CN1211869C - Luminuous diode packaging structure and its method - Google Patents
Luminuous diode packaging structure and its method Download PDFInfo
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- CN1211869C CN1211869C CNB021286701A CN02128670A CN1211869C CN 1211869 C CN1211869 C CN 1211869C CN B021286701 A CNB021286701 A CN B021286701A CN 02128670 A CN02128670 A CN 02128670A CN 1211869 C CN1211869 C CN 1211869C
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- emitting diode
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Abstract
The present invention relates to a light emitting diode packaging structure and a method thereof. The present invention utilizes a condenser lens pre-molded with a recess, and fluorescent powder colloid is dropped in the recess; a light emitting diode fixed to a baseplate is arranged in the recess to form the packaging structure of the light emitting diode and the fluorescent powder colloid, and the redundant fluorescent powder colloid is extruded out of the recess simultaneously in the process that the light emitting diode is arranged in the recess. After the fluorescent powder colloid is solidified and molded, a layer of fluorescent powder colloid film for coating the light emitting diode is formed. The thickness and the shape of the fluorescent powder colloid film are controlled by the pre-molded recess. The thickness of the fluorescent powder colloid film desired at each area on the surface of the light emitting diode can be determined by matching with the luminosity distribution of each area, and uniform color temperature is generated after light emitted by the light emitting diode and light generated by exciting the fluorescent powder are mixed.
Description
Technical field
The present invention relates to a kind of package structure for LED and method thereof, particularly a kind of package structure for LED and method thereof of sending the uniform light of colour temperature.
Background technology
(Light Emitting Diode is a kind of semiconductor light emitting components and parts LED) to light-emitting diode, is different from traditional incandescent lamp bulb and makes filament heat to luminous with big electric current, and light-emitting diode only must can inspire suitable light by a minimum electric current.Light-emitting diode is to show the energy that it discharges in luminous mode when utilizing electronics in the semi-conducting material and hole-recombination; Light-emitting diode has that volume is little, the life-span is long, driving voltage is low, power consumption is low, reaction rate is fast, shatter-proof characteristic reaches advantages such as monochromaticjty is good well, is the emitting components of various electrical equipment, information board, communication product etc.By the control of the chip kind and the course of processing, can obtain various monochromatic light.
Because LED saves the characteristic of the energy, to be expected to substitute the part bulb future as ligthing paraphernalia, but because white light LEDs therefore still fail to popularize, but white light LEDs is a field of the LED industry Great Leap Forward on long terms owing to the factor of luminosity and price at present.The product of white light LEDs now is to send sodium yellow with the blue light-emitting diode excitated fluorescent powder mostly, just can visually form white light after two kinds of light mix.And along with blue light-emitting diode brightness lifting gradually, being applied on the illumination market of feasible exploitation white light emitting diode is full of hope.The development of high-brightness LED, allow the industry of LED inject vigour into, especially blue-green light LED succeeds in developing, and luminous usefulness promoted more day by day, brightness at present can reach several more than candle light, and in up promoting, also more and more higher because of the brightness of blue light, so coat the white light LEDs that fluorescent material inspires by blue light-emitting diode, be applied in the also expansion day by day thereupon of purposes on the illumination market.But because its white light is to be formed by blue light and yellow light mix, the light that white light LEDs sent is difficult to be controlled to be pure white, approximately be white in band green grass or young crops or have yellow halo, promptly have uneven colour temperature (Color Temperature).For example the most representative day inferior Nichia house journal is that blue light-emitting diode is placed the small-sized conical reflector with electric current pin; Directly in reflector, splash into the yellow fluorescent powder that contains glue again, whereby the whole coating of blue light diode is got up.Make a part in the blue light that is sent after the blue light diode energising can excitated fluorescent powder to send gold-tinted, simultaneously and another partly blue light form white light, the transparent concavees lens by the top penetrate at last.But, be subject to the shape of conical reflector, this design can make splash into conical reflector contain the top thickness of glue yellow fluorescent powder at the blue light diode chip, far be thinner than its thickness in chip sides.The blue light that makes chip emit excites the path of gold-tinted shorter through end face fluorescent material, and is then longer through the path of side, so the gold-tinted that the side excited is also stronger, and it is inhomogeneous that blue light is mixed with white light; And present yellow halo when causing the white light that transparent concavees lens sent via the top to be projeced on the blank sheet of paper.
