CN1209910A - System used especially in an electronic controller, and mfg. of same - Google Patents

System used especially in an electronic controller, and mfg. of same Download PDF

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Publication number
CN1209910A
CN1209910A CN97191812A CN97191812A CN1209910A CN 1209910 A CN1209910 A CN 1209910A CN 97191812 A CN97191812 A CN 97191812A CN 97191812 A CN97191812 A CN 97191812A CN 1209910 A CN1209910 A CN 1209910A
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CN
China
Prior art keywords
pins
plug
base
pin
arrangement
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN97191812A
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Chinese (zh)
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CN1072850C (en
Inventor
埃尔马·胡贝尔
罗尔夫·利青格
托马斯·拉伊卡
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Robert Bosch GmbH
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Robert Bosch GmbH
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Publication of CN1209910A publication Critical patent/CN1209910A/en
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Publication of CN1072850C publication Critical patent/CN1072850C/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
    • B60R16/0239—Electronic boxes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01067—Holmium [Ho]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/029—Welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/16—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for manufacturing contact members, e.g. by punching and by bending
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

An arrangement includes a supporting plate, at least one substrate applied thereon for electrical and/or electronic components and a plug-in part. The plug-in part includes a plurality of connector pins which are embedded in insulating material, whose first ends are provided for the connection to external plug-in devices and whose second ends are electrically connected to the substrate via bonding wires. In order to reduce the dimensions of the raster of the connector pins and to achieve a small, compact design of the arrangement, the individual connector pins are manufactured as stamped-out parts whose second ends, in each case, have end faces manufactured in the stamping process and running roughly parallel to the substrate, and the bonding wires are welded directly to the stamped-out end faces of the connector pins. In addition, there is a method for manufacturing the arrangement.

