CN101477859B - Novel surface mounting type thermistor and manufacturing method thereof - Google Patents
Novel surface mounting type thermistor and manufacturing method thereof Download PDFInfo
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- CN101477859B CN101477859B CN2009100454821A CN200910045482A CN101477859B CN 101477859 B CN101477859 B CN 101477859B CN 2009100454821 A CN2009100454821 A CN 2009100454821A CN 200910045482 A CN200910045482 A CN 200910045482A CN 101477859 B CN101477859 B CN 101477859B
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Abstract
The invention relates to a novel surface mount type thermistor which comprises a conductive module and a left and a right conductive metal layers; the conductive module comprises a core conductive module and an insulating layer covers the upper surface, the lower surface, the left side surface and the right side surface of the core conductive module; the core conductive module comprises at least a conductive element; two conductive elements are separated by an insulating material layer; the conductive element comprises upper metal foil, a conductive polymer chip with PTC characteristics, and lower metal foil successively attached with each other from top to bottom; the left and the right conductive metal layers are attached to the left and the right parts of the conductive module respectively and locally passes through the insulating layer, so that the left and the right conductive metal layers are connected with two metal foil of the conductive element respectively; and the conductive element further comprises two resistance coatings attached to the upper surface and the lower surface of the conductive module and used for separating the left and the right metal layers. The invention further provides a corresponding manufacturing method. The novel thermistor has the advantages of superior performance and high product qualification ratio, and the manufacturing method thereof has the advantages of special process, no etching, environmental friendliness, greatly reduced cost, steady process, high precision and high yield.
Description
Technical field
The present invention relates to the thermistor technology field, more specifically, relate to the surface mounting type thermistor technical field, be meant novel surface mounting type thermistor and manufacture method thereof especially.
Background technology
Positive temperature coefficient (PTC, Positive Temperature Coefficient) performance thermistor has been widely used in the circuit protection in the 6C industrial fields such as computer, communication, consumer electronics, automobile, path, digital content.Its operation principle is: when the circuit operate as normal, and PTC thermistor resistance R
0The very little electric current that do not hinder passes through; And when overcurrent, overload or fault such as overheated appearred in circuit, the thermistor gauge surface temperature rose rapidly, and moment rises to high-impedance state when surpassing switch temperature, thereby in time the restricting circuits electric current is to very low-level protective circuit; After fault was got rid of, the PTC thermistor cooled off rapidly and returns to former low resistive state, and circuit recovers this thermistor of normal back and can reuse once more.
In the high-density line manufacturing field of 6C industry, electronic component need reach the surface mount requirement, and therefore, the surface mountization of PTC thermistor element has become development trend.Yet present surface attaching type PTC thermistor all has the some shortcomings part in design and manufacturing, below, to the manufacturing process and the structural design of PTC thermistor were illustrated in the past.
When the various surface attaching type ptc characteristics thermistors of disclosed in the past technology (as Chinese patent application prospectus CN 1291775A, CN 2569298Y, CN2591719Y etc.) announcement are made, all inevitably pass through the etch process of surface metal foil, etch process now generally adopts chemical method for etching.But chemical method for etching has inborn shortcoming technically, one, and the used etching solution environmental pollution of technology is serious, and human body and plant equipment are also had bigger harm; Its two, technology opening precision is relatively poor, rate of finished products is relatively low; Its three, the etching subsequent handling easily makes etched figure produce anomalies such as drift, dislocation, makes the technology instability.In addition, in the various surface attaching type ptc characteristics thermistor structures that in the past disclosed, form etching region in the metal forming upper and lower surface through etching often, influence its effective usable floor area like this, and its when being welded to circuit board the welding position skew have the short circuit of causing may.
Therefore, a kind of low cost need be provided, benefit environmental protection, the rate of finished products height, need not etched surface mounting type thermistor manufacture method, the surface attaching type ptc characteristics thermistor superior performance, the product percent of pass height that adopt this method to make.
Summary of the invention
Main purpose of the present invention is exactly the problems and shortcomings at above existence, novel surface mounting type thermistor and manufacture method thereof are provided, this novel surface mounting type thermistor superior performance, product percent of pass height, its manufacturing approach craft uniqueness, need not etching, benefit environmental protection, cost reduction greatly, process stabilizing, precision height, rate of finished products height.
To achieve these goals, in a first aspect of the present invention, a kind of novel surface mounting type thermistor is provided, be characterized in, comprise conductive module, left side conductive metal layer and right conductive metal layer, described conductive module comprises core conductive module and insulating barrier, described insulating barrier coats described core conductive module upper and lower surface and left and right side, described core conductive module comprises a conductive unit, described conductive unit comprises the last metal forming of fitting successively from top to bottom, have the electric conductive polymer chip of ptc characteristics and following metal forming, described conductive module left part and right part and locally wear that described insulating barrier is gone up metal forming/following metal forming with described conductive unit described respectively and described metal forming down/upward metal forming is connected thereby described left conductive metal layer and described right conductive metal layer are fitted respectively.
Preferable, described insulating barrier comprises insulating barrier, following insulating barrier, left insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, and described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module.
Better, described upward insulating barrier and described insulating barrier down are respectively upper nonconductive Film and following dielectric film, described left insulating barrier and described right insulating barrier are respectively left insulating cement and right insulating cement.
Better, described left conductive metal layer part wears described left insulating barrier, and described right conductive metal layer part wears described right insulating barrier, thereby is connected with described metal forming down with the described metal forming that goes up of described conductive unit respectively.
