surface mid portion forming the second portion in the second non-conductive gap, and
Second conductive layer that on first conductive layer, forms.
11,, it is characterized in that the resistance of this device in the time of about 25 ℃ is less than 1 ohm according to the electric device of claim 10.
12,, it is characterized in that the resistivity of PTC element in the time of about 25 ℃ is less than 3 ohmcms according to the electric device of claim 10.
13,, it is characterized in that first and second electrodes are metals of choosing from the group by nickel, copper, silver, tin, gold and alloy composition thereof according to the electric device of claim 10.
14,, it is characterized in that insulating barrier is from by photoresistance, insulate the material of choosing in the group that pottery and solder mask are formed according to the electric device of claim 10.
15,, it is characterized in that first conductive layer is the metal of choosing from the group by nickel, copper, silver, tin, gold and alloy composition thereof according to the electric device of claim 10.
16,, it is characterized in that the contact of second conductive layer and cover first conductive layer fully according to the electric device of claim 10.
17,, it is characterized in that second conductive layer comprises scolder according to the electric device of claim 10.
18, a kind of method of making electric device comprises step:
Solid laminated PTC is provided sheet, has the top and bottom face, first electrode in that end face forms reaches second electrode that forms in the bottom surface;
In laminated PTC sheet, produce a plurality of tapes with regular pattern;
Apply the tape of laminated PTC sheet with insulating barrier;
In laminated PTC sheet, form a plurality of contacts with regular pattern on the top and bottom face of each tape;
With the tape in first conductive layer coating laminated PTC sheet, first conductive layer contacts with electrode in each contact;
In first conductive layer, form non-conductive gap with regular pattern on the top and bottom face of each tape in laminated PTC sheet; And
Each tape in the laminated PTC sheet is divided into a plurality of electric devices.
19,, it is characterized in that before tape is coated with insulating layer coating, on each tape top and bottom face, forming a plurality of breakpoints according to the method for claim 18.
20,, it is characterized in that each tape in laminated PTC sheet forms second conductive layer before being divided into a plurality of electric components on first conductive layer according to the method for claim 18.
21, according to the method for claim 18, the step that it is characterized in that on the top and bottom face of PTC sheet forming first and second electrodes comprises this PTC sheet is layered between the pair of metal thin slice.
22,, it is characterized in that the step that forms first and second electrodes on the top and bottom face of PTC sheet comprises electrodeless plating according to the method for claim 18.
23,, it is characterized in that the step that forms first and second electrodes on the top and bottom face of PTC sheet comprises metallide according to the method for claim 18.
24,, it is characterized in that insulating barrier is from by photoresistance, insulate the material of choosing in the group that pottery and solder mask are formed according to the method for claim 18.
25,, it is characterized in that the step that applies tape in the laminated PTC sheet with insulating barrier comprises the insulating barrier screen printing to tape according to the method for claim 18.
26,, it is characterized in that first conductive layer is the metal of choosing from the group by copper, tin, nickel, silver, gold and alloy composition thereof according to the method for claim 18.
27,, it is characterized in that exposing insulating barrier thus by etching first conductive layer part forms a plurality of non-conductive gaps according to the method for claim 18.
28,, it is characterized in that second conductive layer comprises scolder and is applied to first conductive layer by metallide or scolder immersion according to the method for claim 18.
29, according to the method for claim 18, it is characterized in that the tape that in laminated PTC sheet, produces, width is W, less than 0.20 inch.
30,, it is characterized in that the step that each tape is divided into a plurality of electric devices comprised to breakpoint and exert pressure according to the method for claim 19.
31, according to the method for claim 18, each the electric device area that it is characterized in that forming is less than 0.060 inch.
32, a kind of method of making electric device comprises step:
The laminated resistance element is provided, has the top and bottom face and first and second sides, every mask of top and bottom face has the end parts of being isolated by mid portion;
On the end face of resistance element, form first electrode;
On the bottom surface of resistance element, form second electrode;
Apply first and second sides of first and second electrodes and resistance element with insulating barrier;
The first that removes insulating barrier is to form first contact;
The second portion of removing insulating barrier is to form second contact;
First conductive layer is applied to insulating barrier, first contact and second contact;
Remove first conductive layer part to form first and second terminals of isolating by non-conductive gap; And
Second conductive layer is applied to first conductive layer.
33,, it is characterized in that resistance element presents ptc characteristics according to the method for claim 32.
34,, it is characterized in that resistance element comprises polymers compositions and conductive filler component according to the method for claim 32.
35,, it is characterized in that polymers compositions comprises polyethylene according to the method for claim 34.
36,, it is characterized in that polymers compositions comprises polyethylene and maleic anhydride according to the method for claim 34.
37,, it is characterized in that second conductive layer comprises scolder according to the method for claim 32.
38,, it is characterized in that first and second electrodes comprise nickel according to the method for claim 32.
39, a kind of method of making electric device comprises step:
Solid laminated conducting strip is provided, has the top and bottom face, first electrode that on end face, forms, second electrode that on the bottom surface, forms;
In the laminated conducting strip, produce a plurality of tapes with regular pattern;
With the tape in the insulating barrier coating laminated conducting strip;
In the laminated conducting strip, form a plurality of contacts with regular pattern on the top and bottom face of each tape;
With the tape in first conductive layer coating laminated conducting strip, first conductive layer contacts with electrode in each contact;
In first conductive layer, form a plurality of non-conductive gaps with regular pattern on the top and bottom face of each tape in the laminated conducting strip; And
Each tape in the laminated conducting strip is divided into a plurality of electric devices.