The course of processing that also has a kind of white light LEDs, with the fluorescent material solvent of mixed volatilization in the proper ratio, drop makes solution be attached to the surface of light-emitting diode chip for backlight unit on conical reflector; After treating that solution evaporation finishes, promptly form fluorescent powder film and coat light-emitting diode chip for backlight unit.This processing method also is difficult to make uniform film, because the proportion of fluorescent material is much larger than evaporating solution, the settling rate of fluorescent material is faster than the rate of volatilization of solution.At last, at the formed fluorescent powder film in light-emitting diode chip for backlight unit surface, be deposited on easily directly over light-emitting diode chip for backlight unit and the junction of chip and conical reflector, the agravic precipitation phosphor powder layer in side is then thinner, is difficult to avoid the phenomenon of colour temperature inequality equally; From another point of view, the volume of each drop fluorescent material solution is about ten thousand/milliliter, is difficult to accurately control the accuracy of each drop liquor capacity on the course of processing.Therefore, how making LED send pure white light, is the emphasis that present each LED manufacturer is made great efforts.
Summary of the invention
In view of the problem of above known technology, the object of the present invention is to provide a kind of package structure for LED and method thereof, the thickness and the shape of the phosphor laminate that the may command light-emitting diode is coated.Utilize and form the condenser of depression in advance, and in depression, splash into fluorescent powder colloid, direct again and light-emitting diodes pipe jointing, curing molding promptly forms the encapsulating structure of light-emitting diode and fluorescent powder colloid afterwards.Because the depression may command fluorescent powder colloid of condenser is coated on the thickness and the curve form of LED surface, when being the may command batch process, the fluorescent material content of each encapsulating structure, also because fluorescent powder colloid cooperates the curved surface that depression produced, can cooperate each regional luminous intensity of LED surface to distribute, produce uniform light and then prevent the phenomenon of colour temperature inequality.
For reaching above-mentioned purpose, package structure for LED of the present invention includes light-emitting diode, has the condenser of depression and is filled between the two phosphor laminate.Its light-emitting diode is placed in the depression of condenser, has an amount of fluorescent powder colloid simultaneously in the depression in order to be coated on the surface of light-emitting diode, to form the phosphor laminate of fixed thickness.The shape, size that the pocket shapes of condenser and size cooperate light-emitting diode with and the thickness of the fluorescent powder colloid reserved come in addition moulding.So, the phosphor gel film thickness of coating light-emitting diode and shape can obtain control; Help sending the uniform light of colour temperature.In addition, in order to promote outgoing light intensity and uniformity, the end face of the depression of the condenser that can in advance light-emitting diode light be shone and on every side the four sides all form curved surface; And the focus of this condenser has focussing force in the beam projecting position.
For cooperating above-mentioned package structure for LED, the invention provides a kind of LED encapsulation method; Moulding at first, in advance has the condenser of depression; In depression, splash into suitable fluorescent powder colloid again; Then, the part with this depression combines with light-emitting diode chip for backlight unit; This moment unnecessary fluorescent powder colloid extrude outside the depression, guarantee depression and light-emitting diode chip for backlight unit the space be full of fluorescent powder colloid; At last, again fluorescent powder colloid is solidified, form the phosphor laminate that is coated on LED surface.Therefore, phosphor gel body thickness and the shape that coats light-emitting diode chip for backlight unit can be controlled by the size and dimension of depression fully.
In addition, fluorescent powder colloid used in the present invention is fluorescent material to be sneaked into full-bodied transparent colloid form; Utilize full-bodied colloidal suspension fluorescent powder, the sinking speed of fluorescent powder is slowed down.Avoiding after fluorescent powder colloid solidifies, the fluorescent material precipitation is stacked over the surface of light-emitting diode; And have influence on outgoing light intensity and uniformity.
Use package structure for LED of the present invention and method thereof, the thickness and the shape of the phosphor laminate that the may command light-emitting diode is coated.The embodiment of the invention is to use blue light diode to cooperate yellow fluorescent powder, make blue light that chip emits excite the path of gold-tinted to be equivalent to path through the side via end face fluorescent material, the blue light that makes light-emitting diode send is evenly mixed gold-tinted to form pure white light; Just by the curved design of depression, allow the end face of phosphor laminate and on every side the four sides form the emergent light homogenizing that curved surface is beneficial to mix.
Relevant characteristics and implementation of the present invention, conjunction with figs. and most preferred embodiment are described in detail as follows.