More preferably, described left conductive metal layer part wears the described insulating barrier of going up, and described right conductive metal layer part wears described insulating barrier down, thereby is connected with described metal forming down with the described metal forming that goes up of described conductive unit respectively.
Preferable, described electric conductive polymer chip is to mix the back by at least a crystalline polymer, conducting filler and processing aid to make by processing methods such as twin-screw extrusion calendarings.
Preferable, described upward metal forming, described metal forming, described left conductive metal layer and described right conductive metal layer down are selected from one or more in copper, iron, nickel, tin, silver, the gold respectively, certainly, can also adopt other suitable metals; Described insulating barrier and described insulation material layer are selected from one or more in acrylic resin, bisphenol epoxy, epoxidation phenolic aldehyde, the silicones respectively, or glass-fiber reinforced mixture, certainly, can also adopt other suitable insulative materials.
Preferable, the thickness of described electric conductive polymer chip is 0.10～5mm.
Preferable, described left conductive metal layer and described right conducting metal are U type thin-wall metal layer.
Preferable, also comprise resistance plated film and resistance plated film down, described resistance plated film and the described plated film of resistance down gone up is fitted in described conductive module upper and lower surface respectively and is used for intercepting and opens described left conductive metal layer and described right conductive metal layer.
Better, described upward resistance plated film and the described plated film of resistance down are selected from one or more in acrylic resin, epoxy resin, the silicones respectively, certainly, can also adopt other proper polymer polymeric materials.
In a second aspect of the present invention, a kind of manufacture method of above-mentioned novel surface mounting type thermistor is provided, be characterized in, comprise step:
A. make described electric conductive polymer chip,, promptly go up metal forming and following metal forming in described electric conductive polymer chip upper and lower surface two metal formings of fitting respectively, thus the formation conductive unit;
B. with described conductive unit directly as described core conductive module;
C. described insulating barrier is coated the described upper and lower surface and the described left and right side of described core conductive module, thereby form described conductive module;
D. described insulating barrier is slotted by physical refining processes, two described metal formings of described conductive unit are partly exposed;
E. described left conductive metal layer and described right conductive metal layer are fitted in the described left part and the described right part of described conductive module, and are connected with two described metal formings of described conductive unit respectively; Perhaps, resistance plated film and resistance plated film down on the zone line of the upper and lower surface of described conductive module is fitted respectively, carry out integral body then and electroplate, thereby form described left conductive metal layer and the described right conductive metal layer that is connected with two described metal formings of described conductive unit respectively.
Preferable, in described step a, described electric conductive polymer chip is to mix the back by at least a crystalline polymer, conducting filler and processing aid to make by twin-screw extrusion calendaring machine.
Preferable, in step a, the thickness of described electric conductive polymer chip is 0.10～5mm.
Preferable, described upward metal forming, described metal forming, described left conductive metal layer and described right conductive metal layer down are selected from one or more in copper, iron, nickel, tin, silver, the gold respectively, certainly, can also adopt other suitable metals; Described insulating barrier and described insulation material layer are selected from one or more in bisphenol epoxy, epoxidation phenolic aldehyde, the silicones respectively, or glass-fiber reinforced mixture, certainly, can also adopt other suitable insulative materials; Described upward resistance plated film and the described plated film of resistance down are selected from one or more in acrylic resin, epoxy resin, the silicones respectively, certainly, can also adopt other proper polymer polymeric materials.
Preferable, in described step c, described insulating barrier comprises insulating barrier, following insulating barrier, left insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, and described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module.
Better, by on the described left and right side of described core conductive module, being coated with insulating cement respectively, and make its curing, thereby form described left insulating barrier and described right insulating barrier.
Preferable, in described steps d, described physical refining processes is including, but not limited to laser processing.
Preferable, behind described step b, before described step c, also comprise step: described core conductive module is cut into suitable shape.
In a third aspect of the present invention, a kind of novel surface mounting type thermistor also is provided, be characterized in, comprise conductive module, left side conductive metal layer and right conductive metal layer, described conductive module comprises core conductive module and insulating barrier, described insulating barrier coats described core conductive module upper and lower surface and left and right side, described core conductive module comprises at least two conductive units that stack gradually, interval one insulation material layer between two conductive units, described conductive unit comprises the last metal forming of fitting successively from top to bottom, have the electric conductive polymer chip of ptc characteristics and following metal forming, described conductive module left part and right part and locally wear that described insulating barrier is gone up metal forming/following metal forming with described conductive unit described respectively and described metal forming down/upward metal forming is connected thereby described left conductive metal layer and described right conductive metal layer are fitted respectively.
Preferable, described insulating barrier comprises insulating barrier, following insulating barrier, left insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, and described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module.
Better, described upward insulating barrier and described insulating barrier down are respectively upper nonconductive Film and following dielectric film, described left insulating barrier and described right insulating barrier are respectively left insulating cement and right insulating cement.
Better, the number of described conductive unit is two.Obviously, the number of conductive unit can be determined concrete number according to actual needs more than 2.
Further, thereby described left conductive metal layer part wears described left insulating barrier and a described conductive unit described go up metal forming and another described conductive unit described metal forming down is connected, thereby described right conductive metal layer part wears described right insulating barrier and a described conductive unit describedly descends that metal forming is connected on metal forming and another described conductive unit described.
Further, thereby described left conductive metal layer part wear described go up insulating barrier and described insulating barrier down and a described conductive unit described go up metal forming and another described conductive unit described metal forming down is connected, the described upward metal forming of metal forming and another described conductive unit is connected under described right insulating barrier and a described conductive unit described thereby described right conductive metal layer part wears.
