RU2460170C1 - Method for manufacturing of electronic unit - Google Patents

Abstract

FIELD: electricity.

SUBSTANCE: in the method to manufacture an electronic unit a layer of insulation material is applied onto the first metal plate serving as a base, and printed conductors and contact sites are arranged on it, and elements of an electric circuit are installed on them by means of surface mounting - such as radio elements and current-conducting connectors, besides, connectors are installed to provide access to them at the outer side of the unit. Then the entire surface with printed conductors and elements of the electric circuit is filled with an insulation compound, and the second metal plate similar to the first one is laid on top. Stops are installed between plates, plates are tightened to each other until interaction with stops, and plates are fixed in a tightened condition.

EFFECT: development of a method to manufacture an electronic unit, making it possible to simultaneously achieve reduction of unit dimensions, its higher strength, provision of sealing and efficient heat removal.

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Description

The invention relates to the field of electronic technology and can be used in the manufacture of electronic units, in particular electronic units of mechatronic systems.

For electronic units intended for use in mechatronic systems, increased demands are placed on mechanical strength, reliability, and resistance to temperature changes, due to difficult operating conditions. These requirements, along with the requirements to minimize dimensions, can be achieved through the use of new manufacturing methods, one of the possible variants of which is the subject of the present invention.

In the inventive method uses well-known technological operations of surface mounting of electronic components, described, in particular, in the works: [1] - V.V. Suskin. Basics of surface mounting technology / Ryazan, publishing house Uzorochye; Ryazan State Radio Engineering Academy, 2001; [2] - S.F. Sobolev. Electrical installation technology. Guidelines for the development of a course project and preparation for classes on electrical installation technology / St. Petersburg, St. Petersburg State University ITMO, 2008, as well as standard methods of protection and sealing of electronic units using compounds and synthetic resins, described, in particular, in [3] - C. Harper. Filling electronic equipment with synthetic resins / Moscow, Energy, 1964; [4] - A.Medvedev. Printed circuit boards. Constructions and materials / Moscow, Technosphere, 2005; [5] - V. Urazaev. Moisture protection of printed units / Moscow, Technosphere, 2006.

An example of an electronic unit used in a mechatronic system is the electronic unit presented in the patent of the Russian Federation [6] - RU 2397880 C2, B60C 23/04, 08/27/2010. This unit is designed to control the parameters of the tire of the car into which it is integrated when mounting the tire on the disk. The electronic circuit of the block, containing sensors, a signal processing circuit, a power circuit, and a data transmission circuit, is mounted in a rigid cylindrical support body. The bearing housing is placed in a protective housing that is attached to the tire from its inner side. The protective casing consists of two halves made of elastomeric material, each of which has a side niche for accommodating the corresponding part of the supporting casing. The halves of the protective housing are fixed on the inner surface of the tire with a gap with respect to each other. This ensures the stability of the unit during vibration, as well as protection against mechanical damage during tire deformation. The disadvantage of this technical solution is its narrow specialization.

A known method of manufacturing semiconductor devices presented in US patent [7] - US 7897483 B2, H01L 21/30, 01/01/2011, in which sections of the finished silicon wafers with microcircuits are coated with resin to protect the microcircuits from damage. The disadvantage of this method is the locality of protection related to the individual components of the circuit.

As a prototype, a method of manufacturing an electronic unit is adopted, presented in US patent [8] - US 7897503 B2, H01L 21/4763, 03/01/2011, in which the constituent parts of the electronic unit carrying the electrical circuit elements are placed on a flat base one above the other in the form of whatnot with the provision of necessary connections (electrical, optical or other), and the joints are sealed.

The disadvantage of the prototype method is that the sealing of the connected parts is carried out locally - only at the joints. In addition, the prototype method does not solve the problem of ensuring effective heat removal from heat-loaded elements of the block, the problem of structural strength and its sealing, as well as the problem of dimensions, which reduces the possibility of using such a block in mechatronic systems.

The technical result to which the invention is directed is to develop a method for manufacturing an electronic unit, which allows to achieve at the same time reducing the dimensions of the unit, increasing its strength, providing sealing and efficient heat removal, i.e. allowing to obtain a small-sized electronic unit with improved operational characteristics, providing the ability to use it in mechatronic systems.

The invention consists in the following. A method of manufacturing an electronic unit includes placing electrical circuit elements on a carrier base, wherein the first metal plate is used as the carrier base, onto which a layer of insulating material is applied, on which printed conductors and contact pads are made, and electrical circuit elements are mounted on them - radioelements and live connectors, and the connectors are installed so as to provide access to them from the outside of the unit. Then, the entire surface with printed conductors and electrical circuit elements is poured with an insulating composition, a second metal plate similar to the first is laid on top of it, stops are fixed between the plates, the plates are pulled together to interact with the stops and the plates are fixed in a tightened state.