Description

Arrangement, in particular for an electronic control device, and method for the production thereof
Level of skill
The invention relates to an arrangement having the features of the preamble of claim 1 and a method for the production thereof. An arrangement of this type is known from DE4240755a1 and is particularly suitable for use in electronic control devices. The arrangement comprises a base plate carrying a printed circuit board substrate carrying electronic circuits and circuit components, and a connector to be connected to the base plate. The plug connector is provided with a plurality of contact pins which are arranged in an insulating material and led out from two end faces of the plug connector. For example, the arrangement may be connected from within a motor vehicle to a plug-in unit which is externally insertable into the first end of the pin. The contact pin faces the second end of the printed circuit board, is distributed parallel to the printed circuit board, the end face of the contact pin is vertically aligned with the printed circuit board, and the wiring surface on the printed circuit board is connected with the side face of the rolled contact pin through a connecting lead. A disadvantage of this arrangement is that sufficient space must be left above the pin sides of the parallel printed circuit board substrate and base plate to accommodate the wiring tool on the pins during the wiring operation. Therefore, the pin arrangement of the multi-row parallel layout can not be adopted, and particularly, the plug-in unit with a large number of pins needs to make the plug board transversely enlarged, thereby enlarging the space size of the plug-in unit and having the defect of large position requirement. In addition, because the distance from the outer contact pin is large, only a thick wire with the diameter of 0.1-0.3 mm can be connected to the side surface of the rolled contact pin. The disadvantage is that the thick wire connection operation takes more time than the thin wire connection. In addition, hybrid circuit cabinets are known, for example, in which the pin faces have recesses or flats so that the connection can be made directly on the flats of the pins. This has the disadvantage that expensive processing steps are required, which increases the overall size of the plug connector due to the extension of the recess space.
THE ADVANTAGES OF THE PRESENT INVENTION
The arrangement according to the invention with the features of claim 1 has the advantage, compared to the arrangement described above, that the need for pin-to-base connection locations and the width of the plug connector can be significantly reduced in a simple manner. This is done by directly connecting the connecting leads to the end faces of the stamped pins parallel to the substrate on the backplane. This is advantageous for selecting a small full stamping part to reduce the pin pitch, so that the pin mesh size is equivalent to that of the wiring surface on the substrate, and in addition, the distance between the pins and the wiring surface on the substrate is reduced, so that the size of the substrate is reduced. Thus, the present arrangement as a whole can be made smaller and more compact.
The parallel arrangement of the plug connector pins in multiple rows is a prominent advantage because the end faces of all the pins can be freely accessed, and when conducting wire connection operation, the wiring tool can be placed on the end faces of the pins from the bottom plate surface close to the substrate. Through the parallel arrangement of the multiple rows of the contact pins, even if the end surfaces of the contact pins are wider than the wiring surfaces, the mesh width of the end surfaces of the contact pins is not larger than that of the wiring surfaces on the substrate.
Another advantage is that at least the stamped edges of the pins are metallized in order to improve the quality of the solder joint between the connecting leads and the pins.
The advantage of the plug-in part production is that, when the second pin end projects vertically from the diecast plug-in part, the pins can be held in the diecast mold with high precision during the diecasting of the plug-in part.
The insertion of the plug-in part into the recess of the base plate has the advantage, inter alia, that the contact pins can be positioned in a particularly simple manner in the vicinity of the base connection surface.
The invention also relates to a method for producing an arrangement having a base plate and at least one substrate for electrical and electronic components arranged on the base plate and having a plug-in unit with a plurality of pins embedded in an insulating material, the first ends of the pins being used for connecting external plug-in units and the second ends of the pins being electrically connected to the substrate via connecting lines. The method comprises the following specific steps: freely punching the contact pin from the metal strip under the condition of reserving a transverse strip at one side connected with the first end of the contact pin; finely punching the contact pin; electroplating the contact pin with a metal contact layer; removing the cross bars; and (5) putting the contact pin into a die-casting die, and manufacturing the plug connector by die-casting the insulating material. The connector is placed in the recess of the base plate to maintain the end surfaces of the pins substantially parallel to the substrate. And then conducting wire connection between the end surface of each pin and the base of the bottom plate.
The pin is particularly economical to manufacture as a simple stamping. Through the fine blanking contact pin, make the contact pin terminal surface reach the required surface quality of wire connection. Meanwhile, the contact pin is kept by the connecting strip on one side, and the connecting strip is removed after the plating process is carried out.
The method is particularly suitable for connecting thin wires with the diameter of 0.025-0.1 mm, and the connection operation is much faster than that of thick wires in the prior art.
Drawings
The drawings illustrate examples of the present invention and, together with the detailed description, serve to explain the principles of the invention. Wherein,
fig. 1 is a partial cross-sectional view of the arrangement of the invention with a base plate and a plug-in part along the line i-i in fig. 2.
Fig. 2 is a partial top view of an arrangement of the present invention having a backplane and a plug connector.
Fig. 3 shows the pins after a first stamping operation, connected by a side rail.
Description of the embodiments
FIG. 1 is the present inventionA cross-sectional view of an inventive arrangement, which can be used, for example, in an electronic control unit of a motor vehicle, comprises a base plate 1, such as the base plate constituting the control unit, on which base plate 1 a substrate 3 is mounted, which may be a printed circuit board, a hybrid ceramic substrate or a multilayer ceramic-coated metal plate. The substrate 3 comprises electronic circuitry with electronic components 4, which have been shown in fig. 1 and 2, but not drawn to the circuitry connecting the electronic components 4. The substrate 3 has a terminal surface 6 for connection with the circuit portion and the electronic component 4, and is connected with the connector 2 fixed in the recess 5 of the base plate 1 by screws, bonding or other suitable means. The plug-in part 2 is a die-cast part, on which a plurality of contact pins 7 are inserted in an insulating material, which are produced as simple stamped parts, the two ends of which lead out of the plug-in part 2. The contact pin is made of CuFe plated with nickel and gold2Made with a square cross-section with dimensions 0.6 x 0.6 mm. On the side of the base plate 1 facing away from the base 3, the first ends 9 of the pins 7, which lead out of the plug connector 2, are used for connecting an external counter socket. The second terminals 8 of the pins, which are led out above the base plate 1 towards the substrate 3, are electrically connected to the substrate 3. It is important that the end face 10 of the second end of the pin is parallel to the base 3 and the connection face 6, and that the connection tool can be placed on the end face 10 of the pin and the connection face 6 and can connect the end face 10 and the connection face 6 by means of a wire. FIGS. 1 and 2 show the connecting leads 11 connecting the terminal surface 6 of the substrate 3 and the end surfaces 10 of the pins, which may be thick or thin, such as thin wires, preferably gold wires with a diameter of 0.025 to 0.1mm, such as thick wires, preferably aluminum wires with a diameter of 0.1 to 0.3 mm. The pins 7 on the connector 2 are arranged in two rows in parallel, or in a multi-row structure, as shown in fig. 2, the pins 7 are arranged on the connector 2 in a staggered manner in two front and back rows, and the mesh size of the end surface 10 is equivalent to that of the wiring surface 6 of the substrate 3. As a result, the mesh width of the end face 10 is not larger than that of the wiring face 6, and the wiring face 6 and the pin end face 10 are opposed, thereby advantageously reducing the spatial dimension of the arrangement. The end face 10 adopts a double-row staggered layout, so that when the end face 10 of the row far away from the substrate 3 is connected with the wires, the end face 10 of the front row close to the substrate is not covered, and therefore, the connection with the wires of the front row is not problematic. Due to the arrangement, the pin end face 10 is close to the wiring faceAnd 6, the connecting wires between the two surfaces are relatively short. Therefore, the connection can be made with both thick and thin wires. When the thick wires are used for connection, the high-current connecting wire is particularly suitable for high-current wiring.
The manufacturing method of the above arrangement is described below. As shown in fig. 3, a first stamping step is carried out from a metal strip 20, for example from CuFe2The strip of metal is punched out of the contour of the pin (solid line in fig. 3) while leaving a lateral bar 22 which connects the first ends 9 of the pins. The pin is stamped rough in a first step and must be stamped again in a subsequent precision stamping step (shown in phantom in fig. 3) to achieve the final profile. The smoothness of the punched edge is greatly increased during the second punching, in particular, the end face 10 of the pin 7 serving as the connecting surface has a smooth, attachable surface structure. After this step, at least the pin end face 10 is plated with a nickel base layer and a gold layer and the cross bars are cut away along line 21 of fig. 3. The pin 7 is placed in the die casting mold until the insulation is die cast into the pin first end 9 and second end 8. When the thin wire is used for connection, the distance between the second end 9 and the surface of the plug connector is not more than 1mm, and when the thick wire is used for connection, the distance is not more than 0.5 mm. The finished connector 2 is fixed in the recess 5 of the base plate 1 so that the end faces 10 of the second ends 8 of the pins 7 are parallel to the terminal faces 6 on the base 3. Subsequently, the terminal surface 6 is connected to the end surface 10 by a terminal tool through the lead 11.