Preferable, described electric conductive polymer chip is to mix the back by at least a crystalline polymer, conducting filler and processing aid to make by processing methods such as twin-screw extrusion calendarings.
Preferable, described upward metal forming, described metal forming, described left conductive metal layer and described right conductive metal layer down are selected from one or more in copper, iron, nickel, tin, silver, the gold respectively, certainly, can also adopt other suitable metals; Described insulating barrier and described insulation material layer are selected from one or more in acrylic resin, bisphenol epoxy, epoxidation phenolic aldehyde, the silicones respectively, or glass-fiber reinforced mixture, certainly, can also adopt other suitable insulative materials.
Preferable, the thickness of described electric conductive polymer chip is 0.10～5mm.
Preferable, described left conductive metal layer and described right conducting metal are U type thin-wall metal layer.
Preferable, also comprise resistance plated film and resistance plated film down, described resistance plated film and the described plated film of resistance down gone up is fitted in described conductive module upper and lower surface respectively and is used for intercepting and opens described left conductive metal layer and described right conductive metal layer.
Better, described upward resistance plated film and the described plated film of resistance down are selected from one or more in acrylic resin, epoxy resin, the silicones respectively, certainly, can also adopt other proper polymer polymeric materials.
In a fourth aspect of the present invention, a kind of manufacture method of above-mentioned novel surface mounting type thermistor is provided, be characterized in, comprise step:
A. make described electric conductive polymer chip,, promptly go up metal forming and following metal forming in described electric conductive polymer chip upper and lower surface two metal formings of fitting respectively, thus the formation conductive unit;
B. adopt two or more described conductive units, stack gradually, the described insulation material layer in interval between the two described conductive units, thus form described core conductive module;
C. described insulating barrier is coated the described upper and lower surface and the described left and right side of described core conductive module, thereby form described conductive module;
D. described insulating barrier is slotted by physical refining processes, two described metal formings of described conductive unit are partly exposed;
E. described left conductive metal layer and described right conductive metal layer are fitted in the described left part and the described right part of described conductive module, and are connected with two described metal formings of described conductive unit respectively; Perhaps, resistance plated film and resistance plated film down on the zone line of the upper and lower surface of described conductive module is fitted respectively, carry out integral body then and electroplate, thereby form described left conductive metal layer and the described right conductive metal layer that is connected with two described metal formings of described conductive unit respectively.
Preferable, in described step a, described electric conductive polymer chip is to mix the back by at least a crystalline polymer, conducting filler and processing aid to make by twin-screw extrusion calendaring machine.
Preferable, in step a, the thickness of described electric conductive polymer chip is 0.10～5mm.
Preferable, described upward metal forming, described metal forming, described left conductive metal layer and described right conductive metal layer down are selected from one or more in copper, iron, nickel, tin, silver, the gold respectively, certainly, can also adopt other suitable metals; Described insulating barrier and described insulation material layer are selected from one or more in bisphenol epoxy, epoxidation phenolic aldehyde, the silicones respectively, or glass-fiber reinforced mixture, certainly, can also adopt other suitable insulative materials; Described upward resistance plated film and the described plated film of resistance down are selected from one or more in acrylic resin, epoxy resin, the silicones respectively, certainly, can also adopt other proper polymer polymeric materials.
Preferable, in described step c, described insulating barrier comprises insulating barrier, following insulating barrier, left insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, and described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module.
Better, by on the described left and right side of described core conductive module, being coated with insulating cement respectively, and make its curing, thereby form described left insulating barrier and described right insulating barrier.
Preferable, in described steps d, described physical refining processes is including, but not limited to laser processing.
Preferable, behind described step b, before described step c, also comprise step: described core conductive module is cut into suitable shape.
Beneficial effect of the present invention is specially: novel surface mounting type thermistor novel structure of the present invention, superior performance, product percent of pass height and manufacturing process uniqueness, adopt its manufacture method, need not to carry out etching work procedure in metal foil surface, carry out Physical Processing (for example laser gasification) operation as long as the four sides up and down that forms is had the two described insulating cements (or two described dielectric films or a described insulating cement and a described dielectric film) of the conductive module of insulating barrier, make metal forming partly expose out, be connected with two electroplated metal layers fitted in the outside respectively and get final product.The contrast traditional handicraft, use above-mentioned novel surface mounting type thermistor of the present invention and manufacture method that following advantage is arranged:
(1) easily by the closed conduit recycling, so be beneficial to environmental protection, there is not the environmental pollution important disadvantages that is similar to etching solution in the organic granular material behind Physical Processing (for example laser processing etc.) fluting;
(2) Physical Processing (for example laser processing etc.) fluting cost (the about 0.01 yuan/part of individual layer PTC element, multilayer PTC element cost increases less) with respect to chemical etching cost (the about 0.08 yuan/part of individual layer PTC element, multilayer PTC element cost is multiplied) lower, thus save a large amount of production costs;
(3) be not prone to and be similar to etched figure and easily produce unusual defective such as drift, dislocation, Physical Processing (for example laser processing etc.) grooving processes is more stable;
(4) Physical Processing fluting precision height, for example laser processing isoline precision can reach 0.05mm, and the laser processing live width also can reach 0.05mm, and the relative traditional handicraft of rate of finished products is higher.
Description of drawings
Figure 1A is the schematic perspective view of first specific embodiment of novel surface mounting type thermistor of the present invention.
Figure 1B～Fig. 1 I is the manufacture process schematic diagram of first specific embodiment shown in Figure 1A.
Fig. 2 A is the schematic perspective view of second specific embodiment of novel surface mounting type thermistor of the present invention.