40,, it is characterized in that the laminated conducting strip presents ptc characteristics according to the method for claim 39.
41,, it is characterized in that before tape is coated with insulating layer coating, on the top and bottom face of each tape, forming a plurality of breakpoints according to the method for claim 39.
42,, it is characterized in that each tape in the laminated conducting strip forms second conductive layer before being divided into a plurality of electric devices on first conductive layer according to the method for claim 39.
Applications Claiming Priority (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1042096P | 1996-01-22 | 1996-01-22 | |
| US1032096P | 1996-01-22 | 1996-01-22 | |
| US60/010,320 | 1996-01-22 | ||
| US60/010,420 | 1996-01-22 | ||
| US08/642,597 | 1996-05-03 | ||
| US08/642,597 US5900800A (en) | 1996-01-22 | 1996-05-03 | Surface mountable electrical device comprising a PTC element |
| US08/642,655 | 1996-05-03 | ||
| US08/642,655 US5699607A (en) | 1996-01-22 | 1996-05-03 | Process for manufacturing an electrical device comprising a PTC element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1212072A true CN1212072A (en) | 1999-03-24 |
Family
ID=27486000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN97192553A Pending CN1212072A (en) | 1996-01-22 | 1997-01-21 | Surface mountable electrical device comprising PTC element |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0922286A1 (en) |
| JP (1) | JPH11509689A (en) |
| KR (1) | KR19990081968A (en) |
| CN (1) | CN1212072A (en) |
| AU (1) | AU1953697A (en) |
| WO (1) | WO1997028543A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101477859B (en) * | 2009-01-16 | 2011-11-30 | 上海科特高分子材料有限公司 | Novel surface mounting type thermistor and manufacturing method thereof |
| CN103093909A (en) * | 2011-11-03 | 2013-05-08 | 瑞侃电子(上海)有限公司 | Circuit protection device and its manufacturing method |
| CN106828021A (en) * | 2017-03-03 | 2017-06-13 | 镇江海姆霍兹传热传动系统有限公司 | Auto heater temperature sensor |
| CN109565136A (en) * | 2016-06-10 | 2019-04-02 | 莫列斯有限公司 | Electronic component |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6023403A (en) * | 1996-05-03 | 2000-02-08 | Littlefuse, Inc. | Surface mountable electrical device comprising a PTC and fusible element |
| JP3758408B2 (en) * | 1998-06-24 | 2006-03-22 | 株式会社村田製作所 | Ceramic electronic components |
| US6854176B2 (en) * | 1999-09-14 | 2005-02-15 | Tyco Electronics Corporation | Process for manufacturing a composite polymeric circuit protection device |
| KR100495131B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | method of positive temperature coefficient electrical device for surface mounting |
| KR100495128B1 (en) * | 2002-11-19 | 2005-06-14 | 엘에스전선 주식회사 | Surface mountable electric device using electrical wire |
| CN202632918U (en) * | 2012-04-11 | 2012-12-26 | 瑞侃电子(上海)有限公司 | Circuit protective device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166656A (en) * | 1992-02-28 | 1992-11-24 | Avx Corporation | Thin film surface mount fuses |
| US5552757A (en) * | 1994-05-27 | 1996-09-03 | Littelfuse, Inc. | Surface-mounted fuse device |
| DE69608440T2 (en) * | 1995-06-07 | 2001-01-04 | Littelfuse, Inc. | METHOD AND DEVICE FOR AN SMD ELEMENT FOR PROTECTING THE ELECTRICAL COMPONENTS AGAINST ESD |
-
1997
- 1997-01-21 CN CN97192553A patent/CN1212072A/en active Pending
- 1997-01-21 JP JP9527886A patent/JPH11509689A/en active Pending
- 1997-01-21 EP EP97907561A patent/EP0922286A1/en not_active Withdrawn
- 1997-01-21 AU AU19536/97A patent/AU1953697A/en not_active Abandoned
- 1997-01-21 WO PCT/US1997/001719 patent/WO1997028543A1/en active IP Right Grant
- 1997-01-21 KR KR1019980705686A patent/KR19990081968A/en active IP Right Grant
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101477859B (en) * | 2009-01-16 | 2011-11-30 | 上海科特高分子材料有限公司 | Novel surface mounting type thermistor and manufacturing method thereof |
| CN103093909A (en) * | 2011-11-03 | 2013-05-08 | 瑞侃电子(上海)有限公司 | Circuit protection device and its manufacturing method |
| CN109565136A (en) * | 2016-06-10 | 2019-04-02 | 莫列斯有限公司 | Electronic component |
| US10636549B2 (en) | 2016-06-10 | 2020-04-28 | Molex, Llc | Electronic component |
| CN109565136B (en) * | 2016-06-10 | 2020-10-23 | 莫列斯有限公司 | Electronic component |
| CN106828021A (en) * | 2017-03-03 | 2017-06-13 | 镇江海姆霍兹传热传动系统有限公司 | Auto heater temperature sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11509689A (en) | 1999-08-24 |
| AU1953697A (en) | 1997-08-22 |
| EP0922286A1 (en) | 1999-06-16 |
| WO1997028543A1 (en) | 1997-08-07 |
| KR19990081968A (en) | 1999-11-15 |
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