Description of drawings
Fig. 1 is the package structure for LED generalized section of the embodiment of the invention;
Fig. 2 is for looking schematic diagram on the package structure for LED array;
The colour temperature figure of the white light LEDs that Fig. 3 is produced for Ri Ya company;
Fig. 4 is the colour temperature figure of the white light LEDs of the embodiment of the invention;
The Illumination Distribution figure of the white light LEDs that Fig. 5 is produced for Ri Ya company; And
Fig. 6 is the Illumination Distribution figure of the white light LEDs of the embodiment of the invention.
Description of symbols
10 light-emitting diodes, 20 phosphor laminates
30 condensers, 31 depressions
33 reflectance coatings, 40 substrates
Embodiment
Please refer to Fig. 1, it is the package structure for LED generalized section of the embodiment of the invention.Include light-emitting diode 10, condenser 30 and be filled between the two phosphor laminate 20.Its light-emitting diode that is engaged in substrate 40 is placed in the depression 31 of condenser, simultaneously have the surface that an amount of phosphor laminate 20 is coated on light-emitting diode 10 in the depression 31, utilize the depression 31 of moulding in advance to control the thickness and the shape of phosphor laminate 20.
As shown in Figure 1, the condenser 30 of the embodiment of the invention is transparent plastic components and parts of taper, can utilize the mode of plastics ejection formation to make, it has the depression 31 of ccontaining light-emitting diode, depression 31 shape and size cooperate the shape of light-emitting diode, and cooperate each regional luminous intensity of LED surface to distribute to design the required thickness of its phosphor laminate 20, and in the end face of depression 31 with all form curve form on every side on four sides.And the focus of this condenser 30 has focussing force in the beam projecting position; And plate uniform reflectance coating 33 in the taper lateral surface of its condenser 30, to improve light extraction efficiency.
For being described in more detail the present invention, be example with the package structure for LED of the embodiment of the invention, LED encapsulation method of the present invention is described.At first, in the depression 31 of condenser 30, splash into an amount of fluorescent powder colloid; The light-emitting diode 10 that will be fixed in substrate 40 is inserted the depression 31 with fluorescent powder colloid in addition, can make unnecessary fluorescent powder colloid extrude outside the depression 31, and guarantee that fluorescent powder colloid fills up the space of light-emitting diode and depression; At last, solidify the phosphor laminate 20 of fluorescent powder colloid to form even coating light-emitting diode.Therefore, depression 31 size and dimensions of its moulding in advance can determine to coat phosphor laminate 20 thickness and the shape of light-emitting diode 10; Help sending the uniform light of high strength and colour temperature.
For sending pure white light to reach illumination purposes, the employed light-emitting diode of first embodiment of the invention is short wavelength's diode such as a blue light diode, and cooperation long wavelength's fluorescent material is as mixing yellow fluorescent powder.Fluorescent powder colloid is long wavelength's fluorescent material or yellow fluorescent powder to be sneaked into full-bodied transparent silica gel form; Utilize the colloidal suspension fluorescent powder of high viscosity (4000cps), the sinking speed of fluorescent powder is slowed down, avoiding before fluorescent powder colloid solidifies, the fluorescent material precipitation is stacked over the surface of light-emitting diode, and has influence on the intensity and the uniformity of emergent light 9.For avoiding fluorescent material sedimentation in its colloid of sneaking into too fast, the viscosity of its colloid is required to be more than the 1000cps.
In addition, according to identical method for packing, the present invention also can be in conjunction with optically focused encapsulation array 50 with a plurality of condensers and the substrate 60 with light-emitting diode array, to form the package structure for LED array; As shown in Figure 2, it is for looking schematic diagram on the package structure for LED array.
The color temperature uniformity of the embodiment of the invention and known technology relatively please refer to Fig. 3 and Fig. 4.The colour temperature figure of the white light LEDs that Fig. 3 is produced for Ri Ya company, Fig. 4 is the colour temperature figure of the white light LEDs of the embodiment of the invention.By Fig. 3 and the shown information of Fig. 4, can judge with the naked eye directly that the color temperature uniformity of white light LEDs of the embodiment of the invention is higher.Relatively go up in that light intensity is inhomogeneity, please refer to Fig. 5 and Fig. 6, the Illumination Distribution figure of the white light LEDs that Fig. 5 is produced for Ri Ya company, Fig. 6 is the Illumination Distribution figure of the white light LEDs of the embodiment of the invention.Can learn that by the comparative result of Fig. 5 and Fig. 6 the white light LEDs of the embodiment of the invention can send high-brightness white-light comparatively uniformly.