The invention and the possibility of its implementation are illustrated by illustrative materials presented in figures 1 and 2, where: figure 1 shows a schematic drawing of an electronic unit manufactured in accordance with the claimed method, top view; figure 2 is the same side view.

An electronic unit manufactured in accordance with the claimed method contains, see FIGS. 1 and 2, a first metal plate 1 that performs the function of a base, a layer of insulating material 2 with printed conductors and contact pads on which the elements of the electrical circuit are installed - radio elements 3 and current-carrying connectors 4, and connectors 4 have the ability to access them from the outside of the unit for external connections. The surface with printed conductors and circuit elements is filled with an insulating composition 5 with good heat transfer properties, on top of it is a second metal plate 6, similar to the first plate 1. Between plates 1 and 6 there are end metal channels 7 that perform the function of end stops, in this example - two channels 7-1 and 7-2, equipped, if necessary, with corresponding holes for connectors 4. At the corners of the block between the plates 1 and 6 are mounting sleeves 8, s function angular fixing elements and abutments in the example - four bushings 8-1, 8-2, 8-3, 8-4. The mounting sleeves 8 are flared, which provides a rigid fastening of the plates 1 and 6 and the channels 7 to each other, as a result of which the strength of the entire structure approaches the strength of the material of the plates 1 and 6, while ensuring efficient heat dissipation and tightness.

The manufacture of the electronic unit in accordance with the claimed method is as follows. First, a layer of insulating material 2 is applied to the first metal plate 1, which performs the function of the base. Then, a conductive pattern (printed conductors and contact pads) is applied to this layer and the metal is precipitated from the solution (for example, copper) by an electrochemical or other method. Next, the resulting assembly is washed and an insulating mask is applied to the printed conductors. Then, by means of surface mounting, the electric circuit elements are installed — radio elements 3 and intended for external connections of live connectors 4. The assembly thus assembled is filled with an insulating compound 5, and a second metal plate 6, similar to plate 1, is applied over the insulating composition 5. Between plates 1 and 6 metal channels 7 (7-1, 7-2) are installed from the ends with corresponding holes for connectors 4, which function as end stops, and in the corners are flared mounting tulkus 8 (8-1, 8-2, 8-3, 8-4) operating simultaneously the function of the locking elements and the angular abutments. After that, the plates 1 and 6 are pulled together to interact with the fixing sleeves 8 and channels 7 and the plates 1 and 6 are fixed in a tightened state by flaring the fixing sleeves 8, forming a rigid monoblock structure. If necessary, this design is additionally covered with an insulating layer, which can be used as a polymer composition, for example quick-hardening acrylic resin.

Thus, the application of the proposed method allows to obtain a small-sized, durable, protected from external influences electronic unit suitable for its operational characteristics for use in mechatronic systems.

The above shows that the claimed invention is feasible and ensures the achievement of a technical result, which consists in the development of a new method for manufacturing an electronic unit, which allows achieving at the same time reducing the dimensions of the unit, increasing its strength, ensuring sealing and efficient heat removal, i.e. to obtain a small-sized electronic unit with improved operational characteristics, providing the possibility of its use in mechatronic systems.

Information sources

1. V.V.Suskin. Basics of surface mounting technology / Ryazan, publishing house Uzorochye; Ryazan State Radio Engineering Academy, 2001.

2. S.F. Sobolev. Electrical installation technology. Guidelines for the development of a course project and preparation for classes on electrical installation technology / St. Petersburg, St. Petersburg State University ITMO, 2008.

3. C. Harper. Filling electronic equipment with synthetic resins / Moscow, Energy, 1964.

4. A.Medvedev. Printed circuit boards. Constructions and materials / Moscow, Technosphere, 2005.

5. V. Urazaev. Moisture protection of printed units / Moscow, Technosphere, 2006.

6. RU 2397880 C2, B60C 23/04, publ. 08/27/2010.

7. US 7897483 B2, H01L 21/30, publ. 03/01/2011.

8. US 7897503 B2, H01L 21/4763, publ. 03/01/2011.

Claims (1)

A method of manufacturing an electronic unit, including the placement of electrical circuit elements on a carrier base, characterized in that the first metal plate is used as the carrier base on which a layer of insulating material is applied, on which printed conductors and contact pads are made, and installed on them by surface mounting elements of the electrical circuit - radio elements and live connectors, and the connectors are installed so as to provide access to them from the outside of the unit, ATEM entire surface with printed conductors and the electric circuit elements is filled with insulating composition, it is applied over the second metal plate similar to the first, mounted between abutments plates tightening the plates together to interact with the stops and fixing plate in contracted state.

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