Fig. 2 B～Fig. 2 D is the part manufacture process schematic diagram of second specific embodiment shown in Fig. 2 A.
Fig. 3 A is the schematic perspective view of the 3rd specific embodiment of novel surface mounting type thermistor of the present invention.
Fig. 3 B～Fig. 3 E is the part manufacture process schematic diagram of the 3rd specific embodiment shown in Fig. 3 A.
Fig. 4 A is the schematic perspective view of the 4th specific embodiment of novel surface mounting type thermistor of the present invention.
Fig. 4 B～Fig. 4 G is the manufacture process schematic diagram of the 4th specific embodiment shown in Fig. 4 A.
Fig. 5 A is the schematic perspective view of the 5th specific embodiment of novel surface mounting type thermistor of the present invention.
Embodiment
Content for a better understanding of the present invention is described further below in conjunction with specific embodiment.
Surface attaching type ptc characteristics thermistor and manufacture method thereof below with reference to Figure 1A～Fig. 1 I explanation embodiments of the invention 1.
Figure 1A is the structure chart of the surface attaching type ptc characteristics thermistor of embodiments of the invention 1.
In Figure 1A, the electric conductive polymer chip 3 of ptc characteristics is the high molecular polymer lamellar body that is made of mixtures such as one or more crystalline polymers, conducting filler and processing aids; Metal forming 2 evenly is covered in electric conductive polymer chip 3 upper and lower surfaces of above-mentioned ptc characteristics; Dielectric film 1 evenly is close on above-mentioned two metal formings 2 surfaces; Insulating cement 4 is coated electric conductive polymer chip 3 left and right sides faces of above-mentioned ptc characteristics, and the insulating cement 4 of both sides forms four parts altogether; Resistance plated film 5 evenly is close on dielectric film 1 zone line of above-mentioned upper and lower surface, and the resistance plated film 5 of both sides forms two parts altogether up and down; In the gap of both sides insulating cement 4, form each side one Physical Processing slotted zones, the plated conductive metal level 6 at two ends is good is attached to metal forming 2 surfaces in insulating cement 4, dielectric film 1 and the Physical Processing slotted zones, makes two ends, left and right sides plated conductive metal level 6 and above-mentioned two sides metal forming 2 keep good being electrically connected.
Below with reference to Figure 1A～Fig. 1 I, the manufacture method of the surface attaching type ptc characteristics thermistor of embodiments of the invention 1 is described.
At first, with raw materials such as one or more crystalline polymers, conducting filler and processing aid mix that to make gross thickness by twin-screw extrusion calendaring machine respectively be 0.10～5mm, core conductive module shown in Figure 1B, the characteristics of its operation gained core conductive module are that metal forming 2 closely laminates on electric conductive polymer chip 3 upper and lower surfaces;
Then, respectively laminate one deck dielectric film 1, form the thin slice shown in Fig. 1 C at above-mentioned core conductive module upper and lower surface;
Be cut to a rule Rack, the bar shaped thin slice shown in Fig. 1 D again; Perhaps cutting before laminating dielectric film 1; And if the thin slice shown in Fig. 1 C was exactly suitable dimension originally, just needn't cut;
Then, each side be coated with one deck insulating cement 4 and it is solidified, make that the four sides all covers insulating barrier about the reaching up and down of core conductive module, thereby form the conductive module precursor shown in Fig. 1 E at above-mentioned bar shaped thin slice;
Then on the face of the left and right sides of above-mentioned conductive module precursor, by physical refining processes (for example laser processing etc.) outside insulating cover surface fluting the interior metal paper tinsel is partly exposed, form and shown in Fig. 1 F, have the conductive module that forms Physical Processing slotted zones (among Fig. 1 F shown in the circle);
, at above-mentioned conductive module upper and lower surface zone line respectively be coated with one deck resistance plated film 5, form thin slice shown in Fig. 1 G thereafter;
After with its whole plating, form and have conductive metal layer 6, the bar shaped thin slice shown in Fig. 1 H;
At last, thin strip piece shown in Fig. 1 H cut into have the single surface attaching type element of given size, shown in Fig. 1 I, if the size of the thin strip piece shown in Fig. 1 H was exactly single surface attaching type size of component originally, just need not to cut, its concrete structure figure sees also Figure 1A.
In the above-mentioned technology, coating resistance plated film 5 operations and the interchangeable operation of Physical Processing fluting operation, it does not influence the manufacturing of described surface attaching type ptc characteristics thermistor.
Here, only be aimed at the product concrete structure its manufacturing process is described, the concrete parameter of each operation is not done careful explanation, and cross-linking radiation wherein, heat treatment step can be serially connected with in above-mentioned each operation according to electric property (as resistance-temperature characteristics, current characteristics, the voltage-current characteristic) requirement of concrete element.Below each embodiment all like this, so do not give unnecessary details.
Surface attaching type ptc characteristics thermistor and manufacture method thereof with reference to Fig. 2 A～Fig. 2 D explanation embodiments of the invention 2.
Fig. 2 A is the structure chart of the surface attaching type ptc characteristics thermistor of embodiments of the invention 2.
In Fig. 2 A, the electric conductive polymer chip 3 of ptc characteristics is the high molecular polymer lamellar body that is made of mixtures such as one or more crystalline polymers, conducting filler and processing aids; Metal forming 2 evenly is covered in electric conductive polymer chip 3 upper and lower surfaces of above-mentioned ptc characteristics; Dielectric film 1 evenly is close on above-mentioned two metal formings 2 surfaces; Insulating cement 4 is coated electric conductive polymer chip 3 left and right sides faces of above-mentioned ptc characteristics, and the insulating cement 4 of both sides forms four parts altogether; In the gap of both sides insulating cement 4, form each side one Physical Processing slotted zones, about the conductive metal layer 6 of end and top and bottom part good be attached to metal forming 2 surfaces in insulating cement 4, dielectric film 1 and the Physical Processing slotted zones, make conductive metal layer 6 and above-mentioned two sides metal forming 2 keep good being electrically connected.