Though preferred embodiment of the present invention openly as mentioned above; right its is not in order to limit the present invention; any those of ordinary skill in the art; without departing from the spirit and scope of the present invention; when the variation that can do some equivalences, therefore scope of patent protection of the present invention with claim the person of being defined be as the criterion.
Claims (16)
1. a package structure for LED is characterized in that, includes:
One light-emitting diode is fixed in a substrate surface and this substrate is reached electric connection;
One condenser, this condenser cooperate these light-emitting diode shape and size to form a depression, so that this light-emitting diode is placed in this depression; And
One phosphor laminate, be coated on this light-emitting diode table and, fill up the space of this light-emitting diode and this depression simultaneously.
2. package structure for LED as claimed in claim 1 is characterized in that, the shape and the thickness of this phosphor laminate are controlled by this depression.
3. package structure for LED as claimed in claim 1 is characterized in that, the end face of this depression and on every side the four sides be curved surface.
4. package structure for LED as claimed in claim 1 is characterized in that, this condenser forms curved surface shrinkage pool design in the focal position of light institute outgoing, to assemble emergent ray.
5. package structure for LED as claimed in claim 1 is characterized in that, this condenser is coated with a reflector to improve light extraction efficiency.
6. package structure for LED as claimed in claim 1 is characterized in that, this phosphor laminate mixes a full-bodied transparent colloid curing by fluorescent material and forms.
7. package structure for LED as claimed in claim 6 is characterized in that, the viscosity of this full-bodied transparent colloid is more than the 1000cps.
8. package structure for LED as claimed in claim 6 is characterized in that, this full-bodied transparent colloid is a silica gel.
9. a LED encapsulation method is characterized in that, this method step includes:
Moulding in advance has a condenser of a depression;
In this depression, splash into a fluorescent powder colloid;
A light-emitting diode that is engaged in a substrate is combined with this depression;
This unnecessary fluorescent powder colloid is extruded outside this depression, be full of this fluorescent powder colloid with the interface of guaranteeing this depression and this light-emitting diode; And
Make this fluorescent powder colloid solidify to form a phosphor laminate to be coated on this LED surface.
10. LED encapsulation method as claimed in claim 9 is characterized in that, the shape and the thickness of this phosphor laminate are controlled by this depression.
11, LED encapsulation method as claimed in claim 9 is characterized in that, the end face of this depression and on every side the four sides be curved surface.
12, LED encapsulation method as claimed in claim 9 is characterized in that, this condenser forms curved surface shrinkage pool design in the focal position of light institute outgoing, to assemble emergent ray.
13, LED encapsulation method as claimed in claim 9 is characterized in that, this condenser is coated with a reflector to improve light extraction efficiency.
14, LED encapsulation method as claimed in claim 9 is characterized in that, this phosphor laminate mixes a full-bodied transparent colloid curing by fluorescent material and forms.
15, LED encapsulation method as claimed in claim 14 is characterized in that, the viscosity of this full-bodied transparent colloid is more than the 1000cps.
16, LED encapsulation method as claimed in claim 14 is characterized in that, this full-bodied transparent colloid is a silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021286701A CN1211869C (en) | 2002-08-12 | 2002-08-12 | Luminuous diode packaging structure and its method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021286701A CN1211869C (en) | 2002-08-12 | 2002-08-12 | Luminuous diode packaging structure and its method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1476106A CN1476106A (en) | 2004-02-18 |
| CN1211869C true CN1211869C (en) | 2005-07-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021286701A Expired - Lifetime CN1211869C (en) | 2002-08-12 | 2002-08-12 | Luminuous diode packaging structure and its method |
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| Country | Link |
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| CN (1) | CN1211869C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308898B (en) * | 2007-05-18 | 2010-06-09 | 株式会社东芝 | Light emitting device and method of manufacturing the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100388514C (en) * | 2005-01-20 | 2008-05-14 | 财团法人工业技术研究院 | Mirror and homogeneously luminous LED utilizing the mirror |
-
2002
- 2002-08-12 CN CNB021286701A patent/CN1211869C/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101308898B (en) * | 2007-05-18 | 2010-06-09 | 株式会社东芝 | Light emitting device and method of manufacturing the same |
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| Publication number | Publication date |
|---|---|
| CN1476106A (en) | 2004-02-18 |
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