Claims (7)

1. Arrangement, in particular for an electronic control device, having a base plate (1) and at least one base (3) arranged thereon for electrical and/or electronic components (4), and having a plug connector (2), which plug connector (2) has a plurality of pins (7) embedded in an insulating material, which pins have first ends (9) for connecting to an external plug device, and the second ends (8) of which pins are electrically connected to the base (3) via connecting lines (11), characterized in that the pins (7) are stamped parts, at least the second ends (8) each having a stamped end face (10) running substantially parallel to the base (3), and the connecting lines (11) being soldered directly to the stamped end faces (10) of the pins (7).
2. Arrangement according to claim 1, characterized in that at least two rows of pins (7) are provided in the plug connector (2).
3. Arrangement according to claim 1, characterized in that the pins (7) machined as stampings are plated with a metal layer at least on the end faces (10).
4. Arrangement according to claim 1, characterized in that the second end (8) of the pin (7) extends in sections from the plug part (2) produced by die casting.
5. Arrangement according to claim 1, characterized in that the plug-in unit (2) is fixed in a recess (5) of the base plate (1).
6. Method for producing an arrangement, in particular for an electronic control device, having a base plate (1) and at least one base (3) arranged thereon for electrical and/or electronic components (4), and having a plug connector (2), the plug connector (2) having a plurality of pins (7) embedded in an insulating material, the pins having first ends (9) for connecting to an external plug device, the second ends (8) of the pins being electrically connected to the base (3) via connecting lines (11), characterized by the following steps:
-punching the pin (7) freely with the metal strip (20) while leaving the cross-piece (22) connecting the first ends (9) of the pins (7),
-fine-blanking the pin (7), in particular the end face (10) of the second end (8),
-electroplating a metal contact layer at least on the end faces (10) of the pins (7),
-cutting off the cross-bar (22),
-placing the pins (7) in a die-casting mould, producing the plug-in connector (2) by die-casting insulating material,
-inserting the plug element (2) into the recess (5) of the base plate (1) with the end faces (10) of the pins (7) distributed substantially parallel to the base (3),
-completing a wire (11) connection between the end face (10) of each pin (7) and the substrate (3) on the base plate (1).
7. The method of claim 6, wherein the connecting wire is a thin wire having a thickness of 0.025 to 0.1 mm.
CN97191812A 1996-11-29 1997-08-22 System used especially in an electronic controller, and mfg. of same Expired - Fee Related CN1072850C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19649549.0 1996-11-29
DE19649549A DE19649549C1 (en) 1996-11-29 1996-11-29 Arrangement esp. for use in electronic controller of motor vehicle for connection to external pluggable connector

Publications (2)

Publication Number Publication Date
CN1209910A true CN1209910A (en) 1999-03-03
CN1072850C CN1072850C (en) 2001-10-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN97191812A Expired - Fee Related CN1072850C (en) 1996-11-29 1997-08-22 System used especially in an electronic controller, and mfg. of same

Country Status (8)

Country Link
US (1) US6304455B1 (en)
EP (1) EP0879492B1 (en)
JP (1) JP2000504478A (en)
KR (1) KR100509665B1 (en)
CN (1) CN1072850C (en)
DE (2) DE19649549C1 (en)
RU (1) RU2183892C2 (en)
WO (1) WO1998024157A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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US6304455B1 (en) 2001-10-16
WO1998024157A1 (en) 1998-06-04
DE19649549C1 (en) 1998-04-09
EP0879492B1 (en) 2007-11-21
DE59712896D1 (en) 2008-01-03
KR100509665B1 (en) 2005-11-08
KR19990082048A (en) 1999-11-15
JP2000504478A (en) 2000-04-11
EP0879492A1 (en) 1998-11-25
CN1072850C (en) 2001-10-10
RU2183892C2 (en) 2002-06-20

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