Surface attaching type ptc characteristics thermistor and manufacture method thereof below with reference to Fig. 2 A～Fig. 2 D explanation embodiments of the invention 2.
With with embodiment 1 in the pairing same processes of Figure 1B～F, form the conductive module shown in Fig. 2 B with Physical Processing slotted zones (among Fig. 2 B shown in the circle);
Thereafter, putting conductive metal layer 6 in above-mentioned conductive module two sides is that U type thin-wall metal groove (seeing Fig. 2 C) back is connected U type metallic channel by modes such as welding with the PTC metal forming, forms to have conductive metal layer 6, the bar shaped thin slice shown in Fig. 2 D;
At last, above-mentioned thin strip piece cut into have given size, the single surface attaching type element of structure chart such as Fig. 2 A, same, if the size of the thin strip piece shown in Fig. 2 D was exactly single surface attaching type size of component originally, just need not to cut.
Surface attaching type ptc characteristics thermistor and manufacture method thereof below with reference to Fig. 3 A～Fig. 3 E explanation embodiments of the invention 3.
Fig. 3 A is the structure chart of the surface attaching type ptc characteristics thermistor of embodiments of the invention 3.
In Fig. 3 A, the electric conductive polymer chip 3 of ptc characteristics is the high molecular polymer lamellar body that is made of mixtures such as one or more crystalline polymers, conducting filler and processing aids; Metal forming 2 evenly is covered in electric conductive polymer chip 3 upper and lower surfaces of above-mentioned ptc characteristics; Dielectric film 1 evenly is close on above-mentioned two metal formings 2 surfaces, and dielectric film 1 forms four parts altogether on the metal forming 2 on two sides; Insulating cement 4 is coated electric conductive polymer chip 3 left and right sides face ends of above-mentioned ptc characteristics; Resistance plated film 5 evenly is close to the zone line part of above-mentioned dielectric film 1 upper and lower surface, and the resistance plated film 5 of upper and lower surface forms two parts altogether; Each one has the Physical Processing slotted zones of groove upper and lower surface in the gap of the dielectric film of upper and lower surface; Plated conductive metal level 6 is good is attached to metal forming 2 surfaces in insulating cement 4, dielectric film 1 and the top and bottom dielectric film 1 groove Physical Processing slotted zones, makes left and right sides conductive metal layer 6 keep good being electrically connected with above-mentioned two sides metal forming 2 respectively.
Surface attaching type ptc characteristics thermistor and manufacture method thereof below with reference to Fig. 3 A～Fig. 3 E explanation embodiments of the invention 2.
With with embodiment 1 in the pairing same processes of Figure 1B～E, form the conductive module precursor one shown in Fig. 3 B;
Then, partly be coated with resistance plated film 5, form conductive module precursor two shown in Fig. 3 C at conductive module precursor upper and lower surface zone line;
Then, on the dielectric film 1 of the upper and lower surface of above-mentioned conductive module precursor two, by physical refining processes (for example laser processing etc.) outside insulating cover surface fluting the interior metal paper tinsel is exposed, thereby form the conductive module that shown in Fig. 3 D, has groove Physical Processing slotted zones (shown in Fig. 3 D centre circle circle);
Thereafter, with the whole plating of above-mentioned conductive module, formation has conductive metal layer, the bar shaped thin slice shown in Fig. 3 E;
At last, above-mentioned thin strip piece cut into have given size, the single surface attaching type element of structure chart such as Fig. 3 A, same, if the size of the thin strip piece shown in Fig. 3 E was exactly single surface attaching type size of component originally, just need not to cut.
In the above-mentioned technology, cut into strip thin slice operation, coating insulating cement 4 and resistance plated film 5 operations and the also interchangeable operation of Physical Processing fluting operation, it does not influence the manufacturing of described surface attaching type ptc characteristics thermistor.
Be similar to embodiment 1 and embodiment 2,, after the fluting of the Physical Processing shown in Fig. 3 D operation, also can carry out following operation here:
After forming Physical Processing fluting operation gained conductive module two sides, putting U type thin-wall metal groove, U type metallic channel is connected closely with the PTC metal forming by modes such as welding; At last, if desired, the thin strip piece of above-mentioned formation is cut into have the single surface attaching type element of given size again.On the component structure of gained, there is not the two-layer resistance plated film 5 up and down shown in above-mentioned Fig. 3 A at this moment.
Surface attaching type ptc characteristics thermistor and manufacture method thereof below with reference to Fig. 4 A～Fig. 4 G explanation embodiments of the invention 4.
Fig. 4 A is the structure chart of the surface attaching type ptc characteristics thermistor of embodiments of the invention 4.
In Fig. 4 A, the electric conductive polymer chip 3 of ptc characteristics is to constitute the high molecular polymer lamellar body by mixtures such as one or more crystalline polymers, conducting filler and processing aids, as shown in the figure, one forms the electric conductive polymer chip 3 of two-layer ptc characteristics altogether; Metal forming 2 evenly is covered in the upper and lower surface of the electric conductive polymer chip 3 of above-mentioned ptc characteristics, and like this, the electric conductive polymer chip 3 of two-layer ptc characteristics makes one to have four layers of metal forming 2; Dielectric film 1 evenly is close on the face of above-mentioned four layers of metal forming 2, and four layers of metal forming 2 make one to have three-layer insulated film 1; Insulating cement 4 is coated electric conductive polymer chip 3, dielectric film 1 and metal forming 2 left and right sides of above-mentioned ptc characteristics, and the insulating cement 4 of both sides forms five parts altogether; Form at the place of joining of dielectric film 1, metal forming 2 and left and right sides insulating cement 4 and to have the Physical Processing slotted zones of groove, two places, left side wherein, one place, right side; Resistance plated film 5 evenly is pasted on the zone line of above-mentioned upper and lower surface dielectric film 1, and one forms two parts resistance plated film 5 altogether; The conductive metal layer 6 at two ends, the left and right sides is good is attached to metal forming 2 surfaces in insulating cement 4, dielectric film 1 and the Physical Processing slotted zones, makes two ends, left and right sides conductive metal layer 6 and above-mentioned two metal formings 2 keep good being electrically connected.
Below with reference to Fig. 4 A～Fig. 4 G, the manufacture method of the surface attaching type ptc characteristics thermistor of embodiments of the invention 4 is described.
The mixing of raw materials such as one or more crystalline polymers, conducting filler and processing aid is made electric conductive polymer chip 3 by twin-screw extrusion calendaring machine respectively, metal forming 2 closely laminates in electric conductive polymer chip 3 upper and lower surfaces, forms individual layer PTC thermistor thin slice;
Thereafter, get above-mentioned two individual layer PTC thermistor thin slices and three-layer insulated film 1, form the stacked thin slice of two-layer PTC thermistor by hot pressing process, be characterized in, each above-mentioned individual layer PTC thermistor thin slice upper and lower surface has all laminated one deck dielectric film 1, is cut to a rule Rack, the stacked thin slice of the bar shaped shown in Fig. 4 B again, certainly, if size is suitable, just need not to cut;
Then,, make thin slice form the four sides insulating cover, form conductive module precursor shown in Fig. 4 C in the stacked thin slice of above-mentioned bar shaped left and right sides face coating insulating cement and curing;
Then on the face of the left and right sides of above-mentioned conductive module precursor, by physical refining processes (for example laser processing etc.) outside insulating cover surface fluting the interior metal paper tinsel is partly exposed, formation has the conductive module of three or above Physical Processing slotted zones (shown in circle among Fig. 4 D, one in left side, two on right side) shown in Fig. 4 D;
At above-mentioned conductive module upper and lower surface zone line coating resistance plated film 5, form stacked thin slice as Fig. 4 E shown in thereafter;
After with its whole plating, form and have conductive metal layer, the stacked thin slice shown in Fig. 4 F;
At last, will the stacked thin strip piece shown in Fig. 4 F cut into and have the single surface attaching type element of given size, shown in Fig. 4 G, equally, if the size of the stacked thin slice shown in Fig. 4 F was exactly single surface attaching type size of component originally, just need not to cut, its concrete structure figure sees also Fig. 4 A.
Be similar to embodiment 1 and embodiment 2,, after the fluting of the formation Physical Processing shown in Fig. 4 D operation, also can carry out following operation here:
After forming Physical Processing fluting operation gained conductive module two sides, putting U type thin-wall metal groove, U type metallic channel is connected closely with the PTC metal forming by modes such as welding; At last, the above-mentioned thin strip piece that will form again cuts into and has the single surface attaching type element of given size.On the component structure of gained, there is not the two-layer resistance plated film 5 up and down shown in above-mentioned Fig. 4 A at this moment.
The above-mentioned utilization in Physical Processing such as the laser gasification fluting operation also can form the Physical Processing slotted zones of other modes, only otherwise influencing its switching performance gets final product.
For example, be similar to the mode of grooving of the Physical Processing fluting operation shown in the embodiment 3, Fig. 5 A has illustrated a kind of innovative structure that forms the Physical Processing slotted zones of other modes.Obviously, be not limited thereto the described mode of grooving of example.
In Fig. 5 A, the electric conductive polymer chip 3 of ptc characteristics is to constitute the high molecular polymer lamellar body by mixtures such as one or more crystalline polymers, conducting filler and processing aids, as shown in the figure, one forms the electric conductive polymer chip 3 of two-layer ptc characteristics altogether; Metal forming 2 evenly is covered in the upper and lower surface of the electric conductive polymer chip 3 of above-mentioned ptc characteristics, and like this, the electric conductive polymer chip 3 of two-layer ptc characteristics makes one to have four layers of metal forming 2; Dielectric film 1 evenly is close on the face of above-mentioned four layers of metal forming 2, and four layers of metal forming 2 make one to have three-layer insulated film 1, and three-layer insulated film 1 forms five parts altogether; Insulating cement 4 is coated electric conductive polymer chip 3, dielectric film 1 and metal forming 2 left and right sides of above-mentioned ptc characteristics, and the insulating cement 4 of both sides forms three parts altogether; Form at the place of joining of dielectric film 1, metal forming 2 and left and right sides insulating cement 4 and to have the Physical Processing slotted zones of groove, each place of upper and lower surface wherein, one place, right side; Resistance plated film 5 evenly is pasted on the zone line of above-mentioned upper and lower surface dielectric film 1, and one forms two parts resistance plated film 5 altogether; Conductive metal layer 6 is good is attached to metal forming 2 surfaces in insulating cement 4, dielectric film 1 and the Physical Processing slotted zones, makes two ends, left and right sides conductive metal layer 6 keep good being electrically connected with the metal forming 2 of the upper and lower surface of above-mentioned each electric conductive polymer chip 3 respectively.
Be similar to above-mentioned stacked innovative structure of surface attaching type ptc characteristics thermistor and manufacture method thereof, two-layer or above stacked surface attaching type ptc characteristics thermistor is also within this patent scope.
In sum, novel surface mounting type thermistor superior performance of the present invention, product percent of pass height, its manufacturing approach craft uniqueness, need not etching, benefit environmental protection, cost reduction greatly, process stabilizing, precision height, rate of finished products height.
Need to prove that all documents of mentioning are in the present invention quoted as a reference in this application, are just quoted as a reference separately as each piece document.Should understand in addition, above-described is specific embodiments of the invention and the know-why used, after having read foregoing of the present invention, those skilled in the art can make various changes or modifications and not deviate from spirit of the present invention and scope the present invention, and these equivalent form of values fall within the scope of the invention equally.
Claims (19)
1. novel surface mounting type thermistor, it is characterized in that, comprise conductive module, left side conductive metal layer and right conductive metal layer, described conductive module comprises core conductive module and insulating barrier, described insulating barrier coats described core conductive module upper and lower surface and left and right side, described insulating barrier comprises insulating barrier, following insulating barrier, left side insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module, and described left insulating barrier has left Physical Processing slotted zones, described right insulating barrier has right Physical Processing slotted zones, described core conductive module comprises a conductive unit, described conductive unit comprises the last metal forming of fitting successively from top to bottom, have the electric conductive polymer chip of ptc characteristics and following metal forming, described conductive module left part and right part and local respectively described left Physical Processing slotted zones and the described right Physical Processing slotted zones of wearing are connected with the end face of the following metal forming/last metal forming of the end face of the last metal forming/following metal forming of described conductive unit and described conductive unit respectively thereby described left conductive metal layer and described right conductive metal layer are fitted respectively.
2. novel surface mounting type thermistor according to claim 1 is characterized in that, described left Physical Processing slotted zones and described right Physical Processing slotted zones are the laser processing slotted zones.
3. novel surface mounting type thermistor according to claim 1 is characterized in that, described left conductive metal layer is connected with described metal forming down with the described metal forming that goes up respectively with described right conductive metal layer.
4. novel surface mounting type thermistor according to claim 1, it is characterized in that, described thermistor also comprises resistance plated film and following resistance plated film, and described resistance plated film and the described plated film of resistance down gone up is fitted in described conductive module upper and lower surface respectively and is used for intercepting and opens described left conductive metal layer and described right conductive metal layer.
5. a method of making the described novel surface mounting type thermistor of claim 1 is characterized in that, may further comprise the steps:
A. make described electric conductive polymer chip,, promptly go up metal forming and following metal forming in described electric conductive polymer chip upper and lower surface two metal formings of fitting respectively, thus the formation conductive unit;
B. with described conductive unit directly as described core conductive module;
C. described insulating barrier is coated the described upper and lower surface and the described left and right side of described core conductive module, described insulating barrier comprises insulating barrier, following insulating barrier, left insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module, thereby form described conductive module;
D. described left insulating barrier and described right insulating barrier are slotted by physical refining processes, the end face of two described metal formings of described conductive unit is exposed;
E. described left conductive metal layer and described right conductive metal layer are fitted in the described left part and the described right part of described conductive module, and are connected with the end face of two described metal formings of described conductive unit respectively; Perhaps, resistance plated film and resistance plated film down on the zone line of the upper and lower surface of described conductive module is fitted respectively, carry out integral body then and electroplate, thereby form respectively described left conductive metal layer and the described right conductive metal layer that is connected with the end face of two described metal formings of described conductive unit.
6. the method for manufacturing novel surface mounting type thermistor according to claim 5, it is characterized in that, in described step a, described electric conductive polymer chip is to mix the back by at least a crystalline polymer, conducting filler and processing aid to make by the twin-screw extrusion calendaring.
7. the method for manufacturing novel surface mounting type thermistor according to claim 5 is characterized in that, by being coated with insulating cement respectively on the described left and right side of described core conductive module, thereby forms described left insulating barrier and described right insulating barrier.
8. the method for manufacturing novel surface mounting type thermistor according to claim 5 is characterized in that, in described steps d, described physical refining processes comprises laser processing.
9. the method for manufacturing novel surface mounting type thermistor according to claim 5 is characterized in that, and is behind described step b, before described step c, further comprising the steps of:
Described core conductive module is cut into suitable shape.
10. novel surface mounting type thermistor, it is characterized in that, comprise conductive module, left side conductive metal layer and right conductive metal layer, described conductive module comprises core conductive module and insulating barrier, described insulating barrier coats described core conductive module upper and lower surface and left and right side, described insulating barrier comprises insulating barrier, following insulating barrier, left side insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module, and described left insulating barrier has left Physical Processing slotted zones, described right insulating barrier has right Physical Processing slotted zones, described core conductive module comprises at least two conductive units that stack gradually, interval one insulation material layer between two conductive units, described conductive unit comprises the last metal forming of fitting successively from top to bottom, have the electric conductive polymer chip of ptc characteristics and following metal forming, described conductive module left part and right part and local respectively described left Physical Processing slotted zones and the described right Physical Processing slotted zones of wearing are connected with the end face of the following metal forming/last metal forming of the end face of the last metal forming/following metal forming of described conductive unit and described conductive unit respectively thereby described left conductive metal layer and described right conductive metal layer are fitted respectively.
11. novel surface mounting type thermistor according to claim 10 is characterized in that, described left Physical Processing slotted zones and described right Physical Processing slotted zones are the laser processing slotted zones.
12. novel surface mounting type thermistor according to claim 10 is characterized in that, the number of described conductive unit is two.
13. novel surface mounting type thermistor according to claim 12, it is characterized in that, described left conductive metal layer all is connected with the described described metal forming down that goes up metal forming and another described conductive unit of a described conductive unit respectively, and described right conductive metal layer is connected with the described metal forming down of a described conductive unit and the described metal forming that goes up of another described conductive unit respectively.
14. novel surface mounting type thermistor according to claim 10, it is characterized in that, described thermistor also comprises resistance plated film and following resistance plated film, and described resistance plated film and the described plated film of resistance down gone up is fitted in described conductive module upper and lower surface respectively and is used for intercepting and opens described left conductive metal layer and described right conductive metal layer.
15. a method of making the described novel surface mounting type thermistor of claim 10 is characterized in that, comprises step:
A. make described electric conductive polymer chip,, promptly go up metal forming and following metal forming in described electric conductive polymer chip upper and lower surface two metal formings of fitting respectively, thus the formation conductive unit;
B. adopt two or more described conductive units, stack gradually, the described insulation material layer in interval between the two described conductive units, thus form described core conductive module;
C. described insulating barrier is coated the described upper and lower surface and the described left and right side of described core conductive module, described insulating barrier comprises insulating barrier, following insulating barrier, left insulating barrier and right insulating barrier, described upward insulating barrier and described insulating barrier down are fitted in respectively on the described upper and lower surface of described core conductive module, described left insulating barrier and described right insulating barrier are fitted in respectively on the described left and right side of described core conductive module, thereby form described conductive module;
D. described left insulating barrier and described right insulating barrier are slotted by physical refining processes, two described metal formings of described conductive unit are partly exposed;
E. described left conductive metal layer and described right conductive metal layer are fitted in the described left part and the described right part of described conductive module, and are connected with the end face of two described metal formings of described conductive unit respectively; Perhaps, resistance plated film and resistance plated film down on the zone line of the upper and lower surface of described conductive module is fitted respectively, carry out integral body then and electroplate, thereby form respectively described left conductive metal layer and the described right conductive metal layer that is connected with the end face of two described metal formings of described conductive unit.
16. the method for manufacturing novel surface mounting type thermistor according to claim 15, it is characterized in that, in step a, described electric conductive polymer chip is to mix the back by at least a crystalline polymer, conducting filler and processing aid to make by the twin-screw extrusion calendaring.
17. the method for manufacturing novel surface mounting type thermistor according to claim 15 is characterized in that, by being coated with insulating cement respectively on the described left and right side of described core conductive module, thereby forms described left insulating barrier and described right insulating barrier.
18. the method for manufacturing novel surface mounting type thermistor according to claim 15 is characterized in that, in described steps d, described physical refining processes comprises laser processing.
19. the method for manufacturing novel surface mounting type thermistor according to claim 15 is characterized in that, and is behind described step b, before described step c, further comprising the steps of: described core conductive module is cut into suitable shape.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100454821A CN101477859B (en) | 2009-01-16 | 2009-01-16 | Novel surface mounting type thermistor and manufacturing method thereof |
| US13/145,040 US8451084B2 (en) | 2009-01-16 | 2009-06-29 | Laminated surface mounting type thermistor and manufacturing method thereof |
| PCT/CN2009/072497 WO2010081312A1 (en) | 2009-01-16 | 2009-06-29 | Laminated surface mounting type thermistor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009100454821A CN101477859B (en) | 2009-01-16 | 2009-01-16 | Novel surface mounting type thermistor and manufacturing method thereof |
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| CN101477859A CN101477859A (en) | 2009-07-08 |
| CN101477859B true CN101477859B (en) | 2011-11-30 |
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| CN103345993A (en) * | 2013-06-21 | 2013-10-09 | 兴勤（常州）电子有限公司 | Ultralow-resistance thermistor and forming processing method thereof |
| CN112997261B (en) * | 2018-08-22 | 2022-11-04 | 上海利韬电子有限公司 | Surface movable positive temperature coefficient device and manufacturing method thereof |
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|---|---|---|---|---|
| CN1212072A (en) * | 1996-01-22 | 1999-03-24 | 保险丝公司 | Surface mountable electrical device comprising PTC element |
| CN1254932A (en) * | 1998-11-19 | 2000-05-31 | 上海维安热电材料有限公司 | Low-resistance thermosensitive resistor and its making method |
| CN1409587A (en) * | 2001-09-26 | 2003-04-09 | 日东电工株式会社 | Method for forming holes, using flexible connection board formed thereof and its producing method |
| CN2591719Y (en) * | 2002-11-19 | 2003-12-10 | 上海维安热电材料股份有限公司 | High-polymer PTC thermosensitive electrical resistor for laminated surface pasting |
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- 2009-01-16 CN CN2009100454821A patent/CN101477859B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1212072A (en) * | 1996-01-22 | 1999-03-24 | 保险丝公司 | Surface mountable electrical device comprising PTC element |
| CN1254932A (en) * | 1998-11-19 | 2000-05-31 | 上海维安热电材料有限公司 | Low-resistance thermosensitive resistor and its making method |
| CN1409587A (en) * | 2001-09-26 | 2003-04-09 | 日东电工株式会社 | Method for forming holes, using flexible connection board formed thereof and its producing method |
| CN2591719Y (en) * | 2002-11-19 | 2003-12-10 | 上海维安热电材料股份有限公司 | High-polymer PTC thermosensitive electrical resistor for laminated surface pasting |
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